MACH 5 CPLD Family. Fifth Generation MACH Architecture

Size: px
Start display at page:

Download "MACH 5 CPLD Family. Fifth Generation MACH Architecture"

Transcription

1 MACH 5 CPLD Family Fifth Generation MACH Architecture Includes MACH 5A Family Advance Information FEATURES High logic densities and s for increased logic integration 18 to 51 macrocell densities 68 to 56 s Wide selection of density and combinations to support most application needs 6 macrocell density options 8 options Up to 5 options per macrocell density Up to 6 density & options for each package Performance features to fit system needs 5.5 ns t PD Commercial,.5 ns t PD Industrial 18 MHz f CNT Four programmable power/speed settings per block Flexible architecture facilitates logic design Multiple levels of switch matrices allow for performance-based routing 100% routability and pin-out retention Synchronous and asynchronous clocking, including dual-edge clocking Asynchronous product- or sum-term set or reset to 64 output enables Functions of up to product terms Advanced capabilities for easy system integration 3.3-V & 5-V JEDEC-compliant operations JTAG (IEEE ) compliant for boundary scan testing 3.3-V & 5-V JTAG in-system programming PCI compliant (-5/-6/-/-10/-1 speed grades) Safe for mixed supply voltage system design Programmable pull-up or Bus-Friendly Inputs & s Individual output slew rate control Hot socketing Programmable security bit Advanced EE CMOS process provides high performance, cost effective solutions Supported by Vantis DesignDirect software for rapid logic development Supports HDL design methodologies with results optimized for Vantis Flexibility to adapt to user requirements Software partnerships that ensure customer success Vantis and Third-party hardware programming support Lattice/VantisPRO (formerly known as MACHPRO ) software for in-system programmability support on PCs and Automated Test Equipment Programming support on all major programmers including Data, BP Microsystems, Advin, and System General Publication# 0446 Rev: G Amendment/0 Issue Date: November 1998

2 Note: 1. M5-xxx is for 5-V devices. M5LV-xxx is for 3.3-V devices. Table 1. MACH 5 Device Features 1 M5-18 M5-19 M5-56 M5-0 M5-384 M5-51 Feature M5LV-18 M5LV-56 M5LV-0 M5LV-384 M5LV-51 Supply Voltage (V) Maximum User Pins t PD (ns) t SS (ns) t COS (ns) f CNT (MHz) Static Power (ma) JTAG-Compliant Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes PCI-Compliant Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Feature M5A3-18 M5A5-18 Notes: 1. All information on MACH 5A devices is Advance Information. Please contact a Vantis sales representative for details on availability.. M5A5-xxx is for 5-V devices M5A3-xxx is for 3.3-V devices. GENERAL DESCRIPTION Table. MACH 5A Device Features 1, M5A3-19 M5A5-19 M5A3-56 M5A5-56 M5A3-0 M5A3-384 M5A3-51 Supply Voltage (V) Maximum User Pins t PD (ns) t SS (ns) t COS (ns) f CNT (MHz) Static Power (ma) TBD TBD TBD TBD TBD TBD TBD TBD TBD JTAG-Compliant Yes Yes Yes Yes Yes Yes Yes Yes Yes PCI-Compliant Yes Yes Yes Yes Yes Yes Yes Yes Yes The MACH 5 family consists of a broad range of high-density and high- Complex Programmable Logic Devices (CPLDs). The fifth-generation MACH architecture yields fast speeds at high CPLD densities, low power, and supports additional features such as in-system programmability, JTAG testability, and advanced clocking options (Tables 1 and ). Both the MACH 5 and the MACH 5A families offer 5-V (M5-xxx and M5A5-xxx) and 3.3-V (M5LV-xxx and M5A3-xxx) operation. Manufactured in state-of-the-art ISO 9000 qualified fabrication facilities on EECMOS process technologies, MACH 5 devices are available with pin-to-pin delays as fast as 5.5 ns (Tables 3 and 4). The 5.5, 6.5,.5, 10, and 1-ns devices are compliant with the PCI Local Bus Specification. MACH 5 Family

3 Device Note: 1. C = Commercial grade, I = Industrial grade Table 3. MACH 5 Speed Grades Speed Grade M5-18 C C, I C, I C, I I M5LV-18 C C,I C, I C, I I M5-19 C C, I C, I C, I I M5-56 C C, I C, I C, I I M5LV-56 C C, I C, I C, I I M5-0 C C, I C, I C, I I M5LV-0 C C, I C, I C, I I M5-384 C C, I C, I C, I I M5LV-384 C C, I C, I C, I I M5-51 C C, I C, I C, I I M5LV-51 C C, I C, I C, I I Device Table 4. MACH 5A Speed Grades Speed Grade M5A3-18 C C, I C, I C, I I M5A5-18 C C, I C, I C, I I M5A3-19 C C, I C, I C, I I M5A5-19 C C, I C, I C, I I M5A3-56 C C, I C, I C, I I M5A5-56 C C, I C, I C, I I M5A3-0 C (Note ) C (Note ) C, I (Note ) C, I C, I I M5A3-384 C (Note ) C (Note ) C, I (Note ) C, I C, I I M5A3-51 C (Note ) C, I (Note ) C, I C, I I Notes: 1. C = Commercial grade, I = Industrial grade. All information on MACH 5A devices is Advance Information. Please contact a Vantis sales representative for details on availability.. The 5 and 6 commercial and industrial speed grades are under development for M5A3-0, M5A3-384, and M5A3-51. Please contact a Vantis sales representative for details on availability. With Vantis unique hierarchical architecture, the MACH 5 family provides densities up to 51 macrocells to support full system logic integration. Extensive routing resources ensure pinout retention as well as high utilization. It is ideal for PAL block device integration and a wide range of other applications including high-speed computing, low-power applications, communications, and embedded control. At each macrocell density point, Vantis offers several and package options to meet a wide range of design needs (Tables 5 and 6). MACH 5 Family 3

4 Table 5. MACH 5 Package and Options 1 M5-18 M5-19 M5-56 Package M5LV-18 M5LV pin TQFP 68, 4* 68 68, 4* 100-pin PQFP pin TQFP 104* 104* 144-pin PQFP Note: 1. The options indicated with a * are only available for the LV devices. M5-0 M5LV-0 M5-384 M5LV-384 M5-51 M5LV-51 0-pin PQFP pin PQFP pin PQFP ball BGA ball BGA 56 Package M5A3-18 M5A5-18 Table 6. MACH 5A Package and Options 1 M5A3-19 M5A5-19 M5A3-56 M5A pin PQFP pin TQFP pin TQFP M5A3-0 M5A3-384 M5A pin PQFP pin PQFP ball BGA ball BGA 56 Note: 1. All information on MACH 5A devices is Advance Information. Please contact a Vantis sales representative for details on availability. Advanced power management options allow designers to incrementally reduce power while maintaining the level of performance needed for today s complex designs. safety features allow for mixed-voltage design, and both the 3.3-V and the 5-V device versions are in-system programmable through a JTAG-compliant interface. Vantis offers software design support for MACH devices in both the MACHXL and DesignDirect development systems. The DesignDirect development system is the Vantis implementation software that includes support for all Vantis CPLD, FPGA and SPLD devices. This system is supported under Windows 95, 98 and NT as well as Sun Solaris and HPUX. DesignDirect software is designed for use with design entry, simulation and verification software from leading-edge tool vendors such as Cadence, Exemplar Logic, Mentor Graphics, Model Technology, Synopsys, Synplicity, Viewlogic and others. It accepts EDIF 0 0 input netlists, generates JEDEC files for Vantis PLDs and creates industry standard EDIF, Verilog, VITAL compliant VHDL and SDF simulation netlists for design verification. DesignDirect software is also available in product configurations that include VHDL and Verilog synthesis from Exemplar Logic and VHDL, Verilog RTL and gate level timing simulation from Model Technology. Schematic capture and ABEL entry, as well as functional simulation, are also provided. 4 MACH 5 Family

5 FUNCTIONAL DESCRIPTION The MACH 5 architecture consists of PAL blocks connected by two levels of interconnect. The block interconnect provides routing among 4 PAL blocks. This grouping of PAL blocks joined by the block interconnect is called a segment. The second level of interconnect, the segment interconnect, ties all of the segments together. The only logic difference between any two MACH 5 devices is the number of segments. Therefore, once a designer is familiar with one device, consistent performance can be expected across the entire family. All devices have four clock pins available which can also be used as logic inputs. Block: MCs CLK 4 Segment: 4 Blocks Block Interconnect Segment Interconnect Figure 1. MACH 5 Block Diagram 0446G-001 The MACH 5 PAL blocks consist of the elements listed below (Figure ). While each PAL block resembles an independent PAL device, it has superior control and logic generation capabilities. cells Product-term array Register control generator Output enable generator The s associated with each PAL block have a path directly back to that PAL block called local feedback. If the is used in another PAL block, the interconnect feeder assigns a block interconnect line to that signal. The interconnect feeder acts as an input switch matrix. The block and segment interconnects provide connections between any two signals in a device. The block feeder assigns block interconnect lines and local feedback lines to the PAL block inputs. MACH 5 Family 5

6 OE Block Feeder Block Interconnect Local Feedback Product-term Array Logic Alocator Input Register Path s Interconnect Feeder Figure. PAL Block Structure 0446G-00 PRODUCT-TERM ARRAY AND LOGIC ALLOCATOR The product-term array uses the same sum-of-products architecture as Vantis PAL devices and consists of inputs (plus their complements) and 64 product terms arranged in clusters. A cluster is a sum-of-products function with either 3 of 4 product terms. Logic allocators assign the clusters to macrocells. Each macrocell can accept up to eight clusters of three or four product terms, but a given cluster can only be steered to one macrocell (Table ). If only three product terms in a cluster are steered, the fourth can be used as an input to an XOR gate for separate logic generation and/or polarity control. The wide logic allocator is comprised of all of the individual logic allocators and acts as an output switch matrix by reassigning logic to macrocells to retain pinout as designs change. The logic allocation scheme in the MACH 5 device allows for the implementation of large equations (up to product terms) with only one pass through the logic array. Table. Product Term Steering Options for PT Clusters and Macrocell Available Clusters Macrocell Available Clusters M 0 C 0, C 1, C, C 3, C 4 M 8 C 5, C 6, C, C 8, C 9, C 10, C 11, C 1 M 1 C 0, C 1, C, C 3, C 4, C 5 M 9 C 6, C, C 8, C 9, C 10, C 11, C 1, C 13 M C 0, C 1, C, C 3, C 4, C 5, C 6 M 10 C, C 8, C 9, C 10, C 11, C 1, C 13, C 14 M 3 C 0, C 1, C, C 3, C 4, C 5, C 6, C M 11 C 8, C 9, C 10, C 11, C 1, C 13, C 14, C 15 M 4 C 0, C 1, C, C 3, C 4, C 5, C 6, C M 1 C 8, C 9, C 10, C 11, C 1, C 13, C 14, C 15 M 5 C 1, C, C 3, C 4, C 5, C 6, C, C 8 M 13 C 9, C 10, C 11, C 1, C 13, C 14, C 15 M 6 C, C 3, C 4, C 5, C 6, C, C 8, C 9 M 14 C 10, C 11, C 1, C 13, C 14, C 15 M C 3, C 4, C 5, C 6, C, C 8, C 9, C 10 M 15 C 11, C 1, C 13, C 14, C 15 6 MACH 5 Family

