High Current Power Inductors HCM1104 Series

Transcription

1 High Current Power Inductors HCM1104 Series HALOGEN HF FREE Pb SMD Device Description Halogen free, lead free, RoHS compliant 125 C maximum total operating temperature 11.5x 10.3 x 4.0mm maximum surface mount package Powder Iron core material Magnetically shielded, low EMI High current carrying capacity, low core losses Inductance range 0.20µH to 10.0µH Current range from 7.5 to 45 Amps Frequency range up to 5MHz Applications Voltage Regulator Module (VRM) Multi-phase regulators Point-of-load modules Desktop and server VRMs and EVRDs Base station equipment Notebook regulators Battery power systems Graphics cards Data networking and storage systems Environmental Data Storage temperature range: -55 C to +125 C Operating temperature range: -55 C to +125 C (ambient plus self temperature rise) Solder reflow temperature: J-STD-020D compliant Packaging Supplied in tape and reel packaging, 850 parts per 13 reel Product Specifications Part OCL 1 FLL 2 Min 3 I rms 4, 5 I sat DCR (mw) DCR (mw) Number 7 ± 20% (mh) (mh) C C C Maximum K-factor 6 HCM1104-R20-R HCM1104-R36-R HCM1104-R45-R HCM1104-R56-R HCM1104-R90-R HCM1104-1R0-R HCM1104-1R5-R HCM1104-2R2-R HCM1104-3R3-R HCM1104-4R7-R HCM R Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.25Vrms, 25 C. 2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.25Vrms, 25 C. 3. Irms: DC current for an approximate temperature rise of 40 C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125 C under worst case operating conditions verified in the end application. 4. Isat: Peak current for approx. 20% rolloff at +25 C - HCM1104-R20-R to HCM1104-R90-R. 5. Isat: Peak current for approx. 30% rolloff at +25 C - HCM1104-1R0-R to HCM R. 6. K-factor: Used to determine B p-p for core loss (see graph). B p-p = K * L * DI. B p-p : (Gauss), K: (K-factor from table), L: (Inductance in mh), DI (Peak-to-peak ripple current in Amps). 7. Part Number Definition: HCM1104-xxx-R - HCM1104 = Product code and size - xxx= Inductance value in mh, R = decimal point - -R suffix = RoHS compliant 0312 BU-SB12258 Page 1 of 6 Data Sheet: 4370

2 Dimensions - mm Part marking: xxx = Inductance value in µh, R = decimal point, if no R is present, third character = # of zeros. wwyy = (date Code) R = (Revision Level) All soldering surfaces to be coplanar within 0.10 millimeters. Tolerances are ±0.3 millimeters unless stated otherwise. HCM1104-R20-R to HCM1104-R90-R Color: Black HCM1104-1R0-R to HCM R Color: Grey Packaging Information - mm A Supplied in tape and reel packaging, 850 parts per 13 diameter reel. Temperature Rise vs. Total Loss HCM1104-1R0-R HCM1104-3R3-R HCM R HCM1104-R20 thru R90-R Temperature Rise ( C ) Total Loss (W) 0312 BU-SB12258 Page 2 of 6 Data Sheet: 4370

3 Core Loss - HCM1104-R20-R Through HCM1104-R90-R Core Loss vs. B p-p Core Loss - HCM1104-1R0-R Through HCM R Core Loss vs B p-p K 300K 200K 100K 50K Core Loss (mw) K B p-p (Gauss) 0312 BU-SB12258 Page 3 of 6 Data Sheet: 4370

4 Inductance Characteristics HCM1104-R20-R HCM1104-R36-R I DC (Amps) HCM1104-R45-R HCM1104-R56-R HCM1104-R90-R BU-SB12258 Page 4 of 6 Data Sheet: 4370

5 Inductance Characteristics HCM1104-1R0-R HCM1104-1R5-R HCM1104-2R2-R HCM1104-4R7-R HCM1104-4R7-R HCM R BU-SB12258 Page 5 of 6 Data Sheet: 4370

6 Solder Reflow Profile T P T L Temperature T smax T smin Max. Ramp Up Rate = 3 C/s Max. Ramp Down Rate = 6 C/s Preheat A ts t t P T C -5 C Table 1 - Standard SnPb Solder (T c ) Volume Volume Package mm 3 mm 3 Thickness <350 >_350 <2.5mm 235 C 220 C >_2.5mm 220 C 220 C Table 2 - Lead (Pb) Free Solder (T c ) Volume Volume Volume Package mm 3 mm 3 mm 3 Thickness < >2000 <1.6mm 260 C 260 C 260 C mm 260 C 250 C 245 C >2.5mm 250 C 245 C 245 C 25 C Time 25 C to Peak Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak Temperature min. (T smin ) 100 C 150 C Temperature max. (T smax ) 150 C 200 C Time (T smin to T smax ) (t s ) Seconds Seconds Average ramp up rate T smax to T p 3 C/ Second Max. 3 C/ Second Max. Liquidous temperature (TL) 183 C 217 C Time at liquidous (t L ) Seconds Seconds Peak package body temperature (T P )* Table 1 Table 2 Time (t p )** within 5 C of the specified classification temperature (T c ) 20 Seconds** 30 Seconds** Average ramp-down rate (T p to T smax ) 6 C/ Second Max. 6 C/ Second Max. Time 25 C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T p ) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. North America Europe Asia Pacific Cooper Electronic Technologies Cooper Bussmann Cooper Electronic Technologies Cooper Electronic Technologies Cooper Electronic Technologies 1225 Broken Sound Parkway NWP.O. Box Cooper (UK) Limited Avda. Santa Eulalia, Jalan Kilang Timor Suite F St. Louis, MO 63178?4460 Burton?on?the?Wolds #06?01 Pacific Tech Centre Boca Raton, FL 33487?3533Tel: 1?636?394?2877 Leicestershire LE12 5TH Terrassa, UK (Barcelona), Spain Singapore Tel: 1?561?998?4100 Fax: 1?636?527?1607 Tel: +44 (0) Tel: Tel: Fax: 1?561?241?6640 Fax: +44 (0) Fax: Toll Free: 1?888?414?2645 Fax: The only controlled copy of this Data Sheet is the electronic read?only version located on the Cooper Bussmann Network Drive. All other c document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical in that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design? or constructio ucts and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update,? without notic nical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applicati Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose? failure to perfo erly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to 2012 Cooper Bussmann BU-SB12258 Page 6 of 6 Data Sheet: 4370