ALPHA CVP-360 Solder Paste Product guide

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1 ALPHA CVP-360 Solder Paste Product guide A high performance low silver SACX capable paste, designed to outperform SAC alloy paste in spread, wetting and in circuit pin test yield 1

2 Welcome to the ALPHA CVP-360 Product Guide Contents Page # Introduction 3 Performance Summary 4 Print Performance 5-17 Reflow Performance In-Circuit Pin Testing Reliability Summary

3 Introduction Introducing ALPHA CVP-360, a SACX capable solder paste with a best in class combination of solder paste print volume and volume repeatability, reduced print cycle time, solder spread and wetting on OSP pad finishes, with maximum in circuit test yield. The result is a more first time right assemblies, that are easier to test, PLUS the inherent economy of SACX low silver solder alloy, along with resistance to thermal cycling that you would expect from higher silver SAC alloys. Cookson s world class phase gate product development process began with a rigorous set of product specifications based on the voice of our customers. Exhaustive lab and field testing have resulted in a robust, high yield product that can solve one or more of your challenges associated with lead free, surface mount assemblies. You can count on Cookson s complete support with our global team of technical experts, whenever and however you need us. It s the kind of support you would expect from a company that s remained dedicated to serving the needs of the Global circuit assembly market for over 50 years. 3

4 Performance Summary Performance Summary Process Benefit CVP-360 Property Performance Capability Fine Feature Print Definition Excellent print definition and consistant volumetric performance to 0.30mm(12 mil) circles and 0.4mm (16 mil) pitch rectangular QFP pads. Tack Life >24 hours at 25%, 50% and 75% Relative Humidity Capable of printing in temperatures from 20 C to 30 C (68 F to Temperature Window Print Process Window 86 F) Print Consistancy Repeatable volume deposition and low volume variability on 0.30mm (12 mil) circles with 125 micron (5mil) thick stencil. 25mm/second to 150mm/second (1 inch/second to 6 Print Speed Range inches/second) down to 0.30mm (12 mil) circles and.4mm (16 mil) pitch QFP pads. Peak Reflow Temperature 235º C to 245º C Meetss requirements of IPC 7095 Class lll using soak reflow Reflow Yield Resistance to Voids profile. Class III with straight ramp profile and 1% Ag BGA alloy spheres. Resistance to Hot and Cold Class II with straight ramp profiles and high silver BGA sphere Exceeds the requirements of IPC J-STD-005 for hot and cold Slump slump. Flux Residue Cosmetics Clear, colorless residue. SIR Meets/Exceeds JIS, IPC and Bellcore Requirements Electrical Reliability Electromigration Resistance Meets/Exceeds IPC and Bellcore SIR and EM Requirements J-STD-004 Classification ROM0 Halide Content Halide Free Inspection In Circuit Pin Testing 100% first pass yield virtually eliminating false negatives during in circuit pin testing. 4

5 Printing: Smallest Printed Feature BGA225-12mil Print Performance Process Data LSL 225 Target * USL Sample Mean Sample N 3600 StDev(Within) StDev(Overall) LSL USL Within Overall Potential (Within) Capability Cp 2.79 CPL 2.83 CPU 2.76 Cpk 2.76 Overall Capability Pp 2.13 PPL 2.16 PPU 2.10 Ppk 2.10 Cpm * Observed Performance PPM < LSL PPM > USL 0.00 PPM Total Exp. Within Performance PPM < LSL 0.00 PPM > USL 0.00 PPM Total 0.00 Exp. Overall Performance PPM < LSL 0.00 PPM > USL 0.00 PPM Total 0.00 High Volume and Volume Repeatability with 12 mil (0.3mm) Diameter Circles Using 5 mil (125µ) Thick Stencil CpK 0.60 Area Ratio 5

6 Printing: Print Speed Process Window Print Performance CVP-360 Lot# M Print Volume Repeatability Chart BGA36 (15 mil circles) Volume (cubic mils) % of Theoretical Volume (530 cubic mils) 400 Speed 1 in/sec 2 in/sec 4 in/sec 6 in/sec Board Speed 1 in/sec 2 in/sec 4 in/sec 6 in/sec Consistent print deposit volume at speeds from 1 inch (25mm)/second to 6 inches (150 mm)/second 6

