Intel G35 Express Chipset

Transcription

1 Intel G35 Express hipset Thermal and Mechanical esign Guidelines For the Intel 82G35 Graphics and Memory ontroller Hub (GMH) ugust 2007 ocument Number:

2 INFORMTION IN THIS OUMENT IS PROVIE IN ONNETION WITH INTEL PROUTS. NO LIENSE, EXPRESS OR IMPLIE, Y ESTOPPEL OR OTHERWISE, TO NY INTELLETUL PROPERTY RIGHTS IS GRNTE Y THIS OUMENT. EXEPT S PROVIE IN INTEL S TERMS N ONITIONS OF SLE FOR SUH PROUTS, INTEL SSUMES NO LIILITY WHTSOEVER, N INTEL ISLIMS NY EXPRESS OR IMPLIE WRRNTY, RELTING TO SLE N/OR USE OF INTEL PROUTS INLUING LIILITY OR WRRNTIES RELTING TO FITNESS FOR PRTIULR PURPOSE, MERHNTILITY, OR INFRINGEMENT OF NY PTENT, OPYRIGHT OR OTHER INTELLETUL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. esigners must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel 82G35 Graphics and Memory ontroller Hub (GMH) may contain design defects or errors known as errata which may cause the product to deviate from published specifications. urrent characterized errata are available on request. ontact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel, Pentium, and the Intel logo are trademarks or registered trademarks of Intel orporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. opyright 2007, Intel orporation. ll rights reserved. 2 Thermal and Mechanical esign Guidelines

3 ontents 1 Introduction Terminology Reference ocuments Product Specifications Package escription Non-Grid rray Package all Placement Package Loading Specifications Thermal Specifications Thermal esign Power (TP) efinition Methodology Specifications T ONTROL Limit Non-ritical to Function Solder alls Thermal Metrology ase Temperature Measurements Thermocouple ttach Methodology irflow haracterization Reference Thermal Solution Operating Environment TX Form Factor Operating Environment alanced Technology Extended (TX) Form Factor Operating Environment Reference esign Mechanical Envelope Thermal Solution ssembly Environmental Reliability Requirements...25 ppendix Enabled Suppliers...27 ppendix Mechanical rawings...29 Thermal and Mechanical esign Guidelines 3

4 Figures Figure 1. GMH Non-Grid rray...12 Figure 2. Nominal Package Height...13 Figure 3. Non-ritical to Function Solder alls...15 Figure 4. 0 ngle ttach Methodology (top view, not to scale)...18 Figure 5. 0 ngle ttach Heatsink Modifications (generic heatsink side and bottom view shown, not to scale)...18 Figure. irflow andtemperature Measurement Locations...19 Figure 7. Processor Heatsink Orientation to Provide irflow to GMH Heatsink on an TX Platform...22 Figure 8. Processor Heatsink Orientation to Provide irflow to GMH Heatsink on a alanced Technology Extended (TX) Platform...23 Figure 9. TX GMH Heatsink - Installed on oard...24 Figure 10. alanced Technology Extended (TX) GMH Heatsink - Installed on oard25 Figure 11. GMH Package rawing...30 Figure 12. GMH Keep-Out Restrictions for TX Platforms...31 Figure 13. GMH Keep-Out Restrictions for alanced Technology Extended (TX) Platforms...32 Figure 14. GMH Reference Heatsink for TX Platforms Sheet Figure 15. GMH Reference Heatsink for TX Platforms Sheet Figure 1. GMH Heatsink for TX Platforms nchor...35 Figure 17. GMH Reference Heatsink for TX Platforms Ramp Retainer Sheet Figure 18. GMH Reference Heatsink for TX Platforms Ramp Retainer Sheet Figure 19. GMH Reference Heatsink for TX Platforms Wire Preload lip...38 Figure 20. GMH Reference Heatsink for alanced Technology Extended (TX) Platforms...39 Figure 21. GMH Reference Heatsink for alanced Technology Extended (TX) Platforms lip...40 Tables Table 1. Package Loading Specifications...12 Table 2. Thermal Specifications...14 Table 3. TX Reference Thermal Solution Environmental Reliability Requirements (oard Level)...25 Table 4. alanced Technology Extended (TX) Reference Thermal Solution Environmental Reliability Requirements (System Level)...2 Table 5. TX Intel Reference Heatsink Enabled Suppliers for Intel G35 Express hipset...27 Table. alanced Technology Extended (TX) Intel Reference Heatsink Enabled Suppliers for Intel G35 Express hipset...27 Table 7. Supplier ontact Information Thermal and Mechanical esign Guidelines

5 Revision History Revision Number escription ate -001 Initial release. ugust 2007 Thermal and Mechanical esign Guidelines 5

6 Thermal and Mechanical esign Guidelines

7 Introduction 1 Introduction s the complexity of computer systems increases, so do power dissipation requirements. The additional power of next generation systems must be properly dissipated. Heat can be dissipated using improved system cooling, selective use of ducting, and/or passive heatsinks. The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within functional limits. The functional temperature limit is the range within which the electrical circuits can be expected to meet specified performance requirements. Operation outside the functional limit can degrade system performance, cause logic errors, or cause component and/or system damage. Temperatures exceeding the maximum operating limits may result in irreversible changes in the operating characteristics of the component. This document is for the following device: Intel G35 Express hipset GMH (82G35 GMH) This document presents the conditions and requirements to properly design a cooling solution for systems that implement the GMH. Properly designed solutions provide adequate cooling to maintain the GMH case temperature at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. y maintaining the GMH case temperature at or below those recommended in this document, a system designer can ensure the proper functionality, performance, and reliability of this component. Note: Unless otherwise specified the information in this document applies to all configurations of the Intel G35 Express hipset. The Intel G35 Express hipset will be available with integrated graphics and associated SVO and analog display ports. The Intel G35 Express hipset is a Graphics Memory ontroller Hub (GMH) targeted for use with the Intel ore 2 uo processor family and Intel ore 2 Quad processor family in the LG775 Land Grid rray Package and the Intel IH8 in desktop platforms. Note: In this document the use of the term chipset refers to the combination of the GMH and the Intel IH8. For the IH8 thermal details, refer to the Intel I/O ontroller Hub 8 (IH8) Thermal esign Guidelines. Thermal and Mechanical esign Guidelines 7