7 The macrocells for MACH 5 devices consist of a storage element which can be configured for combinatorial, registered or latched operation (Figure 3). The D-type flip-flops can be configured as T-type, J-K, or S-R operation through the use of the XOR gate associated with each macrocell. Each PAL block has the capability to provide two input registers by using macrocells 0 and 15. In order to use this option, these macrocells must be accessed via the pins associated with macrocells 3 and 1, respectively. Once the macrocell is used as an input register, it cannot be used for logic, so its clusters can be re-directed through the logic allocator to another macrocell. The pins associated with macrocells 0 and 15 can still be used as input pins. Although the pins for macrocells 3 and 1 are used to connect to the input registers, these macrocells can still be used as buried macrocells to drive device logic via the matrix. Logic Allocator Bus Macrocell 5-8 Clusters/ MC D Q Prog. Polarity Mode Selection Figure 3. Macrocell Diagram 0446G-003 The control generator provides four configurable clock lines and three configurable set/reset lines to each macrocell in a PAL block. Any of the four clock lines and any of the three set/reset lines can be independently selected by any flip-flop within a block. The clock lines can be configured to provide synchronous global (pin) clocks and asynchronous product term clocks, sum term clocks, and latch enables (Figure 4). Three of the four global clocks, as well as two product-term clocks and one sum-term clock, are available per PAL block. Positive or negative edge clocking is available as well as advanced clocking features such as complementary and biphase clocking. Complementary clocking provides two clock lines exactly 180 degrees out of phase, and is useful in applications such as fast data paths. A biphase clock line clocks flip-flops on both the positive and negative edges of the clock. The configuration options for the four clock lines per PAL block are as follows: Clock Line 0 Options Global clock (0, 1,, or 3) with positive or negative edge clock enable Product-term clock (A*B*C) Sum-term clock (A+B+C) Clock Line 1 Options Global clock (0, 1,, or 3) with positive edge clock enable MACH 5 Family

8 Global clock (0, 1,, or 3) with negative edge clock enable Global clock (0, 1,, or 3) with positive and negative edge clock enable (biphase) Clock Line Options Global clock (0, 1,, or 3) with clock enable Clock Line 3 Options Complement of clock line (same clock enable) Product-term clock (if clock line does not use clock enable PT (0:3) PINCLK (0:3) MUX 4TO1 IN (0) IN (1) IN () OUT IN (3) U1 F0 F1 PT0 CLKIN Clock Enable MUX TO1 N (0) OUT N (1) F0 MUX TO1 /CLK F0 CLK0 PT (0:) PT0 SET0/RST MUX 4TO1 IN (0) IN (1) IN () OUT IN (3) U F0 F1 PT1 PT /CLK CLK OUT CLKEN1 BIPHASE CLKEN CLK1 PT1 MUX TO1 PT1 OUT /PT1(ST) F0 SET1/RST MUX 4TO1 IN (0) IN (1) IN () OUT IN (3) U3 F0 F1 MUX TO1 CLKIN Clock Enable CLK PT MUX TO1 PT OUT /PT F0 SET/RST/LE Block Sets/Reset 0, LE PT3 MUX TO1 /CLK PTCLK CLK3 F0 Block Clocks G-004 Figure 4. Clock 0446G-005 Figure 5. Set/Reset The set/reset generation portion of the control generator (Figure 5) creates three set/reset lines for the PAL block. Each macrocell can choose one of these three lines or choose no set/reset at all. All three lines can be configured for product term set/reset and two of the three lines can be configured as sum term set/reset and one of the lines can be configured as product-term or sumterm latch enable. While the set/reset signals are generated in the control generator, whether that signal sets or resets a flip-flop is determined within the individual macrocell. The same signal can set one flip-flop and reset another. PT or /PT can also be used as a latch enable for macrocells configured as latches. 8 MACH 5 Family

9 OE There is one output enable (OE) generator per PAL block that generates two product-term driven output enables. Each cell is simply an output buffer. Each cell within the PAL block can choose to be permanently enabled, permanently disabled, or choose one of the two product term output enables per PAL block (Figure 6). Output Enable Internal Feedback External Feedback Figure 6. Output Enable and Cell 0446G-006 MACH 5 Family 9

10 MACH 5 TIMING MODEL The primary focus of the MACH 5 timing model is to accurately represent the timing in a MACH 5 device, and at the same time, be easy to understand. This model accurately describes all combinatorial and registered paths through the device, making a distinction between internal feedback and external feedback. A signal uses internal feedback when it is fed back into the switch matrix or block without having to go through the output buffer. The input register specifications are also reported as internal feedback. When a signal is fed back into the switch matrix after having gone through the output buffer, it is using external feedback. The parameter, t BUF, is defined as the time it takes to go through the output buffer to the pad. If a signal goes to the internal feedback rather than to the pad, the parameter designator is followed by an i. By adding t BUF to this internal parameter, the external parameter is derived. For example, t PD = t PDi + t BUF. A diagram representing the modularized MACH 5 timing model is shown in Figure. Refer to the Technical Note entitled MACH 5 Timing and High Speed Design for a more detailed discussion about the timing parameters. (External Feedback) (Internal Feedback) COMB/DFF/ LATCH IN INPUT REG/ INPUT LATCH t SIR (S/A) t HIR (S/A) t SIL t HIL t SRR t CES t CEH t CO (S/A) i t PDILi t GOAi t SRi Q t BLK t SEG t PL1 t PL t PL3 t PT t S (S/A) t H (S/A) t SAL t HAL t SRR t CES t CEH CE t PDi t CO (S/A) i t PDLi t GOAi t SRi SR Q t BUF t EA t ER t SLW OUT CE SR PIN CLK Figure. MACH 5 Timing Model 0446G MACH 5 Family

11 MULTIPLE AND DENSITY OPTIONS The MACH 5 family offers six macrocell densities in a number of options. This allows designers to choose a device close to their logic density and requirements, thus minimizing costs. For the same package type, every density has the same pin-out. With proper design considerations, a design can be moved to a higher or lower density part as required. JTAG BOUNDARY SCAN TESTABILITY All MACH 5 devices have JTAG boundary scan cells and are compliant to the JTAG standard, IEEE This allows functional testing of the circuit board on which the device is mounted through a serial scan path that can access all critical logic nodes. Internal registers are linked internally, allowing test data to be shifted in and loaded directly onto test nodes, or test node data to be captured and shifted out for verification. In addition, these devices can be linked into a board-level serial scan path for more complete board-level testing. JTAG IN-SYSTEM PROGRAMMING Programming devices in-system provides a number of significant benefits including: rapid prototyping, lower inventory levels, higher quality, and the ability to make in-field modifications. All MACH 5 devices provide in-system programming (ISP) capability through their JTAG ports. This capability has been implemented in a manner that insures that the JTAG port remains compliant to the IEEE standard. By using JTAG as the communication interface through which ISP is achieved, customers get the benefit of a standard, well-defined interface. MACH 5 devices can be programmed across the commercial temperature and voltage range. Vantis provides its free PC-based Lattice/VantisPRO software to facilitate in-system programming. Lattice/ VantisPRO software takes the JEDEC file output produced by Vantis design implementation software, along with information about the JTAG chain, and creates a set of vectors that are used to drive the JTAG chain. Lattice/VantisPRO software can use these vectors to drive a JTAG chain via the parallel port of a PC. Alternatively, Lattice/VantisPRO software can output files in formats understood by common automated test equipment. This equipment can then be used to program MACH 5 devices during the testing of a circuit board. For more information about in-system programming, refer to the separate document entitled MACH ISP Manual. PCI COMPLIANT MACH 5(A) devices in the -5/-6/-/-10/-1 speed grades are compliant with the PCI Local Bus Specification version.1, published by the PCI Special Interest Group (SIG). The 5-V devices are fully PCI-compliant. The 3.3-V devices are mostly compliant but do not meet the PCI condition to clamp the inputs as they rise above because of their 5-V input tolerant feature. MACH 5 devices provide the speed, drive, density, output enables and s for the most complex PCI designs. MACH 5 Family 11

12 SAFE FOR MIXED SUPPLY VOLTAGE SYSTEM DESIGNS 1 Both the 3.3-V and 5-V MACH 5 devices are safe for mixed supply voltage system designs. The 5-V devices will not overdrive 3.3-V devices above the output voltage of 3.3 V, while they accept inputs from other 3.3-V devices. The 3.3-V devices will accept inputs up to 5.5 V. Both the 3.3-V and 5-V versions have the same high-speed performance and provide easy-to-use mixedvoltage design capability. Note: 1. Except for M5-18, M5-19, and M5-56. Please refer to Application Note titled Hot Socketing and Mixed Supply Design with MACH 4 and MACH 5 Devices. PULL-UP OR BUS-FRIENDLY INPUTS AND S All MACH 5 devices have inputs and s which feature the Bus-Friendly circuitry incorporating two inverters in series which loop back to the input. This double inversion weakly holds the input at its last driven logic state. While it is a good design practice to tie unused pins to a known state, the Bus-Friendly input structure pulls pins away from the input threshold voltage where noise can cause high-frequency switching. At power-up, the Bus-Friendly latches are reset to a logic level 1. For the circuit diagram, please refer to the Input/Output Equivalent Schematics (page 393) in the General Information Section of the Vantis 1999 Data Book. All MACH 5A devices have a programmable bit that configures all input and s with either pull-up or Bus-Friendly characteristics. If the device is configured in pull-up mode, all inputs and s are weakly pulled up. For the circuit diagram, please refer to the Input/Output Equivalent Schematics (page 393) in the General Information Section of the Vantis 1999 Data Book. POWER MANAGEMENT There are 4 power/speed options in each MACH 5 PAL block (Table 8). The speed and power tradeoff can be tailored for each design. The signal speed paths in the lower-power PAL blocks will be slower than those in the higher-power PAL blocks. This feature allows speed critical paths to run at maximum frequency while the rest of the signal paths operate in a lower-power mode. In large designs, there may be several different speed requirements for different portions of the design. PROGRAMMABLE SLEW RATE Table 8. Power Levels High Speed/High Power Medium High Speed/Medium High Power Medium Low Speed/Medium Low Power Low Speed/Low Power 100% Power 6% Power 40% Power 0% Power Each MACH 5 device has an individually programmable output slew rate control bit. Each output can be individually configured for the higher speed transition (3 V/ns) or for the lower noise transition (1 V/ns). For high-speed designs with long, unterminated traces, the slow-slew rate will introduce fewer reflections, less noise, and keep ground bounce to a minimum. For designs with short traces or well terminated lines, the fast slew rate can be used to achieve the highest speed. The slew rate is adjusted independent of power. 1 MACH 5 Family

13 POWER-UP RESET/SET All flip-flops power up to a known state for predictable system initialization. If a macrocell is configured to SET on a signal from the control generator, then that macrocell will be SET during device power-up. If a macrocell is configured to RESET on a signal from the control generator or is not configured for set/reset, then that macrocell will RESET on power-up. To guarantee initialization values, the rise must be monotonic and the clock must be inactive until the reset delay time has elapsed. SECURITY BIT A programmable security bit is provided on the MACH 5 devices as a deterrent to unauthorized copying of the array configuration patterns. Once programmed, this bit defeats readback of the programmed pattern by a device programmer, securing proprietary designs from competitors. Programming and verification are also defeated by the security bit. The bit can only be reset by erasing the entire device. HOT SOCKETING MACH 5A devices are well-suited for those applications that require hot socket capability. Hot socketing a device requires that the device, when powered-down, can tolerate active signals on the s and inputs without being damaged. Additionally, it requires that the effects of the powered-down MACH device be minimal on active signals. MACH 5 Family 13

14 MACH 5 PAL BLOCK Output Enable Output Enable M 0 Macro cell Cell M 1 Macro cell Cell M Macro cell Cell M 3 Macro cell Cell 0 C 0 M 4 Macro cell Cell C 1 C M 5 Macro cell Cell C 3 Switch Matrix C 4 C 5 C 6 C C 8 Logic Allocator M 6 M M 8 Macro cell Macro cell Macro cell Cell Cell Cell C 9 C 10 C 11 M 9 Macro cell Cell C 1 C 13 M 10 Macro cell Cell 63 C 14 C 15 M 11 Macro cell Cell M 1 Macro cell Cell M 13 Macro cell Cell M 14 Macro cell Cell M 15 Macro cell Cell CLK 0446G MACH 5 Family

