Fuji IGBT Module. Mounting instruction. 1 PressFIT IGBT Module MT5F V-series spring contact Module (M260 package) MT5Q01727a

Transcription

1 Fuji IGBT Module Mounting instruction 1 PressFIT IGBT Module MT5F V-series spring contact Module (M260 package) MT5Q01727a 3 ECONOPACK TM + MT5Q1070a 4 2MB1400U(4)H-120 MT5Q Mounting Instruction for M271/M272 Package TM (V-series PrimePACKTM Module) Mounting Instruction for M254 Package (V-series DualXT Module) MT5Q01780 MT5Q01693c Note: ECONOPACK TM + is a registered trademark of Infineon Technologies AG, Germany.

2 PressFIT IGBT module mounting instruction section-1 press-in/push-out CONTENTS Page 1 General Information Requirements on PCBs Mounting process and removing process Example of Press-in and Push-out tools Example of mounting process of the module into the PCBs Press-in Example of removing process of a module from PCBs; Push out Restriction of mounting area of PCB surface components Press-in and Push-out force Drawings of recommended Press-in tool Drawings of recommended Push-out tool Technical Documents:MT5F22233

3 1 General Information This application note describes the recommended PCBs specification and mounting / un-mounting advises of Fuji Electric (here in after Fuji) Press FIT IGBT modules. This application note cannot cover every type of application and/or conditions. Therefore, Fuji PressFIT modules, which are used out of these suggestions on PCB and mounting process, will not have any warranty and/or guarantee under any circumstances. We recommend you or your technical partners to confirm throughout electro-mechanical evaluation in practical applications. The PressFIT module provides solder less mounting onto PCB with low resistive stable contact. A PressFIT pin before insertion has opened shape as shown in Fig.1. After press-in processes, which are described in later section, the pin is closed by the contact pressure from both sides (Fig.2). During the press-in process, mechanical deformation of pin and materials of the PCB hole sidewall form cold-welding joints, it is possible to have low resistivity and stable contact with this new technology. This application note describes a basic idea of the mounting restricted area of PCBs. An individually consultation is needed about a detailed alimentation of the mounting restriction area. 圧入方向 PCB PCB PCB PCB 1-2 Technical Documents:MT5F22233

4 2 Requirements on PCBs This chapter describes the PCB recommendation for the Press FIT modules. PCB should have been designed within criteria in the Table1. For example, through hole diameter should be a range of 2.14mm to 2.29mm with properly Sn/Cu plated sidewall as described in the figure. When it smaller, mechanical issue in the press-in process would be found, on the other hands, if it bigger, shock and vibration and/or contact reliability may have concerns. These results were experimentally obtained based from IEC The evaluation is separately needed if PCBs which have out of these parameters. PCB should have holes for guide pins of press-in tools with a specific position, hole diameter so that press-in lower and upper tool contact first and absorb the insertion force to protect PCB and its surface mounted devices from mechanical stress during press-in process. <Recommended specification of PCB> Drill-hole diameter Through-hole diameter PCB PCB Sn-plate Cu-plate Copper-foil PCB gauge SnCu-plate(tip division) Pressfit-pin C194+Ni-plate(whole) Table1. Recommended PCB specification drill hole diameter through hole diameter Copper plating thickness in the hole Metallisation in the hole PCB gauge PCB material min typ max mm mm 2.2mm 2.29mm >25um <15um 70um 105um 1.6mm 2.0mm - FR4 Copper gauge of the circuit board tracks 35um Technical Documents:MT5F22233

5 3 Mounting process and removing process The procedure for mounting process and removing process of PressFIT module are described in this section. PressFIT module should be inserted within a specific range of mounting speed and force. If mounting force were below the limit, the module would have issue in low resistive and stable contact. On the other hand, mechanical damage on PCB and other parts mounted on the surface would be expected if too much press-in force. When press-in, we recommend using the equipment as shown in Fig.3 to have accurate control in force control. We also recommend using specific press-in and push-out tools provided in the latter section with drawings. Recommended press-in force and speed, push-out forces are described in the Table 2. Typical forces for each pin are also indicated in the table. Press-in speed of 25mm/min is also recommended to have good contact. It is possible to remove a module from PCB and re-press-in to the PCBs again, however, we recommend soldering all pins for the modules that are not 1 st -press-in, in order to avoid risk of mechanical damage during push-out process. Position of the module Fig3) Fig.3 press Press device picture picture 1-4 Technical Documents:MT5F22233

6 4 Example of Press-in and Push-out tools Figures 4(a)-(d) are: (a) Photograph press-in toolset, (b) example of physical dimension (drawings) of press-in tools, (c) Push-out tools photo, (d) Push-out tool drawing examples PCB-Guide in press-in lower tool works as mechanical stopper. Press-in lower and upper tool contact first and absorb the insertion force to protect PCB and its surface mounted devices from mechanical stress during press-in process. The height should be adjusted with the board thickness and press-in equipment. upper tool Upper tool Upper upper tool tool guide-pin lower tool Lower tool Fig.4(a) press-in Fig.4(a) toolset press-in tool set lower tool Lower tool Fig.4(b) press-in tool drawing example Upper tool Fig4.(c) Push-out tools Fig.4(c) push-out tool set lower tool Lower tool Fig.4(d) push-out tool drawing example 1-5 Technical Documents:MT5F22233