7 Printing: Response to pause Print Performance CVP-360 Lot# M Out of Jar/ Response to Pause Volume Chart BGA36 (15 mil circles) Volume (cubic mils) % of Theoretical Volume (530 cubic mils) 400 Condition Out of Jar After 100 Kneads After 2 hr Pause Board Condition Out of Jar After 100 Kneads After 2 hr Pause No knead stroke required after 2 hour pause in printing 7

8 Interaction Plot for Std. Deviation-12mil BGA225 Data Means Print Performance Print Speed Print Pressure Stencil Release Using SIX Sigma DOE technique, with print volume and print volume variation as response variables, ranges for squeegee speed (25 to 150mm/sec.), squeegee pressure (0.22 to 0.36 kg/cm) and stencil release speed (3 to 10 mm/sec.) have been established Print Speed Print Speed Print 1.0 Pressure Print Pressure Stencil 0.8 Release Stencil Release

9 Printing Resistance to Dog Ears Print Performance.05 in.(1.3mm)/sec Snap Off Speed.10 in.(2.6mm)/sec Increasing Stencil Snap Off Speed Reduces Occurrence of Dog Ears Recommended Window in. (3-10mm)/sec 9

10 Wipe Frequency Print Performance Number of Bridges Leading SAC305 Brand QFP Pitch Prints 16 (100%) 16 (90%) 20 (100%) 20 (90%) > > Number of Bridges CVP-360 # P1 QFP Pitch Prints 16 (100%) 16 (90%) 20 (100%) 20 (90%) > > > Equal or better than Leading SAC305 Brand- Reducing Average Print Cycle Time 10

11 Stencil Life Volume Data Print Performance CVP-360 Lot# M Stencil Life Data BGA36 (15 mil circles) Volume (cubic mils) 1000 Theoretical Volume (884 cubic mils) % of Theoretical Volume (530 cubic mils) T-0 T-1 T-2 T-3 T-4 T-5 T-6 T-7 Time (hrs) T-8 The solder paste is printed continuously for 8 Hours. Volume measurements are taken every hour to confirm paste s stencil life. 11

12 Stencil Life Volume Data Print Performance 4000 CVP-360 Lot# M Stencil Life Data QFP120-1 (16 mil pitch, 63x10x5 mils) Volume (cubic mils) Theoretical Volume (3150 cubic mils) % of Theoretical Volume (1890 cubic mils) T-0 T-1 T-2 T-3 T-4 T-5 Time (hrs) T-6 T-7 T-8 Minimal volume change over 8 hours of continuous printing using 5 mil (125µ) thick stencil 12

13 Stencil Life: Malcom Viscosity Method Print Performance Continuous viscosity: CVP rpm Time(s) No increase in viscosity over 24 hours at 25ºC 13

14 Stencil Life 12 mil pitch QFP Print Performance Reflowed after 0 hours of continuous printing Reflowed after 4 hours of continuous printing Reflowed after 8 hours of continuous printing 14

15 Stencil Life Rheology Print Performance ALPHA CVP-360 SACX Lot M 1000 Log Viscosity (pas) t=0 t=1 t=2 t=3 t=4 t=5 t=6 t=7 t=8 t=9 t=10 t=11 t=12 t=13 t=14 t=15 t=16 t=17 t=18 t= Shear rate (1/s) Stable Rheology over 19 hours 15

16 Room Temperature & 32 o C Stability 2500 Print Performance Viscosity (poise) o C 32 o C Time (# of days) Acceptable viscosity after 2 weeks at 25 C: 10 days at 32 ºC. 16

17 Tack / Tack Life Print Performance Tack (g/mm2) IPC Time (hours) Requirement: IPC Measure and report up to 24 hours. 140 Requirement: JIS Tack force > 100 g after 24 hours. Tack (gf) JIS Time (hours) 17

18 Reflow Process Guidelines Reflow Performance Parameter Atmosphere SnAgCu alloy melting ranges. Lower temperature=solidus; higher temperature = liquidus Guideline Air Preferred SACX 0807: C SACX 0307: C Profile General Guideline Setting Zone Optimal Dwell Period 40 C to 228 C 60 s 260 s Above 225 C sec. Peak temp. < 240 C for Entek Plus OSP finish Joint cool down rate from 170 C > 3 C 6 C 18

