FUJI IGBT Modules U Series Technical Documents

Transcription

1 Quality is our message FUJI IGBT Modules U Series Technical Documents Power cycle capability... MT5F12959 RBSOA, SCSOA... MT5F13198 High current output-characteristics... MT5F13582 Short circuit current vs V GE characteristics... MT5F in one-package module parallel connection application... MT5F14514 Switching loss, dv/dt vs C GE, R G... MT5F V GE vs switching loss characteristics... MT5F13288 Dependence of blocking and junction temp.... MT5F13015 V CES vs T j characteristics... MT5F dic/dt vs T j characteristics... MT5F14433 Dynamic avalanche voltage vs T j characteristics... MT5F14434 Transient thermal impedance... MT5F14621 Mounting instructions EconoPack-Plus...MT5Q1070a Mounting instructions 2MBI400U(4)H MT5Q1098 Mounting instructions Small-Pack and Small-PIM... MT5F14628a

2 WARNING 1. This Manual contains the product specifications, characteristics, data, materials, and structures as of July The contents are subject to change without notice for specification changes or other reasons. When using a product listed in this Manual, be sure to obtain the latest specifications. 2. All applications described in this Manual exemplify the use of Fuji's products for your reference only. No right or license, either express or implied, under any patent, copyright, trade secret or other intellectual property right owned by Fuji Electric Device Technology Co., Ltd. is (or shall be deemed) granted. Fuji Electric Device Technology Co., Ltd. makes no representation or warranty, whether express or implied, relating to the infringement or alleged infringement of other's intellectual property rights which may arise from the use of the applications described herein. 3. Although Fuji Electric Device Technology Co., Ltd. is enhancing product quality and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take adequate safety measures to prevent the equipment from causing a physical injury, fire, or other problem if any of the products become faulty. It is recommended to make your design fail-safe, flame retardant, and free of malfunction. 4. The products introduced in this Manual are intended for use in the following electronic and electrical equipment which has normal reliability requirements. Computers OA equipment Communications equipment (terminal devices) Measurement equipment Machine tools Audiovisual equipment Electrical home appliances Personal equipment Industrial robots etc. 5. If you need to use a product in this Manual for equipment requiring higher reliability than normal, such as for the equipment listed below, it is imperative to contact Fuji Electric Device Technology Co., Ltd. to obtain prior approval. When using these products for such equipment, take adequate measures such as a backup system to prevent the equipment from malfunctioning even if a Fuji's product incorporated in the equipment becomes faulty. Transportation equipment (mounted on cars and ships) Trunk communications equipment Traffic-signal control equipment Gas leakage detectors with an auto-shut-off feature Emergency equipment for responding to disasters and anti-burglary devices Safety devices 6. Do not use products in this Manual for the equipment requiring strict reliability such as (without limitation) Space equipment Aeronautic equipment Nuclear control equipment Submarine repeater equipment Medical equipment 7. Copyright by Fuji Electric Device Technology Co., Ltd. All rights reserved. No part of this Manual may be reproduced in any form or by any means without the express permission of Fuji Electric Device Technology Co., Ltd. 8. If you have any question about any portion in this Manual, ask Fuji Electric Device Technology Co., Ltd. or its sales agents before using the product. Neither Fuji Electric Device Technology Co., Ltd. nor its agents shall be liable for any injury caused by any use of the products not in accordance with instructions set forth herein.

3 Technical documents MT5F12959 Quality is our message FUJI IGBT Modules U Series Power cycle capability Sn-Ag solder sec ON/18 sec OFF 10 8 Tj Number of cycles (cycle) Tj 2 sec 18 sec Tc 10 4 F(t)=1% line T j 1

4 Technical documents MT5F13198 Quality is our message FUJI IGBT Modules U Series RBSOA, SCSOA 1200V 12 +VGE=15V, -VGE*15V, RG]Recommended, Tj*125 C Collector current : Icrating[ A ] SCSOA (non-repetitive pulse) RBSOA (Repetitive pulse) Collector - Emitter voltage : VCE [V] 1

