2018 Rev1.0 Aug.2018 Prepared by Auto SBU Presented by Stanley Lin, AVP. TSC (5425) Roadshow

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2 2018 Rev1.0 Aug.2018 Prepared by Auto SBU Presented by Stanley Lin, AVP TSC (5425) Roadshow

3 Company Key Information Update 2018 Rev1.0 Aug.2018 Prepared by Auto SBU Presented by Stanley Lin, AVP

4 TSC PRODUCTS OVERVIEW PRODUCT FAMILY ACTIVE PNS AECQ PNS AECQ/ACTIVE PNS TVS % Power Zener % Schottky % Bridge % Standard % ESD capability rectifier % FRD % HER % Superfast % Ultrafast % TOTAL %

FOOTPRINT OF MANUFACTURING SITES TIANJIN, CHINA / FRONTEND (3 /4 WAFER) LI-JE, TW /

Capacity : 150,000pcs wafers/month (Q3-FY18) Yangxin, China / Backend (Assembly)

Q1E/FY19) Capacity : 80,000pcs wafers/month (Q3-FY18) I-lan, Taiwan / Backend

: 80,000,000 pcs /month Axial : 240,000,000 pcs /month Power Pack : 20,000,000 pcs /

5 FOOTPRINT OF MANUFACTURING SITES TIANJIN, CHINA / FRONTEND (3 /4 WAFER) LI-JE, TW / FRONTEND (4 WAFER; 6 IS ON THE WAY) Technology : GPP, Photoglass, SIPOS passivation Capacity : 150,000pcs wafers/month (Q3-FY18) Yangxin, China / Backend (Assembly) Technology : GPP, Photoglass, SIPOS/Si3N4 passivation, Planar (Under development, Q1E/FY19) Capacity : 80,000pcs wafers/month (Q3-FY18) I-lan, Taiwan / Backend (Assembly) SMD/Bridge/Power Pack/Axial Capacity : SMD : 350,000,000 pcs /month Bridge : 80,000,000 pcs /month Axial : 240,000,000 pcs /month Power Pack : 20,000,000 pcs / month SMD/Power Pack/ PDFN (MOSFET) Capacity : SMD : 20,000,000 pcs /month Power Pack : 5,000,000 pcs / month

6 STANDARD SMD PROCESS VS MATRIX LINE BEFORE (STANDARD SMD) NOW (MATRIX SMD)

7 GLOBAL TOP 100 AUTOMOTIVE TIER 1 PROGRAM

8 GLOBAL TOP 100 AUTOMOTIVE TIER 1 PROGRAM Body control Safety system Infotainment Chassis system Engine Transmission Lighting ADAS Air-CON Window lift Body control Mirror ECU Ignition Fuel Injection Air supply AEC TPMS OBD Air Bag EPAS Audio Chassis control Navigation ABS IVI Transmission

9 SALES TREND & PROFITABILITY ($MNTD) Revenue ($MNTD) Gross Profit & Margin ($MNTD) 10,000 8,000 6,000 4,000 2, ,702 8,994 7,640 7,745 FY2014 FY2015 FY2016 FY2017 4,000 3,000 2,000 1, ,157 3,310 2,679 2,453 36% 37% 35% 32% FY2014 FY2015 FY2016 FY % 45% 40% 35% 30% 25% 20% Operation Profit & Margin ($MNTD) Net Profit & Margin ($MNTD) 2,000 1,000 1,304 1,449 1,506 1,618 40% 30% 20% 2,000 1, ,131 1,119 1,261 40% 30% 20% 0 17% 19% 17% 18% FY2014 FY2015 FY2016 FY % 0% 0 12% 15% 13% 14% FY2014 FY2015 FY2016 FY % 0%

10 EPS ($NTD) & DIVIDEND PAYOUT EPS Dividend Dividend Payout Ratio 79.7% 79.6% 81.0% 80.0% 79.0% % % % 74.9% % 76.0% 75.0% 74.0% % % 0.0 FY2013 FY2014 FY2015 FY2016 FY %

11 The RISE of Intelligent & Alternative Energy Vehicle 2018 Rev1.0 Aug.2018 Prepared by Auto SBU Presented by Stanley Lin, AVP