19 Example Reflow Profile P1 Reflow Performance Conveyor Speed 60mm/sec Top Side Setting(ºC) Bottom Side Setting(ºC)

20 Example Reflow Profile P2 Reflow Performance Conveyor Speed 70cm / minute Top Side Setting(ºC) Bottom Side Setting(ºC)

21 Example Reflow Profile P3 Reflow Performance Conveyor Speed 60cm / minute Top Side Setting(ºC) Bottom Side Setting(ºC)

22 Example Reflow Profile P4 Reflow Performance Conveyor Speed 60cm / minute Top Side Setting(ºC) Bottom Side Setting(ºC)

23 Reflow Performance Example Reflow Profile Summary Profile Average Time to Reach 130ºC min:sec Average Time to Reach 170ºC min:sec Average Time Above 220ºC min:sec Average Time to Reach 220ºC min:sec Average Time Above 225ºC min:sec Average Time to Reach 225ºC min:sec P1 01: : : : : :38.0 P2 01: : : : : :46.0 P3 01: : : : : :32.5 P4 01: : : : : :

The spacing between the solder paste stripes range from 0.3mm up to 1.0mm (increasing by 0.1mm increments) and the stripes are printed perpendicular to the traces on the board as shown above.

24 Cross Print Wetting Test Reflow Performance Wetting test cross-print pattern, Prior to reflow. Wetting test cross-print pattern, post reflow. One of the spread/wetting test included on the CERF board involves printing pairs of solder paste stripes over equally spaced traces on the board. The spacing between the solder paste stripes range from 0.3mm up to 1.0mm (increasing by 0.1mm increments) and the stripes are printed perpendicular to the traces on the board as shown above. Upon reflow, the solder melts and since it does not wet to the masked surface between the traces, it pulls back to the metal and spreads out along the traces. If there is enough spread, the gap between the two adjacent solder spots is bridged. There are a maximum number of 20 bridges possible for each gap size. The bridges are counted, percentages computed and plotted for each profile against the gap size. 24

25 Cross Print Spread Reflow Performance 100% % of Gaps Bridged 80% 60% 40% 20% CVP-360 (lot# 81202P1) SACX0807 Leading SAC305 Brand 0% Gap size (mm) Profile: Straight ramp 1.5C/s 245ºC peak Better spread than Leading SAC305 Brand 25

26 Spread per JIS Z-3284 Reflow Performance Oxidized Cu, Solder bath at alloy MP + 50 C 86.7% 87.9% Leading SAC 305 Brand CVP-360 SACX0807 Better than Leading SAC305 Brand 26

27 Self Alignment During Reflow Reflow Performance 16 mil pitch QFP after placement, before reflow 16 mil pitch QFP after placement, after reflow Component Self Alignment = Fewer Reflow Defects 27

28 Reflow / Pad Wetting Leading SAC 305 Brand CVP-360 Reflow Performance DPAK LQFP mil pitch Profile: 1.5C/sec soak 250 C peak (Air) Reflow better/equal to Leading SAC 305 Brand- No de-wetting observed 28

29 Reflow / Fillet Wetting Reflow Performance Leading SAC 305 Brand CVP-360 QFP120 (16 mil pitch) Profile: 1.5C/sec soak 250 C peak (Air) 29

30 IPC Cold & Hot Slump Test Results Reflow Performance CVP-360 Lot# P1, SACX % Pad Size Cold Slump 25C / 50% / 75% RH x 2.03mm 0.33 x 2.03mm Hot Slump Oven 150C / 10mins 0.63 x 2.03mm 0.33 x 2.03mm Largest Gap Bridged No Bridges IPC max gap bridge allowed Pass Pass Pass Pass PASSES Hot/Cold Slump per IPC J-STD

31 DIN Slump Reflow Performance DIN - 1 RT C Large: 0.3 mm OK Small: 0.2 mm OK DIN Requirement: - Large/Small - No bridge 0.3/0.2 mm (PASS) 31

32 JIS Slump Resistance JIS C Reflow Performance Large: 0.4 mm OK Both Pass Small: 0.4 mm OK 32

33 Paste In Hole Performance 2.5 mm overprint 3.75 mm overprint 7.5 mm overprint Reflow Performance Before reflow After reflow Excellent Pin in Paste Performance 33

34 Paste In Hole Performance RCA Jack Bottom side after reflow Reflow Performance 3.75 mm overprint w / connector bottom side after reflow Complete wetting down barrel No dripping or excess solder on pins on bottom side. 34

