InMate. Design Guide. Socket Mount, Up to 100 A Using Vicor s Maxi, Mini, Micro Series Modules

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Neil Freeman
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1 InMate Design Guide Socket Mount, Up to 100 A Using Vicor s Maxi, Mini, Micro Series Modules

Contents Part Numbers and Guide to InMate Selection 1 PCB Layout Drawings Full Brick (Maxi 2 Half Brick (Mini 4 Quarter Brick (Micro 6 InMate Outline Drawings Full Brick (Maxi 3 Half Brick (Mini 5

2 Contents Part Numbers and Guide to InMate Selection 1 PCB Layout Drawings Full Brick (Maxi 2 Half Brick (Mini 4 Quarter Brick (Micro 6 InMate Outline Drawings Full Brick (Maxi 3 Half Brick (Mini 5 Quarter Brick (Micro 7 Product Specifications and Materials 8 The InMate Socket System InMates are an innovative solution for thru hole socket requirements. Consisting of individual plastic carriers for the input and the output, each contains an array of sockets for either a full, half or quarter brick sized module. The sockets are factory loaded into the carrier, which holds them rigidly in place throughout the assembly and soldering process. The carriers are later removed, leaving the sockets accurately positioned. Insert Solder Standoffs & Exchange Tools 9 Remove Carrier Designed for use with pin compatible Maxi, Mini, Micro Series Vicor bricks, InMates are available for a wide range of PCB sizes and mounting styles. PCB thicknesses can range from 0.055" to ". Sockets also allow for mounting modules either inboard, with a cutout in the PCB for the module to minimize the height above the board, or onboard. InMates are part of the ModuMate interconnect family and, as such, are rated for up to 100 Amps. InMates are available in standard recyclable JEDEC style trays for use with automated pick and place equipment and are compatible with most standard wave or hand solder operations. The sockets are soldered into the board as part of the PCB assembly process. The module can then be plugged into place at anytime later. Vicor s comprehensive line of power solutions includes modular high density DC-DC converters and accessory components, configurable power supplies and custom power supplies. InMates require the use of modules with the ModuMate pin option and are not designed for use with standard tin-lead pins. v i c o r p o w e r. c o m

3 Part Numbers and Guide to InMate Selection ➀ Select board thickness. Nominal, or. ➁ Select mounting style. Inboard requires a PCB cutout for the belly of the module. See dotted lines on PCB drawings page for cut out area. ➂ Identify module type. Full brick (maxi, half brick (mini or quarter brick (micro. ➃ Select the ordering part number. Order packages of 5 input/output sets or in higher quantities order input and output InMates separately. For individual input or output InMates, minimum orders of 35 for maxi or mini and 40 for micro apply. ➄ Verify correct pin style for the module. For predefined parts, S or F = short ModuMate and N or G = long ModuMate ➅ See page 9 for standoff recommendations. ➀ ➁ ➂ ➃ ➄ Full Brick (Maxi Half Brick (Mini Quarter Brick (Micro Board Mounting Pin Input Output 5 Sets Input Output 5 Sets Input Output 5 Sets Thickness Style Style Nominal " Inboard S or F Min/Max 0.055"/0.071" Onboard Nor G Nominal 0.094" Inboard S or F Min/Max 0.084"/0.104" Onboard Nor G Nominal " Min/Max "/0.1375" Onboard Nor G v i c o r p o w e r. c o m 1

4 PCB Layout - Full Brick (Maxi Inboard and Onboard , , , ± ,63±0,08 (#52 DRILL X Ø UNPLATED 7,62 4X R SOCKET , ,33 (" PCB (0.094," PCB EXCHANGE TOOL MOUNTING STANDOFFS ,94 ( ,68 6X Ø 0.130± ,3 ± 0,08 INBOARD MOUNT CUT-OUT AREA , , , ,68 CIRCUIT BOARD ± X Ø 7,19±0,08 SOLDER PAD Ø0.323/Ø8.20 7X Ø 0.200± ,08±0,08 SOLDER PAD Ø0.240/Ø , , ,56 2X 2X , , , ,84 ONBOARD MOUNT INBOARD BOARD MOUNT MOUNT COMPONENT SIDE SHOWN PC BOARD LAYOUT TABLE I PIN INFORMATION NO. SYMBOL FUNCTION PIN DIA PC PR S SC +S+ + I N PRIM CONTROL PARALLEL I N OUT SENSE SEC CONTROL + SENSE + OUT / 4, / 4,57 Ø REF 7,19 NOTES: 1. ALL DIMENSIONS ARE Ø REF 8,2 SOLDER PAD INCH METRIC OR INCH / METRIC 2. ANS/IPC-D-300 SPECIFICATIONS APPLY FOR CLASS "B" BOARDS ,3 0.80± ,3±0, ,7 LOCATING PINS X TYPICAL TOOL CLEARANCE 1.07/27,2 MINIMAL TOOL CLEARANCE 0.77/19, ,4 EXCHANGE TOOL HOOK AREA, 4 PLCS (BOTH ENDS, SEE VIEW EXCHANGE TOOL BASEPLATE PCB , v i c o r p o w e r. c o m

