DATA SHEET QW0905-LHY22840/S11-PF/TBS-1 TAPE AND BOX TYPE LED LAMPS. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only REV.

Transcription

1 TAPE AND BOX TYPE ED AMPS Pb ead-free Parts HY22840/S11-PF/TBS-1 DATA SHEET DOC. NO : QW0905-HY22840/S11-PF/TBS-1 REV. : A DATE : 23 - Jul

2 Package Dimensions IGITEK EECTRONICS CO.,TD. Page 1/6 P2 ΔH H2 H1 W2 W0 W1 W3 D P1 F - + P T HY22840/S11-PF MAX 0.5 TYP 25.0MIN MIN 2.54TYP + - Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.

3 Page 2/6 Absolute Maximum Ratings at Ta=25 Parameter Symbol Absolute Maximum Ratings HY UNIT Forward Current Peak Forward Current Duty Power Dissipation IF IFP PD 30 ma 60 ma 75 mw Reverse Ir 10 μa Electrostatic Discharge( * ) ESD 2000 V Operating Temperature Topr -40 ~ +85 Storage Temperature Tstg -40 ~ +100 * Static Electricity or power surge will damage the ED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these ED. All devices, equipment and machinery must be properly grounded. Typical Electrical & Optical Characteristics (Ta=25 ) PART NO MATERIA Emitted HY22840/S11-PF/TBS-1 AlGaInP Yellow COOR ens Yellow Diffused Dominant wave length λdnm 595 Spectral halfwidth λnm Forward Min. Max. uminous Min. Max Viewing angle 2θ 1/2 (deg) Horizontal Axis 80 Vertical Axis 120 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance.

4 Dimension Symbol Information SYMBO ITEMS OPTION CODE SYMBO Page 3/6 SPECIFICATIONS Minimum Maximum mm inch mm inch Tape Feed Hole Diameter D Component ead Pitch F Front-To-Rear Deflection H Feed Hole To Bottom Of Component TBS-1 H Feed Hole To Overall Component Height H ead ength After Component Height W Feed Hole Pitch P ead ocation P Center Of Component ocation P Overall Taped Package Thickness T Feed Hole ocation W Adhesive Tape Width W Adhesive Tape Position W Tape Width W REMARK:TBS=Tape And Box Straight eads Dimensions Symbol Information Package Dimensions Specification Description Symbol minimum maxmum Overall ength mm 330 inch 13.0 mm 340 inch 13.4 W Overall Width W Overall Thickness H Part No. HY22840/S11-PF/TBS Quantity/Box 2500PCS H

5 Page4/6 Typical Electro-Optical Characteristics Curve HY CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current Forward Current(mA) Relative Intensity Forward Voltage(V) Forward Current(mA) Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature Forward Relative Intensity@20mA Ambient Temperature( ) Ambient Temperature( ) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA Wavelength (nm)

6 Page 5/6 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:260 C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp( C) C3sec Max 5 /sec max /sec max Preheat 60 Seconds Max Time(sec)

7 Page 6/6 Reliability Test: Test Item Test Condition Description Reference Standard Operating ife Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MI-STD-750: 1026 MI-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ±5 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MI-STD-883:1008 JIS C 7021: B-10 ow Temperature Storage Test 1.Ta=-40 ±5 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 ±5 2.RH=90%~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. MI-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 ±5 &-40 ±5 (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MI-STD-202: 107D MI-STD-750: 1051 MI-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ±5 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MI-STD-202: 210A MI-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ±5 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MI-STD-202: 208D MI-STD-750: 2026 MI-STD-883: 2003 JIS C 7021: A-2