12 SHIPPMENT TRENDS IN AUTOMOTIVE MARKET FY13 FY14 FY15 FY16 FY17 FY18(f) FY13 FY14 FY15 FY16 FY17 FY18(f) GLOBAL AUTOMOTIVE MAKRET SCALE 105, ,000 95,000 90,000 85,000 80,000 2,500 2,000 1,500 1, BEV PHEV 75,000 0 GLOBLA AUTOMOTIVE MAJOR MAKERS Others 29% Others 28% China 62% Suzuki 3% PSA 4% FCA 5% Honda 6% Ford 6% WW Car Shipment 96,800K pcs FY17 GM 7% Hyundai- Kia 8% Renault- Nissan- Mistubishi Renault- Nissan 10% VW 11% Toyota 11% Toyota 4% GM 5% SAIC 5% VW 6% BMW 8% WW EV Shipment 1,850K pcs FY17 Tesla 8% Geely 8% BAIC 9% 10% BYD 9% GER 5% WW EV Shipment TOP 5 Regions FY17 JPN 6% NOR 6% USA 21%

13 GLOBAL GREEN CAR GROWTH TREND BY POWER TYPE 20 Unit : M units 48V Mild hybrid FHEV PHEV EV FHEV : 42.4% 48V : 34.4% % EV HEV Motor Engine Motor 10 Inverter Generator Inverter Battery Battery

14 CAR MAKERS AMBITION IN EV

15 TOP TRENDS IN AUTOMOTIVE MARKET New FINDINGS in the market Total Car Q ty in China area est. to increase 50% In FY2030, 33% driving mileage comes from sharing In FY2030, 40% driving mileage comes from Self-driving In FY2030, 55% new cars will be EV (Electrical vehicle) Top 5 TRENDS in the market Electrified. More ECUs, new add+ EV charging systems Autonomous. New add+ ECUs for ADAS Shared. Service on demand Connected. New add+ communication NODES Yearly updated. In past, ave 5-8 yrs, with 1-4, frequency Top 3 TRENDS in the tier 1 and component market Shared platform, and keep implement new technology (More M&A) Software development capability becomes more and more important China tier 1 and component providers drive M&A activity bcz of local huge market

16 TOP KEY DRIVERS IN ELECTRICAL VEHICLE MARKET STOP SELLING ANY FUEL CARS Diesel Car Rental Car w/ Diesel Engine SUV w/diesel Engine FUNDAMENTAL INFRASTRUCTURE BATTERY TECHNOLOGY China Outdoor EV Charging Station Qty TECHNOLOGY DRIVERS EU BenZ TESLA Shanghai Site Japan 7 alliance EU BMW Taiwan ARTC Platform

17 CHINA DOMINATES ALL CHARGING OUTLET TYPES

18 Automotive Business Development 2018 Rev Prepared by Auto SBU Presented by Stanley Lin, AVP

19 2017 TOTAL SEMICONDUCTOR MARKET DISCRETE SEMICONDUCTOR MARKET BY PRODUCT FAMILY (Discrete $21.5B) Unit : M USD PRODUCT CATEGORY 2016 WW 2017 WW GROWTH Rectifier+Diode (W/o Small Signal Diode) 4,657 5, % IGBT 3,421 4, % Thyristor % Small Signal 2,494 2, % Power MOSFET 6,309 6, % Power Transistor 1,773 1, % Other discrete % SEMICONDUCTOR MARKET BY FAMILY DISCRETE SEMICON. MARKET BY FAMILY IC 83% Opto 9% Discrete 5% Rectifier 26% IGBT 19% Diode 13% Sensors 3% MOSFET 31% Pwr Transistor 8% Thyristor 3%

AUTOMOTIVE ELECTRONICS COST STRUCTURE IN A CAR AVERAGE SEMI COST IN A CAR Others 22% Sensors 13% Engine Car ~$USD 320 Power 42% Others 16% Sensors 4% MCUs 4% Hybrid Car ~$USD 690 Power 76% Others 27%

20 AUTOMOTIVE ELECTRONICS COST STRUCTURE IN A CAR AVERAGE SEMI COST IN A CAR Others 22% Sensors 13% Engine Car ~$USD 320 Power 42% Others 16% Sensors 4% MCUs 4% Hybrid Car ~$USD 690 Power 76% Others 27% MCUs 11% Sensors 7% E-Car ~$USD 700 Power 55% MCUs 23% AVERAGE COST IN A E-CAR Driving System 20% 50% from IGBT V for Car Ave. $300 per HEV/PHEV Ave. $540 per BEV Battery 48% Others 3% Ass. 13% Body and Chassie 16% Ave. $1000 per E-BUS EV needs 100~140pcs IGBTs HST needs 50-80pcs IGBTs per Carriage Ex. Tesla Model X : 132 IGBTs (Front : 36/Back : 96)

21 Continuous Innovation in Wafer & Package to Support Automotive Trends 2018 Rev Prepared by Auto SBU Presented by Stanley Lin, AVP

22 CONTINUOUS INNOVATION IN WAFER & PACKAGE Miniaturization Electrification Efficiency Transient Capability

23 CONTINUOUS INNOVATION IN WAFER & PACKAGE Miniaturization Electrification Efficiency Transient Capability

PACKAGE TRENDS SOD-123HE 3.70 x 1.80 x 0.80mm SMA 4.33x2.56x2.30mm SMB 4.33x3.63x2.30mm SMC 6.55x5.90x2.30mm D-PAK 9.90x 6.57x2.