15 BLOCK DIAGRAM M5(LV)-18/XXX, M5A(3,5)-18/XXX SEGMENT 0 Block A/ 0-15 Block D/ 0-15 I 0, 1 Block Interconnect Block B/ 0-15 Block C/ 0-15 CLK0 CLK1 CLK CLK3 4 S E G M E N T I N T E R C O N N E C T Block A/ 0-15 Block D/ 0-15 I, 3 Block Interconnect Block B/ 0-15 Block C/ 0-15 SEGMENT G-00 MACH 5 Family 15

16 BLOCK DIAGRAM M5-19/XXX, M5A(3,5)-19/XXX Block A/ 0-15 Block D/ 0-15 Block A/ 0-15 Block D/ 0-15 I 0 Block Interconnect I, I 3 Block Interconnect CLK0 CLK1 CLK CLK3 4 SEGMENT 0 SEGMENT Block B/ 0-15 Block C/ 0-15 Block B/ 0-15 Block C/ 0-15 S E G M E N T I N T E R C O N N E C T Block A/ 0-15 Block D/ 0-15 I 1 Block Interconnect Block B/ 0-15 Block C/ 0-15 SEGMENT G-008 MACH 5 Family

17 BLOCK DIAGRAM M5(LV)-56/XXX, M5A(3,5)-56/XXX Block A/ 0-15 Block D/ 0-15 Block A/ 0-15 Block D/ 0-15 Block Interconnect I 0 Block Interconnect I 3 Block C/ 0-15 Block B/ 0-15 Block B/ 0-15 Block C/ 0-15 S E G M E N T I N T E R C O N N E C T Block A/ 0-15 Block D/ 0-15 Block A/ 0-15 Block D/ 0-15 Block Interconnect I 1 Block Interconnect I CLK0 CLK1 CLK CLK3 4 Block B/ 0-15 Block C/ 0-15 Block B/ 0-15 Block C/ 0-15 SEGMENT 0 SEGMENT 3 SEGMENT 1 SEGMENT 0446G-009 MACH 5 Family 1

18 BLOCK DIAGRAM M5(LV)-0/XXX, M5A3-0/XXX SEGMENT 0 SEGMENT 4 Block A/ 0-15 Block D/ 0-15 Block A/ 0-15 Block D/ 0-15 Block Interconnect Block Interconnect I 0 Block B/ 0-15 Block C/ 0-15 Block B/ 0-15 Block C/ 0-15 S E G M E N T I N T E R C O N N E C T CLK0 CLK1 CLK 4 CLK3 Block A/ 0-15 Block D/ 0-15 Block A/ 0-15 Block D/ 0-15 Block A/ 0-15 Block D/ 0-15 I 1 Block Interconnect I Block Interconnect I 3 Block Interconnect Block B/ 0-15 Block C/ 0-15 Block B/ 0-15 Block C/ 0-15 Block B/ 0-15 Block C/ 0-15 SEGMENT 1 SEGMENT SEGMENT G MACH 5 Family

19 BLOCK DIAGRAM M5(LV)-384/XXX, M5A3-384/XXX I 0 SEGMENT 0 SEGMENT 5 SEGMENT 4 Block A/ 0-15 Block D/ 0-15 Block A/ 0-15 Block D/ 0-15 Block A/ 0-15 Block D/ 0-15 Block Interconnect I 3 Block Interconnect Block Interconnect Block B/ 0-15 Block C/ 0-15 Block B/ 0-15 Block C/ 0-15 Block B/ 0-15 Block C/ 0-15 S E G M E N T I N T E R C O N N E C T Block A/ 0-15 Block D/ 0-15 Block A/ 0-15 Block D/ 0-15 Block A/ 0-15 Block D/ 0-15 CLK0 CLK1 CLK CLK3 I 1 Block Interconnect Block Interconnect I Block Interconnect Block B/ 0-15 Block C/ 0-15 Block B/ 0-15 Block C/ 0-15 Block B/ 0-15 Block C/ 0-15 SEGMENT 1 SEGMENT SEGMENT G-011 MACH 5 Family 19

20 BLOCK DIAGRAM M5(LV)-51/XXX, M5A3-51/XXX Continued CLK0 CLK1 CLK CLK3 I 0 4 SEGMENT 0 SEGMENT Block A/ 0-15 Block D/ 0-15 Block A/ 0-15 Block D/ 0-15 Block Interconnect Block Interconnect Block B/ 0-15 Block C/ 0-15 Block B/ 0-15 Block C/ 0-15 S E G M E N T Block A/ 0-15 Block D/ 0-15 Block A/ 0-15 Block D/ 0-15 I 1 Block Interconnect Block Interconnect Block B/ 0-15 Block C/ 0-15 Block B/ 0-15 Block C/ 0-15 SEGMENT 1 SEGMENT 0446G-01 0 MACH 5 Family

21 BLOCK DIAGRAM M5(LV)-51/XXX, M5A3-51/XXX SEGMENT 6 SEGMENT 5 Block A/ 0-15 Block D/ 0-15 Block A/ 0-15 Block D/ 0-15 Block Interconnect I 3 Block Interconnect Block B/ 0-15 Block C/ 0-15 Block B/ 0-15 Block C/ 0-15 I N T E R C O N N E C T Block A/ 0-15 Block D/ 0-15 Block A/ 0-15 Block D/ 0-15 Block Interconnect I Block Interconnect Block B/ 0-15 Block C/ 0-15 Block B/ 0-15 Block C/ 0-15 SEGMENT 3 SEGMENT 4 Continued 0446G-013 MACH 5 Family 1

22 ABSOLUTE MAXIMUM RATINGS M5 and M5A5 Storage Temperature C to +150 C Device Junction Temperature (Note 1) C or +150 C Supply Voltage with Respect to Ground V to +.0 V DC Input Voltage V to 5.5 V Static Discharge Voltage V Latchup Current (-40 C to +85 C) ma Stresses above those listed under Absolute Maximum Ratings may cause permanent device failure. Functionality at or above these limits is not implied. Exposure to Absolute Maximum Ratings for extended periods may affect device reliability. OPERATING RANGES Commercial (C) Devices Ambient Temperature (T A ) Operating in Free Air C to +0 C Supply Voltage ( ) with Respect to Ground V to +5.5 V Industrial (I) Devices Ambient Temperature (T A ) Operating in Free Air C to +85 C Supply Voltage ( ) with Respect to Ground V to +5.5 V Operating ranges define those limits between which the functionality of the device is guaranteed. 5-V DC CHARACTERISITICS OVER OPERATING RANGES Parameter Symbol Parameter Description Test Description Min Typ Max Unit Output HIGH Voltage I OH = -3. ma, = Min, V IN = V IH or V IL.4 V (For M5-0, M5-384, M5-51, M5A5-18, V M5A5-19, M5A5-56 Devices) OH I OH = 0 ma, = Max, V IN = V IH or V IL 3.3 V Output HIGH Voltage I OH = -3. ma, = Min, V IN = V IH or V IL.4 V (For M5-18, M5-19, M5-56 Devices) I OH = -.5 ma, = 5.5 V, V IN = V IH or V IL 3.6 V V OL Output LOW Voltage (Note ) I OL = + ma, = Min, V IN = V IH or V IL 0.5 V V IH Input HIGH Voltage Guaranteed Input Logical HIGH Voltage for all Inputs (Note 3).0 V V IL Input LOW Voltage Guaranteed Input Logical LOW Voltage for all Inputs (Note 3) 0.8 V I IH Input HIGH Leakage Current V IN = 5.5, = Max (Note 4) 10 µa I IL Input LOW Leakage Current V IN = 0, = Max (Note 4) -10 µa I OZH Off-State Output Leakage Current HIGH V OUT = 5.5, = Max, V IN = V IH or V IL (Note 4) 10 µa I OZL Off-State Output Leakage Current LOW V OUT = 0, = Max, V IN = V IH or V IL (Note 4) -10 µa I SC Output Short-Circuit Current V OUT = 0.5 = Max, V IN = V IH or V IL (Note 5) ma Note: for M5-18, M5-19 and M5-56 devices. 130 for M5-0, M5-384, M5-51 and all M5A5-xxx devices.. Total I OL between ground pins should not exceed 64 ma. 3. These are absolute values with respect to device ground, and all overshoots due to system and/or tester noise are included. 4. pin leakage is the worst case of I IL and I OZL or I IH and I OZH. 5. Not more than one output should be shorted at a time. Duration of the short-circuit should not exceed one second. MACH 5 Family

23 ABSOLUTE MAXIMUM RATINGS M5LV and M5A3 Storage Temperature C to +150 C Device Junction Temperature C Supply Voltage with Respect to Ground V to V DC Input Voltage V to 5.5 V Static Discharge Voltage V Latchup Current (-40 C to +85 C) ma Stresses above those listed under Absolute Maximum Ratings may cause permanent device failure. Functionality at or above these limits is not implied. Exposure to Absolute Maximum Ratings for extended periods may affect device reliability. OPERATING RANGES Commercial (C) Devices Ambient Temperature (T A ) Operating in Free Air C to +0 C Supply Voltage ( ) with Respect to Ground V to +3.6 V Industrial (I) Devices Ambient Temperature (T A ) Operating in Free Air C to +85 C Supply Voltage ( ) with Respect to Ground V to +3.6 V Operating ranges define those limits between which the functionality of the device is guaranteed. 3.3-V DC CHARACTERISITICS OVER OPERATING RANGES Parameter Symbol Parameter Description Test Description Min Max Unit V OH Output HIGH Voltage = Min I OH = -100 µa -0. V V IN = V IH or V IL I OH = 3. ma.4 V V V OL Output LOW Voltage CC = Min I OL = 100 µa 0. V V IN = V IH or V IL I OH = ma (Note 1) 0.5 V V IH Input HIGH Voltage V OUT V OH Min or V OUT V OL Max (Note ) V V IL Input LOW Voltage V OUT V OH Min or V OUT V OL Max (Note ) V I IH Input HIGH Leakage Current V IN = 3.6, = Max (Note 3) 10 µa I IL Input LOW Leakage Current V IN = 0, = Max (Note 3) -10 µa I OZH Off-State Output Leakage Current HIGH V OUT = 3.6, = Max, V IN = V IH or V IL (Note 3) 10 µa I OZL Off-State Output Leakage Current LOW V OUT = 0, = Max, V IN = V IH or V IL (Note 3) -10 µa I SC Output Short-Circuit Current V OUT = 0.5 = Max, V IN = V IH or V IL (Note 4) ma Notes: 1. Total I OL between ground pins should not exceed 64 ma.. These are absolute values with respect to device ground, and all overshoots due to system and/or tester noise are included. 3. pin leakage is the worst case of I IL and I OZL or I IH and I OZH. 4. Not more than one output should be shorted at one time. Duration of the short-circuit should not exceed one second. MACH 5 Family 3

24 M5(LV) TIMING PARAMETERS OVER OPERATING RANGES Min Max Min Max Min Max Min Max Min Max Min Max Unit Combinatorial Delay: t PDi Internal combinatorial propagation delay ns t PD Combinatorial propagation delay ns Registered Delays: t SS Synchronous clock setup time ns t SA Asynchronous clock setup time ns t HS Synchronous clock hold time ns t HA Asynchronous clock hold time ns t COSi Synchronous clock to internal output ns t COS Synchronous clock to output ns t COAi Asynchronous clock to internal output ns t COA Asynchronous clock to output ns Latched Delays: t SAL Latch setup time ns t HAL Latch hold time ns t PDLi Transparent latch internal ns t PDL Propagation delay through transparent latch ns t GOAi Gate to internal output ns t GOA Gate to output ns Input Register Delays: t SIRS Input register setup time using a synchronous clock ns t SIRA Input register setup time using an asynchronous clock ns t HIRS Input register hold time using a synchronous clock ns t HIRA Input register hold time using an asynchronous clock ns Input Latch Delays: t SIL Input latch setup time ns t HIL Input latch hold time ns t PDILi Transparent input latch ns Output Delays: t BUF Output buffer delay ns t SLW Slow slew rate delay ns t EA Output enable time ns t ER Output disable time ns 4 MACH 5 Family