8 Introduction 1.1 Terminology Term F-G Intel IH8 GMH T T escription Flip hip all Grid rray. package type defined by a plastic substrate where a die is mounted using an underfill 4 (ontrolled ollapse hip onnection) attach style. The primary electrical interface is an array of solder balls attached to the substrate opposite the die. Note that the device arrives at the customer with solder balls attached. Intel I/O ontroller Hub 8. The chipset component that contains the primary PI interface, LP interface, US, T, and/or other legacy functions. Graphic Memory ontroller Hub. The chipset component that contains the processor and memory interface and integrated graphics core. The local ambient air temperature at the component of interest. The ambient temperature should be measured just upstream of airflow for a passive heatsink or at the fan inlet for an active heatsink. The case temperature of the GMH component. The measurement is made at the geometric center of the die. T -MX The maximum value of T. T -MIN The minimum valued of T. TP TIM Thermal esign Power is specified as the maximum sustainable power to be dissipated by the GMH. This is based on extrapolations in both hardware and software technology. Thermal solutions should be designed to TP. Thermal Interface Material: thermally conductive material installed between two surfaces to improve heat transfer and reduce interface contact resistance. Ψ ase-to-ambient thermal solution characterization parameter (Psi). measure of thermal solution performance using total package power. efined as (T T ) / Total Package Power. Heat source size should always be specified for Ψ measurements. 8 Thermal and Mechanical esign Guidelines

9 Introduction 1.2 Reference ocuments ocument Intel G35 Express hipset atasheet Intel I/O ontroller Hub 8 (IH8) Family Thermal esign Guidelines Intel ore 2 uo Processor and Intel Pentium ual ore Processor Thermal and Mechanical esign Guidelines Intel ore 2 Extreme Quad-ore Processor and Intel ore 2 Quad Processor Thermal and Mechanical esign Guidelines alanced Technology Extended (TX) Interface Specification Various System Thermal esign Suggestions Various hassis Thermal and Mechanical esign Suggestions Location design/chipsets/datas hts/31707.htm design/chipsets/desig nex/ htm /design/processor/spe cupdt/ htm /design/processor/des ignex/ htm rs.org rs.org rs.org Thermal and Mechanical esign Guidelines 9

10 Introduction 10 Thermal and Mechanical esign Guidelines

11 Product Specifications 2 Product Specifications 2.1 Package escription The GMH is available in a 34 mm [1.34 in] x 34 mm [1.34 in] Flip hip all Grid rray (F-G) package with 122 solder balls. The die size is currently mm [0.4in] x mm [0.414in] and is subject to change. mechanical drawing of the package is shown in Figure Non-Grid rray Package all Placement The GMH package uses a balls anywhere concept. Minimum ball pitch is 0.8 mm [0.031 in], but ball ordering does not follow a 0.8-mm grid. oard designers should ensure correct ball placement when designing for the non-grid array pattern. For exact ball locations relative to the package, contact your Intel Field Sales Representative. Thermal and Mechanical esign Guidelines 11

12 Product Specifications Figure 1. GMH Non-Grid rray 34 x 34mm Substrate [1.34 x 1.34 in] Y W V U T R P N M L K J H G F E Y W V U R T P N M L K J H G F E FISF Y Y9 Y11 Y13 Y15 Y17 Y19 Y21 Y23 Y25 Y27 Y29 Y31 Y33 Y35 Y38 Y2 Y3 Y4 Y7 Y12 Y20 Y24 Y32 Y37 Y40 Y41 Y42 W1 W2 W5 W7 W9 W11 W12 W13 W15 W17 W18 W20 W21 W23 W24 W2 W27 W29 W31 W32 W33 W35 W37 W39 W43 W3 W41 W42 V V38 V2 V3 V7 V9 V11 V12 V13 V15 V17 V18 V20 V21 V23 V24 V2 V27 V29 V31 V32 V33 V35 V37 V40 V42 V4 V41 U1 U2 U4 U5 U U7 U9 U11 U12 U13 U15 U17 U18 U20 U21 U23 U24 U2 U27 U29 U31 U32 U33 U35 U39 U37 U38 U43 U40 U42 T11 T12 T13 T15 T17 T18 T20 T21 T23 T24 T2 T27 T29 T31 T32 T33 R41 R2 R3 R4 R40 R42 R5 R R7 R9 R35 R37 R39 R38 R11 R12 R13 R15 R17 R18 R20 R21 R23 R24 R2 R27 R29 R31 R32 R33 P1 P2 P3 P42 P41 P43 N5 N N7 N8 N9 P12 P13 P15 P17 P18 P20 P21 P23 P24 P2 P27 P29 P31 P32 N35 N37 N39 N2 N3 N4 N11 N3 N41 N33 N38 N40 N42 N12 N13 N15 N17 N18 N20 N21 N23 N24 N2 N27 N29 N31 N32 M1 M2 M4 M40 M42 M43 M5 M M7 M8 M9 M10 M11 M34 M3 M38 M13 M15 M17 M18 M20 M21 M23 M24 M2 M27 M29 M31 M33 M35 M37 M39 L41 L2 L3 L4 L40 L42 L15 L17 L18 L20 L21 L23 L24 L2 L27 L29 L5 L L7 L8 L9 L11 L13 L31 L33 L35 L37 L39 K42 K1 K2 K3 L10 L12 L32 L34 L3 L38 K41 K43 K14 K15 K17 K18 K20 K21 K23 K24 K2 K27 K29 K30 J41 J2 J3 J4 J40 J42 J5 J J7 J8 J9 J11 J13 J31 J33 J35 J37 J39 J10 J12 J14 J15 J17 J18 J20 J21 J23 J24 J2 J27 J29 J30 J32 J34 J3 J38 H42 H1 H2 H4 H43 G17 G18 G19 G20 G21 G22 G23 G24 G25 G2 G27 G5 G G7 G8 G9 G10 G12 G14 G29 G31 G33 G35 G37 G39 G2 G3 G4 G11 G15 G13 G32 G41 G30 G34 G3 G38 G40 G42 F17 F18 F19 F20 F21 F22 F23 F24 F25 F2 F27 F42 F1 F2 F3 F5 F F7 F8 F9 F11 F13 F15 F29 F30 F32 F34 F3 F38 F41 F43 F10 F12 F14 E17 E18 E19 E20 E21 E22 E23 E24 E25 E2 E27 F31 F33 F35 F37 F39 E41 E2 E3 E4 E40 E Y1 Y2 Y4 Y40 Y5 Y Y7 Y8 Y9 Y10 Y11 Y12 Y13 Y14 Y15 Y17 Y18 Y19 Y20 Y21 Y22 Y23 Y24 Y25 Y2 Y27 Y29 Y30 Y31 Y32 Y33 Y34 Y35 Y3 Y37 Y38 Y39 Y42 Y43 W2 W3 W4 W40 W41 W42 W17 W18 W19 W20 W21 W22 W23 W24 W25 W2 W27 V5 V V7 V8 V9 V10 V11 V12 V13 V14 V15 V29 V30 V31 V32 V33 V34 V35 V3 V37 V38 V39 V1 V2 V3 V41 V42 V43 V17 V18 V19 V20 V21 V22 V23 V24 V25 V2 V27 U2 U3 U4 U5 U U7 U8 U9 U10 U11 U12 U13 U14 U15 U29 U30 U31 U32 U33 U34 U35 U3 U37 U38 U39 U40 U41 U42 U17 U18 U19 U20 U21 U22 U23 U24 U25 U2 U27 T1 T2 T4 T42 T43 R14 R15 R17 R18 R20 R21 R23 R24 R2 R27 R29 R30 R5 R R7 R8 R9 R10 R11 R12 R13 R31 R32 R33 R34 R35 R3 R37 R38 R39 R2 R3 R4 R40 R41 R42 P14 P15 P17 P18 P20 P21 P23 P24 P2 P27 P29 P30 P1 P2 P3 N5 N N7 N8 N9 N10 N11 N12 N13 N31 N32 N33 N34 N35 N3 N37 N38 N39 P41 P42 P43 N15 N17 N18 N20 N21 N23 N24 N2 N27 N29 N2 N3 N4 N40 N41 N42 M13 M15 M17 M18 M20 M21 M23 M24 M2 M27 M29 M31 M5 M M7 M8 M9 M10 M11 M33 M34 M35 M3 M37 M38 M39 M1 M2 M4 M40 M42 M43 L12 L13 L15 L17 L18 L20 L21 L23 L24 L2 L27 L29 L31 L32 L11 L33 L2 L3 L4 L5 L L7 L8 L9 K12 K13 K15 K17 K18 K20 K21 K23 K24 K2 K27 K29 K31 K32 L35 L3 L37 L38 L39 L40 L41 L42 K1 K2 K3 J11 J12 J13 J15 J17 J18 J20 J21 J23 J24 J2 J27 J29 J31 J32 J33 K41 K42 K43 J5 J J7 J9 J35 J37 J38 J39 J2 J3 J4 H11 H12 H13 H15 H17 H18 H20 H21 H23 H24 H2 H27 H29 H31 H32 H33 J40 J41 J42 G1 G2 G4 G5 G G7 G9 G11 G12 G13 G15 G17 G18 G20 G21 G23 G24 G2 G27 G29 G31 G32 G33 G35 G37 G38 G39 G40 G42 G43 F2 F3 F4 F7 F9 F11 F12 F13 F15 F17 F18 F20 F21 F23 F24 F2 F27 F29 F31 F32 F33 F35 F37 F40 F41 F42 F F38 E1 E2 E3 E7 E9 E11 E12 E13 E15 E17 E18 E20 E21 E23 E24 E2 E27 E29 E31 E32 E33 E35 E37 E41 E42 E43 E5 E Y W V U T R P N M L K J H G F E Y W V U T R P N M L K J H G F E Non-standard grid ball pattern. Minimum Pitch 0.8mm [0.31 in] 2.2 Package Loading Specifications Table 1 provides static load specifications for the package. This mechanical maximum load limit should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. lso, any mechanical system or component testing should not exceed the maximum limit. The package substrate should not be used as a mechanical reference or load-bearing surface for the thermal and mechanical solution. Table 1. Package Loading Specifications Parameter Maximum Notes Static 15 lbf 1,2,3 NOTES: 1. These specifications apply to uniform compressive loading in a direction normal to the package. 2. This is the maximum force that can be applied by a heatsink retention clip. The clip must also provide the minimum specified load on the package. 3. These specifications are based on limited testing for design characterization. Loading limits are for the package only. 12 Thermal and Mechanical esign Guidelines

