ATR35 Wafer Specification
|
|
- Erika Lang
- 5 years ago
- Views:
Transcription
1 ATR35 Wafer Specification SKW ASSOCIATES, INC Victor Court, Santa Clara, CA Tel: , Fax:
2 Sematech 754 Layout Sematech 754 Documentation Samsung dishing structure Sematech dishing structures The typical Sematech dishing structure used is the 100/100 array
3 ATR35 Description Reduction in critical dimensions Minimum metal line width: 60nm Via sizes down to 80nm ATR35 Capabilities Key BU s : All Via chains with up to ~10 million vias Via chain Guard rings ATR30 (trenches) 140nm ATR35 100nm M2 Expanded and improved set of reliability testers Guard rings added to prevent low-k moisture adsorption V1 M1 Structures down to 45nm node
4 ATR35 Layout Note the CMP test structures highlighted in light brown ATR35 Layout
5 ATR M1 Film Stack 800A +/- 100A Cu Seed A +/- 500A ECP (Total = 5.8KA) 2500A +/- 250 A Coral 500A +/- 50 A USG Cap 150A NDC + 250A ESL3 (Etch Stop) 10000A +/- 500A SiO2 100A TaN + 200A Ta Barrier CMP Target: Remove USG Cap + 200A Coral ATR35 only available with Coral films
6 ATR Process Flow (up to M1 CMP)
7 ATR Test Structures Topography test structures Fang test structures Electrical test structures
8 Typical CIC Profilometry Locations New profilometry recipe was created to measure large and small E-test comb/serp structures in addition to CMP test structures. New structures profiled: 1. CMB_SRP_LRL_M1 2. CMB_SRP_SRL_M1 CMP test structures profiled: 3. FANG1 single line structures 4. FANG2 small pitch arrays
9 Serp/Comb Scan Locations CMB_SRP_SRL_M1 DUTs 5 & 6 scanned (140x140 nm) CMB_SRP_LRL_M1 DUTs 11 & 12 scanned SERPs (140x140 nm, 180x180 nm)
10 CMB_SRP_SRL_M1 Surface Profile Scan EOE EOE
11 CMB_SRP_LRL_M1 Surface Profile Scan EOE EOE
12 CMP Test Structure Scan Locations FANG1 200 um FANG2 10um/ 10um 5um/ 5um 1um/ 1um 0.2um/ 0.2um 2um/ 2um 0.5um/ 0.5um
13 Topo Test Structures
14 M1 backbone 10um C M P C h a r a c t e r I z a t I o n S o l u t I o n s CMP Topo Tester (in place of via_chn_250_m3_upper) Probe Alignment structure ~250um space around all sections between sections M2 comb ~700um M2 comb.14 l/s (10 um backbone) Section # 250um space between sections M1 topo sections (750 um vertical trenches /spaces)
15 M1 topo C M P C h a r a c t e r I z a t I o n S o l u t I o n s ATR35 CMP Topo Tester (in place of via_chn_250_m3_upper) CMP Topography tester (replace via_chn_250_m3 in top portion) tester width (mm) mm space between sections M1 topo (no vias) M2 comb 140nm trench/140nm sp perpendicular to test for shorts (see ppt diagram) section trench space pitch metal tester x dim total x dim # repeats (nm) (nm) (nm) density (mm) (mm) y-dim (um) Use a scaled version of this pattern as the topo sections under combs/serps (CS topo) use horizontal trenches in these testers Section 1 750um long 250um Section 2
16 CMP_TOPO_Tester Metal 1 Metal 2 Pad 10um 9um/ 1um 2.25/ / µm 90um/ 90um 90um/ 10um 10um/ 10um 2.25um 2.25/ /0.25 No of Lines: Metal 2 COMB: 0.14 um / 0.14 um L/S
17 CMP Pad Tester left border left sections density trench space height pitch # repeats width left side testers 250 top border left space left space left space left bot border total 2000 Right side testers space (between lt & rt sect) right sections density trench space pitch # repeats width right border 234 space right space right space right space right space Large pad Get Topo vs. Pattern Density and Line Width
18 CMP Pads at Metal µm 0.2um/ 0.2um 1.8um/ 0.2um 9.8um/ 0.2um 500 µm 0.11um/ 1um 1um/ 1um 9um/ 1um 49um/ 1um 500 µm Dense and Iso pad structures
19 CMP Pad Testers 4 pads measured in 1 trace Profilometer traces
20 Fang Test Structures
21 CMP Fang Tester Diagram 120µm x 120µm bond pads, 155µm pitch M2 comb 0.20µm l/s, height of each 100µm 50µm A 100µm 50µm CMP topography structures 100µm 50µm B 100µm 50µm 950µm (max M1 structure 910µm) 100µm 50µm C 100µm 1300µm (max M1 structure 1200µm) Use A, B, C for fang structures 1, 2 and 3 Use B for fang structure 4
22 CMP Fang Testers Metal 2 COMBs over Metal Topography: Metal 2 COMB dimensions: 0.2 µm line / 0.2 µm space Metal 1 topography dimensions: see each page for detail. Metal 1 Metal 2 Pad
