Programme Reliability in Power Electronics

Transcription

1 Programme Reliability in Power Electronics CORPE Annual Symposium no. 4 Center of Reliable Power Electronics Wednesday, November 18 th 2015 Location: Aalborg University, Department of Energy Technology Fibigerstraede 16, DK-9220 Aalborg East, Denmark, room (Aud.), 1 st Floor The objective of the annual symposium is to get an update on CORPE, and focus on open presentations and discussions about the research in CORPE. At first international recognized speakers within the CORPE research field will present their point of views, and afterwards results, future activities in CORPE will be discussed. The symposium is free of charge (with a fee for no-show) and open for stakeholders, companies and other with an interest in the field of reliability and power electronics. To register, click here. 08:00 09:00 Coffee, Networking and Registration 09:00 09:10 Welcome and a short introduction to CORPE by Center Leader Frede Blaabjerg, Leader CORPE, Aalborg University, Denmark 09:10 09:45 The future of Wide Bandgab Devices - by Prof. Nando Kaminski, University of Bremen, Germany 09:45 10:20 Understanding and Predicting Electronics System Reliability by Prof. Michael Pecht, Calce, University of Maryland, United States 10:20 10:35 Break and coffee 10:35 11:10 Alternative accelerated qualification methods for electronic components by Dr. Golta Khatibi, TU Wien, Austria 11:10 11:45 Smart Transformer: reliability through modularity by Prof. Marco Liserre, Christian-Albrechts-Universität zu Kiel, Germany 11:45 12:10 Power cycling setup for low and medium power by Development Engineer Søren Jørgensen, Grundfos A/S 12:10 13:30 Lunch and Poster Session Posters from CORPE PhD s in PDF format will be available a week before the symposium 13:30 15:00 CORPE activities (Selected presentations) 13:30 13:45 Advanced design tools and applications for the reliability of power electronics system by Assistant Professor Ke Ma, Department of Energy Technology, Aalborg University 13:45 14:00 Effect of thermal cycling on aluminum metallization of power diodes by PhD Student Mads Brincker, Department of Physics and Nanotechnology, Aalborg University

2 14:00 14:15 Physical characterization of film capacitors by PhD Student Dennis Achton Nielsen, Department of Physics and Nanotechnology, Aalborg University 14:15 14:30 IGBT Junction Temperature Measurement via Electrical Parameters by PhD Student Nick Baker, Department of Energy Technology, Aalborg University 14:30 14:45 Effect of Tj duration on lifetime of IGBT module by PhD Student Uimin Choi, Department of Energy Technology, Aalborg University 14:45 15:00 Multidisciplinary modelling tools for power electronic circuits by PhD Student Amir Sajjad Bahman, Department of Energy Technology, Aalborg University 15:00 15:15 Electro-thermal Modeling of IGBT Modules under Abnormal Operating Conditions by PhD Student Rui Wu, Department of Energy Technology, Aalborg University 15:15 15:45 CORPE overview and future by Center Leader, Frede Blaabjerg, Department of Energy Technology, Aalborg University 15:45 17:00 Visit to CORPE Test Facilities 17:00 End of day AAU-1-DAY wireless network passwords: Will be available on the day Price: Free of charge but with a fee for no-show at DKK 800,00 (cancellation no later than November 11 th 2015) Last day of registration: November 11 th 2015 Link for accommodation in Aalborg: We are looking forward to seeing you in Aalborg Best Regards, Frede Blaabjerg fbl@et.aau.dk

3 About CORPE Center of Reliable Power Electronics (CORPE) at Aalborg University, Denmark, inaugurated in 2012, aiming to design more reliable and more efficient power electronic systems for use in equipment for power generation, distribution and consumption. The center addresses a better understanding of how reliability of power electronic devices and systems is influenced by different stress factors such as temperature, overvoltage and current, overload, humidity and other environmental factors. The center is established in close collaboration with major Danish power electronic companies and Aarhus University with collaboration with two leading European universities. Further, the center develop device and system models that will enable simulation and design of power electronic systems very close to the limits of the devices and enable designed reliability. The knowledge will also be used online during operation to predict lifetime and enable smart derating of the power electronics equipment still in operation and ensure longer lifetime. A number of advanced test systems are available in CORPE. More than 30 researchers are active (around 15 PhD s) at universities and companies. The center is supported by the Danish Strategic Research Council and the Obel Foundation. CORPE is sponsored by For more info, please visit us at

4 Maps Aalborg University, Department of Energy Technology Fibigerstraede 16, 1st floor, room Aud Aalborg East Aalborg University, Department of Physics and Nanotechnology, Skjernvej 4A, 9220 Aalborg East

