Wire to Board Insulation Displacement Connectors (1/5)
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1 Wire to Board Insulation Displacement Connectors (1/5) XSR 0.6mm pitch - IDC style 0.2A 30V SUR 0.8mm pitch - IDC style, Compact, Low-profile 0.5A (AWG#32) 0.2A (AWG#36) 30V This is the world's smallest 0.6mm pitch ID for discrete wires. This wire-to-board miniaturised has a mounting height of 1.45mm and depth of 3.0mm. The world's first 0.8mm pitch wire-to-board insulation displacement. ASR side-feed CS CSR??S/1.8A (AWG#27) CSH??S/2A (AWG#26) *Ultra-compact *Header is designed for vacuum pick and place robotics Secure locking structure Realization of multi-circuits by low insertion force Countermeasure for unexpected prying insertion CSR CSR??S/1.8A (AWG#27) SR/SZ - IDC style, Compact This is a 1.0mm pitch insulation displacement with the secure locking structure to prevent coming off the and incomplete mating. 1.8A in rated current was realized by using AWG#27. The various wide usage can be provided, since multi-idc-harnesses by automatic IDC machine, crimping, and header for wire to wire connection are available. *Compact design *The same shrouded header can be used for the SH crimp style.
2 Wire to Board Insulation Displacement Connectors (2/5) SSR - IDC style, Compact, Low-profile 0.5A CZ/CZW - IDC style, Space saving mountable 2A (AWG#26) *Compact design ZA (AWG#28) With the CZ receptacles and headers, and with double-row CZW holder and its mating headers, highly dense complicated harness design is possible. *CZ headers feature fully shrouded distortion resistant construction. *CZW s feature low insertion force i.e. only about 70N for 40-circuit combination. The CZW holder has friction locks to the securely held by the CZW header. ZF/ZFW (AWG#28) *Twin-slot ID section *Insulation barrel construction The insulation barrel located between the twin slots firmly grips the wire and protects it from movements due to the heat of soldering or due to handling right after soldering. This is a secure lock board-to-wire/insulation displacement for the first time in the industry, having the bearing force to unusual external force. ZR - IDC style, Compact (AWG#28) CK 2A (AWG#26) *The same shrouded header can be used for the ZH crimp style. Multi-harness of CK (2.0mm) and CZ (1.5mm) combination has been realized.
3 Wire to Board Insulation Displacement Connectors (3/5) CR 1.0A DA This is suitable for interconnection of UL1007 electric wires in a wide range of electrical and electronic equipment such as TVs. *The same shrouded header can be used for the KR/KRD insulation displacement s or the PH crimp style. DD/DS, Top entry, Wire side-feed *The board insertion section of the contact is resilient to ensure easy and secure insertion onto PC boards. *The DA is interchangeable with the SAN crimp style board-in in terms of insertion hole size and pitch. DR - IDC style, Space saving mountable *Compact and low profile Compliant locking solder tails *Strain relief *Low profile 5.0mm in mounting height. KR KRD - IDC style, Daisy chain connection *The same shrouded header can be used for the CR/KRD insulation displacement s or the PH crimp style. The KRD allows 'daisy chain connections' or 'through connections'. With these simple connections, many signals can be bussed to many different PC boards. *The same shrouded header can be used for the CR/KR insulation displacement s of the PH crimp style s.
4 Wire to Board Insulation Displacement Connectors (4/5) KRW - IDC style, Double-row PAF The KRW allows double-row wire-to-board connection using either the KR or PHN s. *Multi-IDC-harnesses are possible. *Various s of s In addition to the KRW, KR, PHN and TR s, there are other 2.0mm pitch s available such as the KRD, CR, DA, DD and DS ranges. DB 2 The first insulation displacement that has secure. *Secure prevents accidental disconnection. *Secondary retainers *The PAF receptacle has metal strain relieves to hold the wire insulation so that the external forces such as vibration or shock do not directly affect the ID section. HR (IDC ) - IDC style, Thin 2 *Locking solder tail *The DB has the same board layout and hose size as crimp style SCN. *Thin design *The same shrouded header can be used for the EH or HR crimp style. NR side-feed 2 NRD - IDC style, Daisy chain connection 2 *The same shrouded header can be used for the XH crimp style, the NRD and the BR insulation displacement s, and the JQ board-to-board. The NRD allows 'daisy chain connections' or 'through connections'. With these simple connections, many signals can be bussed to many different PC boards. *The same shrouded header can be used for the XH crimp style, the NR and the BR insulation displacement s, and the JQ board-to-board.
5 VR 3.96mm pitch side-feed 7A (AWG#18) 2 Wire to Board Insulation Displacement Connectors (5/5) Since the can accommodate AWG #18 wires and has a large pitch, it is ideal for connecting power supply circuits. *This receptacle can be used for both daisy chain (through) connections and end connections.
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