5 Technical documents MT5F13582 Quality is our message FUJI IGBT Modules U Series High current output-characteristics 1200V Typical value Conditions: Tj=25/125 C V GE =15V Not include internal-drop voltage due to internal-resistance of module. 7.5 Collector current/rated current : IC / IC rating T j =25 C T j =125 C Collector-Emitter voltage : V CE [V] (chip) 1

6 Technical documents MT5F14993 Quality is our message FUJI IGBT Modules U Series Short circuit vs V GE characteristics 1200V Sample: 2MBI150UA-120, 2MBI200UB-120, 2MBI300UD-120 Conditions: V DC =600V +V GE =8, 10, 13, 15, 18V V GE =15V Tj=125 C R G (Recommended value) = 2.2Ω (2MBI150UA-120) 3.0Ω (2MBI200UB-120) 1.1Ω (2MBI300UD-120) Results: V GE - I SC characteristics Fig. 1 Definition of I SC : Saturated current at short circuit condition I SC 1600 I SC (A) UA UB UD V GE (V) Fig. 1 V GE - I SC characteristics Waveforms: 2MBI150UA-120 Fig. 2 to Fig. 6 2MBI200UB-120 Fig. 7 to Fig. 11 2MBI300UD-120 Fig. 12 to Fig. 16 1

7 2MBI150UA-120 ISC = 43A ISC = 180A VCE ; 200V/div. VCE ; 200V/div. IC ; 25A/div. IC ; 100A/div. Fig. 2 V GE =8V Fig. 3 V GE =10V ISC = 460A ISC = 640A VCE ; 200V/div. VCE ; 200V/div. IC ; 250A/div. IC ; 250A/div. Fig. 4 V GE =13V Fig. 5 V GE =15V ISC = 925A VCE ; 200V/div. IC ; 250A/div. Fig. 6 V GE =18V 2

8 2MBI200UB-120 ISC = 29A ISC = 168A VCE ; 200V/div. VCE ; 200V/div. IC ; 25A/div. IC ; 50A/div. Fig. 7 V GE =8V Fig. 8 V GE =10V ISC = 520A ISC = 780A VCE ; 200V/div. VCE ; 200V/div. IC ; 250A/div. IC ; 250A/div. Fig. 9 V GE =13V Fig. 10 V GE =15V ISC = 1140A VCE ; 200V/div. IC ; 250A/div. Fig. 11 V GE =18V 3

9 2MBI300UD-120 ISC = 50A ISC = 268A VCE ; 200V/div. VCE ; 200V/div. IC ; 50A/div. IC ; 100A/div. Fig. 12 V GE =8V Fig. 13 V GE =10V ISC = 770A ISC = 1150A VCE ; 200V/div. VCE ; 200V/div. IC ; 250A/div. IC ; 500A/div. Fig. 14 V GE =13V Fig. 15 V GE =15V ISC = 1520A VCE ; 200V/div. IC ; 500A/div. Fig. 16 V GE =18V 4

10 Technical documents MT5F14514 Quality is our message FUJI IGBT Modules U Series 2 in one-package module parallel connection application 1200V Current imbalance in parallel connection Configuration and equation Von1 Von2 Von=Von2 Von1 I1 I2 Current imbalance was caused by difference between Von1 and Von2, current will be divided to I1 and I2 respectively. In this case, the current imbalance rate is defined as following equation. α=[i1 / Ic(ave) 1] 100(%) 30 Current imbalance proportion : α [%] FWD-Part IGBT-Part ÆV on [V] ( = Von2 Ð Von1) 1