35 Residue Tackiness Reflow Performance Residue Tackiness Procedure: Reflow paste in air, let cool. Sprinkle talc & store 24 hours. Brush with paintbrush. Requirement: Talc removed by brush - PASS 35

36 Random Solder ball Straight Ramp 1.5 o C/sec, peak 245 o C Initial 4 50 % RH Reflow Performance CVP-360 CVP- 360 Meets IPC visual criteria for solder balling SAC305 CVP- 360 OM360 Equal / better than Leading SAC305 Brand on mask 36

Reflow Performance Random Solder ball High Soak 160 o C/60sec, 240 o C peak Initial 4 hours @ 50 %

37 Reflow Performance Random Solder ball High Soak 160 o C/60sec, 240 o C peak Initial 4 50 % RH PNC0808A CVP-360 CVP-360 Meets IPC visual criteria for solder balling OM338PT PNC0808A OM360 37

38 Resistance to Voiding Void Size Distribution BGA mil circles Reflow Performance CVP-360 Cerf 1.5c_s 245c Peak 60s TAL_SACX % 90.00% 80.00% 70.00% CVP-360 Cerf 160c_60s Soak 240c Peak 60s TAL % of Joints 60.00% 50.00% 40.00% 30.00% 20.00% 10.00% 0.00% ZERO 0-4% 4-8% 8-12% 12-16% 16-20% >20% % of Joint area Soak profile reduces voiding versus straight ramp profile (20 mil circles, SAC OM338PT 305 alloy BGA spheres) 38

39 Resistance to Voiding Void Size Distribution BGA256 90% Reflow Performance CVP-360 Cerf 1.5c_s 245c Peak 60s TAL_SACX % 90.00% 80.00% 70.00% CVP-360 Cerf 160c_60s Soak 240c Peak 60s TAL % of Joints 60.00% 50.00% 40.00% 30.00% 20.00% 10.00% 0.00% ZERO 0-4% 4-8% 8-12% 12-16% 16-20% >20% % of Joint area 10% Aperture reduction also reduces voiding OM338PT 39

40 Resistance to Voiding Reflow Performance Initial Void Size Distribution - SACX0807 CVP-360 Paste, SAC105 CBGA84 (12 mil spheres on 20 mil pitch) 4 50 % RH 100% 90% 80% 70% Ramp: 0.7 C/sec, 240 Peak, TAL - 85 s Ramp: 1.5 C/sec, 245 Peak, TAL - 45 s % of Joints 60% 50% 40% 30% 20% 10% 0% ZERO 0-4% 4-8% 8-12% 12-16% 16-20% >20% % of Joint area Best results with 1% OM338PT Silver BGA spheres 40

Pin Testability (Flying Probe Method) Pin

Plus 106A) Data is average of 3 boards with

41 Pin Testability (Flying Probe Method) Pin Testability Pad type: A B C D A 1.0 mm sq pads B 1.0 mm sq pads with 0.33 mm vias C mm round pads D 0.7 mm round pads with 0.33 mm vias All pads coated with Cu-OSP (Entek Plus 106A) Data is average of 3 boards with 1000 pads of each type / board. Reflow: 238 C peak, sharp chisel, 6.5 oz. force PNC0802A contacts 41

42 Pin Testability (Flying Probe Method) Pin Testability Flying Probe Pin Pad Type Test Yields A B C D Paste Pin Test Yield % Leading SAC Paste 100% 91.60% 100% 72.40% CVP % 97.80% 99.40% 99.80% Dramatically reduced level of residue from CVP-360 Equal to or better than Leading, Pin Testable SAC305 Paste 42

43 Clamshell Fixture Pin Test Pin Testability 3 Pin Shapes 4 Pin Probe Pressures 43

44 In Circuit Testing Results: Clam Shell Similar or Better Resistance to ICT False Failures vs. Leading Pin Testable SAC Paste Pin Shape Crown Blade Crown Spear Force (oz) CVP-360 Pin Testability Leading SAC Paste % Open % Open

45 IPC Compliance Reliability CVP-360 Cu Mirror: Pass (flux & paste) 45

46 IPC Compliance Reliability Ag Chromate paper: Pass Paste is halide free ROM0 WER: Ω-cm Halogen content: <700 ppm (flux) 46