13 Product Specifications To ensure the package static load limit is not exceeded, the designer should understand the post reflow package height. The following figure shows the nominal post-reflow package height assumed for calculation of a heatsink clip preload of the reference design. Refer to the package drawing in ppendix to perform a detailed analysis. Figure 2. Nominal Package Height Top of (G)MH 2.38 mm Solder all P 2.3 Thermal Specifications To ensure proper operation and reliability of the GMH, the temperature must be at or below the maximum case temperature specified in Table 2 when operating at TP. System and component level thermal enhancements are required to dissipate the heat generated and maintain the GMH within specifications. hapter 0 provides the thermal metrology guidelines for case temperature measurements. The GMH should also operate above the minimum case temperature specification listed in Table Thermal esign Power (TP) efinition Thermal design power (TP) is the estimated power dissipation of the GMH based on normal operating conditions including V and T -MX while executing real worst-case power intensive applications. This value is based on expected worst-case data traffic patterns and usage of the chipset and does not represent a specific software application. TP attempts to account for expected increases in power due to variation in GMH current consumption due to silicon process variation, processor speed, RM capacitive bus loading and temperature. However, since these variations are subject to change, the TP cannot guarantee that all applications will not exceed the TP value. The system designer must design a thermal solution for the GMH such that it maintains T below T -MX for a sustained power level equal to TP. Please note that the T -MX specification is a requirement for a sustained power level equal to TP, and that the case temperature must be maintained at temperatures less than T -MX when operating at power levels less than TP. This temperature compliance is to ensure component reliability over its useful life. The TP value can be used for thermal design if the thermal protection mechanisms are enabled. The GMH incorporate a hardwarebased fail-safe mechanism to keep the product temperature in specification in the event of unusually strenuous usage above the TP power. Thermal and Mechanical esign Guidelines 13

14 Product Specifications Methodology Pre-Silicon To determine TP for pre-silicon products in development, it is necessary to make estimates based on analytical models. These models rely on knowledge of the past GMH power dissipation behavior along with knowledge of planned architectural and process changes that may affect TP. Knowledge of applications available today and their ability to stress various aspects of the GMH is also included in the model. The projection for TP assumes GMH operation at T -MX. The TP estimate also accounts for normal manufacturing process variation Post-Silicon Once the product silicon is available, post-silicon validation is performed to assess the validity of pre-silicon projections. Testing is performed on both commercially available and synthetic high power applications and power data is compared to pre-silicon estimates. Post-silicon validation may result in a small adjustment to pre-silicon TP estimates Specifications The data in Table 2 is based on post-silicon power measurements of the GMH. The system configuration is: two (2) IMMs per channel, R2, FS operating at the top speed allowed by the chipset with a processor operating at that system bus speed. F- G packages have poor heat transfer capability into the board and have minimal thermal capability without thermal solutions. Intel requires that system designers plan for an attached heatsink when using the GMH. Table 2. Thermal Specifications omponent System us Speed Memory Frequency T - MIN T -MX Max Idle Power TP Value Intel 82G35 GMH 1333 MHz 800 MHz W 28 W NOTES: 1. Thermal specifications assume an attached heatsink is present. 2. Max Idle Power is the worst case idle power in system booted to Windows* with no background applications running. 3. When an external graphics card is installed in a system with the Intel G35 Express hipset, the TP for this part will drop to approximately 19 W. The GMH will detect the presence of the graphics card and disable the on-board graphics resulting in the lower GMH TP T ONTROL Limit Intel Quiet System Technology (Intel QST) monitors an embedded thermal sensor. The maximum operating limit when monitoring this thermal sensor is T ONTROL. For the GMH this value has been defined as 95. This value should be programmed into the appropriate fields of Intel QST as the maximum sensor temperature for operation of the Intel 82G35 GMH. 14 Thermal and Mechanical esign Guidelines