11 V CE (sat), V F distribution 150 U-series 1200V IGBT Ave.=1.82V S.D.= 0.030V n= count [pcs.] VCE(sat).chip [V](Tj=RT, VGE=15V) U-series 1200V FWD Ave.=1.64V S.D.= 0.078V n=468 count [pcs.] VF.chip [V](Tj=RT) Von distribution Parallel connection application (Von classification) Applicable types: 2MBI300UC-120, 2MBI300UD-120, 2MBI300UE-120, 2MBI450UE-120 Spec. V CE (sat) rank V F rank Current Imbalance rate (Derating rate for parallel connection) Standard 0.5V 0.5V 20% maximum Selection ( 03) 0.3V 1-rank V 4-rank 13% maximum The standard part can be used to parallel connection application with 20% of current imbalance rate. If lower current imbalance rate is necessary, selection version ( 03 at end of type number) is recommended. In this case, same rank device must be used to same arm of inverter leg. 2

12 Technical documents MT5F14571 Quality is our message FUJI IGBT Modules U Series Switching loss, dv/dt vs C GE, R G 6MBI450U-120 Reverse recovery dv/dt Sample: 6MBI450U-120 # Y-phase drive Tj=25 C, Vcc=800V, Ic=22.5A (5% of rating) V GE =±15V, Ls=45nH, Snubber C=0 Switching loss Eon Tj=125 C, Vcc=600V, Ic=450A V GE =±15V, Ls=75nH, Snubber C=0 RG[Ω] RG[Ω] Switching loss Eoff Tj=125 C, Vcc=600V, Ic=450A V GE =±15V, Ls=75nH, Snubber C=0 Switching loss Err Tj=125 C, Vcc=600V, Ic=450A V GE =±15V, Ls=75nH, Snubber C=0 RG[Ω] RG[Ω] In order to reduce dv/dt or oscillation at reverse recovery, additional C GE and smaller R G are effective. In order to keep same switching loss, (C GE as same as Cies) + (0.7 R G ), or (C GE of 2 Cies) + (0.5 R G ) are recommended. These are same manner also for other 1200V U-series IGBT module. 1

13 Reverse recovery dv/dt Sample: 6MBI450U-120 # Y-phase drive Tj=25 C, Vcc=800V, Ic=22.5A, V GE =±15V, Ls=45nH, Snubber C=0 RG[Ω] CGE=0nF 2

14 Eon (Latest sample) Sample: 6MBI450U-120 # Y-phase drive Tj=125 C, Vcc=600V, Ic=450A, V GE =±15V, Ls=75nH, Snubber C=0 RG[Ω] CGE=0nF 3

15 Eoff (Latest sample) Sample: 6MBI450U-120 # Y-phase drive Tj=125 C, Vcc=600V, Ic=450A, V GE =±15V, Ls=75nH, Snubber C=0 RG[Ω] CGE=0nF 4

16 Err (Latest sample) Sample: 6MBI450U-120 # Y-phase drive Tj=125 C, Vcc=600V, Ic=450A, V GE =±15V, Ls=75nH, Snubber C=0 RG[Ω] CGE=0nF 5

17 Technical documents MT5F13288 Quality is our message FUJI IGBT Modules U Series V GE vs switching loss characteristics 6MBI150UB Conditions : T j = 125 C V CC = 600V V GE = +15V I C = 100A R G = 2.2ohm E off Switching loss [mj] 10.0 E on E rr Ð17.5 Ð15 Ð12.5 Ð10 Ð7.5 ÐV GE [V] Ð5 Ð

18 Technical documents MT5F13015 Quality is our message FUJI IGBT Modules U Series Dependence of blocking voltage and junction temp. 1700V For 1700V-U series (Engineering samples), such as 6MBI450U-170 and others Averaged typ. value (Measured) Blocking voltage : VCES [V] Estimated min. value (Typ. 6 ) Junction temp. T j [ C] 1

19 Technical documents MT5F14432 Quality is our message FUJI IGBT Modules U Series V CES vs Tj characteristics 1200V Blocking voltage : VCES [V] Typ. Guarantee Junction temp. : Tj [ C] 1

20 Technical documents MT5F14433 Quality is our message FUJI IGBT Modules U Series dlc/dt vs T j characteristics 1200V, 6MBI450U VDC = 600V VGE = ±15V -dic/dt (at turn off) [ka/µs] Typ. RG = 1.1Ω Ic = 450A Junction temperature : Tj [ C] 1