5 Poster Session Presentations by the PhD students within CORPE funding: Morten Arnfeldt Hygum Rui Wu Uimin Choi Dennis Achton Nielsen Amir Sajjad Bahman Pramod Ghimire Mads Brincker Correlation between environmental related failures and reliability in power electronics Multi-Physics Based Modeling of Power Electronic Components and Circuits Effect of Tj duration on lifetime of IGBT module Physical characterization of Capacitors Multidisciplinary Design Tool for Power Electronic Circuits Real Time Measurement and Life Time Prediction Methods of Power Modules Physical characterization and lifetime prediction of power electronic devices Presentations by the PhD student within the CORPE field (other funding activities): Nick Baker Paula Diaz Reigosa Hammam Abdelaal Hammam Soliman Brwene Salah Abdelkarim Gadalla Haoran Wang Xiaohui Qu Temperature sensitive Electrical Parameters Non-Destructive Testing of Power Modules Condition Monitoring of Capacitors for DC-Link Application in Power Electronic Converters Thermal Investigation of Buck-Boost Power Converters Capacitive DC-Links Design, Control, and Its Impact on Reliability of Single-Phase Power Electronic Systems A Lifetime Prediction Method for LEDs Considering Mission Profiles Presentations by other participants within CORPE funding: Raghavendra Rao Juluri Silicon carbide dies studied with transmission electron microscopy (TEM) and secondary ion mass spectrometry (SIMS)

6 Finalized PhD Students Kristian Bonderup Pedersen Nicolae-Cristian Sintamarean Yongheng Yang Dao Zhou Zian Qin IGBT Module Reliability, Physics-of-failure based Characterization and Modelling Reliability Oriented Circuit Design for Power Electronics Applications Advanced Control Strategies to Enable a More Wide-Scale Adoption of Single-Phase Photovoltaic Systems Reliability Assessment and Energy Loss Evaluation of Modern Wind Turbine Systems Improved Design Methods for Robust Single- and Three-Phase ac-dcac Power Converters Keynote Speakers Michael Pecht Abstract: Understanding and Predicting Electronics System Reliability Reliability is the ability of a system to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions; and is one of the key attributes tracked during Department of Defense (DoD) acquisition. Yet the urgency to deploy new technologies and military capabilities often leads to defense systems being fielded with-out having first demonstrated adequate reliability. The same is true for other products and systems, ranging from consumer products, to computers, cars, airplanes and space vehicles. Systems with poor reliability are not only less likely to successfully carry out their intended missions, but they may also endanger lives. Deficient systems are also much more likely to require extra scheduled and unscheduled maintenance and to demand more spare and replacement parts over their life cycles. In addition, not finding fundamental flaws in a system s design until after it is deployed can lead to costly program delays, expensive redesigns, and the imposition of operational constraints. Reliability Growth: Enhancing Defense System Reliability (2015), is a report from the National Research Council, written over a two year period by some of the leading reliability experts in the U.S. This report offers recommendations to improve defense system reliability throughout the sequence of reliability growth stages that comprise DoD acquisition processes beginning with the articulation of requirements for new systems and ending with feedback mechanisms that document the reliability experience of deployed systems. In this talk, Prof. Pecht, a participant on the National Academy of Science team that helped write the report, will present some of the key problems with design for reliability and reliability growth of electronics systems that have plagued organizations. Some of the recommendations given by the NAS committee will be discussed, but the topic will be expanded to include other recommendations based on the Center for Advanced Life Cycle Engineering s (CALCE) success with both military and commercial industries.