23 CMP Fang 1 Tester 200 um / 20 10/ 10 5/ 5 2/ 2 1/1 0.5/ /0.2 20/ 20 10/ 10 5/5 2/ 2 1/1 0.5/ /0.2 The unit is um.
24 CMP Fang 2 Tester 10um/ 10um 5um/ 5um 2um/ 2um 200 um 1um/ 1um 0.5um/ 0.5um 0.2um/ 0.2um 10um/ 10um 5um/ 5um 1um/ 1um 0.2um/ 0.2um 2um/ 2um 0.5um/ 0.5um
25 CMP Fang 3 Tester 90um/ 10um 45um/ 5um 18 um/ 2um 200um 9um/ 1um 4.5um/ 0.5um 1.8um/ 0.2um 90um/ 10um 45um/ 5um 18um/ 2um 9um/ 1um
26 CMP Fang 4 Tester 500 µm 500 µm
27 E-Test Structures
28 CMP Tester Layout Dummy Pattern Resistor (Cu line) Measure impact of dummy pattern on line resistance (dishing / erosion) Each device (DUTs) has different dummy pattern or line width
29 ATR35 - CMP Resistance Testers Pattern ~400um wide each side proximity resistor Voltage tap 1 device (6 variations + 1 VDP per test module)
30 ATR35 - CMP Resistance Testers Topo Pattern lines /spaces~200um wide each (in 1 m2 tester only) resistor Resistor to pattern space pattern space pattern trench Voltage tap 1 device (6 variations) + 1 VDP per test module)
31 ATR35 - M1 CMP Resistance Testers CMP_M1_a (replace CMP_m1_top section) length lines = 750um width in um width in um width in um width in um width in um width in um DR Description VDP DUT1 DUT2 DUT3 DUT4 DUT5 DUT6 1 Resistor line-width Resistor to pattern line spacing Pattern line-width Pattern spacing # pattern l/s on each side of resistor total width (um) resistor line length pattern density < VDP line width 10 iso fang dishing dishing CMP_M1_b (replace CMP_M3_ top section) DR Description VDP DUT1 DUT2 DUT3 DUT4 DUT5 DUT6 1 Resistor line-width Resistor to pattern line spacing Pattern line-width Pattern spacing # pattern l/s on each side of resistor total width (um) resistor line length pattern density < VDP line width 50 iso fang dishing dishing
32 ATR35 M2 CMP Resistance Testers CMP_M2_a (replace CMP_m2_top section) length lines = 750um width in um width in um width in um width in um width in um width in um DR Description VDP DUT1 DUT2 DUT3 DUT4 DUT5 DUT6 1 Resistor line-width Resistor to pattern line spacing Pattern line-width Pattern spacing # pattern l/s on each side of resistor total width (um) resistor line length pattern density <1 < VDP line width 10 iso iso fang fang dishing dishing CMP_M2_b - with underlying topo (replace CMP_M2 in bottom section) DR Description DUT1 DUT2 DUT3 DUT4 DUT5 DUT6 1 Resistor line-width Resistor to pattern line spacing Pattern line-width Pattern spacing # pattern l/s on each side of resistor total width (um) resistor line length pattern density M1 topo (l/s) - horizontal.2/.2 10/10 90/10.2/.2 10/10 90/10 10 VDP 50
33 CMP Pad Tester Diagram - different pattern in each pad Horizontal trenches spaces in each section Left border 1L 1R Right border Space between right sections 2L 2R Space between left and right sections 250um x 250 um pads
34 Recommended ATR35 Structure The structure on ATR35 which most closely matches the 100/100 structure on Sematech is the 90/90 structure Refer to slide 13
35 CMP_TOPO_Tester 90um/90um Line Profile
36 CMP_TOPO_Tester 90um/90um Line Profile
37 CMP_TOPO_Tester 90um/90um Line Profile
38 ATR35 Summary Design rules at 140nm and 90nm Multiple CMP test physical and electrical test structures
39 CMP_FANG1 Die Floor Plan um 20/20 10/10 5/5 2/2 1/1 0.5/ /0.2 20/20 10/10 5/5 2/2 1/1 0.5/ /0.2
40 CMP_FANG1 Row 1 Line Profile
41 CMP_FANG1 Row 1 Line Profile L1 L2 L3 L4 L5 L6 L7 L8 L9 L1 L L3 L L5 L6 L7 L8 L
42 CMP_FANG1 Die Floor Plan um 20/20 10/10 5/5 2/2 1/1 0.5/ /0.2 20/20 10/10 5/5 2/2 1/1 0.5/ /0.2
43 CMP_FANG1 Row 2 Line Profile
44 CMP_FANG1 Row 2 Line Profile A1 A1 A2 A2 A3 A4 A3 A4 A5 A5 A6 A6 A7 A7 A1 A1 A2 A2 A3 A3 A A4 A5 A5 A6 A6 A7 A7
45 CMP_FANG1 Die Floor Plan um 20/20 10/10 5/5 2/2 1/1 0.5/ /0.2 20/20 10/10 5/5 2/2 1/1 0.5/ /0.2
46 CMP_FANG1 Row 3 Line Profile
47 CMP_FANG1 Row 3 Line Profile A1 A1 A2 A2 A3 A3 A4 A5 A4 A5 A6 A6 A7 A7 A1 A1 A2 A2 A3 A3 A4 A4 A5 A5 A6 A6 A7 A
48 CMP_FANG2 Die Floor Plan 10um/ 10um 5um/ 5um 2um/ 2um 200 um 1um/ 1um 0.5um/0.5um 0.2um/ 0.2um 10um/ 10um 5um/ 5um 2um/ 2um 1um/ 1um 0.5um/ 0.5um 0.2um/ 0.2um
49 CMP_FANG2 Row 1 Line Profile
50 CMP_FANG2 Row 1 Line Profile Array 1 Array 1 Array 2 Array 2 Array 3 Array 3 Array 1 (A) Array 1 (A) Array 2 (A) Array 2 (A) Array 3 (A) Array 3 (A)
51 CMP_FANG2 Die Floor Plan 10um/ 10um 5um/ 5um 2um/ 2um 200 um 1um/ 1um 0.5um/0.5um 0.2um/ 0.2um 10um/ 10um 5um/ 5um 2um/ 2um 1um/ 1um 0.5um/ 0.5um 0.2um/ 0.2um
52 CMP_FANG2 Row 2 Line Profile
53 CMP_FANG2 Row 2 Line Profile Array 1 Array 1 Array 2 Array 2 Array 3 Array 3 Array 1 (A) Array 1 (A) Array 2 (A) Array 2 (A) Array 3 (A) Array 3 (A)
54 CMP_FANG2 Die Floor Plan 10um/ 10um 5um/ 5um 2um/ 2um 200 um 1um/ 1um 0.5um/0.5um 0.2um/ 0.2um 10um/ 10um 5um/ 5um 2um/ 2um 1um/ 1um 0.5um/ 0.5um 0.2um/ 0.2um
55 CMP_FANG2 Row 3 Line Profile
56 CMP_FANG2 Row 3 Line Profile A1 A1 A2 A2 A3 A3 A4 A4 A5 A5 A6 A6 A1 A1 A2 A2 A3 A3 A4 A4 A5 A5 A6 A
57 CMP_FANG3 Die Floor Plan 90um/ 10um 45um/ 5um 18um/ 2um 200 um 9um/ 1um 4.5um/ 0.5um 1.8um/ 0.2um 90um/ 10um 45um/ 5um 18um/ 2um 9um/ 1um
58 CMP_FANG3 Row 1 Line Profile
