Flexible Hybrid Systems: High Performance CMOS with Printed Electronics

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Clarence Barnett
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1 Flexible Hybrid Systems: High Performance CMOS with Printed Electronics Defense Manufacturing Conference November 26, 2012 Rich Chaney Approved for Public Release

2 Flexible Hybrid System What is that? 2012 American Semiconductor, Inc. All rights reserved. 2 Fly-by-Feel: Conformal Structural Integration Performance Ruggedness Durability Pressure Sensor Strain Gauge LNA Antenna ADC µctrl Printed Electronics Low Cost, R2R, Large Format Data Bus Flexible Hybrid System Combination of flexible printed materials and flexible siliconbased ICs to create a new class of flexible electronics. Flexible ICs High Performance, High Density

Bearing Antenna Structure 3 Pressure Sensor AFRL/RBSA

LNA ADC µctrl Data Bus CLAS: Airframe Integration

Connector Right Configurable Array Center Array Left

3 2012 American Semiconductor, Inc. All rights reserved. Flexible Hybrid System Application Conformal Load Bearing Antenna Structure 3 Pressure Sensor AFRL/RBSA CLAS Phase I SBIR FA M-3219 Strain Gauge Antenna LNA ADC µctrl Data Bus CLAS: Airframe Integration Traditional ICs Flexible Reconfigurable Antenna SMA Connector Right Configurable Array Center Array Left Configurable Array CLAS: Antenna Integration in Structural Composite Ground Plane

IC FleX Pressure Sensor Strain Gauge LNA Antenna ADC µctrl Flexible

4 2012 American Semiconductor, Inc. All rights reserved. Flexible Hybrid System Concept to Product 4 IC Design IC Fabrication IC FleX Pressure Sensor Strain Gauge LNA Antenna ADC µctrl Flexible Hybrid Integration Printed Circuits & Sensor Design Printed Electronics Fabrication

5 2012 American Semiconductor, Inc. All rights reserved. Flexible Hybrid System Concept to Product 5 IC Design IC Fabrication IC FleX Pressure Sensor Strain Gauge LNA Antenna ADC µctrl Flexible Hybrid Integration Printed Circuits & Sensor Design Printed Electronics Fabrication

Testing Process Qualification TRL4 Jazz CS18 Proof-of-Concept Electrical Testing Process Qualification TRL6 ASI

6 FleX Current Technology Status 2012 American Semiconductor, Inc. All rights reserved. 6 FleX: Transparently Thin Functional CMOS Next Foundry Process FleX Silicon-On-Polymer Roadmap Electrical Testing Process Qualification TRL4 Jazz CS18 Proof-of-Concept Electrical Testing Process Qualification TRL6 ASI SOI CMOS Electrical Testing Functional CMOS FleX Development TRL7 Custom Process Functional Devices Initial Production Volume Production Today

FleX Option for Jazz CS18 2012 American Semiconductor, Inc. All rights reserved. Jazz CS18 post FleX processing www.

com/flex Jazz CS18-FleX is the industry s first commercially available flexible CMOS foundry process Characterization of

transistor performance RF pre- and post-flex evaluation underway Initial characterization data will provide a preliminary

7 FleX Option for Jazz CS American Semiconductor, Inc. All rights reserved. Jazz CS18 post FleX processing Jazz CS18-FleX is the industry s first commercially available flexible CMOS foundry process Characterization of CS18 in FleX is underway First wafers show excellent mechanical properties DC data pre- and post-flex show no shift in transistor performance RF pre- and post-flex evaluation underway Initial characterization data will provide a preliminary CS18-FleX PDK Announced at TowerJazz Technical Global Symposium Oct 31, 2012 For more information contact: Rich Chaney Mike Scott richchaney@americansemi.com Mike.Scott@jazzsemi.com CS18 PMOS Top, NMOS Bottom Full Thickness data in red FleX data in blue 7

8 2012 American Semiconductor, Inc. All rights reserved. Flexible Hybrid System Concept to Product 8 IC Design IC Fabrication IC FleX Pressure Sensor Strain Gauge LNA Antenna ADC µctrl Flexible Hybrid Integration Printed Circuits & Sensor Design Printed Electronics Fabrication

9 Flexible Hybrid System Development & Prototype Capability 2012 American Semiconductor, Inc. All rights reserved. 9 Direct Write System American Semiconductor Boise has developed capability for flexible die attach and direct write of flexible interconnects. FleX interconnect This manual capability provides a basis for high volume automated assembly. The first demonstration of flexible die attach and interconnects in harsh environments was made in June A FleX IC was successfully tested as part of a NASA payload by the RockSat Team from Idaho s NNU, sponsored by American Semiconductor. FleX die and interconnects June 2012 NASA Launch

10 2012 American Semiconductor, Inc. All rights reserved. Flexible Hybrid Manufacturing Near Term, Low Cost, High Volume Flexible Hybrid System integration using roll-to-roll R2R capability 10 FleX IC Stamp or Smart Sensor Integrated in Roll-to-Roll Line (Automation Concept) Conductor Insulator Simple Power Transistors FleX Display Die on Cure Cure Cure Cure Reel Ft/min

11 2012 American Semiconductor, Inc. All rights reserved. Flexible Hybrid System Concept to Product 11 IC Design IC Fabrication IC FleX Pressure Sensor Strain Gauge LNA You American Semiconductor Others Jazz American Semiconductor Others American Semiconductor Antenna ADC µctrl Flexible Hybrid Integration Printed Circuits & Sensor Design You American Semiconductor Others Printed Electronics Fabrication Soligie American Semiconductor Others

12 Flexible Hybrid Systems Example Applications 2012 American Semiconductor, Inc. All rights reserved. Implantable Medical Secure Documents & Financial Smart Labels 12 Sensimed Image Surgical Traditional IC ~40um; FleX IC <20um U. Illinois / MC10 Inc. Image Wearable Medical Satellites Conformal Antennas Load Bearing Antennas Fly-by-Feel BodyMedia Image RichChaney@AmericanSemi.com

13 Flexible Electronic Products and Services Provider 2012 American Semiconductor, Inc. All rights reserved. 13 Corporate Headquarters Boise, ID Engineering Design, Process, Modeling FleX Silicon-on-Polymer mfg and assembly Test & Characterization Cleanroom Sales, Marketing, Administration Process engineering center Santa Clara, CA Manufacturing pilot SoP operations Small Business Privately Held Founded November, 2001 Product Lines FleX Silicon-on-Polymer (Flexible Electronics) Design Services Turnkey Design Solutions ITAR Compliant 2007 Supplier of the Year DoME 45nm CMOS This work is sponsored by the Air Force Research Laboratory)

14 Thank You 2012 American Semiconductor, Inc. All rights reserved. American Semiconductor Inc., the American Semiconductor logo, Flexfet, FleX, and the Flexfet logo are trademarks of American Semiconductor, Inc. All other trademarks are the property of their respective owners. American Semiconductor, Inc South Vista Avenue, Suite 230 Boise, ID Tel: Fax:

Ian Jones, TWI Ltd ITMA 2015, Milan

Ian Jones, TWI Ltd ITMA 2015, Milan Powerweave FP7 European Project Development of Textiles for Electrical Energy Generation and Storage 4 years - ends in November 2015 Coordinated by TWI Ltd, UK 7 industrial