7 Biography: Prof Michael Pecht is a world renowned expert in strategic planning, design, test, and risk assessment of information systems. Prof Pecht has a BS in Physics, an MS in Electrical Engineering and an MS and PhD in Engineering Mechanics from the University of Wisconsin at Madison. He is a Professional Engineer, an IEEE Fellow, an ASME Fellow, an SAE Fellow and an IMAPS Fellow. He is the editor-in-chief of IEEE Access, and served as chief editor of the IEEE Transactions on Reliability for nine years, chief editor for Microelectronics Reliability for sixteen years. He has also served on three NAS studies, two US Congressional investigations in automotive safety, and as an expert to the FDA. He is the founder and Director of CALCE (Center for Advanced Life Cycle Engineering) at the University of Maryland, which is funded by over 150 of the world s leading electronics companies at more than US$6M/year. The CALCE Center received the NSF Innovation Award in 2009 and the National Defense Industries Association Award. He is currently a Chair Professor in Mechanical Engineering and a Professor in Applied Mathematics at the University of Maryland. He has written more than twenty books on product reliability, development, use and supply chain management. He has also written a series of books of the electronics industry in China, Korea, Japan and India. He has written over 700 technical articles and has 7 patents. He consults for 22 international companies. In 2015 he was awarded the IEEE Components, Packaging, and Manufacturing Award for visionary leadership in the development of physics-of-failure-based and prognostics-based approaches to electronic packaging reliability. He was also awarded the distinguished Chinese Academy of Sciences President's International Fellowship. In 2013, he was awarded the University of Wisconsin-Madison s College of Engineering Distinguished Achievement Award. In 2011, he received the University of Maryland s Innovation Award for his new concepts in risk management. In 2010, he received the IEEE Exceptional Technical Achievement Award for his innovations in the area of prognostics and systems health management. In 2008, he was awarded the highest reliability honor, the IEEE Reliability Society s Lifetime Achievement Award. Golta Khatibi Abstract: Alternative accelerated qualification methods for electronic components The rapid technological advancements and market demands in electronic sector requires application of highly accelerated, still practice relevant reliability assessment methods. At present, accelerated power and temperature cycling tests count as the state of the art for qualification of the devices. However due to physical characteristics of the devices, there are limitations to accelerated thermal and power cycling tests. Further acceleration by exceeding a critical temperature or time reduction may result in occurrence of failure mechanisms other than those encountered in real application or suppressing these failures. An alternative approach for further acceleration of the testing procedures is based on the application of isothermal mechanical fatigue testing at high frequencies. The principle idea of this approach is replacement of thermally induced strains by means of equivalent mechanical strains. Based on a physics of failure approach, the relevant failure modes in the material interfaces are induced enabling detection of weak sites of the devices in a very short duration of time. In addition of time saving factor a further advantage of mechanical fatigue testing is the possibility of decoupling of thermal, mechanical and environmental stress factors for a more effective investigation and diagnosis. Examples of applications of accelerated mechanical fatigue testing on a variety of electronic systems consisting of different materials and size scales, including wire bonds, solder joints and multilayered films are demonstrated. Based on experimentally determined fatigue life curves and numerical methods lifetime prediction curves are presented and the advantages and limits of the proposed methods are briefly discussed.

8 Biography: Golta Khatibi has a BSc in material science and MSc and PhD degrees in technical chemistry. At present she is leading the research Group Mechanical Response of Materials at the Institute for Chemical Technologies and Analytics (CTA) of TU Vienna studying physical and thermo-mechanical properties of materials and structures in small dimensions. The expertise of the research group is development of special measurement and characterization techniques for miniaturized structures and components with a special focus being investigation of fatigue response and long term reliability of electronic components. Since 2000, she has been supervising /and co-supervising master and PhD students at the Faculty of Physics, University of Vienna and CTA, TU Vienna. She has published about 120 scientific publications and has been project leader and key researcher in several scientific and industrial projects. Nando Kaminski Abstract: Wide Band-Gap Beyond the Hype Where is it Going? Since the market introduction of the first commercial SiC-Schottky diode in 2001 wide band-gap semiconductor devices made significant progress. In the meantime SiC-MOSEFTs are commercially available from several manufacturers and also GaN-HEMTs appeared on the market. Especially SiC-devices are available in a growing variety of packages and the components conquer more and more applications and market shares. One could start believing the prediction that finally WBG-devices will replace their silicon competitors in power electronics completely. However, WBG-devices still face a variety of technical challenges not to mention the cost. SiC-MOSFETs show low channel mobility and low threshold voltage with a strange temperature behaviour pointing to interfaces far from ideal. GaN-HEMTs show the current collapse and require significant voltage derating for stable operation. On top, packaging is a limiting factor with respect to parasitics preventing fast switching, with respect to materials preventing high temperature operation, and with respect to long term stability because of the extremely high fields on the semiconductor surface as well as in the packaging materials. Furthermore, the passive components in the circuitry might not cope with the high switching speed or the high frequency. Thus, the advantages of WBG-devices cannot be fully exploited yet. Obviously, there is still significant effort required to gain confidence in WBG-devices reliability and to make them attractive for a wider range of applications, consequently profiting from the economy of scale. Only this way, WBGdevices could step out of the high end niche and could really challenge silicon in the future. But for the time being lead applications are required to get out of the hen-and-egg situation. Is that PV, which is under enormous cost pressure? Is that EVs, which are an extremely cost and reliability sensitive application? After all, silicon is still a powerful competitor and even better WBG-materials like Ga2O3 are at the horizon. So where is WBG going? Biography: Nando Kaminski studied electrical engineering at the University of Bremen and finished with the Dipl. Ing. degree (with distinction) in Afterwards until 1998 he was researcher and PhD-candidate at the former Daimler-Benz research institute in Frankfurt (Main), Germany. He worked on Silicon-Carbide power devices and received the Dr. Ing. degree (summa cum laude) in 2001 from University of Bremen. From 1998 until 2008 Nando Kaminski was with ABB Semiconductors in Lenzburg, Switzerland. He worked on IGBTs, IGCTs, diodes, packaging, and reliability. He held various positions as project, team, laboratory, and customer support manager in R&D and quality before he finally became department manager and head of the IGBT module production line.

