AD898 Automatic Die Bonder

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Shannon Norton
6 years ago
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1 AD898 Automatic Die Bonder A New Definition for High Speed and Accuracy

2 AD898 Features Bonding System High speed - 320ms system cycle time XYZ bondhead with decoupled YZ motion Capable of handling die sizes between 10 x x 1000 mil (0.25 x x 25.4 mm) Capable of handling multi-placement/ matrix leadframes and leadframes with downset Vision System Multi-grey levels PR system CCD targeting systems with zoom lenses Automatic bad unit, pre-bond & postbond inspection Advanced defect detection at wafer stage Wafer Handling System Automatic wafer handling system with wafer cassette elevator for up to 8" (200 mm) wafer Motorized wafer expander with programmable expansion Ejector system with programmable ejector height Workholder System Universal workholder with block design concept Linear motor indexer with flexible indexing clamp Motorized downset adjustment on workholder Epoxy Writer System Real time position alignment 2-in-1 epoxy writing system with syringe dispensing capability Standard epoxy patterns provided with flexibility to generate customized pattern Material Handling System Stack loader with interleaf paper separator Leadframe box handling capability Control System PC based control system Interactive menu driven control and data logging capability Process recipe storage on hard disk and/or floppy disk SECS I & II Communication Bar code reader for wafer mapping Options Small die kit (10 x 10 mil x 200 mil) Stacked die kit including heater assembly BGA handling kit Boat handling kit (for SBGA) Waffle pack handling kit Rotary collet bond arm Wafer mapping protocol Strip marker with characters Air ionizer system Intelligent epoxy dispensing controller Multiple die attach process for MCM using cascade linkage concept In-line capability Multiple magazine input system

3 Bonding System Advanced Wafer Inspection Detect all possible defects/features at wafer stage Bad Unit Rejection Rotated Die Broken Die Die with Washed Ink Edge Die Device with Minimal Pattern Scratched Die Epoxy Alignment Stacked Die Alignment Standard 2 in 1 Epoxy Writer Real time PRS Dispensing area Maximum 3" for Y Wafer Handling System Programmable wafer expander Z motor 5 minutes conversion Optional wafer ring and waffle pack holders Waffle Pack Holder Y motor Wafer Expanders Light weight bond arm For 6" OD Wafer Ring For 6" and 8" Film Frame Bond Arm Decoupled YZ axis Large vertical clearance for premolded package

Workholder System w Modular Track Design

universal configurations anvil blocks window

FlexBGA, Pre-molded LF Configuration for

4 Workholder System w Modular Track Design Block by block conversion concept for universal configurations anvil blocks window clamps press rollers heater blocks Rear Track Front Track Configuration for Substrate Sensitive to Scratch e.g. FlexBGA, Pre-molded LF Configuration for Adhesive Tape Bonding e.g. Motorized Top Clamp Press Rollers Premolded Leadframe Workholder without Central Supporting Blocks Tape FlexBGA Leadframe Premolded Leadframe Stacked CSP

ith Built-in Flexibility Flexible Anvil Block Assembly Optional pre-installed heater

plug-in design Anvil Block for Elevated Temperature Bonding Normal Substrate Anvil

5 ith Built-in Flexibility Flexible Anvil Block Assembly Optional pre-installed heater plate assembly Good heat distribution control Anvil block conversion only Quick plug-in design Anvil Block for Elevated Temperature Bonding Normal Substrate Anvil Block Heater plate assembly fixed on track Stacked CSP Configuration for Singulated Unit e.g. CLCC Motorized Top Clamp Anvil Block with Heating Plate Workholder without Central Supporting Blocks Motorized Up/Down Anvil Block Bonded Sample Carrier for CLCC CLCC Device

Flexible Package Applications Requirement : Control of die

High UPH Requirement : Control of placement accuracy Die

Large Small Long Die Handling Requirements Thin 358 mil x

6 Flexible Package Applications Requirement : Control of die tilt Requirement : Control of epoxy bleeding Requirement : High UPH Requirement : Control of placement accuracy Die Handling Capabilities 800 mil x 800 mil 10 mil x 10 mil Large Small Long Die Handling Requirements Thin 358 mil x 21 mil (1:17) Thick Die thickness: 3 mil Die thickness: 44 mil

Manufacturing Automation Wafer Map Strip Map Post Bond Inspection with Real Time Data One Pass Multi-die Application Customer CIM System MES TCP / IP TCP / IP and / or RS232 Cell Controller CELL

7 Manufacturing Automation Wafer Map Strip Map Post Bond Inspection with Real Time Data One Pass Multi-die Application Customer CIM System MES TCP / IP TCP / IP and / or RS232 Cell Controller CELL CONTROL MODULES * Connection Management * Job (or Lot) Management * Auto WIP Tracking * Strip Map Management * Equipment Management * Statistical Data Collection * Recipe & Wafer Management * Alarm Management Equipment Drivers GUI Design Database

Specifications Die size 10 x 10 mil - 1000 x 1000 mil (0.25 x 0.25 mm - 25.4 x 25.

Conversion Conversion Epoxy Writer XY travel Resolution XY Z Leadframe, BGA 0" - 0.2" (0-5 mm) linear programmable 6.0" - 11.4" (150-290 mm) 0.6" - 3.15" (15-80 mm) 3" (76.