95mm SOD-128 3.80 x 2.50 x 1.00mm ThinSMA 4.25 x 2.60 x 0.95mm SOD-128 3.80 x 2.50 x 1.00mm TO-277A(SMPC) 6.50 x 4.60 x 1.

10mm 48% in space 80% in height 100% of the current rating 45% in space 50% in height 60% of the current rating 45% in space 35%

24 PACKAGE TRENDS SOD-123HE 3.70 x 1.80 x 0.80mm SMA 4.33x2.56x2.30mm SMB 4.33x3.63x2.30mm SMC 6.55x5.90x2.30mm D-PAK 9.90x 6.57x2.29mm MicroSMA 2.50 x 1.30 x 0.65mm SOD-123W 3.70 x 1.80 x 0.96mm SOD-123HE 3.70 x 1.80 x 0.80mm ThinSMA 4.25 x 2.60 x 0.95mm SOD x 2.50 x 1.00mm ThinSMA 4.25 x 2.60 x 0.95mm SOD x 2.50 x 1.00mm TO-277A(SMPC) 6.50 x 4.60 x 1.10mm TO-277A(SMPC) 6.50 x 4.60 x 1.10mm 48% in space 80% in height 100% of the current rating 45% in space 50% in height 60% of the current rating 45% in space 35% in height 60% of the current rating 69% in space 50% in height 120% of the current rating 29% in space 40% in height 100% of the current rating 64% in space 40% in height 100% of the current rating 45% in space 50% in height 60% of the current rating

25 CONTINUOUS INNOVATION IN WAFER & PACKAGE Miniaturization Electrification Efficiency Transient Capability

26 ELECTRIFICATION OF A CAR Increased Elec. function ADAS (Vision & Safety) Replacement of Relays Electrification of powertrain

CONTINUOUS INNOVATION IN WAFER & PACKAGE

of Relays Electrification of powertrain ECU ++

transmission ECU ++ Vision & Safety Replace

Hybrid 48V BMS STD rectifier up to 1000V

Load Dump Protection (Load Dump TVS) PwrMOS

under development PwrMOS (*) Space saving

27 CONTINUOUS INNOVATION IN WAFER & PACKAGE Increased Electrical function ADAS Replacement of Relays Electrification of powertrain ECU ++ ABS, Power steering, Fuel injection, Automatic transmission ECU ++ Vision & Safety Replace conventional electrical or mechanical relays Hybrid 48V BMS STD rectifier up to 1000V Avalanche ruggedness (BYG, Avalanche Rectifier) High current density package (SOD-128, SMPC) ESD protection (ESD rectifier) Load Dump Protection (Load Dump TVS) PwrMOS with low RDS(ON) and high ID (*) Remarks : (*) under development PwrMOS (*) Space saving Efficient Low Noise SKY up to 150V Trench SKY (*) FRD up to 200V PwrMOS 40/80/100V (*)

FY2010 FY2020 FY2030 Adaptive Cruise Control (ACC)

28 ELECTRIFICATION OF A CAR Increased Elec. function ADAS (Vision & Safety) Radar Lidar LDW EPS ACC LKA DSRC 3/4G AISL C&D uc Min ECU+ 2 Hi-res Radar Lidar Level 2 Level 3 Level 4 GPU V2X Max ECU+ 10 Hi-res Maps FY2010 FY2020 FY2030 Adaptive Cruise Control (ACC) Automatic Emergency Braking (AEB) Lane Departure Warning (LDW) Lane Keep Assist (LKA)

29 AVERAGE ECUs PER CAR 160 Small Medium Large Executive Luxury Special FY2016 FY2017 FY2018 FY2019 FY2020

30 ON/OFF BOARD CHARGING On Board Charger AC Charging AC DC HV BATTERY PACK Motor HSG ISG AC PCU Fast Charging Module AC Charging 7.2KW (32A, 1-phase) 22KW (3-phases) Charging time, 7.2KW, 3-4hrs DC Charging >100A 80%, 30-60mins DC Inverter (Motor) Inverter (HSG) Boost Converter DC-DC Converter Inverter DC(Fast) Charging

