SMT T SERIES SURFACE MOUNT TINY SWITCHES Distinctive features
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- Thomasine Haynes
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1 Distinctive features ENTIRELY DESIGNED FOR SURFCE MOUNT Surface mount devices (SMD) are subjected to more stringent constraints of temperature, solderability and space savings than through-hole components. To meet these requirements, has designed a range of surface mount switches including 3 product types : - pushbutton switches, TP series - slide switches, TG series - toggle switches, TL series Tape and reel packaging This type of packaging is recommended for the following reasons : - economy, - suitability for automated placement - large number of components per packaging unit - good component positioning - protection of terminals against damage during handling - high static resistance Reflow solderable High temperature plastic materials Tin plated ground plate Terminal coating : tin-lead alloy aver nickel plating Terminals turned to the outside, preventing the shadow effect in infrared soldering and permitting visual inspection of solder joints Distance between case and circuit : 0,55 mm (.021) End stackable with 10,16 mm (.40) pitch vailable with positioning pins to ensure switch orientation during the reflow process and increasing switch mechanical resistance Pushbutton and toggle models protected against electrostatic discharges (ESD) up to 10 KV Washable Construction withstands cleaning processes, including hot water under pressure -6
2 Specifications ELECTRICL SPECIFICTIONS PCKGING Max. current/voltage rating with resistive load : 0,4V 20V max. C or DC Minimum load : 10m 50mV or 10µ 5VDC Initial contact resistance : - pushbutton switches : 50 mω max. - slide or toggle switches : 20 mω max. Insulation resistance : MΩ min. at 500VDC Dielectric strength : Vrms. 50 Hz min. between terminals and frame 500 Vrms. 50 Hz min. between terminals Electrical life at full load : - pushbutton switches : cycles - 2 position switches : cycles - 3 position switches : cycles Static resistance (pushbutton or toggle models) : 10 KV (Schaffner equipment) GENERL SPECIFICTIONS Travel: - slide switches : 2,60 mm (.102) - pushbutton switches : function 2 : 1 mm (.039) - function 3 : 0,8 mm Operating temperature : -40 C to +85 C Moisture resistance : 21days per IEC test 11c Vibration resistance : Hz / 10 g per IEC test 6d Shock resistance : 50 g per IEC test 6c Unrolling direction 7.70 (.303) (.472) 7.50 (.295) 44.00±0.30 (1.732±.011) 40.40±0.10 (1.590±.003) TPE for TL - TP 24.00±0.30 (.944±.011) MTERILS (.629) Case : high temperature plastic material UL94-V0 ctuator : - button and slide : high temperature plastic material UL94-V0 - toggle : brass, nickel plated, with high temperature UL94-V0 plastic cap Ground plate and positioning pins : steel, tin plated Contacts : brass, gold plated Terminals : brass, with tin-lead alloy over nickel plating Rubber seal (on slide switches) : silicone, translucent TPE for TG Reflow soldering : - infrared - vapor phase - infrared convection Washable per IE-RS448-2 : - water + detergent - preferred - solvents SOLDERING ND CLENING Dimensions : First dimensions are in mm while inches are shown as bracketted numbers. Standard packaging unit : TL and TP : 700 pieces - TG : 500 pieces Tape meeting international standard IEC - Publication (EI481) Start leader : 400 mm min. Ø Maxi ( DI MX) REEL Tape width (.944) (1.732) Reel (dimension ) Ø1±0.25 (.511 DI±.009) /0.00 ( /.000) Ø mini (3.937 DI MIN) /0.00 ( /.000) -7
3 With or without positioning pins On slide switches, rubber seal removable after cleaning Single pole Pushbutton and toggle models also available for vertical mounting. On request Funct. 2 Funct. 3 Pushbutton Slide Toggle Pushbutton Slide Toggle Pushbutton switches TP32WS83500 ON MOM TP33WS83500 OFF MOM (.165) 4.50 (.177) Ø (.098 DI) (.196 DI) Shown in function 2 Pushbutton switches - with positioning pins TP32WS83565 ON MOM TP33WS83565 OFF MOM 1.00 (.039) (.165) (.196 DI) 4.50 (.177) Ø (.098 DI) Ø (.031 DI) Shown in function 2 Slide switches 0.90 (.035) TG36WS80050 ON - ON TG39WS80050 ON OFF ON 1.30 (.051) -8
4 Slide switches - with positioning pins TG36WS80065 ON - ON TG39WS80065 ON OFF ON Ø (.031 DI) Slide switches with flush actuator 0.90 (.035) Without positioning pins TG36WS81050 ON - ON TG39WS81050 ON OFF ON With positioning pins TG36WS81065 ON - ON TG39WS81065 ON OFF ON 1.30 (.051) Shown without positioning pins (positioning pins same as above) Toggle switches III II I TL36WS84000 ON - ON TL39WS84000 ON OFF ON TL37WS84000 MOM OFF MOM TL38WS84000 ON OFF MOM TL32WS84000 ON - MOM Ø2.40 (.094 DI) (.165) 5.50 (.216) I II 24 III (.196 DI) Toggle switches - with positioning pins III II I TL36WS84065 ON - ON TL39WS84065 ON OFF ON TL37WS84065 MOM OFF MOM TL38WS84065 ON OFF MOM TL32WS84065 ON - MOM Ø2.40 (.094 DI) 1.00 (.039) (.165) (.196 DI) 5.50 (.216) I II 24 III Ø (.031 DI) -9
5 Soldering process REFLOW SOLDERING (standard profile) PROCESS STEPS The P.C. board, carried by a conveyor belt, goes through the different areas of a reflow soldering oven : - pre-heating (maximum 170 C, 60 seconds) - reflow peak (maximum 245 C) - final cleaning (optional) P.C. board TEMPERTURE / TIME PROFILE (typical) Solder paste printing C Component placement s 100 Reflow soldering 0 0 pre-heating préchauffage drying séchage stabilization stabilisation reflow pic de refroidissement gradual cooling peak refusion t (s) Final cleaning BORD REWORK TECHNIQUE Hot air reflow technique is preferred. void use of a traditional soldering iron. Caution : Excessive and/or repeated high temperature exposure may affect switch performance and reliability. -10
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