59 CMP_FANG3 Row 1 Line Profile Array 1 Array 1 Array 2 Array 2 Array 3 Array 3 Array 1 (A) Array 1 (A) Array 2 (A) Array 2 (A) Array 3 (A) Array 3 (A)
60 CMP_FANG3 Die Floor Plan 90um/ 10um 45um/ 5um 18um/ 2um 200 um 9um/ 1um 4.5um/ 0.5um 1.8um/ 0.2um 90um/ 10um 45um/ 5um 18um/ 2um 9um/ 1um
61 CMP_FANG3 Row 2 Line Profile
62 CMP_FANG3 Row 2 Line Profile Array 1 Array 1 Array 2 Array 2 Array 3 Array 3 Array 1 (A) Array 1 (A) Array 2 (A) Array 2 (A) Array 3 (A) Array 3 (A)
63 CMP_FANG3 Die Floor Plan 90um/ 10um 45um/ 5um 18um/ 2um 200 um 9um/ 1um 4.5um/ 0.5um 1.8um/ 0.2um 90um/ 10um 45um/ 5um 18um/ 2um 9um/ 1um
64 CMP_FANG3 Row 3 Line Profile
65 CMP_FANG3 Row 3 Line Profile Array 1 Array 1 Array 2 Array 2 Array 3 Array 3 Array 4 Array 4 Array 1 (A) Array 1 (A) Array 2 (A) Array 2 (A) Array 3 (A) Array 3 (A) Array 4 (A) Array 4 (A)
66 CMP_FANG4 Die Floor Plan 500 um 500 um
67 CMP_FANG4 Row 1 Line Profile
68 CMP_FANG4 Row 1 Line Profile (A) (A)
69 CMP Pads at Metal um 0.2um/ 0.2um 1.8um/ 0.2um 9.8um/ 0.2um 500 um 0.11um/ 1um 1um/ 1um 9um/ 1um 49um/ 1um 500 um
70 CMP Pads Row 1 Line Profile
71 CMP Pads Row 1 Line Profile Array 1 Array 3 Array 3 Array 4 Array 2 Array 2 Array 4 Array 1 (A) Array 2 (A) Array 2 (A) Array 3 (A) Array 3 (A) Array 4 (A) Array 4 (A)
72 CMP Pads at Metal um 0.2um/ 0.2um 1.8um/ 0.2um 9.8um/ 0.2um 500 um 0.11um/ 1um 1um/ 1um 9um/ 1um 49um/ 1um 500 um
73 CMP Pads Row 2 Line Profile
74 CMP Pads Row 1 Line Profile Array 3 Array 3 Array 4 Array 4 Array 1 Array 1 Array 2 Array 2 Array 1 (A) Array 1 (A) Array 2 (A) Array 2 (A) Array 3 (A) Array 3 (A) Array 4 (A) Array 4 (A)
75 CMP_M1_A C M P C h a r a c t e r I z a t I o n S o l u t I o n s CMP_M1_B 2 x L50 µm 2 x L50 µm Array L2.0 µm / S2.0 µm 4 x L90 µm / S10 µm Array L2.0 µm / S2.0 µm 4 x L90 µm / S10 µm 2 x L1.0 µm Array L10 µm / S10 µm 2 x L200 µm Square feature 2 x L1.0 µm Array L10 µm / S10 µm 2 x L200 µm CMP_M1_B and CMP_M1_A have same array dimensions. CMP_M1_B has a square feature, as is shown above, whereas CMP_M1_A does not. CMP_M1_A exhibits a greater amount of dishing after CMP, as is shown on the following pages.
76 2 x L50 um Structure 2 x L50 µm Array L2.0 µm / S2.0 µm 4 x L90 µm / S10 µm CMP_M1_A 2 x L50 Profile CMP_M1_A shows 18% more dishing Array L10 µm / S10 µm 2 x L1.0 µm 2 x L200 µm Note: Graphs not to scale CMP_M1_B 2 x L50 Profile
77 4 x L90 / S10 um Structure 2 x L50 µm Array L2.0 µm / S2.0 µm 4 x L90 µm / S10 µm Array L10 µm / S10 µm CMP_M1_A 2 x L90/S10um Profile CMP_M1_A shows 11% more dishing than CMP_M1_B 2 x L1.0 µm 2 x L200 µm Note: Graphs not to scale CMP_M1_B 2 x L90/S10um Profile
78 2 x L200 um Structure 2 x L50 µm Array L2.0 µm / S2.0 µm 4 x L90 µm / S10 µm Array L10 µm / S10 µm CMP_M1_A 2 x L200 Profile CMP_M1_A shows 22% more dishing than CMP_M1_B 2 x L1.0 µm 2 x L200 µm Note: Graphs not to scale CMP_M1_B 2 x L200 Profile
79 L10 µm/ S10 µm Array Structure 2 x L50 µm Array L2.0 µm / S2.0 µm 4 x L90 µm / S10 µm Array L10 µm / S10 µm CMP_M1_A L10um/S10um Profile CMP_M1_A shows 18% more dishing than CMP_M1_B 2 x L1.0 µm 2 x L200 µm Note: Graphs not to scale CMP_M1_B L10um/S10um Profile
Contact cleaning opportunities on single wafer tool
Contact cleaning opportunities on single wafer tool 1 L. Broussous a, 1 S.Zoll, 2 H.Ishikawa, 2 F.Buisine, 2 A.Lamaury, 1 STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles, France 2 SCREEN SPE Germany
More informationContacting various metal compositions using ViProbe Vertical Technology
Denis Deegan Analog Devices Inc Simon Allgaier Feinmetall GmbH Contacting various metal compositions using ViProbe Vertical Technology June 6 to 9, 2010 San Diego, CA USA Content Motivation. ViProbe Vertical
More information300mm Wafer Electroless Bumping
300mm Wafer Electroless Bumping T. Teutsch, E. Zakel, T. Oppert Internepcon 2005 January 19, 2005 Tokyo Big Sight, Japan Pac Tech GmbH Outline Short Company Profile Introduction Electroless Ni/Au Under
More informationProbing Process Analysis and Continuous Improvement. John Strom Applied Precision Inc. (425)
Probing Process Analysis and Continuous Improvement John Strom Applied Precision Inc. (425) 557-1000 jstrom@api.com Pg1 June 12, 2000 Overview Analyze the current probing process Present technique for
More informationEutectic Sn/Pb Fine-Pitch Solder Bumping and Assembly for Rad-Hard Pixel Detectors
Eutectic Sn/Pb Fine-Pitch Solder Bumping and Assembly for Rad-Hard Pixel Detectors Alan Huffman MCNC Advanced Packaging and Interconnect Sept 11, 2002 Outline MCNC Overview Solder Bumping Overview Fermilab
More informationInterface-Unit (SIU) Design Methods for Reducing Burn Rates on Tight-Pitch C4 Logic Arrays
Intel Sort-Interface Interface-Unit (SIU) Design Methods for Reducing Burn Rates on Tight-Pitch C4 Logic Arrays Kip Stevenson and Pooya Tadayon Intel Corporation Problem Statement! Logic Test Challenge:
More informationAdvances in MEMS Spring Probe Technology for Wafer Test Applications
Advances in MEMS Spring Probe Technology for Wafer Test Applications Author & Presenter, Koji Ogiwara Nidec SV TCL Tokyo, Japan Co-Author, Norihiro Ohta Nidec-Read Corporation Kyoto, Japan Overview Why