21 Technical documents MT5F14434 Quality is our message FUJI IGBT Modules U Series Dynamic avalanche voltage vs T j characteristics 1200V 6MBI450U Dynamic avalanche voltage : Vav [V] Typ. Definition of Vav VDC = 600V, Ic = 2 Rated VGE = ±15V, RG = Recommended Ic VCE VGE Vav Junction temperature : Tj [ C] 1

22 Technical documents MT5F14621 Quality is our message FUJI IGBT Modules U Series Transient thermal impedance Calculated value Definition of case temperature position Tb (case temp. at center position on the edge) Cu base surface Module Chip position Tc (case temp. beneath the chip) 2MBI150UA-120 Rth(j-c) FWD Rth(j-c)@Tb Thermal resistance : Rth(j-c) [ C/W ] FWD Rth(j-c)@Tc IGBT Rth(j-c)@Tb IGBT Rth(j-c)@Tc = 0.05 C/W = C/W Pulse width : Pw [ sec ] 1

23 2MBI150UB-120 Rth(j-c) FWD Thermal resistance : Rth(j-c) [ C/W ] FWD Rth(j-c)@Tc IGBT Rth(j-c)@Tc IGBT Rth(j-c)@Tb = C/W = C/W Pulse width : Pw [sec ] 2MBI200UB-120 Rth(j-c) FWD Rth(j-c)@Tb Thermal resistance : Rth(j-c) [ C/W ] 0.1 IGBT Rth(j-c)@Tc FWD Rth(j-c)@Tc IGBT Rth(j-c)@Tb = C/W = C/W Pulse width : Pw [sec ] 2

24 2MBI300UC-120 Rth(j-c) Thermal resistance : Rth(j-c) [ C/W ] FWD Rth(j-c)@Tc IGBT Rth(j-c)@Tc FWD Rth(j-c)@Tb IGBT Rth(j-c)@Tb = C/W = C/W Pulse width : Pw [sec ] 2MBI450UE-120 Rth(j-c) Thermal resistance : Rth(j-c) [ C/W ] FWD Rth(j-c)@Tb IGBT Rth(j-c)@Tb FWD Rth(j-c)@Tc IGBT Rth(j-c)@Tc = C/W = C/W Pulse width : Pw [sec ] 3

25 2MBI300U2B-060 Rth(j-c) FWD Thermal resistance : Rth(j-c) [ C/W ] FWD Rth(j-c)@Tc IGBT Rth(j-c)@Tb IGBT Rth(j-c)@Tc = C/W = C/W Pulse width : Pw [sec ] 2MBI400U2B-060 Rth(j-c) Thermal resistance : Rth(j-c) [ C/W ] FWD Rth(j-c)@Tb FWD Rth(j-c)@Tc IGBT Rth(j-c)@Tb IGBT Rth(j-c)@Tc = C/W = C/W Pulse width : Pw [sec ] 4

26 6MBI225U-120 Rth(j-c) Thermal resistance : Rth(j-c) [ C/W ] FWD Rth(j-c)@Tb FWD Rth(j-c)@Tc IGBT Rth(j-c)@Tb IGBT Rth(j-c)@Tc = C/W = C/W Pulse width : Pw [sec ] 6MBI300U-120 Rth(j-c) FWD Rth(j-c)@Tb Thermal resistance : Rth(j-c) [ C/W ] FWD Rth(j-c)@Tc IGBT Rth(j-c)@Tb IGBT Rth(j-c)@Tc = C/W = C/W Pulse width : Pw [sec ] 5

27 6MBI450U-120 Rth(j-c) Thermal resistance : Rth(j-c) [ C/W ] FWD Rth(j-c)@Tb IGBT Rth(j-c)@Tb FWD Rth(j-c)@Tc IGBT Rth(j-c)@Tc = C/W = C/W Pulse width : Pw [sec ] 6