47 Bellcore SIR- Pass SIR TEST REPORT - BELLCORE Request: (per GR-78-CORE Issue 1, Sept 97) Reliability Test #: b Date: 12/5/2008 T/H/B:35/85/-48 Tested by: K. Tellefsen Reported by:k. TellefP/F limit:1e11 Ohms MATERIAL TESTED/ SIR SIR COMMENTS CONDITION (1 day) (4 days) CVP E E+12 Visually OK Reflowed Paste SACX E E+12 uncleaned 2.7E E E E E E E E E E E E E E E E E E E E Geometric mean: 3.4E E+11 Control boards 1.1E E E E E E E E E E E E E E E E E E E E E E E E Geometric mean: 2.4E E+13 47

48 IPC SIR- Pass SIR TEST PER J-STD-004 Request: ********************** Test #: i Date: 11/24/2008 T/H/B 85C/85%RH/-48V Tested by: K. Tellefsen P/F limit: Reported by: K. Tellefsen 1.0E+08 ohms MATERIAL TESTED/ Initial SIR(ohms) SIR SIR Final COMMENTS CONDITION ambient (1 day) (4 days)(7 days) ambient CVP-360 SACX0807 >1.0E12 6.4E E E+09 >1.0E12 passed electrical Reflowed paste >1.0E12 8.8E E E+09 >1.0E12 and visual uncleaned >1.0E12 8.1E E E+09 >1.0E12 requirements >1.0E12 6.5E E E+09 >1.0E12 >1.0E12 1.7E E E+09 >1.0E12 >1.0E12 1.8E E E+09 >1.0E12 >1.0E12 1.7E E E+09 >1.0E12 >1.0E12 1.8E E E+09 >1.0E12 >1.0E12 1.5E E E+09 >1.0E12 >1.0E12 6.8E E E+08 >1.0E12 >1.0E12 4.9E E E+08 >1.0E12 >1.0E12 1.5E E E+08 >1.0E Arithmetic mean: >1.0E12 1.2E E E+09 >1.0E12 Control boards >1.0E12 8.4E E E+10 >1.0E12 >1.0E12 1.0E E E+10 >1.0E12 >1.0E12 2.0E E E+11 >1.0E12 >1.0E12 9.6E E E+10 >1.0E12 >1.0E12 1.5E E E+10 >1.0E12 >1.0E12 9.6E E E+10 >1.0E12 >1.0E12 9.2E E E+10 >1.0E12 >1.0E12 1.4E E E+10 >1.0E12 >1.0E12 5.8E E E+10 >1.0E12 >1.0E12 5.7E E E+10 >1.0E12 >1.0E12 7.6E E E+10 >1.0E12 >1.0E12 1.1E E E+10 >1.0E Arithmetic mean: >1.0E12 1.0E E E+10 >1.0E12 Reliability 48

49 IPC SIR- Pass Reliability IPC SIR CVP

50 Bellcore EM- Pass Bellcore Electromigration (per GR-78-CORE Issue 1, September 1997) Request: Test #: e Start dat11/17/08bias = 10 V T/H: 65/85 Tested by: K. Tellefsen Reported by: K. Tellefsen MATERIAL TESTED/ SIR SIR COMMENTS CONDITION 96 hr. 500 hr. bias CVP-360 SACX E E+10 passed visual and IPC-B-25 pattern B 2.6E E+10 electrical requirements reflowed paste 2.0E E+10 Uncleaned 2.1E E E E E E E E E E E E E E E E E E+10 Pass/Fail final > Geometric mean: 2.4E E+10 initial/10 Controls 4.7E E E E E E E E E E E E E E E E E E E E E E E E+10 Pass/Fail final > Geometric mean: 9.1E E+11 initial/10 Reliability 50

51 Bellcore EM- Pass Reliability Bellcore EM CVP

52 Reliability Thermal Cycling- CERF Board Test Vehicle BGA 256 Package 52

53 Thermal Cycling- CERF Board Test Vehicle 1,500 Cycles -40ºC to +100ºC BGA 256 Reliability Joints from 2 ends and middle were crosssectioned 53

54 Reliability After 1,500 Cycles -40ºC to +100ºC BGA 256 Copper Component Pad Bulk BGA Tin/Copper Intermetallic Copper Pad Tin/Copper Intermetallic in Tact 54