More informationDesigning for Cost Effective Flip Chip Technology
Designing for Cost Effective Flip Chip Technology Jack Bogdanski White Electronic Designs Corp. Designing For Cost Effective Flip Chip Technology Bump and fl ip approaches to semiconductor packaging have
More informationKeeping Your CMP Slurry From Being A Pain in the As-Probed Die Yield. Robert L. Rhoades (Entrepix) Brian Orzechowski and Jeff Wilmer (DivInd, LLC)
Keeping Your CMP Slurry From Being A Pain in the As-Probed Die Yield Robert L. Rhoades (Entrepix) Brian Orzechowski and Jeff Wilmer (DivInd, LLC) Presentation for the Levitronix Conference February 10,
More information"Fusion Cuisine" Hybrid Technologies to address MEMS sensors, Magnetics and High Voltage Probing
"Fusion Cuisine" Hybrid Technologies to address MEMS sensors, Magnetics and High Voltage Probing Georg Franz, Dr. Rainer Gaggl T.I.P.S. Messtechnik GmbH Overview Probing Sensors Pressure Sensors Pressurized
More informationArcing prevention by dry clean optimization at Shallow Trench Isolation (STI) Etch in AMAT MxP by use of plasma parameters
Page 1 Arcing prevention by dry clean optimization at Shallow Trench Isolation (STI) Etch in AMAT MxP by use of plasma parameters www.tu-cottbus.de www.infineon.com 2 nd AEC/ Conference Europe, April 18
More informationSurface MEMS Design Examples Dr. Lynn Fuller Webpage:
ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING Surface MEMS Design Examples Webpage: http://people.rit.edu/lffeee 82 Lomb Memorial Drive Rochester, NY 14623-5604 Tel (585) 475-2035 Email:
More informationPlatinum-chip Temperature Sensors in SMD Design Type According to DIN EN 60751
Data Sheet 906125 Page 1/5 Platinum-chip Temperature Sensors in SMD Design Type According to DIN EN 60751 Design type PCS/PCF For temperatures from -50 to +150 C (-70 to +250 C) In accordance with DIN
More informationA Trace-Embedded Coreless Substrate Technique
A Trace-Embedded Coreless Substrate Technique Chang-Yi(Albert) Lan, 藍章益 SPIL (Siliconware Precision Industries Co., Ltd) No. 153, Sec. 3, Chung Shan Rd, Tantzu Dist, Taichung, Taiwan, R.O.C. Outline Introduction
More informationyard each of the following prints:
SHOPPING LIST: Finished size approx. 85" x 96" yard each of the following prints: PWTP034 AQUA PWTP033 AQUA PWTP031 AQUA PWTP030 AQUA PWTP035 AQUA PWTP029 AQUA PWTP036 SEAWEED PWTP035 SEAWEED PWTP029 SEAWEED
More informationFrank Pietzschmann (IFX) James Andersen (APLLC)
The probe card signature syndrome or who has the old maid Frank Pietzschmann (IFX) James Andersen (APLLC) Dresden, June 2005 N e v e r s t o p t h i n k i n g. 1 Yield Monitoring Software How to find the
More informationJet Dispensing Underfills for Stacked Die Applications
Jet Dispensing Underfills for Stacked Die Applications Steven J. Adamson Semiconductor Packaging and Assembly Product Manager Asymtek Sadamson@asymtek.com Abstract It is not uncommon to see three to five
More informationCOSASCO Corrosion under Insulation (CUI) Corrosion Sensors
COSASCO Corrosion under Insulation (CUI) Corrosion Sensors Features: Low cost, easy to install corrosion sensors Detects corrosion at pipe surface Three sensor types to choose from No removal of insulation
More informationKelvin Testing Using a GHz socket for MLF/QFN packages
Kelvin Testing Using a GHz socket for MLF/QFN packages A measurement method called Kelvin probing for measuring resistance allows very accurate measurement of milliohm or sub-milliohm resistance. To accomplish
More information0.3 mm Pitch, 1.0 mm Height FPC Connector
0.3 mm Pitch, 1.0 mm Height FPC Connector FH26 Series Space saving(51 pos. shown) 1.0mm 3.2mm.8mm Metal fittings do no protrude outside of the connector body Features 1. Low-profile 0.3 mm pitch FPC connector
More informationBenefits of Flip Chip Wafer Sort using MEMs Multi Site Capability
Lo Wee Tick, GLOBALFOUNDRIES Pascal Pierra and Robert Murphy, FormFactor Benefits of Flip Chip Wafer Sort using MEMs Multi Site Capability Lessons learnt June 6 to 9, 2010 San Diego, CA, USA Outline The
More informationCreative Links to World Electronics
Interconnect Solutions for Lighting Creative Links to World Electronics Hirose Wire-to-Board Connectors Hirose s interconnect products offer innovation, versatility and low profiles for your LED engineered
More informationMPC8271/MPC8272/ MPC8247/MPC8248 Product Information:
Qualification Report MPC8271, MPC8272, MPC8247, MPC8248 ATMC(MOS 13) HiP7AP 516 PBGA PowerQUICC II Communications Processor MPC8271/MPC8272/ MPC8247/MPC8248 Product Information: Package Mask Set Die Coating
More informationAdvanced Technique for Si 1-x Ge x Characterization: Infrared Spectroscopic Ellipsometry
Advanced Technique for Si 1-x Ge x Characterization: Infrared Spectroscopic Ellipsometry Richard Sun Angstrom Sun Technologies Inc., Acton, MA Joint work with Darwin Enicks, I-Lih Teng, Janice Rubino ATMEL,
More informationBEST PRACTICES REPORT. Tank Car Lessee PROJECT OVERVIEW: Industrial Customer: A chemical company.