25 M5(LV) TIMING PARAMETERS OVER OPERATING RANGES 1 (CONTINUED) Power Delays: t PL1 Power level 1 delay (Note ) t PL Power level delay (Note ) t PL3 Power level 3 delay (Note ) Min Max Min Max Min Max Min Max Min Max Min Max 4.0 (5.0) 6.0 (9.0) 9.0 (1.5) 4.0 (5.0) 6.0 (9.0) 9.0 (1.5) 4.0 (5.0) 6.0 (9.0) 9.0 (1.5) 4.0 (5.0) 6.0 (9.0) 9.0 (1.5) 4.0 (5.0) 6.0 (9.0) 9.0 (1.5) 4.0 (5.0) 6.0 (9.0) 9.0 (1.5) Additional Cluster Delay: t PT Product term cluster delay ns Interconnect Delays: t BLK Block interconnect delay ns t SEG Segment interconnect delay ns Reset and Preset Delays: t SRi Asynchronous reset or preset to internal register output ns t SR Asynchronous reset or preset to register output ns t SRR Reset and set register recovery time ns t SRW Asynchronous reset or preset width ns Clock Enable Delays: t CES Clock enable setup time ns t CEH Clock enable hold time ns Width: t WLS Global clock width low (Note 3) ns t WHS Global clock width high (Note 3) ns t WLA Product term clock width low ns t WHA Product term clock width high ns t GWA Gate width low (for low transparent) or high (for high transparent) ns t WIR Input register clock width low or high ns Unit ns ns ns MACH 5 Family 5

26 M5(LV) TIMING PARAMETERS OVER OPERATING RANGES 1 (CONTINUED) Frequency: f MAX f MAXA f MAXI External feedback, PAL block level. Min of 1/(t WLS + t WHS ) or 1/(t SS + t COS ) Internal feedback, PAL block level. Min of 1/(t WLS + t WHS ) or 1/(t SS +t COSi ) No feedback PAL block level. Min of 1/(t WLS + t WHS ) or 1/(t SS + t HS ) External feedback, PAL block level. Min of 1/(t WLA + t WHA ) or 1/(t SA + t COA ) Internal feedback, PAL block level. Min of 1/(t WLA + t WHA ) or 1/(t SA +t COAi ) No feedback, PAL block level. Min of 1/(t WLA + t WHA ) or 1/(t SA + t HA ) Maximum input register frequency 1/(t SIRS +t HIRS ) or 1/( x t WICW ) Min Max Min Max Min Max Min Max Min Max Min Max MHz MHz MHz MHz MHz MHz MHz Notes: 1. See Switching Test Circuits in the General Information Section of the Vantis 1999 Data Book.. Numbers in parentheses are for M5-18, M5-19, and M If a signal is used as both a clock and a logic array input, then the maximum input frequency applies (f MAX /). Unit 6 MACH 5 Family

27 M5A(3,5) TIMING PARAMETERS OVER OPERATING RANGES Min Max Min Max Min Max Min Max Min Max Min Max Unit Combinatorial Delay: t PDi Internal combinatorial propagation delay ns t PD Combinatorial propagation delay ns Registered Delays: t SS Synchronous clock setup time ns t SA Asynchronous clock setup time ns t HS Synchronous clock hold time ns t HA Asynchronous clock hold time ns t COSi Synchronous clock to internal output ns t COS Synchronous clock to output ns t COAi Asynchronous clock to internal output ns t COA Asynchronous clock to output ns Latched Delays: t SAL Latch setup time ns t HAL Latch hold time ns t PDLi Transparent latch internal ns t PDL Propagation delay through transparent latch ns t GOAi Gate to internal output ns t GOA Gate to output ns Input Register Delays: t SIRS Input register setup time using a synchronous clock ns t SIRA Input register setup time using an asynchronous clock ns t HIRS Input register hold time using a synchronous clock ns t HIRA Input register hold time using an asynchronous clock ns Input Latch Delays: t SIL Input latch setup time ns t HIL Input latch hold time ns t PDILi Transparent input latch ns Output Delays: t BUF Output buffer delay ns t SLW Slow slew rate delay ns t EA Output enable time ns t ER Output disable time ns Power Delays: t PL1 Power level 1 delay ns t PL Power level delay ns t PL3 Power level 3 delay ns Additional Cluster Delay: t PT Product term cluster delay ns MACH 5 Family

28 M5A(3,5) TIMING PARAMETERS OVER OPERATING RANGES 1 (CONTINUED) Interconnect Delays: t BLK Block interconnect delay 0, 384 and ns t SEG Segment interconnect delay 0, 384, and ns t BLK Block interconnect delay 18, 19 and ns t SEG Segment interconnect delay 18, 19 and ns Reset and Preset Delays: t SRi Asynchronous reset or preset to internal register output ns t SR Asynchronous reset or preset to register output ns t SRR Reset and set register recovery time ns t SRW Asynchronous reset or preset width ns Clock Enable Delays: t CES Clock enable setup time ns t CEH Clock enable hold time ns Width: t WLS Global clock width low (Note ) ns t WHS Global clock width high (Note ) ns t WLA Product term clock width low ns t WHA Product term clock width high ns t GWA Gate width low (for low transparent) or high (for high transparent) ns t WIR Input register clock width low or high ns Frequency: f MAX f MAXA f MAXI External feedback, PAL block level Min of 1/(t WLS + t WHS ) or 1/(t SS + t COS ) Internal feedback, PAL block level Min of 1/(t WLS + t WHS ) or 1/(t SS +t COSi ) No feedback, PAL block level Min of 1/(t WLS + t WHS ) or 1/(t SS + t HS ) External feedback, PAL block level Min of 1/( t WLA + t WHA ) or 1/(t SA + t COA ) Internal feedback, PAL block level Min of 1/(t WLA + t WHA ) or 1/(t SA +t COAi ) No feedback, PAL block level Min of 1/(t WLA + t WHA ) or 1/(t SA + t HA ) Maximum input register frequency 1/(t SIRS +t HIRS ) or 1/( x t WICW ) Min Max Min Max Min Max Min Max Min Max Min Max MHz MHz MHz MHz MHz MHz MHz Notes: 1. See Switching Test Circuit in the General Information Section of the Vantis 1999 Data Book.. If a signal is used as both a clock and a logic array input, then the maximum input frequency applies (f MAX /) Unit 8 MACH 5 Family

29 CAPACITANCE 1 Parameter Symbol Parameter Description Test conditions Typ Unit C IN I/CLK pin V IN =.0 V 3.3 V or 5 V, 5 C, 1 MHz 1 pf C pin V OUT =.0 V 3.3 V or 5 V, 5 C, 1 MHz 10 pf Note: 1. These parameters are not 100% tested, but are calculated at initial characterization and at any time the design is modified where these parameters may be affected. I CC vs. FREQUENCY These curves represent the typical power consumption for a particular device at system frequency. The selected typical pattern is a -bit up-down counter. This pattern fills the device and exercises every macrocell. Maximum frequency shown uses internal feedback and a D-type register. Power/Speed are optimized to obtain the highest counter frequency and the lowest power. The highest frequency (LSBs) is placed in common PAL blocks, which are set to high power. The lowest frequency signals (MSBs) are placed in a common PAL block and set to lowest power. For a more detailed discussion about MACH 5 power consumption, refer to the application note entitled MACH 5 Power in the Application Notes section of the Vantis 1999 Data Book. I CC CURVES AT HIGH /LOW POWER MODES = 5 V or 3.3 V, T A = 5 C M5(LV)-51 high power M5(LV)-384 high power I CC (ma) M5(LV)-0 high power M5LV-56 high power M5(LV)-51 low power M5(LV)-384 low power M5(LV)-0 low power M5LV-56 low power M5LV-18 low power M5LV-18 high power Frequency (MHz) 0446G-048 Figure 8. I CC Curves at High/Low Power Modes MACH 5 Family 9

30 = 5 V, T A = 5 C M5-56 high power 500 M5-19 high power I CC (ma) M5-18 high power M5-56 low power M5-19 low power M5-18 low power Frequency (MHz) 0446G-049 Figure 9. I CC Curves at High/Low Power Modes 30 MACH 5 Family

31 100-PIN PQFP CONNECTION DIAGRAM Top View 100-Pin PQFP (68 ) M5(LV)-18 M5A(3,5)-18 0A13 0A1 0A11 0A8 0A 0A 0D 0D3 0D4 0D 0D8 0D11 0D1 0D13 M5(LV)-18 M5A(3,5)-18 M5-19 M5A(3,5)-19 M5(LV)-56 M5A(3,5)-56 0A 0A6 0A5 0A 0A1 0A0 0A 0A6 0A5 0A 0A1 0A0 A0 A1 A A3 A4 A5 A6 A 3A0 3A1 3A 3A3 3A4 3A5 3A6 3A M5-19 M5A(3,5)-19 M5(LV)-56 M5A(3,5)-56 0A14 0B1 0B 0B 1B 1B 1B1 1B13 1A14 0A1 0B1 0B 0B 1B 1B 1B1 1B13 1A1 0A1 0B1 0B 0B 1B 1B 1B1 1B13 1A1 TDI I0/CLK0 I1/CLK TCK TDO I3/CLK3 I/CLK TMS 3A1 3B13 3B1 3B11 3B8 3B 3B4 3B3 3B B B3 B4 B B8 B11 B1 B13 A1 A1 B13 B1 B11 B8 B B4 B3 B C C3 C4 C C8 C11 C1 C13 D1 0D14 0C13 0C1 0C11 0C8 0C 0C4 0C3 0C 1C 1C3 1C4 1C 1C8 1C11 1C1 1C13 1D M5(LV)-56 M5A(3,5)-56 1A 1A6 1A5 1A 1A1 1A0 A0 A1 A A3 A4 A5 A6 A M5(LV)-56 M5A(3,5)-56 M5-19 M5A(3,5)-19 1A 1A6 1A5 1A 1A1 1A0 D0 D1 D D3 D4 D5 D6 D M5-19 M5A(3,5)-19 M5(LV)-18 M5A(3,5)-18 1A13 1A1 1A11 1A8 1A 1A 1D 1D3 1D4 1D 1D8 1D11 1D1 1D13 M5(LV)-18 M5A(3,5) G-0 Pin Designations CLK = Clock = Ground I = Input = Input/Output NC = No Connect = Supply Voltage TDI = Test Data In TCK = Test Clock TMS = Test Mode Select TDO = Test Data Out 3 D 15 Macrocell (0-15) PAL Block (A-D) Segment (0-3) MACH 5 Family 31

