Hybrid Metrology 2.0: From Metrology to Information Technology Avron Ger - Nova Measuring Instruments. VP - Strategic Partnership Programs

Transcription

1 Hybrid Metrology 2.0: From Metrology to Information Technology Avron Ger - Nova Measuring Instruments VP - Strategic Partnership Programs

2 Outline Hybrid Metrology Introduction Hybrid Metrology Use Cases Hybrid Metrology The Next Phase Summary

3 Hybrid Metrology Introduction

4 Why the industry speak of Hybrid Metrology In the words of Lord Kelvin ( ).

5 Definition of Hybrid Metrology In fact, there is no one single tool that can handle all metrology needs for today s & future 3D IC metrology space such as 3D NAND, finfets, or the next-generation transistor (GAA) To overcome challenge chipmakers have been implementing a technology called hybrid metrology. In this approach, chipmakers use a mix-and-match of several different tool technologies and then combine the data from each.

6 Hybrid Metrology Publications

7 Injection Multi-Channel Nova Holistic Metrology Approach Metrology, SW Modeling, Reference - Tools Adding more information is the key to simultaneously improve Concurrent precision Optimization and accuracy, and allowing better extract the profile details Model Optimized Solution

8 Nova Hybrid Metrology Combined use of 2 (or more) metrology tools to measure same structure Data from multiple tools shared in complementary way to enhance metrology performance Enable measurements of complex structures that are not feasible (or not meeting spec) by individual tools Most of work to date combine CD-SEM and OCD 2013: Combine TF & Materials (X-Ray) with structure profile (OCD)

9 Hybrid Metrology Use Cases

10 Test Site Design + Multi-stack for SAQP CDUs of the spaces are defined by all etch steps While CDU of Fins is defined at final etch steps Multi-Stack allows to break correlations and reduce modelling complexity Alternative way of solving SAQP problem (measure 3 different spaces) is to use Test Site Design + Multi-stack

11 Hybrid on GAA It is important to be able to measure several dimensions at this step for process control, including the remaining hard mask (HM) height, the CD of the fin, and the total height of the fin Allows to break correlations and reduce modelling complexity Complex 3D stack with profile complexity and large number of parameters (more than 16 degrees of freedom).

12 Hybrid Metrology EUV Litho Critical parameters Resist CD Resist SWA CD SEM measures CD and LER Optical CD model has 6 profile parameters Best SWA accuracy (vs TEM) was achieved with LER hybrid schemes (with or without CD)

13 RMS (nm) Hybrid + Injection DSA hole profile 37 DSA residue Guide shape Injection Hybrid metrology TuT (nm) TMU Slope R Exact DSA hole profiles were measured with hybrid metrology and injection.

14 Hybrid metrology in production Hybrid results are more accurate and more stable than non-hybrid Break correlations of SWA and Height Implementation in HVM Hybrid Server (CDSEM + Optical CD) and Co-Optization allows 3X improvement in variability

15 Hybrid X-ray HKIL on Fins Optical CD alone: IL & HK cross-talk & profile, low sensitivity XPS alone: IL cross-talk with profile Optical CD helps XPS to measure accurate IL Hybrid (XPS+Optical CD) allows 2-3X improvement in variability, better DOE tracking and better accuracy

16 The Next Phase of Hybrid Metrology

17 The Big data & Smart Factories Big data apply to all type of digital data Process complexity increases as technology node continues to shrink following Moore s Law Semiconductor manufacturers have been collecting and using production data from the equipment Process data in fab growing exponentially

18 Hybrid Metrology and Machine Learning OCD good for profile information but limited in prediction of inline electrical test due to factors outside of its control Can supplement OCD information with XRF and ML to significantly improve prediction capabilities Electrical Test Prediction Incorporating Machine learning with hybrid metrology, prediction power is significantly improved

19 Summary Growing device complexity in advanced nodes requires the use of Holistic and Hybrid Metrology solutions (1+1 equals more than 2) The next phase in Hybrid Metrology will integrate big data and machine learning techniques Nova has pioneered Hybrid Metrology and will continue to development next generation Hybrid Metrology solutions