8 Specifications Die size 10 x 10 mil x 1000 mil (0.25 x 0.25 mm x 25.4 mm) Bondhead Bond force g Package handled Ejector height Leadframe size Length Width Thickness Magazine size Length Width Height Speed Cycle Time Wafer Stage Wafer size XY table travel Conversion Conversion Epoxy Writer XY travel Resolution XY Z Leadframe, BGA 0" - 0.2" (0-5 mm) linear programmable 6.0" " ( mm) 0.6" " (15-80 mm) 3" (76.2 mm) Y-axis bond area 4-79 mil (0.1-2 mm) > 0.75mm : require conversion 6.0" " ( mm) 0.6" " (15-85 mm) 2.7" - 6.0" ( mm) 320ms Max. 8" (200 mm) 9.5" x 9.5" (237.5 x mm) 5 mins (Device only) 15 mins (Full conversion) 2" x 3" (50.8 x 76.2 mm) 0.02 mil (0.5 µm) 0.15 mil (3.81 µm) Pattern Recognition System PRS model Multi-grey levels PRS Camera resolution 512 pixels x 512 pixels Grey scale 256 grey levels Position accuracy ± 1 / 4 pixel Angle accuracy ± 0.1 System Accuracy XY placement θ rotation Facilities Required Voltage Frequency Compressed air Power consumption Dimensions & Weight ± 1 mil (± σ ± 3σ 110/220 VAC (pre-set at factory) 50/60 Hz (pre-set at factory) 87 PSI Approx W L x W x H w/o input mag. 50.0" x 43.3" x 68.9" (1270 x 1100 x 1750 mm) w/ input mag. 58.7" x 43.3" x 68.9" (1490 x 1100 x 1750 mm) Net weight 2772 lb (1260 kg) * Technical details are subject to change without prior notice For further information, please contact our regional offices Hong Kong ASM ASSEMBLY AUTOMATION LTD. 4/F Watson Centre, 16 Kung Yip Street Kwai Chung, Hong Kong Tel : Fax : ASM ASSEMBLY MATERIALS LTD. 14/F, Block A, Wo Kee Hong Bldg Castle Peak Road Kwai Chung, Hong Kong Tel : Fax : Singapore ASM TECHNOLOGY SINGAPORE PTE LTD. 2 Yishun Avenue 7 Singapore Tel : Fax : U.S.A. ASM PACIFIC ASSEMBLY PRODUCTS INC East University Drive Phoenix, Arizona U.S.A. Tel : Fax : Western Regional Office 97 East Brokaw Road, Suite 100, San Jose California , U.S.A. Tel : Fax : Europe ASM ASSEMBLY PRODUCTS B.V. Jan Van Eycklaan BC Bilthoven The Netherlands Tel : Fax : China ASM MICROELECTRONICS TECHNICAL SERVICES (SHANGHAI) CO., LTD Room 401&402, Building 7 No. 84 Zu Chong Zhi Road Lot 887 Shanghai Zhangjiang Hi-tech Park Shanghai,China Post Code: Tel : / Fax : ASM MICROELECTRONICS TECHNICAL SERVICES (SHANGHAI) CO., LTD Shenzhen Branch Office Room 107, Hai Bin City Square, No.9 Yu An Road, Area 46, Bao An, Shenzhen, China Post Code: Tel : Fax : Thailand ASM ASSEMBLY EQUIPMENT BANGKOK LTD. 51/3, Vibhavadi Tower, 18/2 Floor Ngamwongwan Road, Ladyao, Chathuchak Bangkok, 10900, Thailand Tel : /2 Fax : Korea ZEMOS KOREA INC./ ASM PACIFIC KOR LTD. 3F, 628-6, Deung Chon Dong Kangseo Gu, Seoul , Korea Tel : Fax : Taiwan ASM ASSEMBLY AUTOMATION (TAIWAN) BRANCH 2/F, No. 70, Sec 2, Chang Sha Street, Taipei, Taiwan Tel : Fax : ASM TAIWAN BRANCH OFFICE 8F-1, No. 135, Sec 2 Chung Shan Road, Tantzu Taichung, Taiwan, R.O.C. Tel : Fax : CAPITAL EQUIPMENT DISTRIBUTION LTD. TAIWAN BRANCH No. 4-2, East 3 Road Street, N.E.P.Z. Kaohsiung, Taiwan, R.O.C. Tel : Fax : ASM TAIWAN BRANCH OFFICE 2/F, No. 9, Lane 379, Sec 1 Ching Kuo Road Hsin Chu, Taiwan, R.O.C. Tel : Fax : Japan ASM ASSEMBLY TECHNOLOGY CO LTD. 2F MS Bldg., Shouwa-cho Akishima-shi, Tokyo Japan Tel : Fax : Malaysia ASM ASSEMBLY EQUIPMENT MALAYSIA SDN. BHD. Bayan Point, Block A, No , Medan Kampung Relau Penang, Malaysia Tel : Fax : ASM MUAR 17 Tingkat Satu, Jalan Mulia Satu, Taman Sri Mulia, Sungai Abong 84000, Muar, Johor, Malaysia Tel : Fax : Philippines ASM PACIFIC PHILIPPINES Unit 401 The Sycamore Building Alabang-Zapote Road, Alabang Muntinlupa City, Philippines 1770 Tel : Fax : CC2

Akribis Systems. Where Precision Matters

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