32 100-PIN TQFP CONNECTION DIAGRAM Top View 100-Pin TQFP (68 ) M5(LV)-18 0A13 0A1 0A11 0A8 0A 0A 0D 0D3 0D4 0D 0D8 0D11 0D1 0D13 M5(LV)-18 M5-19 0A 0A6 0A5 0A 0A1 0A0 A0 A1 A A3 A4 A5 A6 A M5-19 M5(LV)-56 0A 0A6 0A5 0A 0A1 0A0 3A0 3A1 3A 3A3 3A4 3A5 3A6 3A M5(LV) TDI I0/CLK0 I1/CLK TCK NC NC NC A14 0B1 0B 0B 1B 1B 1B1 1B13 1A14 0A1 0B1 0B 0B 1B 1B 1B1 1B13 1A1 0A1 0B1 0B 0B 1B 1B 1B1 1B13 1A1 TDO I3/CLK3 I/CLK TMS 3A1 3B13 3B1 3B11 3B8 3B 3B4 3B3 3B B B3 B4 B B8 B11 B1 B13 A1 A1 B13 B1 B11 B8 B B4 B3 B C C3 C4 C C8 C11 C1 C13 D1 0D14 0C13 0C1 0C11 0C8 0C 0C4 0C3 0C 1C 1C3 1C4 1C 1C8 1C11 1C1 1C13 1D14 M5(LV)-56 1A 1A6 1A5 1A 1A1 1A0 A0 A1 A A3 A4 A5 A6 A M5(LV)-56 M5-19 1A 1A6 1A5 1A 1A1 1A0 D0 D1 D D3 D4 D5 D6 D M5-19 M5(LV)-18 1A13 1A1 1A11 1A8 1A 1A 1D 1D3 1D4 1D 1D8 1D11 1D1 1D13 M5(LV) G-01 Pin Designations CLK = Clock = Ground I = Input = Input/Output NC = No Connect = Supply Voltage TDI = Test Data In TCK = Test Clock TMS = Test Mode Select TDO = Test Data Out 3 D 15 Macrocell (0-15) PAL Block (A-D) Segment (0-3) MACH 5 Family

33 100-PIN TQFP CONNECTION DIAGRAM Top View 100-Pin TQFP (4 ) M5LV-18 M5A(3,5)-18 0A13 0A1 0A11 0A10 0A9 0A8 0A 0A 0D1 0D 0D3 0D4 0D 0D8 0D11 0D1 0D13 M5LV-18 M5A(3,5)-18 M5A(3,5)-19 0A11 0A10 0A 0A6 0A5 0A 0A1 0A0 0D1 A0 A1 A A3 A4 A5 A6 A M5A(3,5)-19 M5LV-56 M5A(3,5)-56 0A 0A6 0A5 0A 0A1 0A0 0D11 0D1 3D1 3A0 3A1 3A 3A3 3A4 3A5 3A6 3A M5LV-56 M5A(3,5) TDI I0/CLK0 I1/CLK TCK /O /O A14 0B1 0B 0B 1B 1B 1B1 1B13 1A14 0A1 0B1 0B 0B 1B 1B 1B1 1B13 1A1 0A1 0B1 0B 0B 1B 1B 1B1 1B13 1A1 TDO I3/CLK3 I/CLK TMS 3A1 3B13 3B1 3B11 3B8 3B 3B4 3B3 3B B B3 B4 B B8 B11 B1 B13 A1 A1 B13 B1 B11 B8 B B4 B3 B C C3 C4 C C8 C11 C1 C13 D1 0D14 0C13 0C1 0C11 0C8 0C 0C4 0C3 0C 1C 1C3 1C4 1C 1C8 1C11 1C1 1C13 1D14 M5LV-56 M5A(3,5)-56 1A 1A6 1A5 1A 1A1 1A0 1D11 1D1 D1 A0 A1 A A3 A4 A5 A6 A M5LV-56 M5A(3,5)-56 M5A(3,5)-19 1A8 1A 1A6 1A5 1A 1A1 1A0 1D3 D0 D1 D D3 D4 D5 D6 D D11 M5A(3,5)-19 M5LV-18 M5A(3,5)-18 1A13 1A1 1A11 1A10 1A8 1A 1A 1A1 1D 1D3 1D4 1D 1D8 1D10 1D11 1D1 1D13 M5LV-18 M5A(3,5) G-018 Pin Designations CLK = Clock = Ground I = Input = Input/Output NC = No Connect = Supply Voltage TDI = Test Data In TCK = Test Clock TMS = Test Mode Select TDO = Test Data Out 3 D 15 Macrocell (0-15) PAL Block (A-D) Segment (0-3) MACH 5 Family 33

34 34 MACH 5 Family 144-PIN PQFP CONNECTION DIAGRAM Top View 144-Pin PQFP TDI I0/CLK0 I1/CLK TCK 0A8 0A9 0A10 0A11 0A1 0B1 0B5 0B 1B 1B5 1B1 1B13 1A1 1A11 1A10 1A9 1A8 0A1 0A13 0A14 0B1 0B5 0B 0B1 0B0 1B0 1B1 1B 1B5 1B1 1B13 1A14 1A13 1A1 0A14 0B1 0B10 0B 0B6 0B5 0B 0B1 1B1 1B 1B5 1B6 1B 1B10 1B1 1B13 1A14 M5(LV)-18 M5(LV)-56 M5(LV)-56 M5(LV)-56 M5(LV)-56 M5-19 M5-19 M5-19 M5-19 M5(LV)-18 M5(LV)-18 M5(LV) A 1A6 1A5 1A 1A1 1D3 1D4 1D 1D8 1D11 1D1 D1 D11 D8 D D4 D3 A1 A A3 A4 A5 A6 A 1A11 1A10 1A8 1A 1A6 1A5 1A 1D 1D3 1D4 1D 1D8 1D11 1D1 1D13 D D3 D4 D5 D6 D D8 D10 D11 1A13 1A1 1A11 1A10 1A8 1A 1A6 1A5 1A 1A1 1A0 1D0 1D1 1D 1D3 1D4 1D5 1D6 1D 1D8 1D10 1D11 1D1 1D A 0A6 0A5 0A 0A1 0D3 0D4 0D 0D8 0D11 0D1 3D1 3D11 3D8 3D 3D4 3D3 3A1 3A 3A3 3A4 3A5 3A6 3A 0A11 0A10 0A8 0A 0A6 0A5 0A 0D 0D3 0D4 0D 0D8 0D11 0D1 0D13 A A3 A4 A5 A6 A A8 A10 A11 0A13 0A1 0A11 A10 0A8 0A 0A6 0A5 0A 0A1 0A0 0D0 0D1 0D 0D3 0D4 0D5 0D6 0D 0D8 0D10 0D11 0D1 0D TDO I3/CLK3 I/CLK TMS 3A8 3A9 3A10 3A11 3A1 3B13 3B1 3B11 3B8 3B5 3B4 3B3 3B B B3 B4 B5 B8 B11 B1 B13 A1 A11 A10 A9 A8 A1 A13 A14 B13 B1 B11 B8 B5 B4 B3 B B1 B0 C0 C1 C C3 C4 C5 C8 C11 C1 C13 D14 D13 D1 0D14 0C13 0C1 0C11 0C10 0C8 0C 0C6 0C5 0C4 0C3 0C 0C1 1C1 1C 1C3 1C4 1C5 1C6 1C 1C8 1C10 1C11 1C1 1C13 1D G D 15 CLK = Clock = Ground I = Input = Input/Output NC = No Connect = Supply Voltage TDI = Test Data In TCK = Test Clock TMS = Test Mode Select TDO = Test Data Out Pin Designations Macrocell (0-15) PAL Block (A-D) Segment (0-3)

MACH 5 CPLD Family. Fifth Generation MACH Architecture

MACH 5 CPLD Family. Fifth Generation MACH Architecture MACH 5 CPLD Family Fifth Generation MACH Architecture FEATURES High logic densities and s for increased logic integration 18 to 51 macrocell densities 68 to 56 s Wide selection of density and combinations

More information

XC95288 In-System Programmable CPLD

XC95288 In-System Programmable CPLD R 0 XC95288 In-System Programmable CPLD 0 5 Product Specification Features 15 ns pin-to-pin logic delays on all pins f CNT to 95 MHz 288 macrocells with 6,400 usable gates Up to 166 user pins 5V in-system

More information

XC95144 In-System Programmable CPLD. Features. Description. Power Management. December 4, 1998 (Version 4.0) 1 1* Product Specification

XC95144 In-System Programmable CPLD. Features. Description. Power Management. December 4, 1998 (Version 4.0) 1 1* Product Specification 查询 XC95144 供应商 捷多邦, 专业 PCB 打样工厂,24 小时加急出货 1 XC95144 In-System Programmable CPLD December 4, 1998 (Version 4.0) 1 1* Product Specification Features 7.5 ns pin-to-pin logic delays on all pins f CNT to 111

More information

XC95108 In-System Programmable CPLD

XC95108 In-System Programmable CPLD PODUCT OBSOLETE / UNDE OBSOLESCENCE 0 XC95108 In-System Programmable CPLD DS066 (v5.0) May 17, 2013 0 5 Features 7.5 ns pin-to-pin logic delays on all pins f CNT to 125 MHz 108 macrocells with 2,400 usable

More information

DS1250W 3.3V 4096k Nonvolatile SRAM

DS1250W 3.3V 4096k Nonvolatile SRAM 19-5648; Rev 12/10 3.3V 4096k Nonvolatile SRAM www.maxim-ic.com FEATURES 10 years minimum data retention in the absence of external power Data is automatically protected during power loss Replaces 512k

More information

DS1230Y/AB 256k Nonvolatile SRAM

DS1230Y/AB 256k Nonvolatile SRAM www.maxim-ic.com FEATURES 10 years minimum data retention in the absence of external power Data is automatically protected during power loss Replaces 32k x 8 volatile static RAM, EEPROM or Flash memory

More information

DS1643/DS1643P Nonvolatile Timekeeping RAM

DS1643/DS1643P Nonvolatile Timekeeping RAM Nonvolatile Timekeeping RAM www.dalsemi.com FEATURES Integrated NV SRAM, real time clock, crystal, power-fail control circuit and lithium energy source Clock registers are accessed identically to the static

More information

DS1250Y/AB 4096k Nonvolatile SRAM

DS1250Y/AB 4096k Nonvolatile SRAM 19-5647; Rev 12/10 www.maxim-ic.com FEATURES 10 years minimum data retention in the absence of external power Data is automatically protected during power loss Replaces 512k x 8 volatile static RAM, EEPROM

More information

Sequential Circuit Background. Young Won Lim 11/6/15

Sequential Circuit Background. Young Won Lim 11/6/15 Sequential Circuit /6/5 Copyright (c) 2 25 Young W. Lim. Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free ocumentation License, Version.2 or any later

More information

NC7SV126 TinyLogic ULP-A Buffer with Three-State Output

NC7SV126 TinyLogic ULP-A Buffer with Three-State Output NC7S126 TinyLogic ULP-A Buffer with Three-State Output Features 0.9 to 3.6 CC Supply Operation 3.6 Over-oltage Tolerant I/O s at CC from 0.9 to 3.6 Extremely High Speed tpd - 1.0 ns: Typical for 2.7 to

More information

DS1245Y/AB 1024k Nonvolatile SRAM

DS1245Y/AB 1024k Nonvolatile SRAM www.maxim-ic.com FEATURES 10 years minimum data retention in the absence of external power Data is automatically protected during power loss Replaces 128k x 8 volatile static RAM, EEPROM or Flash memory

More information

NC7SP17 TinyLogic ULP Single Buffer with Schmitt Trigger Input

NC7SP17 TinyLogic ULP Single Buffer with Schmitt Trigger Input NC7SP17 TinyLogic ULP Single Buffer with Schmitt Trigger Input Features 0.9 to 3.6 CC Supply Operation 3.6 Over-oltage Tolerant I/Os at CC from 0.9 to 3.6 Propagation Delay (t PD ): 4.0ns Typical for 3.0

More information

NC7SV08 TinyLogic ULP-A 2-Input AND Gate

NC7SV08 TinyLogic ULP-A 2-Input AND Gate NC7S08 TinyLogic ULP-A 2-Input AND Gate Features 0.9 to 3.6 CC Supply Operation 3.6 Over-oltage Tolerant I/Os at CC from 0.9 to 3.6 Extremely High Speed t PD - 1.0 ns: Typical for 2.7 to 3.6 CC - 1.2 ns:

More information

DS1644/DS1644P Nonvolatile Timekeeping RAM

DS1644/DS1644P Nonvolatile Timekeeping RAM Nonvolatile Timekeeping RAM www.maxim-ic.com FEATURES Integrated NV SRAM, Real-Time Clock, Crystal, Power-Fail Control Circuit and Lithium Energy Source Clock Registers are Accessed Identically to the

