カーエレクトロニクスの動向と MEMS Trend in automotive electronics and MEMS

Transcription

1 May 11, 2016 MEF 2016 カーエレクトロニクスの動向と MEMS Trend in automotive electronics and MEMS 株式会社デンソー DENSO CORPORATION 基礎研究所 Research Laboratories 川原伸章 Nobuaki Kawahara

2 Corporate Profile 1 / 24 Established Capital Net sales Consolidated basis December 16, billion yen (US$2.0 billion) 4,524.5 billion yen (US$40.2 billion) Net income Consolidated basis billion yen (US$2.8 billion) Headquarters Employees Consolidated basis 146,714 Consolidated subsidiaries 188 (Japan 61, North America 28, Europe 35, Asia/Oceania 58, Others 6) Affiliates under the equity method 35 (Japan 13, North America 4, Europe 4, Asia/Oceania 12, Others 2) / as of March 31, 2016

3 DENSO s Products Thermal System Powertrain Electronics Air-Conditioning Compressor Air-Intake System Engine Management System (EMS) & Parts - EMS for Gas - EMS for Diesel - HEV control Cooling System Common Rail Postprocessing ECU ASIC EGR Cooler Intercooler Electric System Information & Safety - Thermal System Control - Body Electronics Control Instrument cluster Starter Alternator Navigation Meter/Display Systems for Hybrid vehicle Scanner Robot Non-Automotive A/C Water Heater ETC RADAR

4 Automotive Business Fields Environment Hybrid and electric vehicle components, Products for fuel cell vehicles, gasoline engine management system, diesel engine management system, starter, alternator, radiator, etc. Safety Sensing technologies for driving assist systems, actuator & computer for antilock brake system (ABS) / for electronic stability control (ESC), adaptive front-lighting system (AFS), airbag sensors & electronic control units, periphery monitoring system, instrument cluster, rain sensor for automatic windshield wiper, etc. Comfort & Convenience Car air-conditioning system, air conditioner for buses, air purifier, Car navigation system, electronic toll collection system (ETC), remote security system, remote touch controller, smart key, advanced vehicle operation system (AVOS), etc.

5 Architecture of the Automotive Embedded System Sensor Sensor device Processing circuit I/O ADC ASIC Regulator MPU ASIC:Application Specific Integrated Circuit Transceiver LAN/CAN ECU Smart actuator Switch Sensor Processing circuit Input signal processing circuit Core Memory I/O Timer ECU Output signal processing circuit Power device ECU: Electronic Control Unit Actuator - Motor - Solenoid - Piezoelectric device - Ignition coil - Lamp - Display

6 Automotive Sensors Engine Camshaft Crank Oil press Tank press Gas press A/C Sunload Air Intake Refrigerant Inlet press Atmospheric press Turbo press Brakes Acceleration Yaw Brake press Wheel speed Suspension Tire press Inertia(ESC) Exhaust Exhause press(dpf) EGR press Transmission Oil press(a/t,cvt) Speed Airbag Acceleration (A/B,Satellite, Side impact,role over) Dynamics Slant(Security) Oil(steering) sunload(headlight) 125pcs on Lexus600h(2007) Powertrain Control Pressure Sensor Magnetic Sensor Inertia sensor Optical Sensor inlet atmosphere exhaust oil(e/g, A/T, CVT) turbo tank EGR camshaft crank angle speed battery current inclinometer (neutral) Safety Control oil(brake, ABS, ESC) tire(suspension) speed wheel speed acceleration (A/B) Yaw rate(esc) inertia(esc) camera LIDAR RADAR Body Control refrigerant(a/c) inclinometer (navi, security) sunload (A/C, headlight)

7 Pressure Sensor Principle 歪みによる抵抗値変化を検出 Resistivity change by distortion Strain gage Current Element Front side Back side mm Recent Integrated Sensor Voltage Strain gage Pressure Reference Glass Diaphragm

8 Magnetic Sensor(Rotating/Angle Sensing) Principle Element 磁界による磁気抵抗変化を検出 Resistivity change by magnetic field 1.2mm 180 Current 90 Magnetic Field θ 0 Bridge Center 0.6mm MR element (Ni/Fe) MRE chip A B 2mm IC chip S N Flux wave Recent Integrated Sensor(Hall sensor) 磁界による起電力を検出 Principle:Electromotive force by magnetic field DSP Hall A/D Rotor D/A AMP

9 Inertia Sensor(Accelerometer) Principle 電極間隔の容量変化を検出 Capacitance by gap change capacitance G sensor Gyro 4fF 1aF f:10-15, a:10-18 movable Fixed electrode C fixed electrode Element ceramic package thick gap Fixed electrode Moving electrode 20μm Anchor Moving electrode processing IC Sensor chip Aspect ratio Si micromachining : thickness/gap=5

10 Sensor Miniaturization with MEMS Features Mechanical Accelerometer Mechanical parts Manual assembling is needed External electronic circuit is needed MEMS Accelerometer Sensor and circuit are Integrated on the same silicon substrate High quality and high productivity by semiconductor process Low power consumption and light weight Structure Size mm Volume 600: mm Circuit Sensing Element