5 InMate and Socket Assembly Outlines Full Brick (Maxi Part Marking 9=Full Size 8=Half Brick 7=Quarter Brick L=Long (Onboard S=Short (Inboard B- "X" -A- "X" -A- MAX , , ± ,56±0, [0,18] A B C MAX , ,3 LARGE SOCKETS ±0.0010/6,668±0,025 SMALL SOCKETS ±0.0010/4,559±0, [0,18] A B C , ,6 -C- -C- -B- MOUNTING STYLE MATERIALS: INMATES: PPS Ryton TM R-7 SOCKETS: BE-CU #25, Au PLATED. DIMENSIONS ARE IN INCH OR INCH / METRIC MM ,4 DIM "X" INCH/MM ,56 DIM INCH/MM 0.059± ,50±0, [0,08] A B C INBOARD 0.136/3, /0,84 ONBOARD 0.173/4, /1,78 UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE INCHES TOLERANCES ARE: , ,4 FRACTIONS DECIMALS ANGLES ±1/64.XX = ±.01 ±1.XXX = ± , ± ,50±0, [0,08] A B C ( MAX ( 4,559 SOCKET DETAIL (DIM B (DIM A ,57 ( ,95 ( MAX ,668 (DIM B (DIM A , ,96 ( ( ( Mounting Board Thk DIM A DIM B Inboard /1, /3, /2,54 Onboard /1, /4, /2,54 Inboard 0.094/2, /4, /3,43 Onboard 0.094/2, /5, /3,43 Onboard / 0.230/5, /4, " SOCKET 0.180" SOCKET v i c o r p o w e r. c o m 3

6 PCB Layout - Half Brick (Mini Inboard and Onboard ( 4X ± ,30 ± 0,08 IN-BOARD MOUNT CUT-OUT INBOARD AREA MOUNT CUT-OUT AREA , , , X R 4X Ø , ± ,63±0,08 (#52 DRILL , ,01 UNPLATED SOCKET CIRCUIT BOARD , ,33 (" PCB (0.094," PCB EXCHANGE TOOL MOUNTING STANDOFFS ± X Ø 7,19±0,08 SOLDER PAD Ø.323/Ø ,78 2X 2X , ,67 7X Ø 0.200± ,08±0,08 SOLDER PAD Ø0.240/Ø , ,56 COMPONENT SIDE SHOWN ONBOARD MOUNT INBOARD MOUNT PC BOARD LAYOUT.283 7, ,2 SOLDER PAD Ø REF Ø REF , ,7 TABLE I Mini FARM FIAM 0.80± ,3±0,8 PIN SYMBOL FUNCTION SYMBOL FUNCTION SYMBOL FUNCTION PIN DIA. NO. (inches / mm 1 + +IN N Neutral + +IN 2 PC Prim. Control EMI GRD EMI N/C No Connection 3 PR Parallel NC No Connection EMI/GRD Ground 4 IN L Line IN 5 OUT Out OUT / 3,81 6 S Sense EN Enable ON/OFF ON/OFF 7 SC Sec. Control ST Strap N/C No Connection 8 +S +Sense BOK BUS OK N/C No Connection 9 + +Out + + OUT + +Out / 3,81 NOTES: 1. ALL DIMENSIONS ARE INCH METRIC OR INCH / METRIC 2. ANS/IPC-D-300 SPECIFICATIONS APPLY FOR CLASS "B" BOARDS LOCATING PINS X TYPICAL TOOL CLEARANCE 1.07/27,2 MINIMAL TOOL CLEARANCE 0.77/19, ,4 EXCHANGE TOOL HOOK AREA, 4 PLCS (BOTH ENDS, SEE VIEW EXCHANGE TOOL BASEPLATE PCB , v i c o r p o w e r. c o m