15 Product Specifications Thermal and Mechanical esign Guidelines Non-ritical to Function Solder alls Intel has defined selected solder joints of the GMH as non-critical to function (NTF) when evaluating package solder joints post environmental testing. The GMH signals at NTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality. Figure 3 identifies the NTF solder joints of the GMH package. Figure 3. Non-ritical to Function Solder alls F27 E G27 F H2 H1 H 13 G12 F N3 N2 N J G E F H L K M E2 G2 E1 G1 F2 J2 G4 J3 F3 E3 F4 J4 M1 K2 L2 K1 M2 K3 L3 L4 M J9 G9 F9 E9 J5 E5 F G G5 G7 F7 E7 L M5 J L5 M M7 L7 L8 M8 J7 F11 G11 H11 E11 G12 E12 H12 F12 L11 M10 M9 L9 J11 K12 J12 M11 L12 U N R T P W Y V P2 T2 T1 R2 P1 P3 T4 R3 R4 Y2 V2 Y1 U2 V1 W2 W4 W3 U3 V3 U4 Y4 E G F F2 G3 E3 F1 G2 E2 F3 G4 E4 R N N5 R5 R7 N7 N8 R8 Y5 V5 Y U U5 V V7 Y8 V8 U8 Y7 U7 R10 N10 R9 N9 R12 R11 N11 N12 V9 Y10 Y9 U10 U9 V10 Y11 V11 U11 Y12 V12 U F F5 G G5 F8 F7 G8 G F10 F9 G10 G9 G11 F M17 L17 H17 E17 K17 J17 F17 G17 H13 F13 G13 E13 H15 G15 F15 E15 L13 K13 J13 M13 J15 K15 M15 L15 H18 G18 F18 E18 G20 F20 H20 E20 L18 M18 K18 J18 M20 L20 J20 K M24 J24 F24 L24 K24 H24 G24 E24 H21 E21 G21 F21 G23 H23 F23 E23 K21 L21 J21 M21 K23 L23 M23 J23 H2 G2 F2 E2 E27 H27 G27 F27 M2 L2 K2 J2 L27 K27 M27 J27 F G21 E N17 P17 W17 V17 R17 R14 R13 P14 N13 U17 R15 P15 N15 Y13 V14 U14 V13 U13 Y14 Y17 Y15 V15 U15 U19 N18 U18 R18 P18 U20 R20 P20 N20 W19 Y19 V19 Y18 W18 V18 W20 Y20 V20 G17 F17 E G14 F14 G13 F13 G15 F F19 G19 E19 E18 G18 F18 18 E20 G20 F20 20 W24 N24 P24 Y24 V24 U24 R24 P21 U22 U21 R21 N21 N23 P23 U23 R23 W22 V22 Y21 Y22 W21 V21 Y23 W23 V23 U25 R2 P2 N2 R27 U27 U2 P27 N27 Y25 W25 V25 Y27 Y2 W27 W2 V27 V2 E G24 F E22 G22 F22 22 F23 23 G23 E G2 F2 E G25 F25 E Y13 J12 L W5 4 T M J L K R N P J3 L3 K2 J2 L2 K1 J4 H4 L4 K3 P2 M2 N3 R3 M1 R2 N2 P1 P3 N4 M4 R4 Y W U V U2 W2 V3 W1 Y2 U1 V2 Y4 Y3 U4 W3 V FISF R9 M7 M5 M M8 J J5 L L5 J8 J7 L8 L7 R R5 N N5 N8 R7 N7 M9 M10 M11 J10 J9 L10 L9 J11 L11 N11 R11 T11 N9 P12 R12 N12 T12 9 Y9 9 U9 W9 V9 Y U V U5 Y7 U7 V7 W Y11 V11 U11 W11 U12 V12 W12 Y Y20 N17 R17 M17 P17 T17 J17 L17 K17 L15 M15 K14 J14 M13 L13 J13 J15 K15 R15 N15 T15 P15 N13 R13 P13 T13 L18 K18 J18 M18 M20 L20 K20 J20 T18 N18 R18 P18 R20 N20 T20 P20 Y17 W17 U V17 Y15 U15 W15 V15 U13 V13 W Y19 U18 W18 V18 U20 W20 V R24 N24 M24 T24 L24 K24 J24 P24 L23 M23 K23 J23 L21 K21 J21 M21 T23 N23 P23 R23 N21 T21 P21 R21 M2 L2 K2 J2 L27 M27 K27 J27 N2 T2 R2 P2 T27 N27 R27 P27 U24 24 W24 24 Y24 V24 Y21 Y23 W23 U23 V23 W21 U21 V Y27 Y25 W2 U2 V2 U27 V27 W H43 H E G J L N R U W E G N40 N41 N42 L3 M K32 G32 H32 F32 L32 J32 E32 G29 E29 H29 F29 G31 F31 H31 E31 L29 J29 M29 K29 M31 L31 J31 K31 F33 H33 G33 E33 G35 F35 E35 M34 L33 J33 M33 M35 L35 J E41 J40 G40 L40 K41 F40 M40 J39 F38 G38 G37 E37 F37 E39 G39 L38 J38 M38 M37 L37 J37 L39 M39 J42 F42 G42 J41 F41 E42 E43 G43 M43 L42 M42 K42 L41 K43 F3 R3 N3 3 G3 U3 V3 Y3 3 3 V32 P30 N29 P29 R30 R29 R32 N32 R31 N31 Y30 Y29 V30 V29 U30 U29 Y32 U32 Y31 V31 U31 N34 R34 N33 R33 N35 R35 U34 V34 Y34 Y33 V33 U33 Y35 U35 V F32 32 G G30 F30 G29 F31 G G34 F34 G33 F33 G35 F35 U40 Y40 W40 V41 P41 R40 R38 N38 N37 R37 R39 N39 V38 U38 Y38 Y37 U37 V37 Y39 V39 U39 R42 T42 R41 P42 P43 T43 U42 W42 V42 Y42 W41 U41 V43 Y43 G40 E40 41 F G38 F38 G37 F37 F39 G G42 E42 G41 F42 E41 F43 F H K M P T V Y F J L N R U W Y35 L3 N3 M J3 R32 N32 L32 J32 P32 T32 M31 L31 K30 J30 L29 M29 K29 J29 J31 T31 N31 R31 P31 P29 R29 T29 N29 M34 J34 L34 L33 J33 M33 J35 L35 M35 R33 T33 N33 R35 N35 Y32 W32 32 U32 32 V32 