DSCC Supplemental Information Sheet for Electronic QML-38534

Transcription

1 Specification Details: Specification: MIL-PRF Title: Hybrid s Federal Supply (FSC): 5962 Conventional: No Specification contains quality assurance program: Yes MIL-STD-79 Established Reliability & High Reliability: No MIL-STD-69 Failure Rate Sampling Plans & Procedures: No Weibull Graded: No Specification contains space level reliability requirements: Yes Specification allows test optimization: Yes Contact Information: Date: 5/27/2 DSCC Office of Primary Involvement: Hybrid Devices Branch, DSCC-VQH Primary DSCC-VQ Contact: , vqh.rb@dla.mil Secondary DSCC-VQ Contact: , vqh.esr@dla.mil Notes: In order for a manufacturer to have test data considered for qualification, the manufacturer must perform all required qualification tests; produce the qualification sample with DSCC certified materials and manufacturing construction techniques; and comply with the requirements specified in MIL-PRF Custom hybrid microcircuit materials and manufacturing construction techniques in this listing applies only to products produced on the MIL-PRF certified line(s) at the plant(s) specified in this listing. Custom hybrid microcircuits manufactured, assembled, and tested in accordance with MIL-PRF shall bear the "certification mark" for SMD controlled hybrid s, or the "compliant hybrid" certification mark for non-smd controlled hybrid microcircuits as follows: SMD product, for all classes, shall have the certification mark "QML" or "Q" for small devices. Non-SMD product dated after MIL-PRF-38534D, for K shall have the certification mark "CK." Non-SMD product dated after MIL-PRF-38534D, for H shall have the certification mark "CH." Non-SMD product dated after MIL-PRF-38534D, for G shall have the certification mark "CG." Non-SMD product dated after MIL-PRF-38534D, for E shall have the certification mark "CE." Non-SMD product dated after MIL-PRF-38534D, for D shall have the certification mark "CD." Non-SMD dated prior to MIL-PRF-38534D, for all classes, shall have the certification mark "CH" or "C" for small devices. These certification marks or the abbreviations "Q" or "C" shall not be used on product that does not meet all requirements of MIL-PRF except as allowed in of MIL-PRF s manufactured, assembled, and tested for K, H, G, E, or D, with all the provisions of MIL-PRF-38534, and with DSCC qualified materials and manufacturing construction techniques, can be represented as being compliant to the appropriate product assurance levels as listed herein. The information contained in this listing reflects the general material and manufacturing techniques of the particular test sample(s). In order to protect the manufacturers' proprietary processes and materials, only the generic process and material are listed. The user must contact the manufacturer for any detail information on specific materials (i.e., such as epoxy, getter, solder-type), or process details. Processes and materials, not listed, may be considered qualified by similarity to those demonstrated for the qualification (e.g., different wire, package, or die sizes). See Appendix E of MIL-PRF-38534, l, major changes paragraph, for a baseline of qualification limits. Any product represented as being compliant to MIL-PRF must be built using qualified processes and materials. The user shall be responsible for determining if the qualification baseline for a given class level is adequate to demonstrate capability for the intended application. To obtain MIL-PRF qualified hybrid microcircuits, the user should specify in the procurement document that the product be manufactured to MIL-PRF , and be comprised of materials and manufacturing construction techniques listed herein. Acquisition requirements are contained in paragraph 6.2 of MIL- PRF devices represented as being built, tested and shipped under the QML provision of MIL-PRF must be built using qualified manufacturing materials and construction in this listing. Contractor acquiring activities, military program offices, and other government representatives can determine if hybrid microcircuits meet the requirements of MIL-PRF by: a. For SMD controlled product: listed in the product eligibility section herein and marked with "QML" or "Q". b. For non-smd controlled : The part will not be listed herein. However, the part will be marked with "C" plus the Level designator". WARNING! If products were not purchased to, and identified as MIL-PRF compliant, do not assume they have been manufactured on the DSCC certified line, with qualified materials and processes, or that all other MIL-PRF requirements were performed. To determine whether new SMD controlled products are in accordance with MIL-PRF-38534, or to verify any new process/material qualifications, you may call the qualifying activity (DSCC-VQ). DSCC-VQ ISO Registrations are also listed herein. However, QML listed manufacturers may have ISO registrations from other registrars. / This listing can be expanded provided appropriate qualification testing is performed and passed. Therefore the manufacturer may accept an order for compliant product not covered by his listing, but shall not ship the compliant product until the testing has been successfully completed. 2/ Package seal perimeter is listed by largest perimeter successfully tested in inches. 3/ Package lead counts are listed by maximum number of leads covered by qualification. --

2 4/ Caution. Do not use this number for item acquisition. Item acquired to this number may not satisfy the performance requirements of the listed SMD. 5/ Inactive for new design, no longer available from manufacturer. 6/ E devices are devices which meet all of the requirements of one of the other classes (K, H, or G), with some exceptions taken. Therefore any manufacturer qualified to G, H or K is eligible to produce and mark product as compliant to class E. Part Configuration: ized (SMD) H X A Federal Stock SMD Number Device Number Package Type Lead Finish Process/Material Listings: MIL-PRF QML Program Status Microelectronic Solutions ( : ) 35 South Service Road, Plainview, NY , US Company Contact: Mr. Jack Young, Phone: , Fax: , jack.young@aeroflex.com DSCC Contact: Ms. Jacqueline Cunningham, Phone: , Fax: , vqh.jc@dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Options and 2 DSCC ISO 9 System: No Technologies: Linear, Analog, Digital, Power, Voltage Regulator Microelectronic Solutions Qualification Letters: EQ(EQC-9-66), EQ(EQC-9-896), EQ(EQC-92-), EQ(EQC-93-9), EQ(EQC-94-32), ELS(ELSH ), ELS(ELSH-95-42), ELS(ELSH ), ELS(ELSH-96-3), ELS(ELSH-96-76), VQ(VQH-98-), VQ(VQH-99-28), VQ(VQH--7), VQ(VQH--8), VQH-2-43, VQ(VQH-2-27), VQ(VQH-4-586), VQ(VQH ), VQ(VQH-4-626), VQ(VQH ), VQ(VQH-5-867), VQ(VQH-5-944), VQ(VQH-6-542), VQ(VQH-7-286) Level Information: See Note 6/ K, H, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: QAP2-225, QAP2-24 Substrate Fabrication: Thick Film on Alumina, 6 Conductor Level(s), Resistors; Thick Film on Beryllia, Conductor Level(s) Assembly Information: See Note / Assembly Flows: QAP2-24, QAP2-337 Substrate Attach: Solder, Nonconductive Epoxy, Conductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Tabs, Chip Resistors, Daughter Board, Transformers, Optocoupler Assembly Wire Bonding: Gold, Aluminum Package Information: See Notes / 2/ 3/ Package Information: Metal Package, Axial Leads, Seam Weld, 7.94 Inch Seal Perimeter, 9 Leads, Gold Lead Finish; Ceramic Package, Dual-in-line, Seam Weld, 3.72 Inch Seal Perimeter, 24 Leads, Gold Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 7. Inch Seal Perimeter, 88 Leads, Gold/Solder Lead Finish; Metal Package, Platform, Projection Weld, 3.93 Inch Seal Perimeter, 24 Leads, Gold Lead Finish; Ceramic Co-fire Package, Axial Leads, Seam Weld, 7.66 Inch Seal Perimeter, 9 Leads, Gold Lead Finish; Metal Package, Flatpack, Seam Weld, 5. Inch Seal Perimeter, 96 Leads, Gold Lead Finish -2-