More information

NC7SV126 TinyLogic ULP-A Buffer with Three-State Output

NC7SV126 TinyLogic ULP-A Buffer with Three-State Output NC7S126 TinyLogic ULP-A Buffer with Three-State Output Features 0.9 to 3.6 CC Supply Operation 3.6 Over-oltage Tolerant I/O s at CC from 0.9 to 3.6 Extremely High Speed tpd - 1.0ns: Typical for 2.7 to

More information

VHDL (and verilog) allow complex hardware to be described in either single-segment style to two-segment style

VHDL (and verilog) allow complex hardware to be described in either single-segment style to two-segment style FFs and Registers In this lecture, we show how the process block is used to create FFs and registers Flip-flops (FFs) and registers are both derived using our standard data types, std_logic, std_logic_vector,

More information

Using SystemVerilog Assertions in Gate-Level Verification Environments

Using SystemVerilog Assertions in Gate-Level Verification Environments Using SystemVerilog Assertions in Gate-Level Verification Environments Mark Litterick (Verification Consultant) mark.litterick@verilab.com 2 Introduction Gate-level simulations why bother? methodology

More information

( DOC No. HX8705-B-DS ) HX8705-B

( DOC No. HX8705-B-DS ) HX8705-B ( DOC No. HX8705-B-DS ) HX8705-B 800x600CH EPD Source+Gate Driver Preliminary version 01 800x600CH EPD Source+Gate Driver Preliminary Version 01 1. General Description The HX8705-B is a 800-channel outputs

More information

DS1321 Flexible Nonvolatile Controller with Lithium Battery Monitor

DS1321 Flexible Nonvolatile Controller with Lithium Battery Monitor 19-6312; Rev 6/12 Flexible Nonvolatile Controller with Lithium Battery Monitor FEATURES Converts CMOS SRAM into nonvolatile memory Unconditionally write-protects SRAM when V CC is out of tolerance Automatically

More information

ASIC Design (7v81) Spring 2000

ASIC Design (7v81) Spring 2000 ASIC Design (7v81) Spring 2000 Lecture 1 (1/21/2000) General information General description We study the hardware structure, synthesis method, de methodology, and design flow from the application to ASIC

More information

80 SEGMENT DRIVER FOR DOT MATRIX LCD S6A2067

80 SEGMENT DRIVER FOR DOT MATRIX LCD S6A2067 80 SEGENT DRIVER FOR DOT ATRIX LCD INTRODUCTION The is a LCD driver lc which is fabricated by low power COS technology. Basically this lc consists of 40 x 2 bit bi-directional shift register, 40 x 2 bit

More information

( DOC No. HX8678-A-DS ) HX8678-A

( DOC No. HX8678-A-DS ) HX8678-A ( DOC No. HX8678-A-DS ) HX8678-A Preliminary version 01 July, 2006 Preliminary Version 01 July, 2006 1. General Description The HX8678-A is a 480/320 channels output gate driver used for driving the gate

More information

Field Programmable Gate Arrays a Case Study

Field Programmable Gate Arrays a Case Study Designing an Application for Field Programmable Gate Arrays a Case Study Bernd Däne www.tu-ilmenau.de/ra Bernd.Daene@tu-ilmenau.de de Technische Universität Ilmenau Topics 1. Introduction and Goals 2.

More information

Energy Efficient Content-Addressable Memory

Energy Efficient Content-Addressable Memory Energy Efficient Content-Addressable Memory Advanced Seminar Computer Engineering Institute of Computer Engineering Heidelberg University Fabian Finkeldey 26.01.2016 Fabian Finkeldey, Energy Efficient

More information

CMPEN 411 VLSI Digital Circuits Spring Lecture 24: Peripheral Memory Circuits

CMPEN 411 VLSI Digital Circuits Spring Lecture 24: Peripheral Memory Circuits CMPEN 411 VLSI Digital Circuits Spring 2012 Lecture 24: Peripheral Memory Circuits [Adapted from Rabaey s Digital Integrated Circuits, Second Edition, 2003 J. Rabaey, A. Chandrakasan, B. Nikolic] Sp12

More information

Distributed by: www.jameco.com 1-800-831-4242 The content and copyrights of the attached material are the property of its owner. DS1746/DS1746P Y2K-Compliant, Nonvolatile Timekeeping RAMs www.maxim-ic.com

More information

DS1743/DS1743P Y2K-Compliant, Nonvolatile Timekeeping RAMs

DS1743/DS1743P Y2K-Compliant, Nonvolatile Timekeeping RAMs DS1743/DS1743P Y2K-Compliant, Nonvolatile Timekeeping RAMs FEATURES Integrated NV SRAM, Real-Time Clock, Crystal, Power-Fail Control Circuit, and Lithium Energy Source Clock Registers are Accessed Identically

More information

DS1743/DS1743P Y2K-Compliant, Nonvolatile Timekeeping RAMs

DS1743/DS1743P Y2K-Compliant, Nonvolatile Timekeeping RAMs www.maxim-ic.com FEATURES Integrated NV SRAM, Real-Time Clock, Crystal, Power-Fail Control Circuit, and Lithium Energy Source Clock Registers are Accessed Identically to the Static RAM. These Registers

More information

5K - 50K Gates Coprocessor FPGA with FreeRAM AT40K05 AT40K05LV AT40K10 AT40K10LV AT40K20 AT40K20LV AT40K40 AT40K40LV

5K - 50K Gates Coprocessor FPGA with FreeRAM AT40K05 AT40K05LV AT40K10 AT40K10LV AT40K20 AT40K20LV AT40K40 AT40K40LV Features Ultra High Performance System Speeds to MHz Array Multipliers > 50 MHz 10FlexibleSRAM Internal Tri-state Capability in Each Cell FreeRAM Flexible, Single/Dual Port, Synchronous/Asynchronous 10

More information

CprE 281: Digital Logic

CprE 281: Digital Logic CprE 28: Digital Logic Instructor: Alexander Stoytchev http://www.ece.iastate.edu/~alexs/classes/ Registers and Counters CprE 28: Digital Logic Iowa State University, Ames, IA Copyright Alexander Stoytchev

More information

DS1746/DS1746P Y2K-Compliant, Nonvolatile Timekeeping RAMs

DS1746/DS1746P Y2K-Compliant, Nonvolatile Timekeeping RAMs DS1746/DS1746P Y2K-Compliant, Nonvolatile Timekeeping RAMs FEATURES Integrated NV SRAM, Real-Time Clock, Crystal, Power-Fail Control Circuit, and Lithium Energy Source Clock Registers are Accessed Identically

More information

CONSONANCE CN3051A/CN3052A. 500mA USB-Compatible Lithium Ion Battery Charger. General Description: Features: Pin Assignment.

CONSONANCE CN3051A/CN3052A. 500mA USB-Compatible Lithium Ion Battery Charger. General Description: Features: Pin Assignment. CONSONANCE 500mA USB-Compatible Lithium Ion Battery Charger CN3051A/CN3052A General Description: The CN3051A/CN3052A is a complete constant-current /constant voltage linear charger for single cell Li-ion

More information

LM3352 Regulated 200 ma Buck-Boost Switched Capacitor DC/DC Converter

LM3352 Regulated 200 ma Buck-Boost Switched Capacitor DC/DC Converter Regulated 200 ma Buck-Boost Switched Capacitor DC/DC Converter General Description The LM3352 is a CMOS switched capacitor DC/DC converter that produces a regulated output voltage by automatically stepping

More information

DS1747/DS1747P Y2K-Compliant, Nonvolatile Timekeeping RAMs

DS1747/DS1747P Y2K-Compliant, Nonvolatile Timekeeping RAMs DS1747/DS1747P Y2K-Compliant, Nonvolatile Timekeeping RAMs FEATURES Integrated NV SRAM, Real-Time Clock (RTC), Crystal, Power-Fail Control Circuit, and Lithium Energy Source Clock Registers are Accessed

More information

EE 330 Integrated Circuit. Sequential Airbag Controller

EE 330 Integrated Circuit. Sequential Airbag Controller EE 330 Integrated Circuit Sequential Airbag Controller Chongli Cai Ailing Mei 04/2012 Content...page Introduction...3 Design strategy...3 Input, Output and Registers in the System...4 Initialization Block...5

More information

RAM-Type Interface for Embedded User Flash Memory

RAM-Type Interface for Embedded User Flash Memory June 2012 Introduction Reference Design RD1126 MachXO2-640/U and higher density devices provide a User Flash Memory (UFM) block, which can be used for a variety of applications including PROM data storage,

More information

( DOC No. HX8678-B-DS )

( DOC No. HX8678-B-DS ) ( DOC No. HX8678-B-DS ) Preliminary version 01 1. General Description The HX8678-B is a 480-channel outputs gate driver, which is used for driving the gate line of TFT LCD panel. It is designed for 2-level

More information

Lithium Ion Battery Charger for Solar-Powered Systems

Lithium Ion Battery Charger for Solar-Powered Systems Lithium Ion Battery Charger for Solar-Powered Systems General Description: The is a complete constant-current /constant voltage linear charger for single cell Li-ion and Li Polymer rechargeable batteries.

More information

( DOC No. HX8615A-DS ) HX8615A

( DOC No. HX8615A-DS ) HX8615A ( DOC No. HX8615A-DS ) HX8615A Version 05 Mayl, 2005 Version 05 May, 2005 1. General Description The HX8615A is a 240 channel outputs gate driver used for driving the gate electrode of TFT LCD panel. It

More information

Programmable Comparator Options for the isppac-powr1220at8

Programmable Comparator Options for the isppac-powr1220at8 November 2005 Introduction Application Note AN6069 Lattice s isppac -POWR1220AT8 offers a wide range of features for managing multiple power supplies in a complex system. This application note outlines

More information

128Mb Synchronous DRAM. Features High Performance: Description. REV 1.0 May, 2001 NT5SV32M4CT NT5SV16M8CT NT5SV8M16CT

128Mb Synchronous DRAM. Features High Performance: Description. REV 1.0 May, 2001 NT5SV32M4CT NT5SV16M8CT NT5SV8M16CT Features High Performance: f Clock Frequency -7K 3 CL=2-75B, CL=3-8B, CL=2 Single Pulsed RAS Interface Fully Synchronous to Positive Clock Edge Four Banks controlled by BS0/BS1 (Bank Select) Units 133

More information

SYNCHRONOUS DRAM. 256Mb: x4, x8, x16 SDRAM 3.3V

SYNCHRONOUS DRAM. 256Mb: x4, x8, x16 SDRAM 3.3V SYNCHRONOUS DRAM 256Mb: x4, x8, x16 Features: Intel PC133 (3-3-3) compatible Fully synchronous; all signals registered on positive edge of system clock Internal pipelined operation; column address can

More information

AN-1166 Lithium Polymer Battery Charger using GreenPAK State Machine

AN-1166 Lithium Polymer Battery Charger using GreenPAK State Machine AN-1166 Lithium Polymer Battery Charger using GreenPAK State Machine This note describes the design of a complete charging circuit. A single cell Lithium Polymer (LiPol) battery is charged in two stages:

More information

NC7SVL08 TinyLogic Low-I CCT Two-Input AND Gate

NC7SVL08 TinyLogic Low-I CCT Two-Input AND Gate NC7SL08 TinyLogic Low-I CCT Two-Input ND Gate Features 0.9 to 3.6 CC Supply Operation 3.6 Over-oltage Tolerant I/Os at CC from 0.9 to 3.6 Power-Off High-Impedance Inputs and Outputs Proprietary Quiet Series

More information

Standalone Linear Li-Ion Battery Charger with Thermal Regulation

Standalone Linear Li-Ion Battery Charger with Thermal Regulation HM4056 Standalone Linear Li-Ion Battery Charger with Thermal Regulation FEATURES DESCRIPTION Programmable Charge Current up to 1A No MOSFET, Sense Resistor or Blocking Diode Required Constant-Current/Constant-Voltage

More information

FXLP34 Single Bit Uni-Directional Translator

FXLP34 Single Bit Uni-Directional Translator FXLP34 Single Bit Uni-Directional Translator Features V to 3.6V V CC supply operation Converts any voltage (V to 3.6V) to (V to 3.6V) 4.6V tolerant inputs and outputs t PD 4ns typ. for V to 3.6V V CC 5ns

More information

PT8A mA Li-ion/Polymer Battery Charger

PT8A mA Li-ion/Polymer Battery Charger Features A Constant-Current / Constant-Voltage Linear Charger for Single-Cell Li-ion/Polymer Batteries Integrated Pass Element and Current Sensor Highly-Integrated, Requiring No External FETs or Blocking

More information

MODEL BASED DESIGN OF HYBRID AND ELECTRIC POWERTRAINS Sandeep Sovani, Ph.D. ANSYS Inc.