31 CONTINUOUS INNOVATION IN WAFER & PACKAGE Miniaturization Electrification Efficiency Transient Capability

32 ON/OFF BOARD CHARGING On Board Charger AC Charging AC DC HV BATTERY PACK Motor HSG ISG AC PCU Fast Charging Module AC Charging 7.2KW (32A, 1-phase) 22KW (3-phases) Charging time, 7.2KW, 3-4hrs DC Charging >100A 80%, 30-60mins DC Inverter (Motor) Inverter (HSG) Boost Converter DC-DC Converter Inverter DC(Fast) Charging

TOPOLOGIES FOR EV OBC (On Board Charger) AC/DC + PFC (Interleaved PFC) DC-DC (LLC Full Bridge) (1) (4) (5) (5) (6) (6) Singe phase + Full Bridge LLC (OBC) (3) (3) (4) (4) (2) (2) (5) (5) (6) (6) (2)

reduce conduction loss), 600/1200V Package concern : Common package is TS6P Bridge rectifier x 1, TO-247 x 2.

SMAJ & SMBJ series (Package Trend : SMB to SOD-128; SMA to SOD-123W/HE) Super junction MOS ( Infenion/Toshiba/STM are major suppliers) 650V/41mohm & 65mohm TSC Solution : TSM60NB041PW (No AECQ yet)

33 TOPOLOGIES FOR EV OBC (On Board Charger) AC/DC + PFC (Interleaved PFC) DC-DC (LLC Full Bridge) (1) (4) (5) (5) (6) (6) Singe phase + Full Bridge LLC (OBC) (3) (3) (4) (4) (2) (2) (5) (5) (6) (6) (2) (2) (2) (2) (1) Bridge (2) TVS (3) PFC MOSFET (4) PFC Diode (5) LLC MOSFET (6) Output Diode Higher efficiency concern may choose Bridgeless topology, but higher cost Design concern : Lower VF (To reduce conduction loss), 600/1200V Package concern : Common package is TS6P Bridge rectifier x 1, TO-247 x 2. Later, SMD will be preferred PKG TSC Solution : TS15P-50P series, and new PLDS3060H-80H (D2PAK-D, under development stage) 400W SMA Bi-directional TVS & 600W SMB Bi-directional TVS TSC Solution : SMAJ & SMBJ series (Package Trend : SMB to SOD-128; SMA to SOD-123W/HE) Super junction MOS ( Infenion/Toshiba/STM are major suppliers) 650V/41mohm & 65mohm TSC Solution : TSM60NB041PW (No AECQ yet) Ultrafast, 30A/ V/DO-247, fast trr + Soft recovery (Switch loss & Noise), Lower VF (Conduction loss) SiC SBD, 10A/650V/TO-220, also Zero switch loss (Cree, Infenion) TSC Solution : SMAJ & SMBJ series (Package Trend : SMB to SOD-128; SMA to SOD-123W/HE) Super junction MOS ( Infenion/Toshiba/STM are major suppliers) 650V/41mohm & 65mohm + Built-in FRD (trr ~ 200ns) TSC Solution : Under development stage Ultrafast, 20-30A/ V/DO-247, fast trr + Soft recovery (Switch loss & Noise), Lower VF (Conduction loss) SMD will be preferred package (Suitable for SMT process) TSC Solution : UG20J/UG30J (D2PAK-D, under development stage)

34 CHINA OFF BOARD CHARGING DESIGN SPEC V BYD E5 600 Danza V V Unstable Area 110V 300V 250V BYD E6 Kandi K17A

INPUT FROM MKT FOR FUTURE POWER SEMICON.

Device Semiconductor Key characteristic VBR (V)

1200 650 900 1200 650 900 1200 650 900 1200 200

100 100 300 20 100 5 20 100 500 10 50 Component

30ns OBCM DC-DC Inverter IGBT 600V 40/60A

SBD 600V 10A 35ns 30ns SJMOS 650V, 48mohm <

35 INPUT FROM MKT FOR FUTURE POWER SEMICON. Inverter HV DC-DC Charging 12V/48V DC-DC Power Device Semiconductor Key characteristic VBR (V) IModule (A) Fswitch(KHz) Die size(mm2) Component Current SPEC Next SPEC SiC SBD 600V 15/30A 35ns 30ns OBCM DC-DC Inverter IGBT 600V 40/60A 650V/60A SJMOS 650V, 40A, 41mohm < 40mohm SiC SBD 600V 10A 35ns 30ns SJMOS 650V, 48mohm < 40mohm IGBT Module 660A 950A MVMOS -16A, -60V, 65mohm < 40mohm