3 MIL-PRF QML Program Status Microelectronic Solutions ( : ) 35 South Service Road, Plainview, NY , US Company Contact: Mr. Jack Young, Phone: , Fax: , jack.young@aeroflex.com DSCC Contact: Ms. Jacqueline Cunningham, Phone: , Fax: , vqh.jc@dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Options and 2 DSCC ISO 9 System: No Technologies: Linear, Analog, Digital, Power, Voltage Regulator Cirtek Electronics Corp. Philippines Plant Qualification Letters: VQ(VQH-3-393), VQ(VQH ) Level Information: See Note 6/ H Substrate Fabrication Information: See Note / Substrate Fabrication Flows: Substrate Fabrication: N/A N/A Assembly Information: See Note / Assembly Flows: QAP2-24 Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors, Tabs, Chip Resistors Wire Bonding: Gold Package Information: See Notes / 2/ 3/ Package Information: N/A -3-

4 MIL-PRF QML Program Status Analog Devices Incorporated ( : 343) Assembled s Division, 79 Triad Center Drive, Greensboro, NC , US Company Contact: Ms. Elaine Trotter, Phone: , Fax: , elaine.trotter@analog.com DSCC Contact: Mr. Joseph Buben II, Phone: , Fax: , vqh.jbu@dla.mil Quality Management (QM) Program: TRB Periodic Inspection System: Option DSCC ISO 9 System: No Technologies: AD/DA Converters, Buffer, Op-Amp, Track and Hold, Voltage Reference, Signal Processor, Data Acquisition Systems, DC/DC Converters Subcontractor: C-MAC s (Cage: U4388) Qualification Letters: VQ(VQH-4-65), VQ(VQH-4-722), VQ(VQH-4-723), VQ(VQH ), VQ(VQH-6-44), VQ(VQH ) Level Information: See Note 6/ H, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: N/A Substrate Fabrication: Purchased Ceramic Co-fire; Thick Film, 4 Conductor Level(s) Assembly Information: See Note / Assembly Flows: FCES 63:5 Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors, Ceramic Tabs, Transformers Wire Bonding: Gold Package Information: See Notes / 2/ 3/ Package Information: Ceramic Co-fire Package, Dual-in-line, Seam Weld, 2.53 Inch Seal Perimeter, 24 Leads, Gold Lead Finish; Ceramic Package, Dual-inline, Seam Weld, 5.38 Inch Seal Perimeter, 32 Leads, Gold Lead Finish; Ceramic Package, Quad Flat Pack, Seam Weld, 3.48 Inch Seal Perimeter, 68 Leads, Gold Lead Finish -4-

5 MIL-PRF QML Program Status Technologies ( : ) No. Yishun Avenue 7, Singapore, Company Contact: Ms. Shelley Sinclair, Phone: , Fax: , shelley.sinclair@avagotech.com DSCC Contact: Mr. Dan Miller, Phone: , Fax: , vqh.dm@dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Options and 2 DSCC ISO 9 System: No Technologies: Optocoupler Qualification Letters: EQ(EQM ), EQ(EQM ), EQ(EQC-9-754), EQ(EQC-93-27), EQ(EQC-93-59), ELS(ELSH-95-27), VQ(VQH-97-47), VQ(VQH--9), VQ(VQH--64), VQ(VQH-2-432), VQ(VQH-2-278), VQ(VQH-4-668), VQ(VQH ) Level Information: See Note 6/ K, H, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: N/A Substrate Fabrication: Purchased Thick Film Assembly Information: See Note / Assembly Flows: ICPI-9-3 Substrate Attach: Eutectic, Solder, Silver Glass Element Attach: Eutectic, Silver Glass Add-on Elements: Unpackaged Die Wire Bonding: Gold, Aluminum Package Information: See Notes / 2/ 3/ Package Information: Ceramic Package, Dual-in-line, Solder Seal,.28 Inch Seal Perimeter, 6 Leads, Gold/Solder Lead Finish; Ceramic Package, Leadless Chip Carrier, Solder Seal,.92 Inch Seal Perimeter, 2 Leads, Solder Lead Finish; Ceramic Package, Peripheral Leads, Solder Seal,.32 Inch Seal Perimeter, 6 Leads, Gold Lead Finish -5-

6 MIL-PRF QML Program Status BAE Systems Electronic & Integrated Solutions ( : 6376) 2 Taylor Street, Fort Wayne, IN , US Company Contact: Ms. Julie Kukelhan, Phone: , Fax: , julie.kukelhan@baesystems.com DSCC Contact: Ms. Jonnie Schneider, Phone: , Fax: , vqh.jms@dla.mil Quality Management (QM) Program: TRB Periodic Inspection System: Option DSCC ISO 9 System: No Technologies: Linear, High Power Qualification Letters: VQ(VQH--9), VQ(VQH--2) Level Information: See Note 6/ H, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: N/A Substrate Fabrication: Purchased Thick Film on Beryllia, Conductor Level(s), Resistors; Purchased Thick Film on Ceramic Co-fire, Conductor Level(s), Resistors Assembly Information: See Note / Assembly Flows: QCWI-ES-6 Substrate Attach: Solder Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors, Tabs Wire Bonding: Gold, Aluminum Package Information: See Notes / 2/ 3/ Package Information: Metal Package, Flatpack, Seam Weld, 5.92 Inch Seal Perimeter, 28 Leads, Gold Lead Finish -6-