7 InMate and Socket Assembly Outlines Half Brick (Mini Part Marking 9=Full Size 8=Half Brick 7=Quarter Brick L=Long (On-Board (Onboard S=Short (In-Board (Inboard B- "X" "X" -A- MAX , , ± ,56±0, [0,18] A B C ,6 -B- -A , ,3 LARGE SOCKETS ±0.0010/6,668±0,025 SMALL SOCKETS ±0.0010/4,559±0, [0,18] A B C ,6 -C- -C- MOUNTING STYLE INBOARD ONBOARD ,4 MATERIALS: INMATES: PPS Ryton TM TM R-7 SOCKETS: SOCKETS: BE-CU BE-CU #25, Au #25, PLATED. Au PLATED. DIMENSIONS ARE IN INCH OR INCH / METRIC MM DIM "X" INCH/MM ,56 DIM INCH/MM 0.136/3, /0, /4, /1, ± ,50±0, [0,08] A BC , ,4 UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE INCHES TOLERANCES ARE: FRACTIONS DECIMALS ANGLES ±1/64.XX = ±.01 ±1.XXX = ± , ± ,50±0, [0,08] A B C ( MAX ( ,559 SOCKET DETAIL (DIM B (DIM A ,57 ( ,95 ( MAX. ( ,668 (DIM B (DIM A ,35 ( ,96 Mounting Board Thk DIM A DIM B Inboard /1, /3, /2,54 Onboard /1, /4, /2,54 Inboard 0.094/2, /4, /3,43 Onboard 0.094/2, /5, /3,43 Onboard / 0.230/5, /4, " SOCKET 0.150" SOCKET In-Board On-Board In-Board On-Board On-Board v i c o r p o w e r. c o m 5

8 PCB Layout - Quarter Brick (Micro Inboard and Onboard , , , ,77 (.063" PCB , , ,33 (0.094,.125" PCB 4X ± ,30 ± 0, ,97 4X Ø 0.064± ,63±0,08 (#52 DRILL UNPLATED EXCHANGE TOOL ,94 LOCATING PINS INBOARD MOUNT CUT-OUT AREA SOCKET MOUNTING STANDOFFS , PCB ,04 (2.000 CIRCUIT BOARD Ø REF 5,08 Ø REF 6,1 SOLDER PAD.350 8, , ,02 COMPONENT SIDE SHOWN PC BOARD LAYOUT 2X 2X 1, ,38 7X Ø 0.200± ,08±0,08 SOLDER PAD Ø0.240/Ø6, ,78 ONBOARD MOUNT , ,84 INBOARD MOUNT , , ,4 EXCHANGE TOOL HOOK AREA, 4 PLCS (BOTH ENDS, SEE VIEW 4X BASEPLATE TYPICAL TOOL CLEARANCE 1.07/27,2 MINIMAL TOOL CLEARANCE 0.77/19,5 PCB TABLE I Micro VI-ARM FiltMod IAM ± ,3±0, ,99 15 PIN SYMBOL FUNCTION SYMBOL FUNCTION SYMBOL FUNCTION SYMBOL FUNCTION PIN DIA. NO. (inches / mm 1 + +IN -Out + +IN -Out 2 PC Prim. Control EN Enable N/C No Connection N/C No Connection 3 PR Parallel B OK -Bus OK N/C No Connection ON/OFF ON/OFF 4 IN + +Out -IN + +OUT 5 OUT N Neutral -OUT + +IN 6 SC Sec. Control ST Strap GRD Ground N/C No Connection 7 + +OUT L Line + +OUT IN NOTES: 1. ALL DIMENSIONS ARE INCH METRIC OR INCH / METRIC 2. ANS/IPC-D-300 SPECIFICATIONS APPLY FOR CLASS "B" BOARDS 6 v i c o r p o w e r. c o m

9 InMate and Socket Assembly Outlines Quarter Brick (Micro Part Marking 9=Full Size 8=Half Brick 7=Quarter Brick L=Long (Onboard S=Short (Inboard "X" ,6 -B- -A- "X" ,6 MAX , , , , , , ± ,56±0, ± ,50±0, [0,18] A BC ,6 -B- -A [0,08] AB C MAX , , , , ± ,56± [0.18] A BC , ± ,50±0,03 -C- -C [0.08] A BC MOUNTING STYLE INBOARD ONBOARD MATERIALS: INMATES: PPS Ryton TM R-7 SOCKETS: BE-CU #25, Au PLATED. DIMENSIONS ARE IN INCH OR INCH / METRIC MM DIM "X" INCH/MM DIM INCH/MM 0.136/3, /0, /4, /1,78 ( MAX (DIM A UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE INCHES TOLERANCES ARE: FRACTIONS DECIMALS ANGLES ±1/64.XX = ±.01 ±1.XXX = ±.005 SOCKET DETAIL (DIM B ( , ,57 ( ,95 Mounting Board Thk DIM A DIM B Inboard /1, /3, /2,54 Onboard /1, /4, /2,54 Inboard 0.094/2, /4, /3,43 Onboard 0.094/2, /5, /3,43 Onboard / 0.230/5, /4, " SOCKET v i c o r p o w e r. c o m 7