7 5 Example of mounting process of the module into the PCBs; Press-in 1 Set the lower and upper tools. 2 Place PCB on the lower tool to fit the PCB-guides. 3 Set the module upside down. 4 Press the module base plate by pressing equipment with recommended force and speed. 1-6 Technical Documents:MT5F22233

8 6 Example of removing process of a module from PCBs; Push out 1 Set the lower and upper tools 2 Set the PCB with module. 3 Push the top of the press-fit pins with recommended force. 4 Set the module upside down 5 The module and PCB will be separated and module will be dropped in the lower push-out tool. 1 Set the lower and upper tools 2 Set the PCB with module 3 Push the top of the press-fit pins with recommended force 5 The module and PCB will be separated Fig.6 Push out process 1-7 Technical Documents:MT5F22233

9 7 Restriction of mounting area of PCB surface components In order to avoid risk of mechanical damage of other components mounted on PCB surface, we recommend reserving specific area, which would have high strain during press-in and/or push-put process. Figures 8 and 9 are restricted area for PCB front-side and backside, respectively. Basically, we recommend reserving 5mm in distance from the center of pins. PCB-Front side side PCB-Back side PCB-Back side Available to mount other parts Blue: Press-in tool foot print Red: Reserved for press-in stress Fig.8 PCB designing recommendation (Front side) Available to mount other parts Blue: Press-in tool foot print Red: Reserved for press-in stress Fig9. PCB-Back side (Back side) 1-8 Technical Documents:MT5F22233

10 8 Press-in and push-out force Recommended press-speed and the load (average a pin) of mounting process is shown at the under Table 2 shows the press-in speed and the press-in forces per pin in case of a small hole diameter (2.14mm) and a big diameter (2.29mm). On the other hands, Table 3 shows push-out forces typical per pin in case of a small hole diameter and a big diameter. Hole diameter Press-in speed Press-in Forces typical per pin Table2. In case of Mounting process 2.14mm(min) 93N 2.29mm(max) 25mm/min 74N Hole diameter Push-put Forces typical per pin Table3. In case of Removing process 2.14mm(min) 45N 2.29mm(max) 49N 1-9 Technical Documents:MT5F22233

11 9 Drawings of recommended Press-in tool Press-in tool (upper) Unit:mm 1-10 Technical Documents:MT5F22233

12 Press-in tool (lower) Unit:mm Metarial:SUS 1-11 Technical Documents:MT5F22233

13 10 Drawings of recommended Push-out tool Push-out tool (upper) Unit:mm Metarial:SUS 1-12 Technical Documents:MT5F22233

14 Push-out tool (lower) Unit:mm Metarial:SUS 1-13 Technical Documents:MT5F22233

15 Mounting instruction for M260 package (V-series spring contact module) CONTENTS Page 1 Mounting methods of the IGBT module Connecting main terminals Suggestions when mounting onto PCB Degradation of spring 1-9 This section provides information how to mount IGBT modules of M260 package, so called DualXT(Spring). This mounting instruction is available for type name(s) of 2MBI XXX VJ- XXX -5X. (X is number of 0~9.) 1-1 Technical Documents:MT5Q01727a

16 1 Mounting IGBT modules This section presents how to mount M260 package, so called DualXT(Spring). 1.1 Mounting on heat sink The thermal resistance between IGBT module base plate and heat sink depends on module location, thermal properties of heat sink and cooling methods. In general, each system has different heat sink properties such as thermal conductivity and cooling fan, this section focuses on module location on heat sink. Followings should be taken into account in IGBT module mounting process since thermal resistance varies according to the position of the mounted modules: IGBT modules should have thermally optimized layout on heat sink according to the mechanical-thermal design so that the modules have good heat spread to minimize the thermal resistance. The distance between IGBT modules should be optimized based on the mechanical-thermal design and the estimated total power dissipation for each module to avoid the thermal coupling effect between modules mounted on the next 1.2 Heat sink surface finishing (module mounting area) The mounting surface of the heat sink should be finished to the roughness of 10μm or less. A warp based on a length of 100mm should be 50μm or less. If the surface of the heat sink does not have enough flatness, the modules may have unexpected increase in the contact thermal resistance (Rth(c-f)). If the heat sink flatness does not match the above requirements, the high stress in the DCB on the modules may result high voltage insulation failure. 1.3 Thermal grease pasting Thermal grease between heat sink and module base plate is strongly recommended to reduce the contact thermal resistance. Screen-printing, rollers and spatulas are typical method of thermal grease pasting, however, stencil mask is recommended when target grease thickness is less than 100μm. Table 1 Recommended properties of thermal grease Items Recommendation Penetration (typ.) >= 338 Thermal conductivity >= 0.92 W/m.K Thermal grease thickness 100μm +/- 30μm *1 The thermal desistance between the heat sink and the module depends on the thermal grease properties and thickness. We strongly recommend customer to check contact interface after mounted to confirm if the interface has good thermal grease spreading. Also we recommend checking the thermal interface conditions after thermal cycling if the thermal grease has low viscosity. *2 Stencil mask pattern electric data and recommended method are also available on request. 1-2 Technical Documents:MT5Q01727a