7 MIL-PRF QML Program Status BI Technologies Corporation ( : 7338) 42 Bonita Place, Fullerton, CA , US Company Contact: Mr. Raul Suarez, Phone: , Fax: , raulsuarez@bitechnologies.com DSCC Contact: Ms. Jonnie Schneider, Phone: , Fax: , vqh.jms@dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Options and 2 DSCC ISO 9 System: No Technologies: Voltage Regulator, Data Converters, Analog Qualification Letters: EQ(EQC-89-7), EQ(EQC-9-78), EQ(EQC ), EQ(EQC ), VQH-97-8, VQ(VQH--95) Level Information: See Note 6/ H, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: Substrate Fabrication: Thick Film on Alumina, 3 Conductor Level(s), Resistors Assembly Information: See Note / Assembly Flows: Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy Add-on Elements: Unpackaged Die, Chip Capacitors, Tabs, Chip Resistors Wire Bonding: Gold Package Information: See Notes / 2/ 3/ Package Information: Metal Package, Peripheral Leads, Seam Weld, 5.86 Inch Seal Perimeter, 6 Leads, Gold Lead Finish; Ceramic Package, Dual-in-line, Seam Weld, 6.87 Inch Seal Perimeter, 44 Leads, Gold Lead Finish; Ceramic Co-fire Package, Flatpack, Seam Weld,.4 Inch Seal Perimeter, Leads, Gold Lead Finish -7-

8 MIL-PRF QML Program Status Cirrus Logic - APP Tucson ( : 624) 598 North Shannon Road, Tucson, AZ , US Company Contact: Mr. Mark Collingham, Phone: , Fax: , mark.collingham@cirrus.com DSCC Contact: Mr. Edward Raybould, Phone: , Fax: , vqh.esr@dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option DSCC ISO 9 System: Yes Technologies: Power Op-Amp Qualification Letters: EQ(EQC-9-347), EQ(EQC-92-4), EQ(EQC-92-46), EQ(EQC-93-28), EQ(EQC ), ELS(ELSH ), ELS(ELSH-95-7) Level Information: See Note 6/ H, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: Flow Substrate Fabrication: Thick Film on Beryllia, Conductor Level(s), Resistors Assembly Information: See Note / Assembly Flows: Flow, Flow 99 Substrate Attach: Solder Element Attach: Conductive Epoxy, Solder Add-on Elements: Unpackaged Die, Chip Capacitors Wire Bonding: Aluminum Package Information: See Notes / 2/ 3/ Package Information: Metal Package, TO can, Projection Weld, 2.67 Inch Seal Perimeter, 8 Leads, Gold/Solder Lead Finish -8-

9 MIL-PRF QML Program Status C-MAC MicroTechnology ( : U4388) South Denes, Great Yarmouth, Norfolk NR3 3PX, England Company Contact: Mr. David Lawn, Phone: , Fax: , davidlawn@cmac.com DSCC Contact: Mr. Joseph Buben II, Phone: , Fax: , vqh.jbu@dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option DSCC ISO 9 System: No Technologies: 553 Transceiver, High Voltage Drivers, Power Qualification Letters: EQ(EQC-9-835), EQ(EQC-92-84), EQ(EQC-93-39), ELS(ELSH-96-54), ELS(ELSH-96-6), VQ(VQH ), VQ(VQH-99-92), VQ(VQH-99-96), VQ(VQH-4-65), VQ(VQH-4-722), VQ(VQH-4-723), VQ(VQH ), VQ(VQH ), VQ(VQH-6-73), VQ(VQH-6-795), VQ(VQH ), VQ(VQH--273), VQ(VQH--2296) Level Information: See Note 6/ K, H, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: FCES 63:5 Substrate Fabrication: Purchased Ceramic Co-fire; Thick Film on Alumina, 4 Conductor Level(s), Resistors; Purchased Direct Bonded Copper on Beryllia Assembly Information: See Note / Assembly Flows: FCES 63:5 Substrate Attach: Conductive Epoxy, Nonconductive Epoxy, Solder Element Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors, Transformers, Ceramic Tabs Wire Bonding: Gold, Aluminum, Aluminum Ribbon Package Information: See Notes / 2/ 3/ Package Information: Metal Package, Axial Leads, Seam Weld, 5.3 Inch Seal Perimeter, 36 Leads, Gold/Solder Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 5.3 Inch Seal Perimeter, 36 Leads, Gold/Solder Lead Finish; Metal Package, Axial Leads, Projection Weld, 4.37 Inch Seal Perimeter, 24 Leads, Gold/Solder Lead Finish; Ceramic Package, Pin Grid Array, Seam Weld, 5. Inch Seal Perimeter, Leads, Gold Lead Finish; Metal Package, TO can, Projection Weld,.3 Inch Seal Perimeter, Leads, Gold/Solder Lead Finish; Ceramic Co-fire Package, Dual-in-line, Seam Weld, 2.53 Inch Seal Perimeter, 24 Leads, Gold Lead Finish; Ceramic Package, Dual-in-line, Seam Weld, 5.38 Inch Seal Perimeter, 32 Leads, Gold Lead Finish; Ceramic Package, Quad Flat Pack, Seam Weld, 3.48 Inch Seal Perimeter, 68 Leads, Gold Lead Finish -9-

10 MIL-PRF QML Program Status CMC Electronics Incorporated ( : 973) 6 Dr. Frederik Philips Boulevard, Ville Saint Laurent, Quebec, H4M 2S9, Canada Company Contact: Mr. Jean-Marc Perreault, Phone: x487, Fax: , Jean-Marc.Perreault@cmcelectronics.ca DSCC Contact: Ms. Jacqueline Cunningham, Phone: , Fax: , vqh.jc@dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Options and 2 DSCC ISO 9 System: No Technologies: Voltage Regulator Qualification Letters: EQ(EQC-9-72), EQ(EQC ), VQ(VQH-98-33), VQ(VQH ) Level Information: See Note 6/ H, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: Substrate Fabrication: Thick Film on Alumina, 7 Conductor Level(s), Resistors Assembly Information: See Note / Assembly Flows: Substrate Attach: Nonconductive Epoxy, Conductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors Wire Bonding: Gold Package Information: See Notes / 2/ 3/ Package Information: Metal Package, Axial Leads, Seam Weld, 3.6 Inch Seal Perimeter, 6 Leads, Gold Lead Finish; Metal Package, Bathtub, Seam Weld, 4.3 Inch Seal Perimeter, 24 Leads, Gold Lead Finish; Metal Package, Flatpack, Seam Weld,.56 Inch Seal Perimeter, 44 Leads, Gold Lead Finish --

