Product specifications. Model 2111
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1 Product specifications Model 2111 Version 1.10 Copyright 2011 In Win Development Inc Copyright 2011 In Win Development Inc.
2 Model 2111 System 1. Introduction The model 2111 is designed to address a variety of computing applications at a very cost effective price. lthough the 2111 is a small tower, it delivers the same level of performance as a traditional mid-size PC. 2. Mechanical dimensions The model 2111 system is 322mm (12.7 ) wide, 140mm (5.5 ) high, and 302mm (11.9 ) deep. The system is constructed with a steel chassis design and a plastic bezel. dhesive rubber mounting feet are provided to be installed on the bottom or side of the chassis to properly support mounting the model 2111 in either the vertical (mini tower) or horizontal (desktop) orientation. 2.1 Mechanical features The model 2111 system supports four add-on expansion cards. The expansion card must be a standard height design (111.15mm/4.376 high) and not longer in length than 254mm (10.0 ). The system supports one 3.5 hard drive. The 2111 has a single 5.25 drive bay, which is primarily used to support a DVD or Blue-ray optical drive device (ODD). The model 2111 also supports a 3.5 external bay, which is used primarily for a floppy drive (FDD). 2.2 Front bezel The model 2111 supports a number of different bezels. ll bezels and options are fully supported with the various market access certifications for the model The bezels for the model 2111 are: 623, 628, and 644. The model 623 is the standard bezel. ll others are special order. Bezel 623 Bezel 623 supports a power-on LED, HD activity LED, power switch, recessed reset switch, and a dual USB and audio expansion module. The USB expansion connection is USB 2.0 compliant. The audio expansion connection is HD udio compliant. 2.3 Motherboard & CPU support The model 2111 supports the following motherboard and CPU configurations. MFG. Motherboard CPU Frequency FSB Frequency Notes Intel DQ67SW Up to 3.40Ghz Up to 1333MHz 1 Intel DH67GD/BL Up to 3.40Ghz Up to 1333MHz 1 Intel DQ57TM Up to 3.46GHz Up to 1333MHz 1 Intel DQ45CB Up to 3.33GHz Up to 1333MHz 1 Intel DG41TY Up to 3.33GHz Up to 1333MHz Copyright 2011 In Win Development Inc.
3 Notes: Intel motherboards must use the Intel supplied I/O shield. ll CPUs on the Intel motherboards supported processor list may be used up to the stated processor frequency and front side bus frequency. Refer to Intel s website for this information. NOT LL processors are supported in ENERGY STR configurations. Refer to the Model 2111 ENERGY STR compliance data for support processors. 3. Product assembly The model 2111 is designed for quick and easy assembly. ll connectors are single piece designs and are keyed to match the connectors on the supported motherboards. ll cable connections are verified for cable length and suitable cable routing. 3.1 Product accessories The model 2111 is supplied with a number of accessories to assemble the system. The model 2111 includes the following accessories: ssembly screws, mounting feet 2 ST data cables 300mm long with a 90 degree connector at one end 5.25 external bay EMI shield and bezel insert 3.5 external bay EMI shield and bezel insert Power cord 3.2 Product documentation The model 2111 is supplied with product documentation both for the assembler and the end user. The documentation included with the 2111 is: Model 2111 Regulatory Compliance Guide. This document details what the assembler can assemble in to the system configuration and maintain the various product safety/emi/emc regulatory compliance markings on the system label. Model 2111 ENERGY STR 5.0 Compliance Guide. This document details what the assembler can assemble in to the system configuration and maintain the ENERGY STR 5.0 compliance markings on the system label. Model 2111 Quick Start Guide (End-User). This document must be included in the shipment to the customer and is the end user guide to installing and using the system safely. 4. Power supply/power budget The model 2111 utilizes an 80PLUS Bronze 300 watt ctive PFC power supply specifically to support the requirements of the various 2111 configurations. The model 2111 supports the following power budget: Copyright 2011 In Win Development Inc.