Y29 Y31 W31 U31 V31 U29 W29 V Y33 V33 W33 U33 V35 W35 U L40 K41 J40 P41 M40 R40 N40 M38 J38 L38 M37 J37 L37 L39 M39 J39 N38 R38 R37 N37 R39 N39 K43 J42 L42 K42 H42 J41 L41 P43 R42 N42 M42 P42 R41 N41 M43 U V40 W41 Y38 U38 V38 Y37 V37 U37 W37 Y40 U39 W V42 Y42 W43 U43 Y41 V41 U42 W T M K P Y V F27 E G27 F H2 H1 H 13 G12 F N3 N2 N J G E F H L K M E2 G2 E1 G1 F2 J2 G4 J3 F3 E3 F4 J4 M1 K2 L2 K1 M2 K3 L3 L4 M J9 G9 F9 E9 J5 E5 F G G5 G7 F7 E7 L M5 J L5 M M7 L7 L8 M8 J7 F11 G11 H11 E11 G12 E12 H12 F12 L11 M10 M9 L9 J11 K12 J12 M11 L12 U N R T P W Y V P2 T2 T1 R2 P1 P3 T4 R3 R4 Y2 V2 Y1 U2 V1 W2 W4 W3 U3 V3 U4 Y4 E G F F2 G3 E3 F1 G2 E2 F3 G4 E4 R N N5 R5 R7 N7 N8 R8 Y5 V5 Y U U5 V V7 Y8 V8 U8 Y7 U7 R10 N10 R9 N9 R12 R11 N11 N12 V9 Y10 Y9 U10 U9 V10 Y11 V11 U11 Y12 V12 U F F5 G G5 F8 F7 G8 G F10 F9 G10 G9 G11 F M17 L17 H17 E17 K17 J17 F17 G17 H13 F13 G13 E13 H15 G15 F15 E15 L13 K13 J13 M13 J15 K15 M15 L15 H18 G18 F18 E18 G20 F20 H20 E20 L18 M18 K18 J18 M20 L20 J20 K M24 J24 F24 L24 K24 H24 G24 E24 H21 E21 G21 F21 G23 H23 F23 E23 K21 L21 J21 M21 K23 L23 M23 J23 H2 G2 F2 E2 E27 H27 G27 F27 M2 L2 K2 J2 L27 K27 M27 J27 F G21 E N17 P17 W17 V17 R17 R14 R13 P14 N13 U17 R15 P15 N15 Y13 V14 U14 V13 U13 Y14 Y17 Y15 V15 U15 U19 N18 U18 R18 P18 U20 R20 P20 N20 W19 Y19 V19 Y18 W18 V18 W20 Y20 V20 G17 F17 E G14 F14 G13 F13 G15 F F19 G19 E19 E18 G18 F18 18 E20 G20 F20 20 W24 N24 P24 Y24 V24 U24 R24 P21 U22 U21 R21 N21 N23 P23 U23 R23 W22 V22 Y21 Y22 W21 V21 Y23 W23 V23 U25 R2 P2 N2 R27 U27 U2 P27 N27 Y25 W25 V25 Y27 Y2 W27 W2 V27 V2 E G24 F E22 G22 F22 22 F23 23 G23 E G2 F2 E G25 F25 E Y13 J12 L W5 4 T M J L K R N P J3 L3 K2 J2 L2 K1 J4 H4 L4 K3 P2 M2 N3 R3 M1 R2 N2 P1 P3 N4 M4 R4 Y W U V U2 W2 V3 W1 Y2 U1 V2 Y4 Y3 U4 W3 V FISF R9 M7 M5 M M8 J J5 L L5 J8 J7 L8 L7 R R5 N N5 N8 R7 N7 M9 M10 M11 J10 J9 L10 L9 J11 L11 N11 R11 T11 N9 P12 R12 N12 T12 9 Y9 9 U9 W9 V9 Y U V U5 Y7 U7 V7 W Y11 V11 U11 W11 U12 V12 W12 Y Y20 N17 R17 M17 P17 T17 J17 L17 K17 L15 M15 K14 J14 M13 L13 J13 J15 K15 R15 N15 T15 P15 N13 R13 P13 T13 L18 K18 J18 M18 M20 L20 K20 J20 T18 N18 R18 P18 R20 N20 T20 P20 Y17 W17 U V17 Y15 U15 W15 V15 U13 V13 W Y19 U18 W18 V18 U20 W20 V R24 N24 M24 T24 L24 K24 J24 P24 L23 M23 K23 J23 L21 K21 J21 M21 T23 N23 P23 R23 N21 T21 P21 R21 M2 L2 K2 J2 L27 M27 K27 J27 N2 T2 R2 P2 T27 N27 R27 P27 U24 24 W24 24 Y24 V24 Y21 Y23 W23 U23 V23 W21 U21 V Y27 Y25 W2 U2 V2 U27 V27 W H43 H E G J L N R U W E G N40 N41 N42 L3 M K32 G32 H32 F32 L32 J32 E32 G29 E29 H29 F29 G31 F31 H31 E31 L29 J29 M29 K29 M31 L31 J31 K31 F33 H33 G33 E33 G35 F35 E35 M34 L33 J33 M33 M35 L35 J E41 J40 G40 L40 K41 F40 M40 J39 F38 G38 G37 E37 F37 E39 G39 L38 J38 M38 M37 L37 J37 L39 M39 J42 F42 G42 J41 F41 E42 E43 G43 M43 L42 M42 K42 L41 K43 F3 R3 N3 3 G3 U3 V3 Y3 3 3 V32 P30 N29 P29 R30 R29 R32 N32 R31 N31 Y30 Y29 V30 V29 U30 U29 Y32 U32 Y31 V31 U31 N34 R34 N33 R33 N35 R35 U34 V34 Y34 Y33 V33 U33 Y35 U35 V F32 32 G G30 F30 G29 F31 G G34 F34 G33 F33 G35 F35 U40 Y40 W40 V41 P41 R40 R38 N38 N37 R37 R39 N39 V38 U38 Y38 Y37 U37 V37 Y39 V39 U39 R42 T42 R41 P42 P43 T43 U42 W42 V42 Y42 W41 U41 V43 Y43 G40 E40 41 F G38 F38 G37 F37 F39 G G42 E42 G41 F42 E41 F43 F H K M P T V Y F J L N R U W Y35 L3 N3 M J3 R32 N32 L32 J32 P32 T32 M31 L31 K30 J30 L29 M29 K29 J29 J31 T31 N31 R31 P31 P29 R29 T29 N29 M34 J34 L34 L33 J33 M33 J35 L35 M35 R33 T33 N33 R35 N35 Y32 W32 32 U32 32 V32 Y29 Y31 W31 U31 V31 U29 W29 V Y33 V33 W33 U33 V35 W35 U L40 K41 J40 P41 M40 R40 N40 M38 J38 L38 M37 J37 L37 L39 M39 J39 N38 R38 R37 N37 R39 N39 K43 