28 Technical documents MT5Q1070a Quality is our message FUJI IGBT Modeules U Series Mounting Instructions EconoPACK-Plus CONTENTS Page 1. Mounting Main terminal connection PCB fixed on the module... 3 This manual describes the recommended method to install and use EconoPACK-Plus safely. 1 Mounting 1.1 Colling fin mounting Since thermal resistance varies according to the position of the mounted modules, pay attention to the following points: a. When mounting only one module, position it in the center of the cooling fin in order to minimize the thermal resistance. b. When mounting several modules, determine the individual positions on the cooling fin according to the amount of heat that each module generates. Leave more space for modules that generate more heat. 1.2 Cooling fin surface finishing (module mounting area) The mounting surface of the cooling fin should be finished to the roughness of 10µm or less and a warp based on a length of 100mm should be 50µm or less. If the surface of the cooling fin is not flat enough, there will be a sharp increase in the contact thermal resistance (Rth(c-f)). If the flatness of the cooling fin does not meet the above requirements, the mounted module will experience extreme stress on the DBC substrate possibly destroying its insulating barrier. Roughness: 10µm max: Flatness of the cooling fin: 50µm max. (based on a length of 100mm)

29 Mounting Instructions EconoPACK-Plus 1.3 Thermal compound application To reduce the contact thermal resistance, we recommend applying thermal compound with screen printing, rollers or spatulas between the cooling fin and the base plate of the module. Recommended thickness of the compound is approx.100µm. Recommended thermal compound for your reference Penetration (typ.) 338 min. Thermal conductivity 0.92 W/m k min. Thickness of the compound 100µm±30µm Note: 1) The contact thermal resistance is dependent on the compound's efficiency and thickness. The thickness of the compound could be lessened if the warp of the cooling fin could be reduced. Use the above table as a reference to decide the thickness of the compound being used. 2) Confirm the expansion of the compound when the module is installed with high viscosity compound. On the other hand, note that low viscosity compound may flow out due to the temperature cycle. 1.4 Mounting procedure 1) Recommended tightening torques: 3 to 6 N m (M5) 2) Initial: Torque 0.5 to 1.0 (N m), sequence (1)-(2)-(3)-(4)-(5)-(6)-(7)-(8) 3) Final: Full specified torque (3 to 6 N m), sequence (1)-(2)-(3)-(4)-(5)-(6)-(7)-(8) M ESD If excessive static electricity is applied to the control terminals, the devices could be broken. Some countermeasures against static electricity is necessary. Refer to the Chapter 3-2 of the Application Manual (REH984). 2

30 Mounting Instructions EconoPACK-Plus 2 Main terminal connection 2.1 Bus bar connection 1) Screw: M6 2) Screw length: Bus bar thickness + (7mm to 9mm) 3) Tightening torque: 3 to 6 [N m] 4) Allowable terminal temperature: 100 C max. Note: In case of connecting a bus bar to the main terminal, avoid excessive force to a terminal part. Especially, the applied force at the opposite end of the copper bar will act as much bigger to the terminal part, because the moment force is proportional to the copper bar length. Moreover, if a screw will be tightened when there is position gap between a terminal and a copper bar, stress will be generated continuously in the terminal part, and becomes the cause of damage. Fasten the screw so that position gap does not occur. 2.2 Limitation of forces for the mounted conductors Force direction Strength* 5N m 3N m 500N 500N 5N m 5N m 500N 1000N * Strength for a short time during mounting 3 PCB fixed on the module 3.1 Fixing by screws The hole diameters are 2.25mm and 2.6mm. Therefore, a diameter of mm is recommended. 1. Screw type: Self tapping screw (In Japan, M2.6 self tapping screw) Mounting hole Screw 2.4~2.6mm 3

31 Mounting Instructions EconoPACK-Plus 2. Screw length : PCB thickness +(5mm to 8mm) PCB No good Module 8mm or less Note : Recommended tightening torque: 0.4 +/ N m (Make installation of the screw perpendicular to the module.) 3. Recommended tightening method: Hand tightening Note : If high speed tightening tool is used, the module case might be damaged. Confirm the tightening torque of the high speed tightening tool in advance. Note : The case might break if screws beside the above recommendation are used. Confirm the screws before using them. 3.2 Soldering pin-terminals 1) Plating of pin terminal: Sn/Cu (lead-free plating) 2) Recommended soldering method: Flow soldering or hand soldering 3) Soldering conditions a. Flow soldering Pre heat: 125 C max. Post heat: 265 C/11s max. b. Hand soldering (by soldering iron) Iron tip temperature: 410 C max. Soldering time: 5s/terminal max. 4