10 Specifications and Materials Parameter Specification Value Reference Compatibility S = short Au plated Short ModuMate pins Module pin styles See P/N selection (pg1 N = long Au plated Long ModuMate pins Mechanical Contact normal force Number of mating cycles 100 grams EOL min GR-1217-CORE, R min Exception to GR-1217-CORE which specifies 25 mating cycle Module engagement force 32 lbs per connector max GR-1217-CORE, R5-31,32 Module disengagement force 32 lbs per connector max GR-1217-CORE, R5-31,32 Electrical Current rating Low level contact resistance 0.080" dia socket (LLCR Low level contact resistance 0.150" dia socket (LLCR Low level contact resistance 0.180" dia sockets (LLCR Thermal Max socket temperature Temperature rise Environmental Shock and vibration 100 Amps - Maxi 50 Amps - Mini Gold plating standards, and 25 Amps - Micro accepted industry standards (Based on 120 C max socket such as IICIT, EIA, Bellcore guidelines temperature & 30 C max temperature rise of contact 400 µ Ohms max GR-1217-CORE, µ Ohms max GR-1217-CORE, µ Ohms max GR-1217-CORE, C max 30 C max EIA A (2 Max continuous use temperature for gold plating GR-1217-CORE (1 InMate products are tested in random vibration environments to best simulate the broad spectrum of frequencies and amplitudes that may be encountered in typical applications. Actual system resonant frequencies will depend on PCB construction and mounting details. For critical, or unusual, shock and vibration environments, the performance of the system should be independently verified. Material Properties of InMate Components Headers Material: Ryton TM R 7 PPS, 65% glass fiber and mineral filled compound Flammability Thermal stability (short term Thermal stability (long term Solder Cap Material Plating Sockets Material Poly-Phenylene Sulfide UL94 V-0/5VA 260 C (500 F 200 C (392 F 305 stainless steel Clear passivate to repel solder Brush Wellman Alloy #25 C17200 deep draw quality or equiv. thick Plating Woods nickel strike followed by 50 µ in min low stress sulfamate-based electrolytic nickel, followed by 20 µ in min hard goldfollowed by 10µin min soft gold (1 GR-1217-CORE issue 1, November 1995 Generic Requirements for Separable Electrical Connectors Used in Telecommunications Hardware. A module of NEBSFR, FR-2063 (2 ANSI/EIA-364 American National Standards Institute/ Electronic Industries Association (Electronic Components, Assemblies & Materials Association 8 v i c o r p o w e r. c o m

11 InBoard Standoff Recommendations (Slotted Baseplate Modules Only OnBoard All board sizes " or high mount 0.094" and " 0.094" and " PCB 0.348" Standoff Ordering Part Number, Bags of F-F M-F* 0.420" Standoff Ordering Part Number, Bags of F-F M-F* 0.403" Standoff Ordering Part Number, Bags of F-F M-F* * Threaded heat sink View standoff drawings online at vicorpower.com/support/apps-info/standoffs.htm Screws with Thread Lock, 100pc packages Recommended Use Part Length PCB Heat Sink or Number Side Baseplate Side /16 Inboard, /4 Onboard, /16 Onboard, In-Board M-F Baseplate only, No Heat Sink /8 Onboard M-F /2 Standard Heat Sink Kits: Pre-Packaged Standoff and Screw Kits (Enough for one module Full Size Brick Half and Quarter Size Brick PCB Module No Thru hole Threaded No Thru hole Threaded Heat Sink Heat Sink Heat Sink Heat Sink Heat Sink Heat Sink Inboard Onboard Inboard Onboard Onboard Module Exchange Tools Used in facilitating the proper extraction of modules from thru hole or InMate sockets. Removal without using the exchange tool may cause damage to the sockets. Description Part Number Maxi Exchange Tool Mini Exchange Tool Micro Exchange Tool v i c o r p o w e r. c o m 9

12 Vicor Corporation 25 Frontage Road Andover, MA Tel: Fax: Lombard, IL Tel: Fax: Sunnyvale, CA Tel: Fax: Austin, TX Tel: Fax: Vicor France Tel: Fax: Vicor Germany Tel: Fax: Vicor Italy Tel: Fax: Vicor U.K. Tel: Fax: Vicor Japan Co., Ltd. Tel: Fax: Vicor Hong Kong Tel: Fax: vicorpower.com Rev /06

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