J42 L42 K42 H42 J41 L41 P43 R42 N42 M42 P42 R41 N41 M43 U V40 W41 Y38 U38 V38 Y37 V37 U37 W37 Y40 U39 W V42 Y42 W43 U43 Y41 V41 U42 W T M K P Y V F27 E G27 F H2 H1 H 13 G12 F N3 N2 N J G E F H L K M E2 G2 E1 G1 F2 J2 G4 J3 F3 E3 F4 J4 M1 K2 L2 K1 M2 K3 L3 L4 M J9 G9 F9 E9 J5 E5 F G G5 G7 F7 E7 L M5 J L5 M M7 L7 L8 M8 J7 F11 G11 H11 E11 G12 E12 H12 F12 L11 M10 M9 L9 J11 K12 J12 M11 L12 U N R T P W Y V P2 T2 T1 R2 P1 P3 T4 R3 R4 Y2 V2 Y1 U2 V1 W2 W4 W3 U3 V3 U4 Y4 E G F F2 G3 E3 F1 G2 E2 F3 G4 E4 R N N5 R5 R7 N7 N8 R8 Y5 V5 Y U U5 V V7 Y8 V8 U8 Y7 U7 R10 N10 R9 N9 R12 R11 N11 N12 V9 Y10 Y9 U10 U9 V10 Y11 V11 U11 Y12 V12 U F F5 G G5 F8 F7 G8 G F10 F9 G10 G9 G11 F M17 L17 H17 E17 K17 J17 F17 G17 H13 F13 G13 E13 H15 G15 F15 E15 L13 K13 J13 M13 J15 K15 M15 L15 H18 G18 F18 E18 G20 F20 H20 E20 L18 M18 K18 J18 M20 L20 J20 K M24 J24 F24 L24 K24 H24 G24 E24 H21 E21 G21 F21 G23 H23 F23 E23 K21 L21 J21 M21 K23 L23 M23 J23 H2 G2 F2 E2 E27 H27 G27 F27 M2 L2 K2 J2 L27 K27 M27 J27 F G21 E N17 P17 W17 V17 R17 R14 R13 P14 N13 U17 R15 P15 N15 Y13 V14 U14 V13 U13 Y14 Y17 Y15 V15 U15 U19 N18 U18 R18 P18 U20 R20 P20 N20 W19 Y19 V19 Y18 W18 V18 W20 Y20 V20 G17 F17 E G14 F14 G13 F13 G15 F F19 G19 E19 E18 G18 F18 18 E20 G20 F20 20 W24 N24 P24 Y24 V24 U24 R24 P21 U22 U21 R21 N21 N23 P23 U23 R23 W22 V22 Y21 Y22 W21 V21 Y23 W23 V23 U25 R2 P2 N2 R27 U27 U2 P27 N27 Y25 W25 V25 Y27 Y2 W27 W2 V27 V2 E G24 F E22 G22 F22 22 F23 23 G23 E G2 F2 E G25 F25 E Y13 J12 L W5 4 T M J L K R N P J3 L3 K2 J2 L2 K1 J4 H4 L4 K3 P2 M2 N3 R3 M1 R2 N2 P1 P3 N4 M4 R4 Y W U V U2 W2 V3 W1 Y2 U1 V2 Y4 Y3 U4 W3 V FISF R9 M7 M5 M M8 J J5 L L5 J8 J7 L8 L7 R R5 N N5 N8 R7 N7 M9 M10 M11 J10 J9 L10 L9 J11 L11 N11 R11 T11 N9 P12 R12 N12 T12 9 Y9 9 U9 W9 V9 Y U V U5 Y7 U7 V7 W Y11 V11 U11 W11 U12 V12 W12 Y Y20 N17 R17 M17 P17 T17 J17 L17 K17 L15 M15 K14 J14 M13 L13 J13 J15 K15 R15 N15 T15 P15 N13 R13 P13 T13 L18 K18 J18 M18 M20 L20 K20 J20 T18 N18 R18 P18 R20 N20 T20 P20 Y17 W17 U V17 Y15 U15 W15 V15 U13 V13 W Y19 U18 W18 V18 U20 W20 V R24 N24 M24 T24 L24 K24 J24 P24 L23 M23 K23 J23 L21 K21 J21 M21 T23 N23 P23 R23 N21 T21 P21 R21 M2 L2 K2 J2 L27 M27 K27 J27 N2 T2 R2 P2 T27 N27 R27 P27 U24 24 W24 24 Y24 V24 Y21 Y23 W23 U23 V23 W21 U21 V Y27 Y25 W2 U2 V2 U27 V27 W H43 H E G J L N R U W E G N40 N41 N42 L3 M K32 G32 H32 F32 L32 J32 E32 G29 E29 H29 F29 G31 F31 H31 E31 L29 J29 M29 K29 M31 L31 J31 K31 F33 H33 G33 E33 G35 F35 E35 M34 L33 J33 M33 M35 L35 J E41 J40 G40 L40 K41 F40 M40 J39 F38 G38 G37 E37 F37 E39 G39 L38 J38 M38 M37 L37 J37 L39 M39 J42 F42 G42 J41 F41 E42 E43 G43 M43 L42 M42 K42 L41 K43 F3 R3 N3 3 G3 U3 V3 Y3 3 3 V32 P30 N29 P29 R30 R29 R32 N32 R31 N31 Y30 Y29 V30 V29 U30 U29 Y32 U32 Y31 V31 U31 N34 R34 N33 R33 N35 R35 U34 V34 Y34 Y33 V33 U33 Y35 U35 V F32 32 G G30 F30 G29 F31 G G34 F34 G33 F33 G35 F35 U40 Y40 W40 V41 P41 R40 R38 N38 N37 R37 R39 N39 V38 U38 Y38 Y37 U37 V37 Y39 V39 U39 R42 T42 R41 P42 P43 T43 U42 W42 V42 Y42 W41 U41 V43 Y43 G40 E40 41 F G38 F38 G37 F37 F39 G G42 E42 G41 F42 E41 F43 F H K M P T V Y F J L N R U W Y35 L3 N3 M J3 R32 N32 L32 J32 P32 T32 M31 L31 K30 J30 L29 M29 K29 J29 J31 T31 N31 R31 P31 P29 R29 T29 N29 M34 J34 L34 L33 J33 M33 J35 L35 M35 R33 T33 N33 R35 N35 Y32 W32 32 U32 32 V32 Y29 Y31 W31 U31 V31 U29 W29 V Y33 V33 W33 U33 V35 W35 U L40 K41 J40 P41 M40 R40 N40 M38 J38 L38 M37 J37 L37 L39 M39 J39 N38 R38 R37 N37 R39 N39 K43 J42 L42 K42 H42 J41 L41 P43 R42 N42 M42 P42 R41 N41 M43 U V40 W41 Y38 U38 V38 Y37 V37 U37 W37 Y40 U39 W V42 Y42 W43 U43 Y41 V41 U42 W T M K P Y V