600 Amp, 3 khz SYSTEM COST REDUCTION OF 20% USING 1200V SiC Increased frequency reduces size and weight of

36 SiC FOR XEV APPLICATIONS Losses (Watts) ROADMAP 300 Amp SiC More Capable than 600 Amp Si IGBTs! Diode Switching Conduction Data from Cree 0 SiC MOSFET 300 Amp, 10 khz Si IGBT 600 Amp, 3 khz SYSTEM COST REDUCTION OF 20% USING 1200V SiC Increased frequency reduces size and weight of magnetics Lower losses reduce system cooling requirements Amperage rating for SiC less than half required for Si IGBTs

37 CONTINUOUS INNOVATION IN WAFER & PACKAGE Miniaturization Electrification Efficiency Transient Capability

38 PROTECTION SOLUTIONS FOR AUTOMOTIVE USB2.0 HDMI SIM COMM SD Digi I/O ON/OFF Keypad GPIO TVS Protection ISO / ISO ESD Protection IEC / ISO10605 Vbat Power V Boost V Buck V Digital RF 3G Module Wifi Bluetooth GPS Audio ESD Protection IEC / ISO10605 TVS/ESD Protection ISO / ISO / IEC / ISO10605 CAN LIN MCU/MPU Output Driver Lighting Body & Chassis Window fit Electronics I/O Display LCD LED Data Port I/O Port ESD Protection IEC ISO10605 TVS/ESD Protection ISO7637-2/ ISO IEC / ISO10605

39 Threats Of Automotive Electronics ESD(Transient wave) Vehicle test - Internal points Vehicle test - external points Electrostatic Discharge Path - Inside Electrostatic Discharge Path - Outside

40 THREATS OF AUTO. ELECTRONICS ESD ESD Standard Object Standard Evaluation Cause Automotive Customer Electronic equipment Vehicle Components Vehicle Components IEC Malfunction Human body VW(TL82466) ISO SAE J Malfunction Break Malfunction Break Human body Human body GM(GVM3097), VW(TL82466), Ford(ES-XW7T), Citoren(B ), BMW(GS95002) Vehicle test ISO vs. IEC Standard ISO Module Test 150pF/330Ω 330pF/330Ω 150pF/2000Ω 330pF/2000Ω Sensitivity Level Test 150pF/330Ω 330pF/330Ω 150pF/2000Ω 330pF/2000 IEC pF/330Ω 150pF/330Ω

41 THREATS OF AUTO. ELECTRONICS : TRANSIENT PULSE Vehicle test - Electrical disturbance by conduction and coupling ( Standard ISO 7637/ISO 16750) Alternator Wiper Pulse Description Conventional Airbag 1 Connected directly to an inductive load in parallel Central Load Dump ABS EEC 2a Transient interruption of a device connected in parallel, due to hardness inductance ISG (BSG/IMG) Motor ESP 2b Transients from DC motor acting as a generator when ignition is switched off 3a/3b Switching transients due to distributed inductance and capacitance of hardness 4 Voltage dip due to starter- Motor current during cranking (Excluding spikes) 5 Load Dump

42 SUMMARY TSC is MOVING forward to AUTOMOTIVE Penetrating into Automotive since FY % rectifier products is Automotive grade, TVS (Protection) is 100% Engaged with 1 st tier WW Automotive OEM manufacturing companies Complete product portfolio to fulfill Automotive application (ECU, Powertrain, On/Off board charging, Protection solution) DO-218 Load Dump TVS is a START products to help TSC penetrate into EU/US/JPN/CN 1 st tier automotive ECU makers Technology migration GPP to Planar

43 THANK YOU Taiwan Semiconductor Co., Ltd. Headquarters Address: 11F. No. 25 Sec. 3, Beishin Rd, Shindian District, New Taipei City, Taiwan R.O.C. Telephone: Website:

Investment Relationship Roadshow Auto Market trend & Performance update Rev1.0 Aug.2018 Prepared by Auto SBU Presented by Stanley Lin, AVP

Investment Relationship Roadshow Auto Market trend & Performance update 2018 Rev1.0 Aug.2018 Prepared by Auto SBU Presented by Stanley Lin, AVP Company Key Information Update 2018 Rev1.0 Aug.2018 Prepared