17 1.4 Mounting procedure Mounting procedures onto heat sink are described. (a) Minimum and maximum torque for mounting M5 screws indicated (1)-(4) in the picture on the right are: Minimum: 2.5Nm Maximum: 3.5Nm (b) Pre-torque is recommended with 1/3 of the final torque with sequence (1) - (2) - (3)-(4) in Fig.1 (c) Final torque must be within specified force of 2.5 to 3.5 Nm with sequence (1) - (2) - (3)-(4) (d) To comply the creepage and clearance distance, the total height of screw and washer must not exceed 6.0mm. 1.5 PCB mounting procedure PCB mounting processes are described. (a) Minimum and maximum torque for mounting M2.6 self tapping screws indicated P1 to P7 in Fig.1: Minimum : 0.4Nm Maximum: 0.6Nm Fig.1Mounting holes 1-4 in M260 modules (b) Pre-torque is recommended with 1/3 of the final torque with sequence P1-P2-P3-P4-P5-P6-P7 in Fig.1. (c) Final torque must be within specified force of 0.4 to 0.6Nm with sequence P1-P2-P3-P4-P5-P6-P7 in Fig.1. Maximum screw rotation speed is 300 rpm. 1.6 Electrostatic Discharge (ESD) protection If excessive static electricity is applied to the control terminals, the devices can be broken. Some countermeasures against static electricity is necessary. 1-3 Technical Documents:MT5Q01727a

18 2 Connecting main terminals 2.1 Bus bar connection Screw M6 Screw length Bus bar thickness + (7 to 9mm) Screw torque Minimum 3.5Nm / Maximum 4.5Nm Maximum terminal temperature 100 o C <Important notes> Special care should be taken when mounting bus bar to IGBT main terminals so that the terminals do not have excess forces. The principle of a lever sometimes makes the moment of force much bigger than expected especially when installing to long bus bar. In addition, the terminals may have seriously damages when the module is fixed with miss alignment in position between the module terminal and bus bar holes. Well alignment to the module terminals and bus bar holes are recommended to reduce mechanical stress. 2.2 Maximum force vectors from bus bar Maximum vectors and definitions are described in the table below. Vector A B Strength* 5 Nm 3 Nm A C D 500 N 500 N C D E 5 Nm F G H 5 Nm 500 N 1000 N B (a) Horizontal direction *) Strength in the table is the mechanical capability for the short period in mounting process. E G F H (a) Vertical direction Fig.2 Vector descriptions from bus bar 1-4 Technical Documents:MT5Q01727a

19 2.3 Clearance and creepage distance In order to establish good isolation voltage, it is recommended for the IGBT application to have both clearance and creepage distance for the main terminal design as defined (a) and (b) in Fig.3 should be longer than minimum value of : Clearance distance Creepage distance 9.5mm 14.0mm Fig. 3 Clearance and creepage distance for IGBT main terminals 1-5 Technical Documents:MT5Q01727a

20 3 Suggestions when mounting onto PCB 3.1 Recommended screws As mounting holes for PCBs have step holes with diameter of 2.2mm and 2.5mm, screws with diameter of 2.4 to 2.6mm are recommended. Figures below shows recommended screw types and length. Self-tapping screws are recommended. In Japan, M2.6 screws are recommended. (a) Hole for PCB; P1, P6 and P7 in Fig.1 (b) Holes for PCB; P2, P3, P4 and P5 in Fig.1 2.4~2.6mm (c) recommended screw Fig.4 PCB screw holes and recommended screw cross section 1-6 Technical Documents:MT5Q01727a

21 3.2 Screw length 5.0mm to 8.5mm + PCB thickness length screws are recommended to mount PCBs. Recommended mounting torque is 0.4~0.6Nm, screws should be placed vertically. If screws are tightened with angles as shown in Figs.5 and 6, the pads on PCB and control terminals on IGBT modules may have loose electrical contact, which may have risk of module failure in worst case. PCB 5~ 8.5mm 5~8.0mm Module Center holes Corner holes Fig.5 P1/P6/P7 hole cross sectional image of screw Fig.6 Bad example of screw tightened with angular position 1-7 Technical Documents:MT5Q01727a

22 3.3 How to mounting PCB screws Manual tighten of PCB screw is preferable. However, if other tools such as electric drivers or other automated methods are used, parameter optimization and confirmation is recommended in practical installation process by customer so that IGBT module does not have mechanical damage by automatic screw process. 3.4 Example of mechanical damage with not recommended screw and/or process PCB mounting is recommended by the methods above. In case, not recommended screws and/or methods are used in IGBT installation process, it may have a risk of mechanical damage as shown in Fig.7. Screw types and process advanced confirmation is desirable. Fig.7 Mechanical damage example of IGBT module 1-8 Technical Documents:MT5Q01727a