11 MIL-PRF QML Program Status Cobham Sensor Systems (formerly REMEC) ( : 65628) 944 Chesapeake Drive, San Diego, CA , US Company Contact: Mr. Chuck Bagwell, Phone: , Fax: , chuck.bagwell@cobhamdes.com DSCC Contact: Mr. Richard Barker, Phone: , Fax: , vqh.rb@dla.mil Quality Management (QM) Program: TRB Periodic Inspection System: Option DSCC ISO 9 System: No Technologies: Microwave Amplifier, Microwave Filter, Microwave Custom (IMAs) Qualification Letters: ELS(ELSH-94-99), VQ(VQH ), VQ(VQH ), VQ(VQH-97-8), VQ(VQH-97-8), VQ(VQH--4) Level Information: See Note 6/ H, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: N/A Substrate Fabrication: Purchased Thin Film; Purchased Duriod; Purchased Polyimide/PWB Copper Assembly Information: See Note / Assembly Flows: 775 Substrate Attach: Conductive Epoxy, Eutectic, Solder Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors, Toroids, Coils, Thermcon, Inductors, Attenuators, IC Package Wire Bonding: Gold, Copper, Ribbon Package Information: See Notes / 2/ 3/ Package Information: Metal Package, Peripheral Leads, Seam Weld, 4. Inch Seal Perimeter, 6 Leads, Gold Lead Finish; Aluminum/Stainless Steel Package, DC/Microwave Leads, Laser Weld, 2.5 Inch Seal Perimeter, 6 Leads; Aluminum/Stainless Steel Package, DC/Microwave Leads (Dual-Sided, Multi-Cavity), Laser Weld, 24. Inch Seal Perimeter, 4 Leads --

12 MIL-PRF QML Program Status Data Device Corporation ( : 9645) 5 Wilbur Place, Bohemia, NY , US Company Contact: Mr. Ronald Kanaby, Phone: x736, Fax: , kanabyr@ddc-web.com DSCC Contact: Mr. Joseph Buben II, Phone: , Fax: , vqh.jbu@dla.mil Quality Management (QM) Program: TRB Periodic Inspection System: Options and 2 DSCC ISO 9 System: No Technologies: 553 Bus, Data Converters, Power Qualification Letters: EQ(EQC-9-22), EQ(EQC-9-657), EQ(EQC-9-4), EQ(EQC-9-36), EQ(EQC-9-38), EQ(EQC-9-386), EQ(EQC-9-66), EQ(EQC-9-667), EQ(EQC-93-55), EQ(EQC-93-99), EQ(EQC ), EQ(EQC ), ELS(ELSH ), ELS(ELSH ), ELS(ELSH ), ELS(ELSH-95-4), ELS(ELSH ), VQ(VQH-96-23), VQ(VQH-98-), VQ(VQH-99-33), VQ(VQH-99-29), VQ(VQH ), VQ(VQH-2-969), VQ(VQH ), VQ(VQH-4-582), VQ(VQH ), VQ(VQH-6- ), VQ(VQH ), VQ(VQH--9748) Level Information: See Note 6/ K, H, D, G, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: 4638, 4639, Substrate Fabrication: Thick Film on Alumina, 4 Conductor Level(s), Resistors; Thin Film on Alumina, Conductor Level(s); Thick Film on Beryllia, Conductor Level(s), Resistors Assembly Information: See Note / Assembly Flows: 4634, 4635, Substrate Attach: Nonconductive Epoxy, Solder, Conductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors, Tabs, Transformers, Chip Resistors, Tantalum Capacitors, Ceramic Capacitors Wire Bonding: Gold, Aluminum, Copper/Tin Solder Package Information: See Notes / 2/ 3/ Package Information: Metal Package, Peripheral Leads, Seam Weld, 8.8 Inch Seal Perimeter, 6 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Axial Leads, Seam Weld,.26 Inch Seal Perimeter, 94 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Platform, Projection Weld, 5.38 Inch Seal Perimeter, 32 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 7.58 Inch Seal Perimeter, 82 Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Axial Leads, Seam Weld, 7.34 Inch Seal Perimeter, 78 Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Peripheral Leads, Seam Weld, 7.34 Inch Seal Perimeter, 78 Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, Axial Leads, Seam Weld, 5.8 Inch Seal Perimeter, 7 Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, Peripheral Leads, Seam Weld, 5.8 Inch Seal Perimeter, 7 Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, Peripheral Leads, Seam Weld, 4. Inch Seal Perimeter, 8 Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, Axial Leads, Seam Weld, 4. Inch Seal Perimeter, 8 Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, J-Leads, Solder Seal, 2.2 Inch Seal Perimeter, 4 Leads, Gold Lead Finish, Getter Qualified -2-

13 MIL-PRF QML Program Status EADS Astrium Limited ( : U6924) Astrium Satellites, Anchorage Road, Portsmouth, Hampshire, PO35PU, UK Company Contact: Mr. David Brewster, Phone: 44() , Fax: 44() , david.brewster@astrium.eads.net DSCC Contact: Mr. Joseph Buben II, Phone: , Fax: , vqh.jbu@dla.mil Quality Management (QM) Program: TRB Periodic Inspection System: Options and 2 DSCC ISO 9 System: No Technologies: Modular Microwave Hybrid Technology Produces E product based on K listing Qualification Letters: VQ(VQH-9-688) Level Information: See Note 6/ K, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: Substrate Fabrication: N/A N/A Assembly Information: See Note / Assembly Flows: MCD-DG6373-ASTR Substrate Attach: N/A Element Attach: Eutectic, Solder Add-on Elements: Unpackaged Die, Molytabs Wire Bonding: Gold Package Information: See Notes / 2/ 3/ Package Information: Ceramic Package, Leadless, Seam Weld, 2.43 Inch Seal Perimeter -3-