16 Product Specifications 1 Thermal and Mechanical esign Guidelines

17 Thermal Metrology 3 Thermal Metrology The system designer must measure temperatures in order to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques of measuring GMH component case temperatures. 3.1 ase Temperature Measurements To ensure functionality and reliability of the GMH the T must be maintained at or below the maximum temperature listed in Table 2. The surface temperature measured at the geometric center of the die corresponds to T. Measuring T requires special care to ensure an accurate temperature reading. Temperature differences between the temperature of a surface and the surrounding local ambient air can introduce error in the measurements. The measurement errors could be due to a poor thermal contact between the thermocouple bead and the surface of the package, heat loss by radiation and/or convection, conduction through thermocouple leads, or contact between the thermocouple cement and the heatsink base (if a heatsink is used). To minimize these measurement errors a thermocouple attach with a zero-degree methodology is recommended Thermocouple ttach Methodology 1. Mill a 3.3 mm [0.13 in] diameter hole centered on bottom of the heatsink base. The milled hole should be approximately 1.5 mm [0.0 in] deep. 2. Mill a 1.3 mm [0.05 in] wide slot, 0.5 mm [0.02 in] deep, from the centered hole to one edge of the heatsink. The slot should be in the direction parallel to the heatsink fins (see Figure 5). 3. ttach thermal interface material (TIM) to the bottom of the heatsink base. 4. ut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts should match the slot and hole milled into the heatsink base. 5. ttach a 3 gauge or smaller K-type thermocouple bead to the center of the top surface of the die using cement with high thermal conductivity. uring this step, make sure no contact is present between the thermocouple cement and the heatsink base because any contact will affect the thermocouple reading. It is critical that the thermocouple bead makes contact with the die (see Figure 4).. ttach heatsink assembly to the GMH, and route thermocouple wires out through the milled slot. Thermal and Mechanical esign Guidelines 17

18 Thermal Metrology Figure 4. 0 ngle ttach Methodology (top view, not to scale) Figure 5. 0 ngle ttach Heatsink Modifications (generic heatsink side and bottom view shown, not to scale) 18 Thermal and Mechanical esign Guidelines

19 Thermal Metrology 3.2 irflow haracterization Figure shows the recommended location for air temperature measurements measured relative to the component. For a more accurate measurement of the average approach air temperature, Intel recommends averaging temperatures recorded from two thermocouples spaced about 25 mm [1.0 in] apart. Locations for both a single thermocouple and a pair of thermocouples are presented. Figure. irflow andtemperature Measurement Locations irflow velocity can be measured using sensors that combine air velocity and temperature measurements. Typical airflow sensor technology may include hot wire anemometers. Figure provides guidance for airflow velocity measurement locations which should be the same as used for temperature measurement. These locations are for a typical JEE test setup and may not be compatible with chassis layouts due to the proximity of the processor to the GMH. The user may have to adjust the locations for a specific chassis. e aware that sensors may need to be aligned perpendicular to the airflow velocity vector or an inaccurate measurement may result. Measurements should be taken with the chassis fully sealed in its operational configuration to achieve a representative airflow profile within the chassis. Thermal and Mechanical esign Guidelines 19

20 Thermal Metrology 20 Thermal and Mechanical esign Guidelines

21 Reference Thermal Solution 4 Reference Thermal Solution The design strategy for the reference component thermal solution for the Intel G35 Express hipset in TX platforms reuses the ramp retainer, extrusion design and anchors from the Intel 945G Express hipset thermal solution. The thermal interface material and a wire preload clip are being redesigned to meet the Intel G35 Express hipset thermal requirements. The alanced Technology Extended (TX) reference design for the Intel G35 Express hipset includes a new extrusion, clip with higher preload and a new thermal interface material. slightly larger motherboard keep out zone than used by the Intel 945G Express hipset thermal solution has been defined, see Figure 13. This chapter provides detailed information on operating environment assumptions, heatsink manufacturing, and mechanical reliability requirements for the GMH. 4.1 Operating Environment The operating environment of the GMH will differ depending on system configuration and motherboard layout. This section defines operating environment boundary conditions that are typical for TX and alanced Technology Extended (TX) form factors. The system designer should perform analysis on platform operating environment to assess impact to thermal solution selection TX Form Factor Operating Environment In TX platforms, an airflow speed of 0.7 m/s [150 lfm] is assumed be present 25 mm [1 in] in front of the heatsink air inlet side of the attached reference thermal solution. The local ambient air temperature, T, at the GMH heatsink in an TX platform is assumed to be 47. The system integrator should note that board layout may be such that there will not be 25 mm [1in] between the processor heatsink and the GMH. The potential for increased airflow speeds may be realized by ensuring that airflow from the processor heatsink fan exhausts in the direction of the GMH heatsink. This can be achieved by using a heatsink providing omni directional airflow, such as a radial fin or X pattern heatsink. Such heatsink can deliver airflow to both the GMH and other areas like the voltage regulator, as shown in Figure 7. In addition, GMH board placement should ensure that the GMH heatsink is within the air exhaust area of the processor heatsink. Note that heatsink orientation alone does not ensure that 0.7 m/s [150 lfm] airflow speed will be achieved. The system integrator should use analytical or experimental means to determine whether a system design provides adequate airflow speed for a particular GMH heatsink. The thermal designer must carefully select the location to measure airflow to get a representative sampling. TX platforms need to be designed for the worst-case thermal environment, typically assumed to be 35 ambient temperature external to the system. Thermal and Mechanical esign Guidelines 21