23 4 Degradation of spring 4.1 H2S Gas exposure Spring resistance may degrade in H2S Gas atmosphere. Initial spring contact resistance is around 100m. It is increasing by H2S Gas exposure (please refer to Fig.8). Recommendation of total exposure is under 5000 [ppm Hr] which can control contact resistance under 500m. Fig.9 shows photo of springs at initial and 1000ppm Hr. Even spring color change to yellowish at 1000ppm Hr, contact resistance is not increase. Life time of the spring can be calculating by expression (1). Life time of spring = 5000 / H2S Gas density [Hr] ---- (1) For example, H2S Gas density of normal atmosphere is around ppm. Life time of the spring is 5000/0.005 = Hr = 114 year in normal atmosphere. Contact resistance of spring [ ] Conditions H2S Gas 25ppm 48.2deg.C 90%RH 500m 5000 ppm Hr MAX. MIN Total exposure [ppm Hr] Fig.8 Contact resistance degradation ( H2S Gas exposure) (a) initial (b) At 1000 ppm Hr Fig.9 Spring discoloration ( H2S Gas exposure) 1-9 Technical Documents:MT5Q01727a

24 4.2 SO2 Gas exposure Spring resistance may degrade in SO2 Gas atmosphere. Initial spring contact resistance is around 100m. It is increasing by SO2 Gas exposure (please refer to Fig.10). Recommendation of total exposure is under 1750 [ppm Hr] which can control contact resistance under 500m. Fig.11 shows photo of springs at initial and 500ppm Hr. Even spring color change to yellowish at 500ppm Hr, contact resistance is under 500 m. Life time of the spring can be calculating by expression (2). Life time of spring = 1750 / SO2 Gas density [Hr] ---- (2) For example, SO2 Gas density of normal atmosphere is around 0.01 ppm. Life time of the spring is 1750/0.01 = Hr = 20 year in normal atmosphere. Contact resistance of spring [ ] Conditions SO2 Gas 25ppm 48.2deg.C 90%RH 1750 ppm Hr 500m MAX. MIN Total exposure [ppm Hr] Fig.10 Contact resistance degradation (SO2 Gas exposure) (a) Initial (b) At 500ppm Hr Fig.11 Spring discoloration (SO2 Gas exposure) 1-10 Technical Documents:MT5Q01727a

25 4.3 Spring color degradation by storage Spring color may change black or yellowish, which is depended on by storage condition. Even spring color is change, the contact resistance of spring is under 500 m if customer keeps storage condition which is defined by expression (1) and (2) of section 4.1 and 4.2. Table 2 shows contact resistance of initial and color degraded spring. Spring color degradation has not always influence for degradation of contact resistance. Table 2 Example of color degradation of spring Initial Color degraded spring Contact resistance = 98m 94m 78m 97m 84m 1-11 Technical Documents:MT5Q01727a

26 Technical documents MT5Q1070a Quality is our message FUJI IGBT Modeules U Series Mounting Instructions ECONOPACK TM + CONTENTS Page 1. Mounting Main terminal connection PCB fixed on the module... 3 This manual describes the recommended method to install and use ECONOPACK TM + safely. Note: ECONOPACK TM + is a registered trademark of Infineon Technologies AG, Germany 1 Mounting 1.1 Colling fin mounting Since thermal resistance varies according to the position of the mounted modules, pay attention to the following points: a. When mounting only one module, position it in the center of the cooling fin in order to minimize the thermal resistance. b. When mounting several modules, determine the individual positions on the cooling fin according to the amount of heat that each module generates. Leave more space for modules that generate more heat. 1.2 Cooling fin surface finishing (module mounting area) The mounting surface of the cooling fin should be finished to the roughness of 10µm or less and a warp based on a length of 100mm should be 50µm or less. If the surface of the cooling fin is not flat enough, there will be a sharp increase in the contact thermal resistance (Rth(c-f)). If the flatness of the cooling fin does not meet the above requirements, the mounted module will experience extreme stress on the DBC substrate possibly destroying its insulating barrier. Roughness: 10µm max: Flatness of the cooling fin: 50µm max. (based on a length of 100mm)

27 Mounting Instructions ECONOPACK TM Thermal compound application To reduce the contact thermal resistance, we recommend applying thermal compound with screen printing, rollers or spatulas between the cooling fin and the base plate of the module. Recommended thickness of the compound is approx.100µm. Recommended thermal compound for your reference Penetration (typ.) 338 min. Thermal conductivity 0.92 W/m k min. Thickness of the compound 100µm±30µm Note: 1) The contact thermal resistance is dependent on the compound's efficiency and thickness. The thickness of the compound could be lessened if the warp of the cooling fin could be reduced. Use the above table as a reference to decide the thickness of the compound being used. 2) Confirm the expansion of the compound when the module is installed with high viscosity compound. On the other hand, note that low viscosity compound may flow out due to the temperature cycle. 1.4 Mounting procedure 1) Recommended tightening torques: 3 to 6 N m (M5) 2) Initial: Torque 0.5 to 1.0 (N m), sequence (1)-(2)-(3)-(4)-(5)-(6)-(7)-(8) 3) Final: Full specified torque (3 to 6 N m), sequence (1)-(2)-(3)-(4)-(5)-(6)-(7)-(8) M ESD If excessive static electricity is applied to the control terminals, the devices could be broken. Some countermeasures against static electricity is necessary. Refer to the Chapter 3-2 of the Application Manual (REH984). 2