NANO-CLEAR INDUSTRIAL FLUOROPOLYMER COATING WATER FOR TANK FEATURE CAR CENTER PROTECTION BAND After NCI Tank Car Lessee Industrial Customer: A chemical company. Project: Top coat the center band of tank
More informationFlexible Hybrid Systems: High Performance CMOS with Printed Electronics
Flexible Hybrid Systems: High Performance CMOS with Printed Electronics Defense Manufacturing Conference November 26, 2012 Rich Chaney Approved for Public Release www.americansemi.com Flexible Hybrid System
More informationUniversity Of Oregon Additional Specifications
University Of Oregon Additional Specifications 13.1.1 Beam current stability 0.1% or less per hour (+/- 0.05%) and 0.6% or less per 12 hours (+/- 0.3%) and 1.0% or less in 24 hours (+/- 0.5%) as measured
More informationGN002 Application Note Thermal Design for GaN Systems Top-side cooled GaNPX -T packaged devices
GN002 Application Note Thermal Design for GaN Systems Top-side cooled GaNPX -T packaged devices Updated on April 3, 2018 GaN Systems 1 Application Note Outline The Basics - Our top side cooled GaNPX -T
More informationINTERNATIONAL 300 mm INITIATIVE
INTERNATIONAL 300 mm INITIATIVE 300 mm Test Wafer Specifications for 0.25 µm Technology International 300 mm Initiative I300I and the I300I logo are registered service marks of International 300 mm Initiative,
More informationIME TSI Consortium Industry Forum
Institute of Microelectronics IME TSI Consortium Industry Forum 2.5D Heterogeneous Integration on Through Silicon Interposers 17 th August 2012 1 IME Industry Forum on 2.5D Through Si Interposer (TSI)
More informationOverview of SOI development (from the HEP perspective)
Overview of SOI development (from the HEP perspective) International workshop on CEPC, 6-8 Nov. 2017, Beijing Yunpeng Lu on behalf of SOIPIX collaboration Outline Concept of SOI pixel sensor Technology
More informationForce Sensing Resistor Technical Guidelines Rev 0 ( ) by M. Wagner
Force Sensing Resistor Technical Guidelines Rev 0 (02-24-14) by M. Wagner The Force-Sensing-Resistor (FSR) is made of a proprietary carbon-based piezoresistive ink, typically screen printed on polyester
More informationYour Super Pillar MCPCB Thermal Management Solution Supplier.
CofanUSA 46177 Warm Springs Blvd. Fremont CA 94539 1-877-228-3250 www.cofan-usa.com CofanCanada 2900 Langstaff Rd. #18 Vaughan, ON. L4K 4R9 Canada 1-877-228-3250 www.cofan-pcb.com Contents 1. Super Pillar
More informationFP1008R5 and FP1008R6 High frequency, high current power inductors
Technical Data 152 Effective April 217 FP18R5 and FP18R6 High frequency, high current power inductors Applications Multi-phase and Vcore regulators Voltage Regulator Modules (VRMs) and high power density
More informationNon-volatile STT-RAM: A True Universal Memory
Non-volatile STT-RAM: A True Universal Memory Farhad Tabrizi Grandis Inc., Milpitas, California August 13 th, 2009 Santa Clara, CA, USA, August 2009 1 Outline Grandis Corporation Overview Current Flash
More informationBridgelux Vero SE 29 Array Series. Product Data Sheet DS123
Bridgelux Vero SE 29 Array Series Product Data Sheet DS123 1 Introduction Vero SE Vero SE is a revolutionary light source system that integrates Bridgelux s seventh generation COB technology with poke-in
More informationBridgelux Vero SE 29 Array. Product Data Sheet DS123
Bridgelux Vero SE 29 Array Product Data Sheet DS123 1 Introduction Vero SE Vero SE is a revolutionary light source system that integrates Bridgelux s seventh generation COB technology with poke-in connectivity
More informationMotor Driver PCB Layout Guidelines. Application Note
AN124 Motor Driver PCB Layout Guidelines Motor Driver PCB Layout Guidelines Application Note Prepared by Pete Millett August 2017 ABSTRACT Motor driver ICs are able to deliver large amounts of current
More informationCrimpmate Range pitch 5.00
Contents pitch. pitch. pitch. Male and female connectors with solder connection. Male and female connectors with crimp connection. Crimp contacts..1 pitch. RSV 1. S Derating curve RSV1. S SN Rectangular
More information2015 June NEW PRODUCTS / MAXXIMA. Hybrid LightningS PAGE 5 Low Profile 4 PAGE 2 MWL-31SP PAGE 3 M20344 PAGES 6
2015 June NEW PRODUCTS Hybrid LightningS PAGE 5 Low Profile 4 PAGE 2 MWL-31SP PAGE 3 M20344 PAGES 6 PANOR CORP/MAXXIMA 125 Cabot Court, Hauppauge, NY 11788 USA Tel: 631.434.1200 1.866.MAXXIMA Fax: 631.952.0349
More informationBridgelux Vero SE 29 Array Series. Product Data Sheet DS123
Bridgelux Vero SE 29 Array Series Product Data Sheet DS123 1 Introduction Vero SE Vero SE is a revolutionary light source system that integrates Bridgelux s seventh generation COB technology with poke-in
More informationProduct Management, ABB Robotics
ABB ROBOTICS IRB 1100 Product Management, ABB Robotics September Outline Overview Features Advantages and benefits Targeted industry Main dimensions Outline manipulator Easy integration Specifications
More informationSeries CP95. Profile Design ISO/VDMA Air Cylinder. Increased kinetic energy absorption. Improved end of stroke cushion capacity
Profile Design ISO/VDMA Air Cylinder Series CP95 Improved end of stroke cushion capacity Piston rod lurching has been eliminated at the end of stroke positions by means of a floating seal mechanism. Increased
More informationONICON Insertion Turbine Flow Meters Single Turbine vs. Dual Turbine Selection Criteria
ONICON Insertion Turbine s Single Turbine vs. Dual Turbine Selection Criteria The purpose of this guide is to provide customers and specifying engineers with information about how to choose between ONICON's