4 Core i7-2xxxs, Core i5-2xxxs, Core i3-2xxx(t), Core 2 Duo, Device Max 12V 5V 3.3V 5VSB Wattage CD-ROM 25W HDD 0 17W HDD 1 13W FDD 0 5W dd-on Card 1 PCI-32 15W dd-on Card 2 PCI-E x 1 15W dd-on Card 3 PCI -E x 16 65W CPU 65W MB/VRM 40W Total 260W Power Supply Maximum 300W Core i3, Core i5 except i5-661 Device Max 12V 5V 3.3V 5VSB Wattage CD-ROM 25W HDD 0 17W HDD 1 13W FDD 0 5W dd-in Card 1 PCI-32 15W dd-in Card 2 PCI-E X1 15W dd-in Card 3 PCI-E X16 65W CPU 73W MB/VRM 32W Total 260W Power Supply Maximum 300W Core i7-2xxx, Core i5-2xxx, Core i5-661, Core 2 Quad CPU Device Max 12V 5V 3.3V 5VSB Wattage CD-ROM 25W HDD 0 15W HDD 1 10W FDD 0 0W dd-on Card 1 0W dd-on Card 2 0W dd-on Card 3 0W dd-on Card 4 65W CPU 95W MB 50W Total 260W Power Supply Maximum 300W Copyright 2011 In Win Development Inc.
5 Note that the power budget is based upon the devices safety rating labels and maximum allowed under the devices associated design standard or specifications. working system will not consume the maximum power documented in the power budget. n actual working system is expected to consume a maximum of 75% of the model 2111 power budget. 4.1 Thermal specifications The model 2111 is designed to meet the following thermal specifications when configured as per the power budget and used in the specified maximum operating environment. Component Maximum Temperature Note CPU 38 Maximum average ambient air for Intel BOX heat sink VRM 55 Maximum average ambient measured directly above VRM dd-on card 55 Maximum average ambient HDD 50 Maximum average ambient ODD 50 Maximum average ambient PSU 50 Maximum average ambient at the power supply inlet fan 4.2 Operating environment The model 2111 will operate within specifications in the following operating conditions: Temperature +5 ~ 35 Humidity 5% ~ 85% relative (Non-condensing) ltitude 0M ~ 2150M (7,000 ft.) 4.3 Noise ISO 7779 Test data available on request. 5. Regulatory specifications The model 2111 is designed to meet the following regulatory specifications. The model 2111 is marked with a CS system mark, a CE mark, and an FCC declaration mark. The requirements for the use of these marks will be met when a system is built following the Regulatory Compliance Guide. 5.1 Product safety specifications The model 2111, when assembled according to the Regulatory Compliance Guide, will meet the following product safety standards: CS/UL , 2 nd edition. The model 2111 has a CS test report documenting compliance IEC , 2 nd edition. The model 2111 has a CB test report documenting compliance Copyright 2011 In Win Development Inc.
6 5.2 Product EMI/EMC specifications The model 2111, when assembled according to the Regulatory Compliance Guide will meet the following EMI/EMC standards: FCC Part 15 Class B/EN55022 Class B EN ENERGY STR 5.0 compliance The model 2111 may be configured and assembled to meet the requirements of the EP ENERGY STR 5.0 program. The 2111 is supplied with an ENERGY STR 5.0 compliance guide which details the various possible peripherals that can be used in the system and have the system comply with ENERGY STR 5.0. In Win is a registered EP ENERGY STR partner and the model 2111 is listed. 5.4 ErP Lot 6 compliance The model 2111 is fully compliant with the ErP Lot 6 requirements. The model 2111 consumes less than 1W C (230V) when in the off state. Compliance requires ME equipped motherboards set to sleep in CPI States S3 & S EPET compliance n EPET Component Compliance Report (ECER) is available on request. The level of compliance is dependent on the sum of the compliance of all the components in the final system configuration. The model 2111 is compliant with the IEEE applicable mandatory criterion plus the following optional criterion: Elimination of Intentionally dded Cadmium < 50ppm Elimination of Intentionally added hexavalent chromium <500PPM Large plastic parts free of certain flame retardants classified under EU Directive 67/548/EEC Large plastics parts (> 25g) free of PVC Reduced number of plastic types Molded/glued in metal eliminated or removable Manual separation of plastics Marking of plastics (> 25g) Modular design vailability of replacement parts 6. Packaging The model 2111 is delivered in an In Win box with Styrofoam end caps. 6.1 Non operating environment The model 2111 can be stored in the following non-operating environment: Temperature -40 (-40 ) to +70 (158 ) Copyright 2011 In Win Development Inc.
7 Humidity 5% ~ 95% relative (Non-condensing) ltitude 15,000M (50,000ft.) 7. Ordering information The model 2111 and optional accessories are ordered with the following order codes: Model 2111 ICP system with bezel Spare parts The following spare parts are available for the model IP-P300CN7-2 power supply - BK cabling 1DDU300CN20020 ST cables 3RMW Model EMI shield 2RRIC Model EMI shield 3RMIC Copyright 2011 In Win Development Inc.
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