11 Progress in Accelerometer High-G sensor for Airbag:Collision-G detection Piezoresitance type Capacitance type GS1<35 pcs> GS2<12 pcs> GS2S<5 pcs> GS3<4 pcs> GS3E<chip> Damping free Downsize Self-Diagnosis First Semiconductor Sensor SMD Stacked 2-Axis Low-G sensor for Chassis Control:ABS, VSC, Clinometer etc. Piezoresistance type Capacitance type SGS1 SGS2 SGS3 SMD Self-Diagnosis Stacked

12 Practical Applications of MEMS Technology Engine Control System Air Bag System Cross sectional view Bipolar IC Piezo-resistor proof mass suspension Pressure sensor Si diaphragm エアバック用 G センサ ABS 40μm Accelerometer Fuel Injection System Piezo-resistor Mass Beam Air flow sensor The compact, high performance and low cost sensors are used in compact vehicle by MEMS technologies Accelerometer

13 Future Direction of Automotive R&D 環境分野 (Environmental Field) New value provided by semiconductor 電動化 (EV/HV) 省燃費 CO 2 (Low Emission) 高効率なパワーエレクトロニクス High Efficiency Power Electronics 車載通信 In-vehicle Communication Inverter, Battery Engine Control 環境負荷ゼロ Environmental Load Free 安全分野 (Safety Field) 自動運転 (Autonomous) 運転支援 (Assist) 限界を突き破る革新技術 Break through toward limits 社外連携で競争力を強化 Open Innovation RF imaging CORE (Device, Circuit, Package) Evolvable R&D Network Biology Integrated Control Active Safety 交通事故ゼロ Traffic Accident Free 高精度センサ High Precise Sensing 革新的な HMI Innovative HMI

14 Energy Loss in Conventional Engine Energy Flow Fuel Energy 100% 25% Exhaust Losses 25% 10% Thermal Storage/Reuse, Thermoelectric Conversion, Regeneration, Energy Management 10% 10% 20% Drivetrain Loss Friction & Parasitic Loss Rolling Resist Cooling Loss(radiator) Direction for Improvement of Energy Efficiency Function Thermal Thermal Reserve Reuse Thermal Electric Thermoelctric Generator (water pump, alternator) Move Energy used to move the vehicle ~20% Mechanical Electric Generators Management Component System Thermal Energy Storage EGR Regenerative Braking

15 Power Electronics Inverter DCDC converter Battery monitoring Air-conditioning Battery Pack HV-radiator ICE T / M ENG ECU HV ECU TCU Cooling fan Mainbattery charger (PHV) Heat-pump Sub-battery (12V) Compressor Generator Current sensor High-voltage relay

16 HMI for Driving Support System (Start of production sequentially from 2015) ROAD Road Sign Expansion & Projection Optical System VISIBILITY / Obstacle Indication Speed, Warning Sensing & monitoring technology Display technology on Ergonomics, System LSI SAFETY INFORMATION 2012/12/13 NIKKEI Closing Warning Lane Warning Navigation 自動運転の時代に向けた わかりやすい HMI を提供 Acceptable HMI toward Automated Driving era

17 Head-Up Display(HUD) Principle 共通の櫛歯電極に X,Y の共振周波数を印加 Driven comb electrode by resonant frequency of X,Y Application:HUD Windshield Left eye Right eye Comb Electrode Y Mirror X Outer Gimbal Inner Gimbal Comb Electrode Unified image R L Virtual image X:40.7kHz resonance Y:1.2kHz resonance Projection sample Projector Laser MEMS mirror

18 Autonomous Driving in 2020(Under Development) Lv.3 AD in Highway 80km/h~ Advanced Driver Support in City Road 5~80km/h 自動運転車にふさわしいコクピット すべてのアプリに最適なセンサ配置 Automated Parking ~15km/h Low Speed Autonomous Driving in Local Road ~40km/h Sensor Specification are different in Applications

19 Components for Autonomous Driving Telecommunication Sonner Camera Digital Communication Module(DCM) ETC Ultrasonic sensor Surrounding view camera Infrastructure cooperative systems Front view camera Radar laser radar (LIDAR*) Gen-2 Gen-3 Pre-crash Safety(PCS), Emergency brake Adaptive Cruse Control (ACC) For ACC For AEB MEMS LIDAR Under development *LIDAR: Laser Imaging Detection And Ranging

20 3-Dimensional(Depth imaging)sensor Time of Flight Detector Emitter(spread laser) Reference image (Camera picture) Depth image (TOF) blue:far red:near Photodiodes luminance image (Reflectivity) 3D IC with TSV 光の往復時間計測に必要な時間分解能 (GHz) と全画素同時性の実現 Many GHz signals with almost the same delay realized by 3D IC 受光素子アレイ メモリ プロセッサなどの異種デバイスを集積 Heterogeneous integration with photodiodes, memories, processor etc. under development

21 Summary 今後自動車は 環境 安全 快適のベクトルに沿って進化する In future, automobile will have been evolving along the vector of Ecology, Comfort and Safety. 自動運転に関わる技術開発は カーエレクトロニクスを大きく新展させる Technologies related Automated Driving changes many Automotive Electronics. その革新の鍵は 半導体技術 MEMS 技術 実装技術が握っている The Semiconductor, Especially MEMS and Packaging technologies hold the key to innovate. ご清聴ありがとうございました Thank you for your kind attention.