More informationReRAM Technology, Versatility, and Readiness
ReRAM Technology, Versatility, and Readiness Hagop Nazarian VP of Engineering & Cofounder Santa Clara, CA 1 Introduction to ReRAM ReRAM Technology Attributes Scalability Ease of integration with CMOS Architectural
More information06. har-mik INTERFACE CONNECTORS
. INTERFACE CONNECTORS Miniature D connectors are a must in various cableto-board applications where space saving and high data transfer rates are required. For the purposes of miniaturization and speed,
More informationALS20000 Series. Mechanical Bearing, Linear Motor Stage. Protective metal waycover. Integral cable management system
ALS20000 Series Mechanical Bearing, Linear Motor Stage Protective metal waycover Integral cable management system Ideally suited for clean-room applications Compact, high-performance, linear motor stage
More informationSE 300 Solder Paste Inspection System Gauge Repeatability and Reproducibility Procedure and Results
SE 300 Solder Paste Inspection System Gauge Repeatability and Reproducibility Procedure and Results Background Any time a process is measured there is some variation. This variation comes from two sources:
More informationAutomotive. 3M Dual Lock Reclosable Fasteners with Pressure Sensitive Adhesive
4 Automotive Technical Data Sheet November 2012 3M Dual Lock Reclosable Fasteners with Pressure Sensitive Adhesive General Description 3M Dual Lock Reclosable Fastening Systems are positive-locking, blind
More informationDevices and their Packaging Technology
4 th Workshop Future of Electronic Power Processing and Conversion Devices and their Packaging Technology May 2001 Werner Tursky SEMIKRON ELEKTRONIK GmbH Nuremberg, Germany 1 1. Devices 2. From Discrete
More informationMPC8270, MPC8275, MPC8280 Product Information:
Rev A Qualification Report MPC8270, MPC8280 ATMC HiP7AP 480 TBGA 516 PBGA PowerQUICC II Communications Processor MPC8270, MPC8275, MPC8280 Product Information: Product / Technology / Fab / Package Description
More informationEmbedded Components: A Comparative Analysis of Reliability
Embedded Components: A Comparative Analysis of Reliability Christopher Michael Ryder AT&S Leoben, Austria Abstract In light of new process and product technologies in the field of embedded components,
More informationMini-MAG Positioning Products
Mini-MAG Positioning Products Miniature Linear Stage The Mini-MAG (MMX) line of miniature linear stages blends the ultimate in performance, reliability, and value, delivering nearly twice the accuracy
More informationMTU1 Series Isolated 1W Single & Dual Output SM DC/DC Converters
www.murata-ps.com MTU1 Series SELECTION GUIDE FEATURES Patent Protected UL60950 recognised Footprint over pins 0.69cm 2 Single & dual isolated output 1kVDC Isolation Hi Pot Test Efficiency up to 88% (Typ.)
More information74x Series Chip Resistor Arrays
Features Low Cost Thick Film Technology Leadless Surface Mount Construction Concave Convex Terminations Solder Coated Nickel Barrier Pads Isolated and Bussed Circuit Configurations Improved TCR Tracking
More informationALS20000 Series. Mechanical Bearing, Linear Motor Stage. Protective metal waycover. Integral cable management system
ALS20000 Series Mechanical Bearing, Linear Motor Stage Protective metal waycover Integral cable management system Ideally suited for clean-room applications Compact, high-performance, linear motor stage
More informationAutomotive Micro and Mild Hybrids
Vishay Intertechnology, Inc. Automotive Micro and Mild Hybrids www.vishay.com One of the World s Largest Manufacturers of Discrete Semiconductors and Passive Components Micro and Mild Hybrids Integrated
More informationProduct Specification YEEMMP98 Series
YEG Opto LED Panel The YEG Opto LED panel incorporates an array of Samsung MP23 mid power LEDs to provide various light intensity outputs depending upon the constant current driver rating. The panel is
More informationMounting Instruction for M629 Package (EconoPACK TM + Module)
Mounting Instruction for M629 Package (EconoPACK TM + Module) CONTENTS Page 1. Mounting 1 2. Main terminal connection 3 3. PCB fixed on the module 3 This manual describes the recommended method to install
More informationVersatile Z-Axis Interconnection-Based Coreless Technology Solutions for Next Generation Packaging
Versatile Z-Axis Interconnection-Based Coreless Technology Solutions for Next Generation Packaging R.N. Das, F.D. Egitto, J. M. Lauffer, Evan Chenelly and M. D. Polliks Endicott Interconnect Technologies,
More informationACTUATOR LA30 PRODUCT DATA SHEET
PRODUCT DATA SHEET ACTUATOR LA3 Features: 12/24V DC permanent magnet motor Max. thrust up to 6 N (LA3LK) Stainless steel piston rod Elegant and compact construction with small installation dimensions Protection
More information3M Textool Test and Burn-In Sockets for 1.0 mm Area Array Packages Including Ball Grid Array and Land Grid Array
3M Textool Test and Burn-In Sockets for 1.0 mm Area Array Packages Including Ball Grid Array and Land Grid Array 1.0 mm Pitch Socket Platforms Socket Max. Package Maximum Max. Pin Lid Series Product Number
More informationPrecision Modules PSK
Precision Modules PSK 2 Bosch Rexroth AG Precision Modules PSK R999000500 (2015-12) Identification system for short product names Short product name Example:: P S K - 050 - N N - 1 System = Precision Module
More informationPreliminary Results of 25 ns Test Beam on Florence Detector. Simone Busoni - INFN Firenze for CMS Florence group