28 Mounting Instructions ECONOPACK TM + 2 Main terminal connection 2.1 Bus bar connection 1) Screw: M6 2) Screw length: Bus bar thickness + (7mm to 9mm) 3) Tightening torque: 3 to 6 [N m] 4) Allowable terminal temperature: 100 C max. Note: In case of connecting a bus bar to the main terminal, avoid excessive force to a terminal part. Especially, the applied force at the opposite end of the copper bar will act as much bigger to the terminal part, because the moment force is proportional to the copper bar length. Moreover, if a screw will be tightened when there is position gap between a terminal and a copper bar, stress will be generated continuously in the terminal part, and becomes the cause of damage. Fasten the screw so that position gap does not occur. 2.2 Limitation of forces for the mounted conductors Force direction Strength* 5N m 3N m 500N 500N 5N m 5N m 500N 1000N * Strength for a short time during mounting 3 PCB fixed on the module 3.1 Fixing by screws The hole diameters are 2.25mm and 2.6mm. Therefore, a diameter of mm is recommended. 1. Screw type: Self tapping screw (In Japan, M2.6 self tapping screw) Mounting hole Screw 2.4~2.6mm 3

29 Mounting Instructions ECONOPACK TM + 2. Screw length : PCB thickness +(5mm to 8mm) PCB No good Module 8mm or less Note : Recommended tightening torque: 0.4 +/ N m (Make installation of the screw perpendicular to the module.) 3. Recommended tightening method: Hand tightening Note : If high speed tightening tool is used, the module case might be damaged. Confirm the tightening torque of the high speed tightening tool in advance. Note : The case might break if screws beside the above recommendation are used. Confirm the screws before using them. 3.2 Soldering pin-terminals 1) Plating of pin terminal: Sn/Cu (lead-free plating) 2) Recommended soldering method: Flow soldering or hand soldering 3) Soldering conditions a. Flow soldering Pre heat: 125 C max. Post heat: 265 C/11s max. b. Hand soldering (by soldering iron) Iron tip temperature: 410 C max. Soldering time: 5s/terminal max. 4

30 Technical documents MT5Q1098 Quality is our message FUJI IGBT Modeules U Series Mounting Instructions 2MBI400U(4)H-120 CONTENTS Page 1. Mounting Main terminal connection Dimensions... 3 This manual describes the recommended method to install and use 2MBI400U(4)H-120 safely. 1 Mounting 1.1 Mounting on heat sink Since thermal resistance varies according to the position of the mounted modules, pay attention to the following points: a. When mounting only one module, position it in the center of the heat sink in order to minimize the thermal resistance. b. When mounting several modules, determine the individual positions on the heat sink according to the amount of heat that each module generates. Leave more space for modules that generate more heat. 1.2 Heat sink surface finishing (module mounting area) The mounting surface of the heat sink should be finished to the roughness of 10µm or less and a warp based on a length of 100mm should be 50µm or less. If the surface of the heat sink is not flat enough, there will be a sharp increase in the contact thermal resistance (Rth(c-f)). If the flatness of the heat sink does not meet the above requirements, the mounted module will experience extreme stress on the DBC substrate possibly destroying its insulating barrier. Roughness: 10µm max. Flatness of the heat sink: 50µm max. (based on a length of 100mm)

31 Mounting Instructions 2MBI400U(4)H Thermal compound application To reduce the contact thermal resistance, we recommend applying thermal compound with screen printing, rollers or spatulas between the heat sink and the base plate of the module. Recommended thickness of the compound is approx.100µm. Recommended thermal compound for your reference Penetration (typ.) 338 min. Thermal conductivity 0.92 W/m k min. Thickness of the compound 100µm±30µm Note: 1) The contact thermal resistance is dependent on the compound's efficiency and thickness. The thickness of the compound could be lessened if the warp of the heat sink could be reduced. Use the above table as a reference to decide the thickness of the compound being used. 2) Confirm the expansion of the compound when the module is installed with high viscosity compound. On the other hand, note that low viscosity compound may flow out due to the temperature cycle. 1.4 Mounting procedure 1) Recommended tightening torques: 2.5 to 3.5 N m (M5 or M6) 2) Initial: Torque 0.5 to 1.0 (N m), sequence (1)-(2)-(3)-(4) 3) Final: Full specified torque (3.5 N m), sequence (1)-(2)-(3)-(4) 2 4 M5 or M ESD If excessive static electricity is applied to the control terminals, the devices could be broken. Some countermeasures against static electricity is necessary. Refer to the Chapter 3-2 of the Application Manual (REH984). 2

32 Mounting Instructions 2MBI400U(4)H Main terminal connection 2.1 Bus bar connection 1) Screw: M6 2) Screw length: Bus bar thickness + (7.5mm to 9.5mm) 3) Tightening torque: 3.5 to 4.5 [N m] 4) Allowable terminal temperature: 100 C max. 5) Allowable terminal pull force: 40N max. Note: In case of connecting a bus bar to the main terminal, avoid excessive force to a terminal part. Especially, the applied force at the opposide end of the copper bar will act as much bigger to the terminal part, because the moment force is proportional to the copper bar length. Moreover, if a screw will be tightened when there is position gap between a terminal and a copper bar, stress will be generated continuously in the terminal part, and becomes the cause of damage. Fasten the screw so that position gap does not occur. 3 Dimensions 3