22 Reference Thermal Solution Figure 7. Processor Heatsink Orientation to Provide irflow to GMH Heatsink on an TX Platform irflow irection irflow irection irflow irection GMH Heatsink irflow irection Omni irectional Flow Processor Heatsink (Fan not Shown) TOP VIEW Other methods exist for providing airflow to the GMH heatsink, including the use of system fans and/or ducting, or the use of an attached fan (active heatsink) alanced Technology Extended (TX) Form Factor Operating Environment This section provides operating environment conditions based on what has been exhibited on the Intel micro-tx reference design. On a TX platform, the GMH obtains in-line airflow directly from the processor thermal module. Since the processor thermal module provides lower inlet temperature airflow to the processor, reduced inlet ambient temperatures are also often seen at the GMH as compared to TX. n example of how airflow is delivered to the GMH on a TX platform is shown in Figure 8. The local ambient air temperature, T, at the GMH heatsink in the Intel micro-tx reference design is predicted to be ~45. The thermal designer must carefully select the location to measure airflow to get a representative sampling. These environmental assumptions are based on a 35 system external temperature measured at sea level. Note: The local ambient air temperature is based on the power for a 2005 platform, processor with a TP up to 130 W. Note: The risk of the solder ball fracture can be minimized with good chassis structure design on a TX platform, refer to the alanced Technology Extended (TX) hassis esign Guide (or alanced Technology Extended (TX) System esign Guide) for detailed chassis mechanical design. 22 Thermal and Mechanical esign Guidelines

23 Reference Thermal Solution Figure 8. Processor Heatsink Orientation to Provide irflow to GMH Heatsink on a alanced Technology Extended (TX) Platform GMH irflow irection TX Thermal Module ssembly over processor Top View 4.2 Reference esign Mechanical Envelope The motherboard component keep-out restrictions for the GMH for an TX platform are included in ppendix, Figure 12. The motherboard component keep-out restrictions for the GMH on a TX platform are included in ppendix, Figure Thermal Solution ssembly The reference thermal solution for the GMH for an TX chassis is shown in Figure 9 and is an aluminum extruded heatsink that uses two ramp retainers, a wire preload clip, and four motherboard anchors. Refer to ppendix for the mechanical drawings. The heatsink is attached to the motherboard by assembling the anchors into the board, placing the heatsink over the GMH and anchors at each of the corners, and securing the plastic ramp retainers through the anchor loops before snapping each retainer into the fin gap. The wire preload clip should be left loose in the extrusion during the wave solder process. The assembly is then sent through the wave process. Post wave, the wire preload clip is assembled using the hooks on each of the ramp retainers. The clip provides the mechanical preload to the package. The mechanical preload is necessary to provide both sufficient pressure to minimize thermal contact resistance and to improve solder ball joint reliability. The mechanical stiffness and orientation of the extruded heatsink also provides protection to reduce solder ball joint reliability. thermal interface material (Honeywell* PM45F) is pre-applied to the heatsink bottom over an area which contacts the package die. Note: The TX design is similar in appearance to the Intel 945G Express hipset thermal solution, but two critical items have been changed. higher performance TIM clip with a higher preload to meet the TIM preload requirements. The combination of the two new items provides the performance increase to meet the GMH thermal requirements. Thermal and Mechanical esign Guidelines 23

24 Reference Thermal Solution The reference thermal solution for the GMH in a TX chassis is shown in Figure 10. The heatsink is aluminum extruded and uses a Z-clip for attach. The clip is secured to the system motherboard via two solder down anchors around the GMH. The clip helps to provide a mechanical preload to the package via the heatsink. thermal interface material (Honeywell* PM45F) is pre-applied to the heatsink bottom over an area in contact with the package die. Note: To minimize solder ball joint reliability risk, the TX Z-clip heatsink is intended to be used with the Support Retention Mechanism (SRM) described in the alanced Technology Extended (TX) Interface Specification. For additional information on designing the TX chassis to minimize solder ball joint reliability, refer to the alanced Technology Extended (TX) hassis esign Guide. Figure 9. TX GMH Heatsink - Installed on oard 24 Thermal and Mechanical esign Guidelines

25 Reference Thermal Solution Figure 10. alanced Technology Extended (TX) GMH Heatsink - Installed on oard 4.4 Environmental Reliability Requirements The environmental reliability requirements for the reference thermal solution are shown in Table 3 and Table 4. These should be considered as general guidelines. Validation test plans should be defined by the user based on anticipated use conditions and resulting reliability requirements. The TX testing will be performed with the sample board mounted on a test fixture and includes a processor heatsink with a mass of 550g. The test profiles are unpackaged board level limits. Table 3. TX Reference Thermal Solution Environmental Reliability Requirements (oard Level) Test 1 Requirement Pass/Fail riteria 2 Mechanical Shock Random Vibration Unbiased Humidity 3 drops for + and - directions in each of 3 perpendicular axes (i.e., total 18 drops). Profile: 50 G, Trapezoidal waveform, 4.3 m/s [170 in/s] minimum velocity change uration: 10 min/axis, 3 axes Frequency Range: 5 Hz to 500 Hz Power Spectral ensity (PS) Profile: 3.13 g RMS 85 % relative humidity / 55, 57 hours Visual\Electrical heck Visual/Electrical heck Visual heck NOTES: 1. The above tests should be performed on a sample size of at least 12 assemblies from 3 different lots of material. 2. dditional Pass/Fail riteria may be added at the discretion of the user. Thermal and Mechanical esign Guidelines 25

26 Reference Thermal Solution Table 4. alanced Technology Extended (TX) Reference Thermal Solution Environmental Reliability Requirements (System Level) Test 1 Requirement Pass/Fail riteria 2 Mechanical 2 drops for + and - directions in each of 3 Shock 5 perpendicular axes (i.e., total 12 drops). Profile: 25g, Trapezoidal waveform, 5.7 m/s [225 in/sec] minimum velocity change. Visual\Electrical heck Random Vibration 5 Power ycling Unbiased Humidity uration: 10 min/axis, 3 axes Frequency Range:.001 5Hz, ramping to.01 Hz, Hz to 500 Hz Power Spectral ensity (PS) Profile: 2.20 g RMS 7500 cycles (on/off) of minimum temperature 27 / maximum temperature cycles (on/off) of minimum temperature 35 / maximum temperature 9 15 second dwell at high / low temperature for both test cycles. 85 % relative humidity / 55, 57 hours Visual/Electrical heck Thermal Performance Visual heck NOTES: 1. The above tests should be performed on a sample size of at least 12 assemblies from 3 different lots of material. 2. dditional Pass/Fail riteria may be added at the discretion of the user. 3. Mechanical Shock minimum velocity change is based on a system weight of 20 to 29 lbs. 4. For the chassis level testing the system will include: 1 H, 1 O, 1 PSU, 2 IMMs and the I/O shield. 5. TX reference solution testing for shock and vibration is to mount the sample board in a TX chassis in with a thermal module assembly (TM) having a maximum mass of 900g. 2 Thermal and Mechanical esign Guidelines