55 Reliability Thermal Cycling- CERF Board Test Vehicle Surface Mount 1206 Resistors 55

56 After 1,500 Cycles -40ºC to +100ºC 1206 Resistor Tin/Copper Intermetallic Reliability Surface Mount 1206 Resistor Tin/Copper Intermetallic in Tact Tin/Copper Intermetallic 56

57 Reliability Thermal Cycling- CERF Board Test Vehicle LQFP

58 After 1,500 Cycles -40ºC to +100ºC LQFP 120 Copper Lead Reliability Tin/Copper Intermetallic Tin/Copper Intermetallic in Tact Tin/Copper Intermetallic Copper Pad 58

59 Summary High performance paste with the economy of low silver SACX alloy Delivers excellent print deposit volume consistency Prints speed window from 1 to 6 in. (25 to 150 mm)/second Excellent stencil life reducing paste scrap Better spread and wetting than leading SAC 305 brand Best in Class in circuit pin test yield Exceeds IPC and Bellcore electromigration and surface insulation resistance requirements Solder joints survive 1500 thermal cycles (-40ºC to +100ºC) 59

ALPHA OM-340 ALPHA OM-350 ALPHA CVP-360 ALPHA CVP-520 Water

60 Summary Leading Products: No Clean, SnPb ALPHA OM-6106 ALPHA OM-5100 No Clean, Lead-free ALPHA OM-338 T ALPHA OM-338 PT ALPHA OM-340 ALPHA OM-350 ALPHA CVP-360 ALPHA CVP-520 Water Soluble, SnPb ALPHA WS-809 Water Soluble, Lead-free ALPHA WS

61 Global Manufacturing Sites Summary AMERICAS EUROPE ASIA-PACIFIC California, USA Florida, USA Illinois, USA New York, USA Pennsylvania, USA Mexico City, Mexico Monterrey, Mexico Manaus, Brazil Sao Paulo, Brazil Woking, England Turnhout, Belgium Cholet, France Budapest, Hungary Hatar, Hungary Naarden, Netherlands East Kilbride, Scotland Hong Kong, China Guangxi, China Shenzhen, China Shanghai, China Chennai, India Hiratsuka, Japan Sihung City, Korea Singapore Taoyuan, Taiwan 61

62 Global Sales Support Summary AMERICAS California, USA Georgia, USA Illinois, USA New Jersey, USA Pennsylvania, USA Ontario, Canada Guadalajara, Mexico Buenos Aires, Argentina Sao Paulo, Brazil EUROPE Woking, England Turnhout, Belgium Cholet, France Langenfeld, Germany Hatar, Hungary Dublin, Ireland Milano, Italy Naarden, Netherlands East Kilbride, Scotland ASIA-PACIFIC Hong Kong, China Shenzhen, China Beijing, China Chengdu, China Guangxi, China Nanjing, China Shanghai, China Suzhou, China Tianjin, China Xiamen, China Bangalore, India Chennai, India Hiratsuka, Japan Sihung City, Korea Penang, Malaysia Muntinlupa, Philippines Singapore Taoyuan, Taiwan Bangkok, Thailand Thomastown, Australia Auckland, New Zealand Vietnam 62

Global Customer Technical Support Summary AMERICAS EUROPE ASIA-PACIFIC California, USA New Jersey, USA Georgia, USA Guadalajara, Mexico Monterrey, Mexico Buenos Aires, Argentina Sao Paulo, Brazil

63 Global Customer Technical Support Summary AMERICAS EUROPE ASIA-PACIFIC California, USA New Jersey, USA Georgia, USA Guadalajara, Mexico Monterrey, Mexico Buenos Aires, Argentina Sao Paulo, Brazil Manaus, Brazil Woking, England Turnhout, Belgium Cholet, France Langenfeld, Germany Hong Kong, China Shenzhen, China Beijing, China Shanghai, China Suzhou, China Tianjin, China Bangalore, India Chennai, India Hiratsuka, Japan Sihung City, Korea Penang, Malaysia Singapore Taoyuan, Taiwan 63

ALPHA OM-5002 HIGH SPEED, PIN TESTABLE SOLDER PASTE

ALPHA OM-5002 HIGH SPEED, PIN TESTABLE SOLDER PASTE DESCRIPTION ALPHA OM-5002 is a no-clean solder paste formulated for optimum performance in a wide variety of applications. The semi-soft, highly reliable residues provide a very low incidence of first