Preliminary Results of ns Test Beam on Florence Detector Simone Busoni - INFN Firenze for CMS Florence group S. Busoni INFN e Universita di Firenze CMS week June 2 Florence wedge detector Milestone detector
More informationPower-Limiting Cables
Power-Limiting Cables This section provides general design guidelines for power-limiting heat-tracing systems installed on insulated metal pipes. For other applications or design assistance, contact your
More informationbrochure PN
brochure PN-2013-01 www.bitorq.com/pneumatic.html Pneumatic Actuators PAGES 4-11 ON THE WEB AT BITORQ.COM/PNEUMATIC_PN.HTML COMPACT, RELIABLE DESIGN OPEN-CLOSED ADJUSTMENT STOPS DOUBLE ACTING AND SPRING
More informationAutomotive Technology
Automotive Technology Advanced Technology for Automotive Applications Design, Manufacture & Test www.cmac.com C-MAC MicroTechnology is a leader in the manufacture and test of complex, high-reliability
More informationPage : 1 of 16. FIELD OF TESTING : Calibration and Measurement CALIBRATION & MEASUREMENT CAPABILITY EXPRESSED AS AN UNCERTAINITY *
Metrix Precision Pte Ltd Certificate No. : LA-2014-0581-C No. 23 Tagore Lane #02-03/04 Tagore 23 Warehouse Issue No. : 2 Singapore 787601 Date : 29 July 2016 FIELD OF TESTING : Calibration and Measurement
More informationRobot Leg Motion in a Planarized-SOI, 2-Poly Process Hilton Head 2002
Robot Leg Motion in a Planarized-SOI, 2-Poly Process Hilton Head 2002 Seth Hollar, Dr. Anita Flynn, Sarah Bergbreiter, Professor Kris Pister Berkeley Sensor and Actuator Center, UC Berkeley Acknowledgements
More informationALD3 Diaphragm Valve Technical Report
ALD Diaphragm Valve Technical Report Scope This technical report provides data on Swagelok ALD normally closed diaphragm valves. The report covers: helium seat leak testing valve flow consistency analysis
More informationACTUATORS POSITION SENSOR
POSITION SENSOR 1 2 SUMMARY P INTRODUCTION PAGE 4 P LTS POSITION SENSOR PAGE 5 P LTL POSITION SENSOR PAGE 9 SUMMARY P LTE POSITION SENSOR PAGE 12 3 INTRODUCTION INTRODUCTION Magnetic position sensors are
More informationThermal Characterization and Modeling: a key part of the total packaging solution. Dr. Roger Emigh STATS ChipPAC Tempe, AZ
Thermal Characterization and Modeling: a key part of the total packaging solution Dr. Roger Emigh STATS ChipPAC Tempe, AZ Outline: Introduction Semiconductor Package Thermal Behavior Heat Flow Path Stacked
More informationWind Turbine Emulation Experiment
Wind Turbine Emulation Experiment Aim: Study of static and dynamic characteristics of wind turbine (WT) by emulating the wind turbine behavior by means of a separately-excited DC motor using LabVIEW and
More informationDescription The APR SRS-CALKIT is a thermal calibration kit for the APR Scorpion Rework System. It is compatible with the following item numbers:
3651 WALNUT AVENUE, CHINO CA 91710 PHONE (909) 664-9980 APR-Rework.com SRS CALKIT Description The APR SRS-CALKIT is a thermal calibration kit for the APR Scorpion Rework System. It is compatible with the
More informationSURFACE TOPOGRAPHY ANALYSIS OF PRECISION ASSEMBLIES OF FUEL INJECTOR NOZZLES
SURFACE TOPOGRAPHY ANALYSIS OF PRECISION ASSEMBLIES OF FUEL INJECTOR NOZZLES Andrzej Miszczak, Wojciech Labuda, Maciej Grondecki Gdynia Maritime University, Faculty of Marine Engineering Morska Street
More information/2008 Altivar 12P Baseplate variable speed drives for asynchronous motors Installation manual 09/2009 V28587 B B
2354235 11/2008 Altivar 12P Baseplate variable speed drives for asynchronous motors Installation manual 09/2009 BBV28587 www.schneider-electric.com Contents Important Information 4 Before you begin 5
More informationMultiGig RT Product Family Slot Pitch Density Data Rate RT lines/inch Gbps lines/inch Gbps RT lines/inch 6.50 Gbp
1 MultiGig RT Assembly! # # "$#! MultiGig RT Product Family Slot Pitch Density Data Rate RT1 0.8 113 lines/inch 3.125 Gbps 1.0 141 lines/inch 3.125 Gbps RT2 0.8 85 lines/inch 6.50 Gbps* 1.0 113 lines/inch
More informationA Novel Non-Solder Based Board-To-Board Interconnection Technology for Smart Mobile and Wearable Electronics
A Novel Non-Solder Based Board-To-Board Interconnection Technology for Smart Mobile and Wearable Electronics Sung Jin Kim, Young Soo Kim*, Chong K. Yoon*, Venky Sundaram, and Rao Tummala 3D Systems Packaging
More informationSECTION Front Drive Axle/Differential
205-03-i Front Drive Axle/Differential 205-03-i SECTION 205-03 Front Drive Axle/Differential CONTENTS PAGE Axle... 205-03-2 205-03-2 Front Drive Axle/Differential 205-03-2 Axle Special Tool(s) C-Frame
More informationSELECTION GUIDE. Nominal Input Voltage. Output Voltage. Input Current. Input reflected ripple current
SELECTION GUIDE FEATURES Patents pending Lower Profile UL9 Recognition pending ANSI/AAMI ES1-1 Recognition pending 3kVDC Isolation Hi Pot Test Substrate Embedded Transformer Automated Manufacture Industry
More informationSELECTION GUIDE. Nominal Input Order Code Voltage. Output Voltage. Reflected ripple current
www.murata-ps.com NML Series FEATURES RoHS compliant Single isolated output 1kVDC isolation Efficiency up to 85% Wide temperature performance at full 2 watt load, 40 C to 85 C Power density 2.01W/cm 3
More informationBridgelux Gen 7 Vero 29 Array. Product Data Sheet DS93
Bridgelux Gen 7 Vero 29 Array Product Data Sheet DS93 1 Introduction Vero Series Vero Series is a revolutionary advancement in chip on board (COB) light source technology and innovation. Vero LED light
More informationA fully integrated 3 phase IGBT switching assembly with a very low loss DC Link Capacitor -- Ed Sawyer, SBE Inc. Scott Leslie, Powerex Inc.