MODEL BASED DESIGN OF HYBRID AND ELECTRIC POWERTRAINS Sandeep Sovani, Ph.D. ANSYS Inc. MODEL BASED DESIGN OF HYBRID AND ELECTRIC POWERTRAINS Sandeep Sovani, Ph.D. ANSYS Inc. October 22, 2013 SAE 2013 Hybrid Powertrain Complexity And Maintainability Symposium Acknowledgements: Scott Stanton,

More information

Is Now Part of To learn more about ON Semiconductor, please visit our website at

Is Now Part of To learn more about ON Semiconductor, please visit our website at Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC

More information

HYB25D256400/800AT 256-MBit Double Data Rata SDRAM

HYB25D256400/800AT 256-MBit Double Data Rata SDRAM 256-MBit Double Data Rata SDRAM Features CAS Latency and Frequency Maximum Operating Frequency (MHz) CAS Latency DDR266A -7 DDR200-8 2 133 100 2.5 143 125 Double data rate architecture: two data transfers

More information

MILITARY SPECIFICATION MICROCIRCUITS, LINEAR, CMOS, ANALOG SWITCH WITH DRIVER, MONOLITHIC SILICON

MILITARY SPECIFICATION MICROCIRCUITS, LINEAR, CMOS, ANALOG SWITCH WITH DRIVER, MONOLITHIC SILICON INCH-POUND 4 February 2004 SUPERSEDING MIL-M-38510/116 16 April 1980 MILITARY SPECIFICATION MICROCIRCUITS, LINEAR, CMOS, ANALOG SWITCH WITH DRIVER, MONOLITHIC SILICON This specification is approved for

More information

SGM4056 High Input Voltage Charger

SGM4056 High Input Voltage Charger GENERAL DESCRIPTION The SGM456 is a cost-effective, fully integrated high input voltage single-cell Li-ion battery charger. The charger uses a CC/CV charge profile required by Li-ion battery. The charger

More information

CE3211 Series. Standalone 1A Linear Lithium Battery Charger With Thermal Regulation INTRODUCTION: FEATURES: APPLICATIONS:

CE3211 Series. Standalone 1A Linear Lithium Battery Charger With Thermal Regulation INTRODUCTION: FEATURES: APPLICATIONS: Standalone 1A Linear Lithium Battery Charger With Thermal Regulation INTRODUCTION: The CE3211 is a complete constant-current/ constant-voltage linear charger for single cell lithium rechargeable battery.

More information

Finite Element Based, FPGA-Implemented Electric Machine Model for Hardware-in-the-Loop (HIL) Simulation

Finite Element Based, FPGA-Implemented Electric Machine Model for Hardware-in-the-Loop (HIL) Simulation Finite Element Based, FPGA-Implemented Electric Machine Model for Hardware-in-the-Loop (HIL) Simulation Leveraging Simulation for Hybrid and Electric Powertrain Design in the Automotive, Presentation Agenda

More information

CMPEN 411 VLSI Digital Circuits Spring Lecture 20: Multiplier Design

CMPEN 411 VLSI Digital Circuits Spring Lecture 20: Multiplier Design CMPEN 411 VLSI Digital Circuits Spring 2011 Lecture 20: Multiplier Design [Adapted from Rabaey s Digital Integrated Circuits, Second Edition, 2003 J. Rabaey, A. Chandrakasan, B. Nikolic] Sp11 CMPEN 411

More information

Advantage Memory Corporation reserves the right to change products and specifications without notice

Advantage Memory Corporation reserves the right to change products and specifications without notice SDRAM DIMM 32MX72 SDRAM DIMM with PLL & Register based on 32MX4, 4 Internal Banks, 4K Refresh, 3.3V DRAMs with SPD GENERAL DESCRIPTION The Advantage is a 32MX72 Synchronous Dynamic RAM high density memory

More information

A4063. AiT Semiconductor Inc. APPLICATION ORDERING INFORMATION TYPICAL APPLICATION

A4063. AiT Semiconductor Inc.   APPLICATION ORDERING INFORMATION TYPICAL APPLICATION DESCRIPTION The is a 2A Li-Ion battery switching charger intended for 5V adapters. Low power dissipation, an internal MOSFET and its compact package with minimum external components requirement makes the

More information

DS2714. Quad Loose Cell NiMH Charger

DS2714. Quad Loose Cell NiMH Charger DS2714 Quad Loose Cell NiMH Charger www.maxim-ic.com GENERAL DESCRIPTION The DS2714 is ideal for standalone charging of 1 to 4 AA or AAA NiMH loose cells. NiCd cells can also be charged. Temperature, voltage

More information

SDR SDRAM. MT48LC8M8A2 2 Meg x 8 x 4 Banks MT48LC4M16A2 1 Meg x 16 x 4 Banks. Features. 64Mb: x8, x16 SDRAM. Features

SDR SDRAM. MT48LC8M8A2 2 Meg x 8 x 4 Banks MT48LC4M16A2 1 Meg x 16 x 4 Banks. Features. 64Mb: x8, x16 SDRAM. Features SDR SDRAM MT48LC8M8A2 2 Meg x 8 x 4 Banks MT48LC4M16A2 1 Meg x 16 x 4 Banks 64Mb: x8, x16 SDRAM Features Features PC100- and PC133-compliant Fully synchronous; all signals registered on positive edge of

More information

HV Supercapacitors Cylindrical cells

HV Supercapacitors Cylindrical cells HV Supercapacitors Cylindrical cells Supersedes October 2015 Pb HALOGEN HF FREE Features Ultra low ESR for high power density UL recognized Applications Electric, Gas, Water smart meters Controllers RF

More information

HYB25D256[400/800/160]B[T/C](L) 256-Mbit Double Data Rate SDRAM, Die Rev. B Data Sheet Jan. 2003, V1.1. Features. Description

HYB25D256[400/800/160]B[T/C](L) 256-Mbit Double Data Rate SDRAM, Die Rev. B Data Sheet Jan. 2003, V1.1. Features. Description Data Sheet Jan. 2003, V1.1 Features CAS Latency and Frequency Maximum Operating Frequency (MHz) CAS Latency DDR200-8 DDR266A -7 DDR266-7F DDR333-6 2 100 133 133 133 2.5 125 143 143 166 Double data rate

More information

Table 1: 2-pin Terminal Block J1 Functional description of BSD-02LH Module Pin # Pin Description Table 2: 10-pin Header J2 Pin # Pin Description

Table 1: 2-pin Terminal Block J1 Functional description of BSD-02LH Module Pin # Pin Description Table 2: 10-pin Header J2 Pin # Pin Description Functional description of BSD-02LH Module The BSD-02LH module is the part of the BSD-02 family of drivers. The main difference is higher microstepping resolution. The BSD-02LH is suitable for driving bipolar

More information

Welcome to ABB machinery drives training. This training module will introduce you to the ACS850-04, the ABB machinery drive module.

Welcome to ABB machinery drives training. This training module will introduce you to the ACS850-04, the ABB machinery drive module. Welcome to ABB machinery drives training. This training module will introduce you to the ACS850-04, the ABB machinery drive module. 1 Upon the completion of this module, you will be able to describe the

More information

54ACxxxx, 54ACTxxxx. Rad-hard advanced high-speed 5 V CMOS logic series. Features. Description

54ACxxxx, 54ACTxxxx. Rad-hard advanced high-speed 5 V CMOS logic series. Features. Description Rad-hard advanced high-speed 5 V CMOS logic series Features Data brief Flat-14 Flat-16 Flat-20 DIL-14 DIL-16 DIL-20 AC: 2 to 6 V operating voltage ACT: 4.5 to 5.5 V operating voltage High speed T PD =

More information

80CH SEGMENT/COMMON DRIVER FOR DOT MATRIX LCD

80CH SEGMENT/COMMON DRIVER FOR DOT MATRIX LCD 80C SEGENT/COON DRIVER FOR T ATRIX CD INTRODUCTION 100 QFP KS0083/84 is a graphic type CD driver Sl which is fabricated by COS process for high voltage. In case of segment driver, can be selected 4 bit,

More information

North America Asia-Pacific Europe, Middle East

North America Asia-Pacific Europe, Middle East Bel Power Solutions point-of-load converters are recommended for use with regulated bus converters in an Intermediate Bus Architecture (IBA). The YMS nonisolated dc-dc converters deliver up to A of output

More information

54ACxxxx, 54ACTxxxx. Rad-hard advanced high-speed 5 V CMOS logic series. Features. Description

54ACxxxx, 54ACTxxxx. Rad-hard advanced high-speed 5 V CMOS logic series. Features. Description 54ACxxxx, 54ACTxxxx Rad-hard advanced high-speed 5 V CMOS logic series Features Data brief Flat-14 Flat-16 DIL-14 DIL-16 AC: 2 to 6 V operating voltage ACT: 4.5 to 5.5 V operating voltage High speed T

More information

HBC DC-DC Series Data Sheet 300-Watt Half-Brick Converters

HBC DC-DC Series Data Sheet 300-Watt Half-Brick Converters Applications Intermediate Bus architectures Telecommunications equipment LAN/WAN applications Data processing applications Features RoHS lead solder exemption compliant High efficiency up to 94% High power

More information

Regenerative Utility Simulator for Grid-Tied Inverters

Regenerative Utility Simulator for Grid-Tied Inverters Regenerative Utility Simulator for Grid-Tied Inverters AMETEK s RS & MX Series with the SNK Option provides the solution Testing of grid-tied inverters used in solar energy systems is emerging as a major

More information

DESCRIPTION FEATURES APPLICATIONS

DESCRIPTION FEATURES APPLICATIONS DESCRIPTION is a dot matrix LCD driver IC. The bit addressable display data which is sent from a microcomputer is stored in a build-in display data RAM and generates the LCD signal. The incorporates innovative

More information

MJWI20 SERIES FEATURES PRODUCT OVERVIEW. DC/DC Converter 20W, Highest Power Density MINMAX MJWI20 Series

MJWI20 SERIES FEATURES PRODUCT OVERVIEW.  DC/DC Converter 20W, Highest Power Density MINMAX MJWI20 Series DC/DC 2W, Highest Power Density MINMAX MJWI2 Series MJWI2 SERIES DC/DC CONVERTER 2W, Highest Power Density FEATURES Smallest Encapsulated 2W! Package Size 1. x1. x.4 Ultra-wide 4:1 Input Range Very high

More information

Electrical Characteristics of MAX220/222/232A/242/ Rev. G /883B for /883B and SMD page 1 of 5

Electrical Characteristics of MAX220/222/232A/242/ Rev. G /883B for /883B and SMD page 1 of 5 SCOPE: +5-POWERED MULTI-CHANNEL RS-232 DRIERS/RECEIERS Device Type Generic Number Pkg Code 01 MAX220(x)/883B J16 & L20 02 MAX222(x)/883B J18 & L20 03 MAX232A(x)/883B J16 & L20 04 MAX242(x)/883B J18 & L20

