POWER MANAGEMENT EL Lamp Drivers: Die Specifications
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1 POWER MANAGEMENT EL Lamp Drivers: Die Specifications IMP2 Single Cell Battery Powered Electroluminescent Lamp Driver IMP2 Single Cell Battery Powered EL Lamp Driver, 180V PP Drive IMP28 IMP0 IMP803 High-Voltage EL Lamp Driver, 220V PP Drive Power Efficient EL Lamp Driver High-Voltage EL Lamp Driver
2 IMP2 - Die Specifications IMP2 Single Cell Battery Powered EL Lamp Driver Die Thickness: Bond Wire Size: Back Side Metal: Back Side Potential: Die Attach Method: Bond Metal: Bond Size: LX CS mils (2 microns) 1.0 mil (2 microns) None Ground Conductive Adhesive Aluminum, 1% Silicon, 1/2% Copper 0 microns per side 1.3mm x 1.4mm IMP2 1.3mm 9 DIS 1 VDD 1.4mm Name Function Ground pad. V B EL lamp drive. 9* DIS Disable pad. DIS = HIGH disables chip. * See table Location 1 X (microns) Y (microns) Disable Disable IMP2/D 9 IMP2/D1 9 2 Daily Silver IMP Electroluminescent Lamp Driver 1
3 IMP2 - Die Specifications IMP2 Single Cell Battery Powered EL Lamp Driver, 180V PP Drive Die Thickness: Bond Wire Size: Back Side Metal: Back Side Potential: Die Attach Method: Bond Metal: Bond Size: LX CS mils (2 microns) 1.0 mil (2 microns) None Ground Conductive Adhesive Aluminum, 1% Silicon, 1/2% Copper 0 microns per side 1.3mm x 1.4mm IMP2 1.3mm 9 DIS 1 VDD 1.4mm Name Function Ground pad. V B EL lamp drive. 9* DIS Disable pad. DIS = HIGH disables chip. * See table Location 1 X (microns) Y (microns) Disable Disable Disable IMP2/D 9 IMP2/D Daily Silver IMP
4 IMP28 - Die Specifications IMP28 High-Voltage EL Lamp Driver, 220V PP Drive Die Thickness: 2 mils (2 microns) Bond Wire Size: 1.0 mil (2 microns) Back Side Metal: None Back Side Potential: Ground Die Attach Method: Conductive Adhesive Bond Metal: Aluminum, 1% Silicon, 1/2% Copper Bond Size: 0 microns per side 1.38mm x 1.82mm DIS VDD 1 Name Function Ground pad. V B EL lamp drive. 9 Ground pad. * DIS Disable pad. DIS = HIGH disables chip. * See table 2 Location 1 CS LX 3 4 IMP mm 1.82mm X (microns) Y (microns) Disable Disable Disable IMP28/D IMP28/D1 28 Daily Silver IMP Electroluminescent Lamp Driver 3
5 IMP0 - Die Specifications IMP0 Power Efficient EL Lamp Driver Die Thickness: 2 mils (2 microns) Bond Wire Size: 1.0 mil (2 microns) Back Side Metal: None Back Side Potential: Ground Die Attach Method: Conductive Adhesive Bond Metal: Aluminum, 1% Silicon, 1/2% Copper Bond Size: 0 microns per side 1.38mm x 1.82mm DIS VDD 1 Name Function Ground pad. V B EL lamp drive. 9 Ground pad. * DIS Disable pad. DIS = HIGH disables chip. * See table CS LX IMP mm 1.82mm Location 1 X (microns) Y (microns) Disable Disable IMP0/D IMP0/D1 0 4 Daily Silver IMP
6 IMP803 High-Voltage EL Lamp Driver IMP803 - Die Specifications Die Thickness: 2 mils (2 microns) Bond Wire Size: 1.0 mil (2 microns) Back Side Metal: None Back Side Potential: Ground Die Attach Method: Conductive Adhesive Bond Metal: Aluminum, 1% Silicon, 1/2% Copper Bond Size: 0 microns per side 1.38mm x 1.82mm DIS VDD 1 Name Function Ground pad. V B EL lamp drive. 9 Ground pad. * DIS Disable pad. DIS = HIGH disables chip. * See table 2 Location 1 CS LX 3 4 IMP mm 1.82mm X (microns) Y (microns) Disable Disable IMP803SX IMP803/D1 803 Daily Silver IMP Electroluminescent Lamp Driver
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SECTION 29iS/U: F-1202D-L PANEL ATTACH STRIP F-01240-1 UPPER FORWARD FUSELAGE SKIN (SHOWN TRANSPARENT) VAN'S AIRCRAFT, INC. FWD UPPER FUSELAGE F-00078 CABIN EGRESS HANDLE F-00077-L UPPER FWD FUSELAGE SKIN
Fuseholders PAGE. Fuseholders.
PAGE International Shock-Safe (Panel Mount).......................................................................... 467-468 Flip-Top Shock-Safe (Panel Mount)..................................................................................
kenall dark sky luminaires
kenall dark sky luminaires Millenium Finite Wall Mount Millenium Edge Ceiling Mount Herculux Wall and Ceiling Mount Kenall's dark sky solution As more buildings are constructed and equipped with powerful
Illustrated Parts List
More time on the road Illustrated s List FSB-406B November 202 Contents How To Use The Illustrated s List... 3 CASE... 4 COUNTERSHAFT ASSY... 7 INPUT SHAFT... 9 KITS & ASSEMBLIES... 0 LEVER ASSY... MAINSHAFT
Geosynthetic Welding Fax Merchandise Way Diamond Springs, CA 95619
Geosynthetic Welding 800.624.2408 530.626.9386 530.626.5144 Fax www.sineqco.com info@sineqco.com 6686 Merchandise Way Diamond Springs, CA 95619 Wedge-It Wedge Welder Since 1987 and well over 4,000 units
HALO H99ICT. 4" RECESSED DOWNLIGHTING Incandescent
DIMENSIONS DESCRIPTION The is a small aperture housing for accent and task lighting. The is designed for use in insulated ceilings where it will be in direct contact with insulation. It is an IR-TITE housing