32 Technical documents MT5Q1098 Quality is our message FUJI IGBT Modeules U Series Mounting Instructions 2MBI400U(4)H-120 CONTENTS Page 1. Mounting Main terminal connection Dimensions... 3 This manual describes the recommended method to install and use 2MBI400U(4)H-120 safely. 1 Mounting 1.1 Mounting on heat sink Since thermal resistance varies according to the position of the mounted modules, pay attention to the following points: a. When mounting only one module, position it in the center of the heat sink in order to minimize the thermal resistance. b. When mounting several modules, determine the individual positions on the heat sink according to the amount of heat that each module generates. Leave more space for modules that generate more heat. 1.2 Heat sink surface finishing (module mounting area) The mounting surface of the heat sink should be finished to the roughness of 10µm or less and a warp based on a length of 100mm should be 50µm or less. If the surface of the heat sink is not flat enough, there will be a sharp increase in the contact thermal resistance (Rth(c-f)). If the flatness of the heat sink does not meet the above requirements, the mounted module will experience extreme stress on the DBC substrate possibly destroying its insulating barrier. Roughness: 10µm max. Flatness of the heat sink: 50µm max. (based on a length of 100mm)

33 Mounting Instructions 2MBI400U(4)H Thermal compound application To reduce the contact thermal resistance, we recommend applying thermal compound with screen printing, rollers or spatulas between the heat sink and the base plate of the module. Recommended thickness of the compound is approx.100µm. Recommended thermal compound for your reference Penetration (typ.) 338 min. Thermal conductivity 0.92 W/m k min. Thickness of the compound 100µm±30µm Note: 1) The contact thermal resistance is dependent on the compound's efficiency and thickness. The thickness of the compound could be lessened if the warp of the heat sink could be reduced. Use the above table as a reference to decide the thickness of the compound being used. 2) Confirm the expansion of the compound when the module is installed with high viscosity compound. On the other hand, note that low viscosity compound may flow out due to the temperature cycle. 1.4 Mounting procedure 1) Recommended tightening torques: 2.5 to 3.5 N m (M5 or M6) 2) Initial: Torque 0.5 to 1.0 (N m), sequence (1)-(2)-(3)-(4) 3) Final: Full specified torque (3.5 N m), sequence (1)-(2)-(3)-(4) 2 4 M5 or M ESD If excessive static electricity is applied to the control terminals, the devices could be broken. Some countermeasures against static electricity is necessary. Refer to the Chapter 3-2 of the Application Manual (REH984). 2

34 Mounting Instructions 2MBI400U(4)H Main terminal connection 2.1 Bus bar connection 1) Screw: M6 2) Screw length: Bus bar thickness + (7.5mm to 9.5mm) 3) Tightening torque: 3.5 to 4.5 [N m] 4) Allowable terminal temperature: 100 C max. 5) Allowable terminal pull force: 40N max. Note: In case of connecting a bus bar to the main terminal, avoid excessive force to a terminal part. Especially, the applied force at the opposide end of the copper bar will act as much bigger to the terminal part, because the moment force is proportional to the copper bar length. Moreover, if a screw will be tightened when there is position gap between a terminal and a copper bar, stress will be generated continuously in the terminal part, and becomes the cause of damage. Fasten the screw so that position gap does not occur. 3 Dimensions 3