More information

Advantage Memory Corporation reserves the right to change products and specifications without notice

Advantage Memory Corporation reserves the right to change products and specifications without notice SD872-8X8-72VS4 SDRAM DIMM 8MX72 SDRAM DIMM with ECC based on 8MX8, 4B, 4K Refresh, 3.3V DRAMs with SPD GENERAL DESCRIPTION The Advantage SD872-8X8-72VS4 is a 8MX72 Synchronous Dynamic RAM high-density

More information

e-smart 2009 Low cost fault injection method for security characterization

e-smart 2009 Low cost fault injection method for security characterization e-smart 2009 Low cost fault injection method for security characterization Jean-Max Dutertre ENSMSE Assia Tria CEA-LETI Bruno Robisson CEA-LETI Michel Agoyan CEA-LETI Département SAS Équipe mixte CEA-LETI/ENSMSE

More information

DH50 SERIES. DATASHEET Rev. A

DH50 SERIES. DATASHEET Rev. A DATASHEET DH50 SERIES 2:1 Wide Input Voltage Ranges Single Outputs, Efficiency up to 92% 2.0 x 1.0 x 0.4 Encapsulated Shielded Metal Package FEATURES RoHS & UL 94V-0 Compliant 50 Watts Output Power 2:1

More information

DIO5538B 5~100mA,Single Li-ion Battery Charger

DIO5538B 5~100mA,Single Li-ion Battery Charger 5~100mA,Single Li-ion Battery Charger Rev 1.1 Features Broad Programmable Charging Current: 5~100mA Over-Temperature Protection Under Voltage Lockout Protection Reverse current protection between BAT and

More information

t WR = 2 CLK A2 Notes:

t WR = 2 CLK A2 Notes: SDR SDRAM MT48LC16M4A2 4 Meg x 4 x 4 Banks MT48LC8M8A2 2 Meg x 8 x 4 Banks MT48LC4M16A2 1 Meg x 16 x 4 Banks 64Mb: x4, x8, x16 SDRAM Features Features PC100- and PC133-compliant Fully synchronous; all

More information

Phase Leg IGBT with an Integrated Driver Module

Phase Leg IGBT with an Integrated Driver Module Phase Leg IGBT with an Integrated Driver Module Overview This design integrates IXYS Corporation s MIXA225PF1200TSF Phase Leg IGBT Module and IXIDM1403_1505_M High Voltage Isolated Driver Module into a

More information

AC Induction Motor Controller with VCL

AC Induction Motor Controller with VCL Motor Controllers AC Induction Motor Controller with VCL www.curtisinstruments.com 1 The Ultimate Class III Truck Control System: Superb Performance and Value This new AC induction motor controller (inverter)

More information

Product Datasheet P MHz RF Powerharvester Receiver

Product Datasheet P MHz RF Powerharvester Receiver DESCRIPTION The Powercast P1110 Powerharvester receiver is an RF energy harvesting device that converts RF to DC. Housed in a compact SMD package, the P1110 receiver provides RF energy harvesting and power

More information

(FPGA) based design for minimizing petrol spill from the pipe lines during sabotage

(FPGA) based design for minimizing petrol spill from the pipe lines during sabotage IOSR Journal of Engineering (IOSRJEN) ISSN (e): 2250-3021, ISSN (p): 2278-8719 Vol. 05, Issue 01 (January. 2015), V3 PP 26-30 www.iosrjen.org (FPGA) based design for minimizing petrol spill from the pipe

More information

FEATURES DESCRIPTION APPLICATIONS TYPICAL APPLICATION PIN OUT & MARKING. Max.2A Li-ion Switching Charger IC

FEATURES DESCRIPTION APPLICATIONS TYPICAL APPLICATION PIN OUT & MARKING. Max.2A Li-ion Switching Charger IC DESCRIPTION The is a 2A Li-Ion battery switching charger intended for 5V adapters. Low power dissipation, an internal MOSFET and its compact package with minimum external components requirement makes the

More information

HB Supercapacitors Cylindrical cells

HB Supercapacitors Cylindrical cells HB Supercapacitors Cylindrical cells Supersedes January 2014 Pb HALOGEN HF FREE Features Ultra low ESR for high power density UL recognized Applications Electric, Gas, Water smart meters Controllers RF

More information

Optimizing Battery Accuracy for EVs and HEVs

Optimizing Battery Accuracy for EVs and HEVs Optimizing Battery Accuracy for EVs and HEVs Introduction Automotive battery management system (BMS) technology has advanced considerably over the last decade. Today, several multi-cell balancing (MCB)

More information

2 to 5 Serial Cell Li-ion Battery Protection IC for Secondary Protection

2 to 5 Serial Cell Li-ion Battery Protection IC for Secondary Protection Series 2 to 5 Serial Cell Li-ion Battery Protection IC for Secondary Protection OERIEW The R5640G is an overcharge protection IC for 2- to 5- series cell Li-ion / Li-polymer rechargeable battery pack,

More information

TVS Diode Arrays (SPA Diodes) SP2502L Series 3.3V 75A Diode Array. Lightning Surge Protection - SP2502L Series. RoHS Pb GREEN.

TVS Diode Arrays (SPA Diodes) SP2502L Series 3.3V 75A Diode Array. Lightning Surge Protection - SP2502L Series. RoHS Pb GREEN. SP202L Series 3.3V 7A Diode Array RoHS Pb GREEN Description The SP202L provides overvoltage protection for applications such as 0/00/000 Base-T Ethernet and T3/ E3 interfaces. This device has a low capacitance

More information

LM3621 Single Cell Lithium-Ion Battery Charger Controller

LM3621 Single Cell Lithium-Ion Battery Charger Controller Single Cell Lithium-Ion Battery Charger Controller General Description The is a full function constant voltage, constant current (CVCC) lithium-ion (Li+) battery charger controller. It provides 1% regulation

More information

CONSONANCE. 1A LiFePO4 Battery Charger CN3058E. Features: General Description: Applications: Pin Assignment

CONSONANCE. 1A LiFePO4 Battery Charger CN3058E. Features: General Description: Applications: Pin Assignment A LiFePO4 Battery Charger CN3058E General Description: The CN3058E is a complete constant-current /constant voltage linear charger for single cell LiFePO4 rechargeable batteries. The device contains an

More information

DQ18 DQ19 VDD DQ20 NC *VREF **CKE1 VSS DQ21 DQ22 DQ23 VSS DQ24 DQ25 DQ26 DQ27 VDD DQ28 DQ29 DQ30 DQ31 VSS **CLK2 NC NC SDA SCL VDD

DQ18 DQ19 VDD DQ20 NC *VREF **CKE1 VSS DQ21 DQ22 DQ23 VSS DQ24 DQ25 DQ26 DQ27 VDD DQ28 DQ29 DQ30 DQ31 VSS **CLK2 NC NC SDA SCL VDD PIN CONFIGURATIONS (Front side/back side) Pin Front Pin Front Pin Front Pin Back Pin Back Pin Back 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 19 20 21 22 23 24 25 26 27 DQ8 DQ9 0 1 2 3 4 5 CB0 CB1 WE 0

More information

(typ.) (Range) Input Specifications Parameter Model Min. Typ. Max. Unit 12V Input Models Input Surge Voltage (100ms.

(typ.) (Range) Input Specifications Parameter Model Min. Typ. Max. Unit 12V Input Models Input Surge Voltage (100ms. FEATURES Smallest Encapsulated 50W! Package Size 2.0 x 1.0 x 0.4 Wide 2:1 lnput Range Excellent Efficiency up to 92% Over-Temperature Protection I/O-isolation Voltage 1500VDC Remote On/Off Control Shielded

More information

ACE4108 Max.2A Li-ion Switching Charger IC

ACE4108 Max.2A Li-ion Switching Charger IC Description The ACE4108 is a 2A Li-Ion battery switching charger intended for 12V. Low power dissipation, an internal MOSFET and its compact package with minimum external components requirement makes the

More information

SPHV-C Series 200W Discrete Bidirectional TVS Diode

SPHV-C Series 200W Discrete Bidirectional TVS Diode SPHV-C Series W Discrete Bidirectional TVS Diode RoHS Pb GREEN Description The SPHV-C series is designed to replace multilayer varistors (MLVs) in portable applications, LED lighting modules, and low speed

More information

CMPEN 411 VLSI Digital Circuits Spring Lecture 06: Static CMOS Logic

CMPEN 411 VLSI Digital Circuits Spring Lecture 06: Static CMOS Logic MPEN 411 VLSI Digital ircuits Spring 2012 Lecture 06: Static MOS Logic [dapted from Rabaey s Digital Integrated ircuits, Second Edition, 2003 J. Rabaey,. handrakasan,. Nikolic] Sp12 MPEN 411 L06 S.1 Review:

More information

5A Synchronous Buck Li-ion Charger With Adapter Adaptive

5A Synchronous Buck Li-ion Charger With Adapter Adaptive 5A Synchronous Buck Li-ion Charger With Adapter Adaptive General Description The is a 5A Li-Ion battery charger intended for 4.4~14 wall adapters. It utilizes a high efficiency synchronous buck converter

More information

AQHV Series 200W Discrete Unidirectional TVS Diode

AQHV Series 200W Discrete Unidirectional TVS Diode AQHV Series W Discrete Unidirectional TVS Diode RoHS Pb GREEN Description The AQHV series is designed to provide an option for very fast acting, high performance over-voltage protection devices. Ideally

More information

HM5061 Max.1.6A Li-ion Switching Charger IC

HM5061 Max.1.6A Li-ion Switching Charger IC Max.1.6A Li-ion Switching Charger IC DESCRIPTION The HM5061 is a 1.6A Li-Ion battery switching charger intended for 5V adapters. Low power dissipation, an internal MOSFET and its compact package with minimum

More information

DPX15-xxWDxx Dual Output: DC-DC Converter Module 9.5 ~ 36VDC, 18 ~ 75VDC input; ±5 to ±15 VDC Dual Output; 15 Watts Output Power

DPX15-xxWDxx Dual Output: DC-DC Converter Module 9.5 ~ 36VDC, 18 ~ 75VDC input; ±5 to ±15 VDC Dual Output; 15 Watts Output Power DPX15-xxWDxx Dual Output: DC-DC Converter Module 9.5 ~ 36VDC, 18 ~ 75VDC input; ±5 to ±15 VDC Dual Output; 15 Watts Output Power FEATURES NO MINIMUM LOAD REQUIRED 1600VDC INPUT TO OUTPUT ISOLATION SCREW

More information

(typ.) (Range) ±18 330# 89 MPW MPW

(typ.) (Range) ±18 330# 89 MPW MPW DC/DC 30W, Single & Dual Output FEATURES 2 x 1.6 x 0.4 Metal Package Ultra-wide 4:1 Input Range Operating Temp. Range 40 C to 80 C Short Circuit Protection I/O-isolation 1500 VDC Input Filter meets EN

More information

DVFL2800S Series HIGH RELIABILITY HYBRID DC-DC CONVERTERS DESCRIPTION FEATURES

DVFL2800S Series HIGH RELIABILITY HYBRID DC-DC CONVERTERS DESCRIPTION FEATURES HIGH RELIABILITY HYBRID DC-DC CONVERTERS DESCRIPTION The DVFL series of high reliability DC-DC converters is operable over the full military (-55 C to +125 C) temperature range with no power derating.

More information

Glossary of CMOS Logic IC Terms Outline

Glossary of CMOS Logic IC Terms Outline of CMOS Logic IC Terms Outline This document describes the terms used in data sheets of CMOS Logic ICs. Table of Contents Outline... 1 Table of Contents... 2 1. Absolute Maximum Ratings... 3 2. Operating

More information