33 Mounting Instruction for M271/M272 Package (V-series PrimePACK TM Module) Contents Page 1 Mounting methods of the IGBT module 2 2 Maximum forces and directions for connecting bus bars 4 Note: PrimePACK TM is registered trade mark of Infineon Technologies AG, Germany. This document describes about recommended mounting procedures for M271/272 packages. This mounting instruction is available only for the following modules. 2MBI****VXB-120*-5X / 2MBI****VXB-170*-5X 2MBI****VXA-120*-5X / 2MBI****VXA-170*-5X 1MBI****VXB-120*L-5X / 1MBI****VXB-170*L-5X 1MBI****VXB-120*H-5X / 1MBI****VXB-170*H-5X 1MBI****VXA-120*L-5X / 1MBI****VXA-170*L-5X 1MBI****VXA-120*H-5X / 1MBI****VXA-170*H-5X (ex. 2MBI1000VXB-170E-50) 1 MT5Q01780

34 Mounting Instruction for M271/M272 Package 1 Mounting IGBT modules This document describes how to mount M271/M272 package, so called PrimePACK TM. 1.1 Mounting on heat sink The thermal resistance between IGBT module baseplate and heat sink depends on module location on the heat sink, thermal properties, such as thermal conductivity, of heat sink, and cooling methods. This section, the module location on heat sink is focused and described. Following items should be taken into account in the IGBT module mounting process since thermal resistance will be varied according to the position of the mounted modules: IGBT module(s) should have thermally optimized layout on heat sink according to the mechanical-thermal design so that the modules have good heat spread to minimize the thermal resistance. In case of several IGBT modules to be mounted on the same heat sink, the distance between IGBT modules should be optimized based on the mechanical-thermal design and the estimated total power dissipation of each module in order to avoid the thermal coupling effect between neighbor modules. 1.2 Heat sink surface finishing (module mounting area) The flatness of the heat sink between the mounting holes should be less than 50μm per 100mm. The surface roughness should be less than 10μm. If the surface of the heat sink does not have enough flatness, the module may have unexpected increase of the contact thermal resistance (R th(c-f) ) between the module and the heat sink. Also, if the heat sink flatness doesn t meet the above requirements, a high mechanical stress may be applied to the DCB on the module and it may cause insulation failure. 1.3 Application of thermal grease Thermal grease between heat sink and module baseplate is absolutely necessary to reduce the contact thermal resistance. Screen-printing, rollers or spatulas are typical method of thermal grease pasting, however, using a stencil mask is recommended when the target grease thickness is less than 100μm. Table 1 Recommended properties of thermal grease Items Recommendation Penetration (typ.) 338 Thermal conductivity 0.92 W/mK Thermal grease thickness 100μm ±30μm *1) The thermal resistance between the heat sink and the module depends on the thermal grease properties and thickness. Fuji Electric strongly recommends customers to confirm contact interface after mounting whether the terminal grease spreading is good enough or not. Also Fuji Electric recommends confirmation of the thermal interface status after thermal cycling if the thermal grease has low viscosity. 2 MT5Q01780

35 Mounting Instruction for M271/M272 Package *2) Electrical document of the recommended stencil mask pattern and recommended method are also available on request. 1.4 Mounting procedure Mounting procedures onto heat sink are described in below. are: (a) The minimum and maximum screw torque for mounting screws (M5) indicated as (1)-(14) in Fig.1 Minimum: 3.0Nm Maximum: 6.0Nm (b) Pre-fastening is recommended with 1/3 of the final torque and sequence of (1) (14) in Fig1. (c) Final torque must be within specified force of 3.0 to 6.0Nm with sequence of (1) (14) in Fig1. Fig1. Mounting holes connecting sequence (1) (14) (M272 package) 1.6 Electrostatic discharge (ESD) protection If excessive static electricity is applied to the control terminals, the devices can be broken. Some countermeasures against static electricity are necessary. 3 MT5Q01780

36 Mounting Instruction for M271/M272 Package 2 Maximum allowable strength and directions for connecting bus bars Maximum allowable mechanical strength and directions when connecting bus bars to the main and auxiliary terminals are describes in the table below. Direction A B C D E F G H Strength* ±100 N ±100 N 100 N 500 N ±20 N ±20 N 50 N 200 N *) The strength in the table is a mechanical capability for short period during mounting process Fig. 2 Maximum allowable strengthand directions (M272 package) 4 MT5Q01780

37 Mounting Instruction for M271/M272 Package The connection of the auxiliary terminals has to follow the common ESD guidelines. It is not allowed that a load current flow through any of the auxiliary terminals. We recommend using a support when bus bars are connected to the main terminals as shown in Fig.3. This measure is especially important if the modules or bus bars are subjected to vibration. The mechanical force direction applied to the terminals should be compression force, not tensile force. Note: It is recommended that the bus bars are attached to the module (main terminals) on compression direction as shown in Fig.3. The maximum stress should be within the values shown in Fig.2 Fig. 3 Example of bus bar configuration without a stress on the module (M272 package) Screw size and torques: Mounting holes of base plate: M5, 3 6 Nm Auxiliary terminals: M4, Nm Main terminals: M8, 8 10 Nm 5 MT5Q01780