35 Technical documents MT5F14628a Quality is our message FUJI IGBT Modeules U Series Mounting Instructions Small-Pack and Small-PIM CONTENTS Page 1. Package design Installing the module on PCB Cooling fin mounting precautions... 3 This manual describes the recommended method to install and use Fuji Small-Pack & PIM safely. 1 Package design There are two kinds of packages for FUJI Small-Pack & PIM shown in below, and have the locking hooks to attach PCB (power circuit board) on the housing. The hooks are inserted in the holes of PCB to fix the module. Two screw clamps are attached to fix the module on cooling fin. Small-Pack1 & PIM1 Hook

36 Mounting Instructions Small-Pack and Small-PIM Small-Pack2 & PIM2 Hook Hook 2 Installing the module on PCB The locking holes in the PCB are necessary at specified position in below(drilling layout). The module is locked into the PCB. After locking the module, all outer pins are to be soldered. The allowable thickness of PCB is 1.6±0.2mm in Small-Pack1 and PIM1, and 1.8±0.2mm in Small-Pack2 and PIM2. Small-Pack1 & PIM1 Small-Pack2 & PIM2 Note: The point of the hooks are exposed on the soldering side. The thermal stress which exceeds deflection temperature should be avoided. Properties of case material: Melting point 224 C Deflection temperature 200 C ASTM D648 Heatproof temperature 260 C x 3 sec. 2

37 Mounting Instructions Small-Pack and Small-PIM 3 Cooling fin mounting precautions 3.1 Cooling fin mounting Since thermal resistance varies according to position of mounted modules, pay attention to the following points: a. When mounting only one module, position it in the center of the cooling fin in order to minimize thermal resistance. b. When mounting several modules, determine the individual positions on the cooling fin according to the amount of heat that each module generates. Leave more space for modules that generate more heat. The pitch size of two screw clamps is designed at 53±0.1mm. 3.2 Cooling fin surface finishing (module mounting area) The mounting surface of the cooling fin should be finished to the roughness of 10µm or less and a warp based on a length of 100mm should be 50µm or less. If the surface of cooling fin is not flat enough, there will be a sharp increase in the contact thermal resistance (Rth(c-f)). If the flatness of the cooling fin does not meet the above requirements, then mounted module will experience extreme stress on the DBC substrate possibly destroying this insulating barrier. Roughness: 10µm max. Flatness of the cooling fin: 50µm max. (based on a length of 100mm) 3.3 Thermal compound application To reduce contact thermal resistance, we recommend applying thermal compound with screen printing, rollers or a spatula between cooling fin and base plate of the module. Recommended thickness of the compound after mounting the module is approx.100µm. The example of the method by the screen printing is shown as follows. Note: Confirm the extension when the module is installed to the compound and the viscosity is high. On the other hand, note effusing by the temperature cycle when the viscosity is low. 3

38 Mounting Instructions Small-Pack and Small-PIM Metal mask Put the metal mask onto the cooling fin and screen printing. For Small-Pack2 & PIM2 Lift off the metal mask. Mount the module onto the cooling fin. square 7.0mm 2.0mm For Small-Pack1 & PIM1 Design for metal mask In this case, recommended thickness of the metal mask is 150μm that can form appox.100µm thickness compound layer after mounting the module. The recommended compound thickness after mounting is 80µm to 150µm. 4

39 Mounting Instructions Small-Pack and Small-PIM 3.4 Mounting procedure Following diagrams show how to tighten screws when mounting module. Each screw (M4 with 9mm washer) must be tightened using a specified torque. For proper tightening torque, recommended value is 1.3 to 1.7 (N m). An insufficient tightening torque may cause the contact thermal resistance to increase or the screws to come loose during operation. Note: When you install the detached module again, replacing with new clamps is recommended to secure proper contact thermal resistance. Step 1 Step 2 Step 3 Step 4 Tighten the screw with 1/3 torque. Tighten the screw of opposite side with 1/3 torque. Tighten the screw of opposite side by specified torque. Tighten the screw of opposite side by specified torque. When the design of the PCB and the arrangement of the module are decided, it is necessary to consider the insulation distance between the module and PCB. When this module is installed in PCB, minimum clearance and creepage distance should be between the top of the clamp and the bottom side of PCB. Clearance = Creepage = 6.1mm (typ.) 5