14 MIL-PRF QML Program Status International Rectifier Aerospace & Defense (CA) ( : ) 252 Junction Avenue, San Jose, CA , US Company Contact: Mr. Granville 'Bo' Rains, Phone: , Fax: , grains@irf.com DSCC Contact: Ms. Jonnie Schneider, Phone: , Fax: , vqh.jms@dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Options and 2 DSCC ISO 9 System: No Technologies: DC/DC Converters Santa Clara Facility Qualification Letters: EQ(EQC-89-65), EQ(EQC-9-652), EQ(EQC-92-3), EQ(EQC-93-24), EQ(EQC-93-43), EQ(EQC ), EQ(EQC ), ELS(ELSH-94-73), ELS(ELSH-94-2), ELS(ELSH-94-22), ELS(ELSH ), ELS(ELSH ), ELS(ELSH ), VQ(VQH-98-), VQ(VQH-98-23), VQ(VQH-3-357), VQ(VQH ), VQ(VQH-6-5), VQ(VQH ), VQ(VQH ) Level Information: See Note 6/ K, H, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: Substrate Fabrication: Thick Film on Alumina, 2 Conductor Level(s), Resistors; Thick Film on Beryllia, 4 Conductor Level(s), Resistors; Purchased Direct Bonded Copper Assembly Information: See Note / Assembly Flows: Substrate Attach: Conductive Epoxy, Nonconductive Epoxy, Solder Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder, RTV, Elastomer Add-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Tabs, Chip Resistors, Transformers, Inductors Wire Bonding: Gold, Aluminum, Copper Package Information: See Notes / 2/ 3/ Package Information: Ceramic Package, Dual-in-line, Seam Weld, 3.69 Inch Seal Perimeter, 24 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Axial Leads, Seam Weld, 6.58 Inch Seal Perimeter, Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld,. Inch Seal Perimeter, 58 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 8. Inch Seal Perimeter, 2 Leads, Gold/Solder Lead Finish, Getter Qualified USI Nan-Tou Taiwan Plant Qualification Letters: VQ(VQH-2-624), VQ(VQH ) Level Information: See Note 6/ H, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: Substrate Fabrication: N/A N/A Assembly Information: See Note / Assembly Flows: Substrate Attach: Conductive Epoxy, Nonconductive Epoxy, Solder Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder Add-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Tabs, Chip Resistors, Transformers Wire Bonding: Gold, Aluminum, Copper Package Information: See Notes / 2/ 3/ Package Information: Metal Package, Axial Leads, Seam Weld, 6.58 Inch Seal Perimeter, Leads, Gold/Solder Lead Finish -4-

15 MIL-PRF QML Program Status International Rectifier Aerospace & Defense (MA) ( : 692) 25 Crawford Street, Leominster, MA , US Company Contact: Ms. Laura Halleck, Phone: , Fax: , lhallec@irf.com DSCC Contact: Ms. Jacqueline Cunningham, Phone: , Fax: , vqh.jc@dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Options and 2 DSCC ISO 9 System: No Technologies: Voltage Regulator, Power Qualification Letters: EQ(EQC-9-48), EQ(EQC-9-87), EQ(EQC-9-838), EQ(EQM-94-29), ELS(ELSH ), VQ(VQH-98-4), VQ(VQH-- 34), VQ(VQH ), VQ(VQH ), VQ(VQH--996), VQ(VQH--28) Level Information: See Note 6/ K, H, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: D55G Substrate Fabrication: Thick Film on Alumina, 2 Conductor Level(s), Resistors; Thick Film on Beryllia, 3 Conductor Level(s), Resistors Assembly Information: See Note / Assembly Flows: D55G Substrate Attach: Solder, Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder Add-on Elements: Unpackaged Die, Chip Capacitors, Tabs, Chip Resistors, Encapsulated Hybrid Wire Bonding: Gold, Aluminum Package Information: See Notes / 2/ 3/ Package Information: Metal Package, Peripheral Leads, Seam Weld, 2.47 Inch Seal Perimeter, 8 Leads, Solder Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 8.8 Inch Seal Perimeter, 43 Leads, Gold Lead Finish; Metal Package, TO Can, Projection Weld, 2.64 Inch Seal Perimeter, 8 Leads, Nickel Lead Finish -5-

16 MIL-PRF QML Program Status Corporation ( : 582) 3 Willows Road, Redmond, WA 9852, US Company Contact: Ms. Doris Krogness, Phone: , Fax: , Doris.Krogness@crane-eg.com DSCC Contact: Mr. Richard Barker, Phone: , Fax: , vqh.rb@dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Options and 2 DSCC ISO 9 System: No Technologies: Linear Amplifier, Signal Processor, Data Converters, DC/DC Converters, Analog, Digital, EMI Filters Qualification Letters: EQ(EQM ), EQ(EQM ), EQ(EQC-92-74), EQ(EQC-92-3), EQ(EQC-93-3), EQ(EQC-93-56), EQ(EQC-93-96), EQ(EQC-93-22), EQ(EQC-93-28), EQ(EQC-93-55), EQC , EQ(EQM-94-43), EQ(EQM-94-), ELS(ELSH ), ELS(ELSH ), ELS(ELSH ), ELS(ELSH-95-36), ELS(ELSH ), ELS(ELSH-96-95), ELS(ELSH-96-39), VQ(VQH-96-24), VQ(VQH ), VQ(VQH-99-3), VQ(VQH--3), VQ(VQH--88), VQ(VQH ), VQ(VQH-3-376), VQ(VQH-4-628), VQ(VQH AMENDED), VQ(VQH ), VQ(VQH-5-856), VQ(VQH-5-882), VQ(VQH-7-229), VQ(VQH ), VQ(VQH ) Level Information: See Note 6/ K, H, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: QA-39 Substrate Fabrication: Thick Film on Alumina, 3 Conductor Level(s), Resistors; Thick Film on Beryllia, 3 Conductor Level(s), Resistors; Thick Film on Beryllia, Conductor Level(s); Purchased Direct Bonded Copper Assembly Information: See Note / Assembly Flows: QA-39 Substrate Attach: Solder, Nonconductive Epoxy, Conductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder, Eutectic, RTV Add-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Tabs, Chip Resistors, Inductors, Toroids, Daughter Board Wire Bonding: Gold, Aluminum, Copper Package Information: See Notes / 2/ 3/ Package Information: Metal Package, Axial Leads, Projection Weld, 4.26 Inch Seal Perimeter, 8 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 4. Inch Seal Perimeter, 32 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 8.75 Inch Seal Perimeter, 2 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Axial Leads, Seam Weld, 6.4 Inch Seal Perimeter, 5 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Axial Leads, Seam Weld, 6. Inch Seal Perimeter, 38 Leads, Gold/Solder Lead Finish, Getter Qualified -6-