9 Since 2008 he is full professor for power semiconductor devices at University of Bremen and one of two directors of the Institute for Electrical Drives, Power Electronics, and Devices (IALB). His research interests include alternative semiconductor materials, material basics, device concepts, simulation, packaging, reliability, influence of parasitics, and EMC. Nando Kaminski is Senior Member of the IEEE (Electron Device Society), and member of the EPE Association (European Power Electronics and Drives Association, Brussels, Belgium) and the VDE (German Association for Electrical, Electronic & Information Technologies, Frankfurt, Germany). He is vice chairman of the VDE chapter Q1 (power electronics) and member of the board of the VDE chapter Northwestern Germany. His chair is Centre of Competence of the ECPE (European Center for Power Electronics e.v., Nuremberg, Germany). Nando Kaminski is member of the technical committee der CIPS, of the advisory board of the PCIM, of the international program committee of the ISPS and of the technical program committee of the ISPSD as well as member of the organising committee of the ISPSD 16 in Prague. Søren Jørgensen Abstract: Power cycling setup for low and medium power The majority of Grundfos pumps produced today contains power electronics to control the speed of the pump. The reliability of power electronics plays an important role, both in ensuring the expected lifetime of the product and reducing cost. The presentation is about a setup, which offers the capability to power cycle 6 inverter modules at the same time under real application conditions. Vce and Vf is measured for all IGBT s and diodes at every switching cycle and these data are not only collected to show the development over time but used actively to estimate the junction temperature during power cycling. Biography: Søren Jørgensen received his Bachelor of Science in Electrical, Electronic and Computer Engineering from Aarhus University, School of Engineering. His more than 25 years professional career has been concentrated about designing power electronics for industrial products. Since 2012, he has been employed as Development Engineer focusing on power semiconductor technology at Grundfos Research & Technology. Marco Liserre Abstract: Smart Transformer, solid-state transformer with control and communication capability, could be the enabling technology to a new electric grid characterized by dc-connectivity, distributed storage use and flexible use of different types of energies. While a lot of effort has been devoted to investigate topologies and switching devices which could maximize efficiency, still little investigation has been carried out in the field of reliability. On the contrary it is expected that a wide use of such power electronics technologies in the electric grid could be made possible only by minimizing outages and needed maintenance. The use of modular solution for realizing the Smart Transformer combined with active thermal control can be the possible solution to increase the system reliability. Biography: Marco Liserre (S'00-M'02-SM'07-F 13) received the MSc and PhD degree in Electrical Engineering from the Bari Polytechnic, respectively in 1998 and He has been Associate Professor at Bari Polytechnic and Professor in

10 reliable power electronics at Aalborg University (Denmark). He is currently Full Professor and he holds the Chair of Power Electronics at Christian-Albrechts-University of Kiel (Germany). He has published over 200 technical papers (more than 60 of them in international peer-reviewed journals), 4 chapters of a book and a book (Grid Converters for Photovoltaic and Wind Power Systems, ISBN-10: IEEE-Wiley, second reprint, also translated in Chinese). These works have received more than citations. Marco Liserre is listed in ISI Thomson report The world s most influential scientific minds, He has been recently awarded with an ERC Consolidator Grant for an overall budget of 2 MEuro for the project The Highly Efficient And Reliable smart Transformer (HEART), a new Heart for the Electric Distribution System. He is member of IAS, PELS, PES and IES. He is Associate Editor of the IEEE Transactions on Industrial Electronics, IEEE Industrial Electronics Magazine, IEEE Transactions on Industrial Informatics, where he is currently Co-Eic, IEEE Transactions on power electronics and IEEE Journal of Emerging and Selected Topics in Power Electronics. He has been Founder and Editor-in-Chief of the IEEE Industrial Electronics Magazine, Founder and the Chairman of the Technical Committee on Renewable Energy Systems, Co-Chairman of the International Symposium on Industrial Electronics (ISIE 2010), IES Vice-President responsible of the publications. He has received the IES 2009 Early Career Award, the IES 2011 Anthony J. Hornfeck Service Award, the 2014 Dr. Bimal Bose Energy Systems Award, the 2011 Industrial Electronics Magazine best paper award and the Third Prize paper award by the Industrial Power Converter Committee at ECCE 2012, He is senior member of IES AdCom. In 2013 he has been elevated to the IEEE fellow grade with the following citation for contributions to grid connection of renewable energy systems and industrial drives.