38 Mounting Instruction for M254 Package (V-series DualXT Module) Contents Page 1 Mounting methods of the IGBT module 2 2 Connecting main terminals 4 3 Suggestions when mounting onto PCB 6 This document provides information how to mount IGBT modules of M254 package, so called DualXT (Pin-type). This mounting instruction is available only for type name of 2MBIxxxVN-xxx-5x (x is number of 0~9) 1 MT5Q01693c

39 Mounting Instruction for M254 Package 1 Mounting IGBT modules This document describes how to mount DualXT solder pin-type module (M254 package). 1.1 Mounting on heat sink The thermal resistance between IGBT module baseplate and heat sink depends on module location on the heat sink, thermal properties, such as thermal conductivity, of heat sink, and cooling methods. This section, the module location on heat sink is focused and described. Following items should be taken into account in the IGBT module mounting process since thermal resistance will be varied according to the position of the mounted modules: IGBT module(s) should have thermally optimized layout on heat sink according to the mechanical-thermal design so that the modules have good heat spread to minimize the thermal resistance. In case of several IGBT modules to be mounted on the same heat sink, the distance between IGBT modules should be optimized based on the mechanical-thermal design and the estimated total power dissipation of each module in order to avoid the thermal coupling effect between neighbor modules. 1.2 Heat sink surface finishing (module mounting area) The flatness of the heat sink between the mounting holes should be less than 50μm per 100mm. The surface roughness should be less than 10μm. If the surface of the heat sink does not have enough flatness, the module may have unexpected increase of the contact thermal resistance (R th(c-f) ) between the module and the heat sink. Also, if the heat sink flatness doesn t meet the above requirements, a high mechanical stress may be applied to the DCB on the module and it may cause insulation failure. 1.3 Thermal grease pasting Thermal grease between heat sink and module baseplate is absolutely necessary to reduce the contact thermal resistance. Screen-printing, rollers or spatulas are typical method of thermal grease pasting, however, using a stencil mask is recommended when the target grease thickness is less than 100μm. Table 1 Recommended properties of thermal grease Items Recommendation Penetration (typ.) 338 Thermal conductivity 0.92 W/mK Thermal grease thickness 100μm ±30μm *1) The thermal resistance between the heat sink and the module depends on the thermal grease properties and thickness. Fuji Electric strongly recommends customers to confirm contact interface after mounting whether the terminal grease spreading is good enough or not. Also Fuji Electric recommends confirmation of the thermal interface status after thermal cycling if the thermal grease has low viscosity. 2 MT5Q01693c

40 Mounting Instruction for M254 Package *2) Electrical document of the recommended stencil mask pattern and recommended method are also available on request. 1.4 Mounting procedure Mounting procedures onto heat sink are described in below. (a) The minimum and maximum screw torque for mounting screws (M5) indicated as (1) (4) in Fig.1 are: Minimum: 2.5Nm Maximum: 3.5Nm P1 (1) (3) P3 (b) Pre-fastening is recommended with 1/3 of the final torque with sequence of (1) (2) (3) (4) or (4)-(3)-(2)-(1) in Fig.1. (c) Final torque must be within specified force of 2.5 to 3.5 Nm with sequence of (1) (2) (3) (4) or (4)-(3)-(2)-(1) in Fig.1. (d) To keep the creepage and clearance distance, the total height include screw and washer must not exceed 6.0mm. P4 P2 Fig.1 (4) Mounting holes (1) (2) (4) 1.5 PCB mounting procedure The PCB mounting procedure is described in below. (a) The minimum and maximum torque for screwing (P1) (P4) indicated in Fig. 1 with M2.6 self-tapping screw are: Minimum: 0.4Nm Maximum: 0.5Nm (b) Pre-fastening is recommended with 1/3 of the final torque with sequence of (P1) (P2) (P3) (P4) or (P4)-(P3)-(P2)-(P1) in Fig.1. (c) Final torque must be within specified torque of 0.4 to 0.5Nm with sequence (P1) (P2) (P3) (P4) or (P4)-(P3)-(P2)-(P1) in Fig.1. The maximum screw rotation speed is 300 rpm. 1.6 Electrostatic discharge (ESD) protection If excessive static electricity is applied to the control terminals, the devices can be broken. Some countermeasures against static electricity are necessary. 3 MT5Q01693c

