3D-MID Coming from prototypes to production
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1 3D-MID Coming from prototypes to production SMT/Hybrid/Packaging 2014 Dr. Thomas Günther Institut für Mikroaufbautechnik Hahn-Schickard-Gesellschaft für angewandte Forschung e.v. Günther SMT/Hybrid/Packaging
2 Outline Introduction to MID Competences of HSG-IMAT Current research activities at HSG-IMAT Development of MID devices at HSG-IMAT Prototyping of MID & 3W-MID Günther SMT/Hybrid/Packaging
3 3D-MID Technology Quelle: Robert Bosch GmbH Quelle: METEC AG & HSG-IMAT Quelle: Harting AG Mitronics & Sick AG Quelle: 2E mechatronic GmbH IGF Vorhaben N: ADIMA-3D Quelle: LPKF AG Günther SMT/Hybrid/Packaging
4 HSG-IMAT and IFM Institute for Micro Assembly Technology 45 Staff Members Director: Prof. H. Kück Günther SMT/Hybrid/Packaging 2014 Institute for Microintegration, Stuttgart University 12 Staff Members Director: Prof. H. Kück 4
5 Competencies and Topics Plastic Micro Devices Molded Interconnect Devices 3D Micro Assembly Sensors and Actuators Printed Microstructures Modeling and Reliability Günther SMT/Hybrid/Packaging
6 MID Technology LPKF-LDS -Technology Semi Additive MID Technology 2 Shot MID Technology Hot Embossing MID Technology Circuits on Thermoset Materials Circuits on Ceramic Devices PVD Electroless Plating and Electroplating Günther SMT/Hybrid/Packaging
7 The HSG-IMAT TransferFab Features and Benefits: Real prototypes within few weeks Small series production Process transfer MID and other miniaturized systems All MID processes in house Machinery suitable for industrial manufacturing Automated processes Certified according to ISO 9001:2008 Günther SMT/Hybrid/Packaging
8 source: acp GmbH HSG-IMAT TransferFab Processes Laser Patterning, Cleaning and Electroless Plating Laser Patterning CO 2 snow jet cleaning Plating Günther SMT/Hybrid/Packaging
9 HSG-IMAT TransferFab Processes Assembly of Chips and SMD, 3D Micro Assembly Automated 3D assembly cluster 3D assembly of MID braille modules Günther SMT/Hybrid/Packaging
10 3D Micro Assembly SMD and Chip Assembly Flip Chip and Wire Bonding Assembly of Sensor and Actuator Devices Assembly of Optical and Optoelectronical Devices Micro Assembly on 3D Carriers Solder and Adhesive joining Günther SMT/Hybrid/Packaging
11 Chip-, SMD- and Micro Assembly Wire Bonding on MID Adhesive Attach of SMD Pick and Place Lead Free Soldering Günther SMT/Hybrid/Packaging
12 HSG-IMAT TransferFab Processes Electrical, Mechanical, Optical, Environmental Testing Electrical testing Hot bump pull test Thermal shock test Günther SMT/Hybrid/Packaging
13 Research: PRONTO R2R-MID Reel-to-Reel production of LDS MID Günther SMT/Hybrid/Packaging
14 Research: ADIMA-3D 3D Micro Assembly of SMD and Integrated Characterization 3D magnetic field sensor system based on low cost SMD MID can be handled as SMD itself IGF Vorhaben N: ADIMA-3D Günther SMT/Hybrid/Packaging
15 From Customer Idea to Production and Ramp up Sensor Carrier Initial design Optimization by simulation Real samples Characterization and reliability tests Optimization and redesign Prototyping Series production Sensor element for brushless DC motor Günther SMT/Hybrid/Packaging
16 Series Production of Hybrid MID Laser patterning from four sides Adhesive based 3D assembly of PCB into MID source: Metec AG Günther SMT/Hybrid/Packaging
17 e-cu:check - Measurement System for Electroless Copper Deposition on MID MID Probe Measurement in Progress Probe after Measurement Günther SMT/Hybrid/Packaging
18 LPKF-LDS Technology on Micro Injection Molded Parts Microsensor LDS-MID Source: Alertis Medical AS 200 µm Mold cavity LDS-MID W.L. Gore & Associates Günther SMT/Hybrid/Packaging
19 Robust MID Sensor Holder Proven reliability of RPM-sensor at HSG-IMAT in a research project in cooperation with Robert Bosch GmbH Temperature Shock Test (TST) -40 to 150 C, Transition time<10s, > 2000 cycles Enviromental Testing (FWL) 85 C and 85% relative humidity, > 2000 Hours Subsequent development of a MID sensor holder for ABS system by Robert Bosch GmbH Fabrication of > 10 Mio. p.a. by Bosch Source: Robert Bosch GmbH Günther SMT/Hybrid/Packaging
20 HSG-IMAT TransferFAB R&D Prototype, Validation, Pilot and Small Series Process transfer Industrial Commercialization Günther SMT/Hybrid/Packaging
21 Development Stages Mass production Small series Validation Prototyping Feasibility Product Idea Basic R&D Idea to production Günther SMT/Hybrid/Packaging
22 Costs of Non-Conformance Costs of fault recovery increase the further the development has progressed Failure avoidance has to start in the early development stages Non-Conformance costs also imply lost revenue Less failure equals higher economization Consequently: advantages on the market Goal: Failure prevention! R&D and Planning 1 Feasibility Studies 10 Prototype 100 Günther SMT/Hybrid/Packaging Production Customer Rules of quality assurance FMEA
23 Rapid Prototyping of MID 3D-part Preprocessing Metallization Assembly 3D printing STL/SLA Casting MJM SLS FDM HSC Conductive lacquer CVD/PVD Electroless full plating Tampon printing Aerosol printing Inkjet printing Plasma spraying Proto Paint Powder coating Repassivation Semiadditive / Subtractive laserpatterning Reinforcing by e-less plating Laser activation + e-less plating 3D assembly with conductive adhesive (Soldering) Günther SMT/Hybrid/Packaging
24 Rapid Prototyping of MID Drawbacks of Rapid Prototyping Different materials and processes are used Different thermal / thermomechanical properties and surface quality Different residual stress compared to molded parts Subsequent processing (laser patterning, metallization, assembly) with limitations No functional testing of real applications possible No reliability proof possible Image by Souverein Weesp B.V. Günther SMT/Hybrid/Packaging
25 Relevant Functional Properties of MIDs Metallization Adhesion Roughness Fine pitch capability Thermal Properties Thermal expansion Thermal conductivity Thermal stability Electrical Properties Insulating properties Dielectric properties Dielectric strength Source: R.E.T. Reiff GmbH, HSG-IMAT Mechanical Properties Rigidity Solidity Material Properties Flowability Moisture absorption Assembly Compatibility Chip assembly Soldering Reliability Relevant functional properties can only be verified with molded parts Günther SMT/Hybrid/Packaging
26 3W-MID Prototype Cycle Günther SMT/Hybrid/Packaging
27 HSG-IMAT Offer Günther SMT/Hybrid/Packaging
28 Günther SMT/Hybrid/Packaging
29 Thank you for your attention! Contact: Dr. Thomas Günther Allmandring 9B D Stuttgart Telefon: Günther SMT/Hybrid/Packaging
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