17 MIL-PRF QML Program Status Taiwan Corporation ( : 582) 5 South 6th Road Box 26-43, KEPZ, Kaohsiung, Taiwan, R.O.C 86 Company Contact: Ms. Doris Krogness, Phone: , Fax: , doris.krogness@intp.com DSCC Contact: Mr. Richard Barker, Phone: , Fax: , vqh.rb@dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option DSCC ISO 9 System: No Technologies: DC-DC Converter, EMI Filters Qualification Letters: VQ(VQH ), VQ(VQH-99-7), VQ(VQH-99-34), VQ(VQH-99-75), VQ(VQH-99-2), VQ(VQH--7), VQ(VQH-- 6), VQ(VQH-2-87), VQ(VQH-3-444), VQ(VQH-4-628), VQ(VQH ), VQ(VQH ), VQ(VQH-6-26), VQ(VQH-6-675), VQ(VQH-7-23), VQ(VQH ), VQ(VQH--9428), VQ(VQH--9429), VQ(VQH- -22) Level Information: See Note 6/ H, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: QA-39 Substrate Fabrication: Thick Film on Alumina, 3 Conductor Level(s), Resistors; Thick Film on Beryllia, 3 Conductor Level(s), Resistors Assembly Information: See Note / Assembly Flows: QA-39 Substrate Attach: Solder, Nonconductive RTV, Conductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Tabs, Chip Resistors, Inductors, Toroids, Daughter Board Wire Bonding: Gold, Aluminum, Copper Package Information: See Notes / 2/ 3/ Package Information: Metal Package, Axial Leads, Projection Weld, 5.4 Inch Seal Perimeter, 8 Leads, Gold Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 8. Inch Seal Perimeter, 2 Leads, Gold Lead Finish -7-

18 MIL-PRF QML Program Status L-3 Communications Cincinnati Electronics ( : 845) 75 Innovation Way, Mason, OH , US Company Contact: Ms. Jennifer Douglas, Phone: , Fax: , Jennifer.Douglas@L-3Com.com DSCC Contact: Mr. Richard Barker, Phone: , Fax: , vqh.rb@dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option DSCC ISO 9 System: No Technologies: Custom, Analog, Amplifier, Linear Qualification Letters: EQ(EQC-93-3), EQC-93-97, ELS(ELSH-94-47), VQ(VQH--34), VQ(VQH--223) Level Information: See Note 6/ K, H, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: 6374 Substrate Fabrication: Thick Film on Alumina, 6 Conductor Level(s) Assembly Information: See Note / Assembly Flows: Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors Wire Bonding: Gold Package Information: See Notes / 2/ 3/ Package Information: Qualification Letters: Metal Package, Axial Leads, Seam Weld, 3.48 Inch Seal Perimeter, 8 Leads, Gold Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 3.58 Inch Seal Perimeter, 2 Leads, Gold Lead Finish; Metal Package, Axial Leads, Seam Weld, 5.2 Inch Seal Perimeter, 3 Leads, Gold Lead Finish VQ(VQH-98-95), VQ(VQH--67) Level Information: See Note 6/ D Substrate Fabrication Information: See Note / Substrate Fabrication Flows: 6374 Substrate Fabrication: Thick Film on Alumina, 7 Conductor Level(s) Assembly Information: See Note / Assembly Flows: Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors Wire Bonding: Gold Package Information: See Notes / 2/ 3/ Package Information: Metal Package, Radial Leads, Laser Weld, 8. Inch Seal Perimeter, 69 Leads, Gold Lead Finish -8-

19 MIL-PRF QML Program Status Lockheed Martin Missiles and Fire Control ( : 4939) 56 Sand Lake Road MP89, Orlando, FL , US Company Contact: Mr. Francis Dalton, Phone: , Fax: , francis.dalton@lmco.com DSCC Contact: Ms. Jonnie Schneider, Phone: , Fax: , vqh.jms@dla.mil Quality Management (QM) Program: TRB Periodic Inspection System: Option DSCC ISO 9 System: No Technologies: Digital, Analog Qualification Letters: EQ(EQC-9-42), EQ(EQC-9-764), EQ(EQC-92-2), EQ(EQC-92-32), EQ(EQC-92-42), VQ(VQH-99-64), VQ(VQH ) Level Information: See Note 6/ H, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: N/A Substrate Fabrication: Purchased Thick Film Assembly Information: See Note / Assembly Flows: Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Chip Resistors, Inductors Wire Bonding: Gold, Aluminum Package Information: See Notes / 2/ 3/ Package Information: Ceramic Package, Leadless Chip Carrier, Solder Seal, 3.8 Inch Seal Perimeter, 68 Leads, Gold Lead Finish; Ceramic Package, Dualin-line, Solder Seal, 2.88 Inch Seal Perimeter, 8 Leads, Gold/Solder Lead Finish; Metal Package, Platform, Projection Weld, 5.76 Inch Seal Perimeter, 44 Leads, Gold Lead Finish; Metal Package, Axial Leads, Seam Weld,.8 Inch Seal Perimeter, 4 Leads, Gold Lead Finish -9-

20 MIL-PRF QML Program Status M.S. Kennedy Corporation ( : 565) 477 Dey Road, Liverpool, NY , US Company Contact: Mr. Daniel Miller, Phone: , Fax: , d.miller@mskennedy.com DSCC Contact: Ms. Binh Tonnu, Phone: , Fax: , vqh.bt@dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Options and 2 DSCC ISO 9 System: No Technologies: High Power, DC Amplifier, PWB H-Bridge, Custom, Voltage Regulator Qualification Letters: EQ(EQC-9-45), EQ(EQC-9-57), EQ(EQC-92-47), EQ(EQC-93-4), EQ(EQC ), EQ(EQC ), EQ(EQC ), EQ(EQC ), EQ(EQC ), EQ(EQC ), EQ(EQM-94-84), EQ(EQM-94-93), ELS(ELSH-94-4), ELS(ELSH-94-4), ELS(ELSH-94-42), ELS(ELSH-94-47), ELS(ELSH-95-2), ELS(ELSH-95-26), ELS(ELSH-95-34), ELS(ELSH-96-73), ELS(ELSH-96-86), VQ(VQH-96-26), VQ(VQH-97-46), VQ(VQH-97-73), VQ(VQH-97-89), VQ(VQH ), VQ(VQH ), VQ(VQH ), VQ(VQH ), VQ(VQH ), VQ(VQH-99-45), VQ(VQH--23), VQ(VQH-- 23), VQ(VQH--65), VQ(VQH--75), VQ(VQH-2-95), VQ(VQH-3-284), VQ(VQH ), VQ(VQH-3-492), VQ(VQH-3-494), VQ(VQH-4-584), VQ(VQH-4-548), VQ(VQH ), VQ(VQH ), VQ(VQH ), VQ(VQH-4-76), VQ(VQH-4-798), VQ(VQH ), VQ(VQH-5-886), VQ(VQH ), VQ(VQH ), VQ(VQH-6-963), VQ(VQH ), VQ(VQH ), VQ(VQH-6-6), VQ(VQH-6-82), VQ(VQH-6-86), VQ(VQH-6-359), VQ(VQH-6-59), VQ(VQH-6-846), VQ(VQH-6-56), VQ(VQH ), VQ(VQH ), VQ(VQH ), VQ(VQH ), VQ(VQH-8-499), VQ(VQH ), VQ(VQH-9-83), VQ(VQH-9-833), VQ(VQH ), VQ(VQH ) Level Information: See Note 6/ K, H, G, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: Substrate Fabrication: Thick Film on Alumina, 2 Conductor Level(s), Resistors; Thick Film on Alumina, 6 Conductor Level(s); Purchased Alumina/Copper; Thick Film on Beryllia, 3 Conductor Level(s), Resistors; Thick Film on Beryllia, Conductor Level(s); Purchased Alumina Assembly Information: See Note / Assembly Flows: Substrate Attach: Conductive Epoxy, Nonconductive Epoxy, Solder Element Attach: Solder, Conductive Epoxy, Nonconductive Epoxy, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors, Tabs, Chip Resistors, Inductors, Bonding Block, Daughter Board, Crystal, Ceramic Posts Wire Bonding: Gold, Aluminum Package Information: See Notes / 2/ 3/ Package Information: Metal Package, TO Can, Projection Weld, 3.4 Inch Seal Perimeter, 2 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Platform, Projection Weld, 2.6 Inch Seal Perimeter, 4 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Axial Leads, Seam Weld, 5. Inch Seal Perimeter, 44 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 6.95 Inch Seal Perimeter, 82 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 6. Inch Seal Perimeter, 2 Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Brazed Leads, Solder Seal, 2.6 Inch Seal Perimeter, 28 Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Leadless Chip Carrier, Solder Seal,.4 Inch Seal Perimeter, 2 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Surface Mount, Seam Weld, 2.5 Inch Seal Perimeter, 3 Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Peripheral Leads, Seam Weld, 4.79 Inch Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Flatpack, Seam Weld, 2.38 Inch Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified; Metal Package, Flatpack, Seam Weld, 5.98 Inch Seal Perimeter, 96 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Flatpack, Solder Seal,.33 Inch Seal Perimeter, 4 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Bathtub, Seam Weld,.68 Inch Seal Perimeter, 3 Leads, Gold Lead Finish, Getter Qualified -2-