41 Mounting Instruction for M254 Package 2 Connecting main terminals 2.1 Bus bar connection Screw size for main terminals: Screw length: Screw torque: Maximum terminal temperature M6 Bus bar thickness + (7 to 9mm) Minimum 3.5Nm / Maximum 4.5Nm 125 o C <Important notes> Special care should be taken when mounting bus bar to IGBT main terminals so that the terminals do not have excess forces. The principle of a lever sometimes makes the moment of force much bigger than expected especially when installing to long bus bar. In addition, the terminals may have seriously damages when the module is fixed with miss alignment in position between the module terminal and bus bar holes. Well alignment to the module terminals and bus bar holes are recommended to reduce mechanical stress. 2.2 Maximum allowable strength and directions for bus bars Mechanical allowable mechanical strength and directions when connecting bus bars to the main and auxiliary terminals are describes in the table A below. C D E Direction A B C D E F G H I J Strength* 5 Nm 3 Nm 500 N 500 N 200 N 200 N 5 Nm 5 Nm 500 N 1000 N G B F (a) Horizontal direction I *) The strength in the table is the mechanical capability for the short period during the mounting process. H J (a) Vertical direction Fig.2 Vector descriptions from bus bar 2.3 Clearance and creepage distance In order to keep enough isolation voltage, it is recommended that the terminals should keep both clearance and creepage distance as defined (a) and (b) in Fig.3. The minimum value of the clearance and 4 MT5Q01693c

42 Mounting Instruction for M254 Package creepage distance are: Clearance distance Creepage distance 9.5mm 14.0mm (b) (a) Fig. 3 Clearance and creepage distance for IGBT main terminals 5 MT5Q01693c

43 Mounting Instruction for M254 Package 3 PCB mounting procedure 3.1 Recommended screws The recommended screw diameter is 2.4mm to 2.6mm (M2.6) because the diameter of the mounting holes for PCB is 2.2mm and 2.5mm. Fig.4 shows the recommended screw types and length. Self-tapping screws are recommended. (a) Holes for PCB 2.4~2.6mm (b) recommended screw Fig.4 PCB screw holes and recommended screw cross section 6 MT5Q01693c

44 3.2 Screw length Mounting Instruction for M254 Package 7.0mm to 10.0mm length screws are recommended for mounting PCBs onto the module. Recommended screw torque is 0.4~0.5Nm, the screws should be placed straight along the hole as shown in Fig.5. If screws are tightened with angles as shown Fig.6, the module or PCB might be damaged in worst case. PCB 7.0~10.0mm Module Fig.5 Hole cross sectional image of screw Fig.6 Bad example of screw tightened with angular position 7 MT5Q01693c

45 Mounting Instruction for M254 Package 3.3 Screwing for mounting PCB Manual screwing is recommended for PCB mounting. If other tools such as electric drivers or other automated machines are used, please confirm the parameter configuration such as screwing torque of the tools before the mounting process in order to avoid the mechanical damage by the automatic screw process. 3.4 Example of mechanical damage with wrong screw and/or process If unrecommended screws and/or methods are used in IGBT/PCB installation process, it may have a risk of mechanical damage as shown in Fig.7. Please confirm the screw types and mounting process in advance. Fig.7 Example of damaged module by wrong screw 8 MT5Q01693c

46 WARNING 1.This Catalog contains the product specifications, characteristics, data, materials, and structures as ofjune2014. The contents are subject to change without notice for specification changes or other reasons. When using a product listed in this Catalog, be sur to obtain the latest specifications. 2.All applications described in this Catalog exemplify the use of Fuji's products for your reference only. No right or license, either express or implied, under any patent, copyright, trade secret or other intellectual property right owned by Fuji Electric Co., Ltd. is (or shall be deemed) granted. Fuji Electric Co., Ltd. makes no representation or warranty, whether express or implied, relating to the infringement or alleged infringement of other's intellectual property rights which may arise from the use of the applications described herein. 3.Although Fuji Electric Co., Ltd. is enhancing product quality and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take adequate safety measures to prevent the equipment from causing a physical injury, fire, or other problem if any of the products become faulty. It is recommended to make your design failsafe, flame retardant, and free of malfunction. 4.The products introduced in this Catalog are intended for use in the following electronic and electrical equipment which has normal reliability requirements. Computers OA equipment Communications equipment (terminal devices) Measurement equipment Machine tools Audiovisual equipment Electrical home appliances Personal equipment Industrial robots etc. 5.If you need to use a product in this Catalog for equipment requiring higher reliability than normal, such as for the equipment listed below, it is imperative to contact Fuji Electric Co., Ltd. to obtain prior approval. When using these products for such equipment, take adequate measures such as a backup system to prevent the equipment from malfunctioning even if a Fuji's product incorporated in the equipment becomes faulty. Transportation equipment (mounted on cars and ships) Trunk communications equipment Traffic-signal control equipment Gas leakage detectors with an auto-shut-off feature Emergency equipment for responding to disasters and anti-burglary devices Safety devices Medical equipment 6.Do not use products in this Catalog for the equipment requiring strict reliability such as the following and equivalents to strategic equipment (without limitation). Space equipment Aeronautic equipment Nuclear control equipment Submarine repeater equipment 7.Copyright byFujiElectricCo.,Ltd.Allrightsreserved. No part of this Catalog may be reproduced in any form or by any means without the express permission of Fuji Electric Co., Ltd. 8.If you have any question about any portion in this Catalog, ask Fuji Electric Co., Ltd. or its sales agents before using the product. Neither Fuji Electric Co., Ltd. nor its agents shall be liable for any injury caused by any use of the products not in accordance with instructions set forth herein.