A fully integrated 3 phase IGBT switching assembly with a very low loss DC Link Capacitor -- Ed Sawyer, SBE Inc. Scott Leslie, Powerex Inc. Thermal characteristics of the Power Ring shape SBE has conducted
More informationNORTHERN ILLINOIS UNIVERSITY PHYSICS DEPARTMENT. Physics 211 E&M and Quantum Physics Spring Lab #6: Magnetic Fields
NORTHERN ILLINOIS UNIVERSITY PHYSICS DEPARTMENT Physics 211 E&M and Quantum Physics Spring 2018 Lab #6: Magnetic Fields Lab Writeup Due: Mon/Wed/Thu/Fri, March 5/7/8/9, 2018 Background Magnetic fields
More informationLarge Area and Fine Pitch testing using Silicon Micro-cantilever
Large Area and Fine Pitch testing using Silicon Micro-cantilever June 3 rd 2003 Kim, DONG IL Tel : +82-31-217-6168 Fax : +82-31-217-6169 E-mail : dikim@amst.co.kr Contents 1. Company Introduction 2. Silicon
More informationSi trim applications: benefits and challenges
Si trim applications: benefits and challenges SPCC, April 2, 2019 S. Kal 1, Y. Oniki 2, C. Alix 1, E. Liu 1, K. Pillai 1, D. Chanemougame 1, F. Holsteyns 2, A. Mosden 1, K. Kumar 1, P. Biolsi 1, T Hurd
More informationHigh Current, High Frequency Power Inductors HCM1103 Series
High Current, High Frequency Power Inductors HCM1103 Series HALOGEN HF FREE Pb Description Halogen free, lead free, RoHS compliant 125 C maximum total temperature operation 11.5 x 10.3 x 3.0mm maximum
More informationGLASS TRANSITION TEMPERATURE (Tg) 65 C >2, , C >2, , C >2, , C 1, ,918 1.
epotek.com Optical Epoxy Technology s extensive line of optical adhesives is used for bonding and coating in many applications; most commonly in fiberoptics. Our epoxy adhesives are frequently used to
More informationAdvanced Topics. Packaging Power Distribution I/O. ECE 261 James Morizio 1
Advanced Topics Packaging Power Distribution I/O ECE 261 James Morizio 1 Package functions Packages Electrical connection of signals and power from chip to board Little delay or distortion Mechanical connection
More informationDesign-Technology Co-Optimization for 5nm Node and Beyond
Design-Technology Co-Optimization for 5 Node and Beyond Semicon West 26 Victor Moroz July 2, 26 Why Scaling? When What scales? When does it end? 965 999 2 Moore s Law (Fairchild): Double transistor density
More informationBridgelux Vero 29 Array Series. Product Data Sheet DS93
Bridgelux Vero 29 Array Series Product Data Sheet DS93 1 Introduction Vero Vero represents a revolutionary advancement in chip on board (COB) light source technology and innovation. Vero LED light sources
More informationOIP Transformer Outdoor Bushings Type COT(C) 125 COT (C) kV to 550kV up to 5000A IEC
OIP Transformer Outdoor Bushings Type COT(C) 125 COT (C) 1800 24kV to 550kV up to 5000A IEC 60137-2008 Features If you need any transformer bushing proven in operation conditions around the world, Trench
More informationOverview of Magnetic Measurement Activities at SLAC National Accelerator Lab (SLAC)
Overview of Magnetic Measurement Activities at SLAC National Accelerator Lab (SLAC) Scott Anderson, Ralph Colon, Scott Jansson, Dave Jensen, Yuri Levashov, Zachary Wolf 17 th International Magnetic Measurement
More information9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :
9 rue Alfred Kastler - BP 10748-44307 Nantes Cedex 3 - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr July 2009 - Version 1 Written by: Romain FRAUX DISCLAIMER
More informationMagnetic-inductive flow meter EPS / UMF2. Technical data sheet
Magnetic-inductive flow meter EPS / UMF2 Technical data sheet high accuracy: 0.3 % of actual maintenance-free no pressure drop numerous lining materials numerous electrode materials low-cost grounding
More informationGROUNDING & BONDING PRODUCTS
GROUNDING & BONDING PRODUCTS Busbars Page 5-3 Insulators Page 5-8 Grounding Products Page 5-9 Compression Tools, Lugs & Taps Page 5-14 Learn About CPI s Extended Limited Warranties for coverage of (2)
More informationLow-Profile, Shielded Drum Core, Tapped Inductor SDT30 Series
Low-Profile, Shielded Drum Core, Tapped Inductor SDT0 Series SMD Device Description Halogen Free Approved for use with Maxim MAX45 chip set 5 C maximum total temperature operation. x. x.0mm shielded drum
More informationBuilding Innovative and Successful Industrial Scale Biomass Supply Chain Solutions Sam Jackson May 15, 2014
Building Innovative and Successful Industrial Scale Biomass Supply Chain Solutions Sam Jackson May 15, 2014 Company Overview Privately held biomass supply solutions company based in Vonore, TN Bringing
More informationThe ITk strips tracker for the phase-ii upgrade of the ATLAS detector of the HL-LHC
The ITk strips tracker for the phase-ii upgrade of the ATLAS detector of the HL-LHC Afroditi Koutoulaki on behalf of the ATLAS Collaboration 14th Topical Seminar on Innovative Particle and Radiation Detectors
More informationInstallation design data for the 500SFK series fuse
Installation design data for the 500SFK series fuse 1. Recommended mounting hole pitch More than 2 Reference value Land Hole 2. Temperature rise Fuse temperature changes according to the width of the pattern
More information