21 MIL-PRF QML Program Status Industries, Incorporated ( : 3757) 95 East Walnut Street, Garland, TX , US Company Contact: Mr. Cecil Miller, Phone: , Fax: , cmiller@micropac.com DSCC Contact: Mr. Dan Miller, Phone: , Fax: , vqh.dm@dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Options and 2 DSCC ISO 9 System: Yes Technologies: Custom, Power, Optocouplers Inmobiliaria San Jose De Co. Plant Qualification Letters: VQ(VQH ), VQ(VQH-6-38), VQ(VQH-6-928) Level Information: See Note 6/ H, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: Substrate Fabrication: N/A N/A Assembly Information: See Note / Assembly Flows: 938 Substrate Attach: N/A Element Attach: Conductive Epoxy, Nonconductive Epoxy Add-on Elements: Unpackaged Die, Chip Resistors, Spacer Wire Bonding: Gold Package Information: See Notes / 2/ 3/ Package Information: N/A Custom Line, Garland TX Qualification Letters: EQ(EQC-9-78), EQ(EQC-9-647), EQ(EQC-92-83), EQ(EQC ), VQ(VQH ), VQ(VQH-5-874), VQ(VQH-5-92), VQ(VQH ), VQ(VQH-6-928), VQ(VQH-7-266), VQ(VQH ) Level Information: See Note 6/ K, H, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: 938 Substrate Fabrication: Thick Film on Alumina, 5 Conductor Level(s), Resistors Assembly Information: See Note / Assembly Flows: 938 Substrate Attach: Nonconductive Epoxy, Solder Element Attach: Eutectic, Conductive Epoxy, Nonconductive Epoxy Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors Wire Bonding: Gold Package Information: See Notes / 2/ 3/ Package Information: Metal Package, Axial Leads, Seam Weld, 5. Inch Seal Perimeter, 28 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 5. Inch Seal Perimeter, 46 Leads, Gold/Solder Lead Finish, Getter Qualified -2-

22 MIL-PRF QML Program Status Industries, Incorporated ( : 3757) 95 East Walnut Street, Garland, TX , US Company Contact: Mr. Cecil Miller, Phone: , Fax: , cmiller@micropac.com DSCC Contact: Mr. Dan Miller, Phone: , Fax: , vqh.dm@dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Options and 2 DSCC ISO 9 System: Yes Technologies: Custom, Power, Optocouplers Opto Line, Garland TX Qualification Letters: EQ(EQC-9-624), EQ(EQC-9-88), EQ(EQC-9-466), EQ(EQC-92-2), ELS(ELSH-95-57), ELS(ELSH ), VQ(VQH ), VQ(VQH-5-872) Level Information: See Note 6/ K, H, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: 938 Substrate Fabrication: Thick Film on Alumina, 2 Conductor Level(s), Resistors; Thick Film on Alumina, Conductor Level(s) Assembly Information: See Note / Assembly Flows: 938 Substrate Attach: Conductive Epoxy, Nonconductive Epoxy Element Attach: Eutectic, Conductive Epoxy Add-on Elements: Unpackaged Die Wire Bonding: Gold Package Information: See Notes / 2/ 3/ Package Information: Ceramic Package, Dual-in-line, Solder Seal,.89 Inch Seal Perimeter, 6 Leads, Gold/Solder Lead Finish, Getter Qualified; Ceramic Package, Leadless Chip Carrier, Solder Seal,.6 Inch Seal Perimeter, 24 Leads, Solder Lead Finish, Getter Qualified; Metal Package, TO Can (dual base), Projection Weld,.54 Inch Seal Perimeter, 7 Leads, Gold/Solder Lead Finish, Getter Qualified Power Line, Garland TX Qualification Letters: EQ(EQC-9-625), EQ(EQC-9-328), EQ(EQC-9-338), EQ(EQC-92-83), EQ(EQC ), ELS(ELSH ), VQ(VQH ), VQ(VQH-5-79), VQ(VQH-5-92), VQ(VQH-6-765), VQ(VQH-7-32), VQ(VQH ) Level Information: See Note 6/ K, H, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: 938 Substrate Fabrication: Thick Film on Alumina, Conductor Level(s), Resistors; Thick Film on Beryllia, 2 Conductor Level(s), Resistors Assembly Information: See Note / Assembly Flows: 938 Substrate Attach: Nonconductive Epoxy, Solder Element Attach: Conductive Epoxy, Solder, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors Wire Bonding: Gold, Aluminum Package Information: See Notes / 2/ 3/ Package Information: Metal Package, TO Can, Projection Weld, 2.27 Inch Seal Perimeter, 8 Leads, Gold/Solder Lead Finish, Getter Qualified; Ceramic Package, Dual-in-line, Seam Weld,.36 Inch Seal Perimeter, 8 Leads, Gold Lead Finish -22-

23 MIL-PRF QML Program Status Micro-Precision Technologies, Inc. ( : F962) Manor Parkway, Salem, NH , US Company Contact: Dr. Etang Chen, Phone: , Fax: , ec@micropt.com DSCC Contact: Ms. Binh Tonnu, Phone: , Fax: , vqh.bt@dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option DSCC ISO 9 System: Yes Technologies: Linear, Digital, Analog Qualification Letters: VQ(VQH--4), VQ(VQH--9928) Level Information: See Note 6/ H, G, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: CP946-Screening Rev. - Substrate Fabrication: Thick Film on Alumina, 3 Conductor Level(s), Resistors Assembly Information: See Note / Assembly Flows: CP946Q-Assembly Traveler Rev. - Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder Add-on Elements: Unpackaged Die, Chip Resistors, Chip Capacitors Wire Bonding: Gold Package Information: See Notes / 2/ 3/ Package Information: Metal Package, Peripheral Leads, Seam Weld, 6.32 Inch Seal Perimeter, 65 Leads, Gold Lead Finish -23-

24 MIL-PRF QML Program Status Micross Components, Austin ( : ) 87 Cross Park Drive, Austin, TX , US Company Contact: Mr. Allen Wares, Phone: x738, Fax: , Allen.Wares@micross.com DSCC Contact: Mr. Joseph Buben II, Phone: , Fax: , vqh.jbu@dla.mil Quality Management (QM) Program: TRB Periodic Inspection System: Option DSCC ISO 9 System: No Technologies: Memory Micross Components, Austin Qualification Letters: VQ(VQH-99-44), VQ(VQH ), VQ(VQH-5-935), VQ(VQH ), VQ(VQH-5-962), VQ(VQH-6-987), VQ(VQH-6-37), VQ(VQH-6-562), VQ(VQH-6-84), VQ(VQH-7-234), (VQ(VQH ) Level Information: See Note 6/ H, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: Substrate Fabrication: N/A N/A Assembly Information: See Note / Assembly Flows: 2/ASI-H/52K32F/A, 595, 648, AS8552K32P-SAD, S5232MA, R2832MA Substrate Attach: N/A Element Attach: Ag Cyanate Ester, Eutectic, Noncond. Cyanate Ester, Conductive Epoxy, Nonconductive Epoxy Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors Wire Bonding: Gold, Aluminum Package Information: See Notes / 2/ 3/ Package Information: Ceramic Co-fire Package, Quad Flat Pack, Solder Seal,.76 Inch Seal Perimeter, 68 Leads, Gold Lead Finish; Ceramic Package, Dual-in-line, Solder Seal,.44 Inch Seal Perimeter, 4 Leads, Solder Lead Finish; Ceramic Co-fire Package, Pin Grid Array, Seam Weld, 4.6 Inch Seal Perimeter, 66 Leads, Gold/Solder Lead Finish; Ceramic Co-fire Package, Quad Flat Pack, Seam Weld, 3.34 Inch Seal Perimeter, 68 Leads, Gold/Solder Lead Finish; Ceramic Co-fire Package, Quad Flat Pack, Seam Weld, 5.6 Inch Seal Perimeter, 68 Leads, Gold Lead Finish -24-

25 MIL-PRF QML Program Status Murata Power Solutions Inc. (Formerly Datel) ( : 572) Cabot Boulevard, Mansfield, MA , US Company Contact: Mr. Tim Brown, Phone: , Fax: , Tim.Brown@murata-ps.com DSCC Contact: Mr. Edward Raybould, Phone: , Fax: , vqh.esr@dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option DSCC ISO 9 System: No Technologies: Digital Qualification Letters: EQ(EQC-9-626), EQ(EQC-9-677), EQ(EQC-9-29), EQ(EQC ), ELS(ELSH ), VQ(VQH-97-84), VQ(VQH-98-26), VQ(VQH ), VQ(VQH--9587) Level Information: See Note 6/ H, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: D-4552 Substrate Fabrication: Thick Film on Alumina, 4 Conductor Level(s) Assembly Information: See Note / Assembly Flows: D-4552 Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy Add-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Chip Resistors Wire Bonding: Gold Package Information: See Notes / 2/ 3/ Package Information: Ceramic Package, Dual-in-line, Seam Weld, 7.24 Inch Seal Perimeter, 62 Leads, Gold Lead Finish -25-

26 MIL-PRF QML Program Status Natel Carson City Operations ( : ANM4) 4 Hot Springs Road, Carson City, NV , US Company Contact: Mrs. Kathy Cano, Phone: , Fax: , kathy.cano@hytek.com DSCC Contact: Mr. Edward Raybould, Phone: , Fax: , vqh.esr@dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Options and 2 DSCC ISO 9 System: No Technologies: Active Delay Line, Linear, Custom Hybrid Qualification Letters: EQ(EQC-9-859), EQ(EQM-94-23), EQ(EQM-94-2), VQ(VQH ), VQ(VQH ), VQ(VQH-6-743), VQ(VQH ), VQ(VQH-8-57), VQ(VQH ), VQ(VQH ) Level Information: See Note 6/ K, H, E Substrate Fabrication Information: See Note / Substrate Fabrication Flows: RN5-2, 8663 Substrate Fabrication: Thick Film on Alumina, 2 Conductor Level(s), Resistors; Thick Film on Beryllia, Conductor Level(s); Thick Film on Ceramic, 7 Conductor Level(s), Resistors Assembly Information: See Note / Assembly Flows: RN5-4 Substrate Attach: Nonconductive Epoxy, Conductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors, Inductors, Chip Resistors, Tabs, Tantalum Capacitors, Quartz Crystal, Ceramic Stand Off Wire Bonding: Gold, Aluminum Package Information: See Notes / 2/ 3/ Package Information: Metal Package, Platform, Projection Weld, 2.94 Inch Seal Perimeter, 6 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Axial Leads, Seam Weld, 6.32 Inch Seal Perimeter, 48 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Axial Leads, Seam Weld, 5. Inch Seal Perimeter, 56 Leads, Nickel Lead Finish, Getter Qualified; Ceramic Co-fire Package, Brazed Leads, Seam Weld, 2.47 Inch Seal Perimeter, Leads, Gold Lead Finish -26-