Application Note Xicato Intelligent Driver (XID) Assembly Instructions Version

Transcription

1 Application Note Xicato Intelligent Driver (XID) Assembly Instructions Version Introduction Xicato Intelligent Drivers (XID) are compact, DC-powered, wireless Bluetooth-controllable LED drivers that can provide constant current control to a wide variety of LED sources. The drivers small size makes them suitable for mounting inside a luminaire or track adapter. Mechanical Interface Ensure proper heat dissipation by mounting the bottom of the XID to a heatsink or to any material that can keep the T C of the XID at or below 75 C. The use of a thermal interface material (TIM) between the XID and the heat exchanging surface is not typically required but can be used as long as the material is not electrically conductive. It is important to note that although no dedicated heatsink is required and the XID can be directly attached to many different materials, regional and local codes for electrical, fire, and safety still apply and must be considered. The driver housing features (2) mounting holes for M3 screws. Xicato recommends assembling the XID with M3x16mm fasteners which should be torqued to 2.75 in lbs (0.31 N m) each. The ø35mm mounting hole pitch circle allows the XID to attach to any Zhaga Book 3 compatible heatsink. XID mounting surface should be flat and free of debris. Spring washers can also be used to help prevent the XID from loosening due to vibrations. Electrical Considerations The XID is designed for use with either a 24V or 48V DC constant voltage power supply. The driver is preconfigured from the factory for 48VDC input but can be programmed to accept 24VDC input using the Xicato Configuration Tool (XCT-0101). Note that input voltage must be supplied by an SELV (CE) or Class 2 (UR/CNR) power supply to ensure compliant operation with CE or UL safety requirements respectively. When two or more XIDs are present in a circuit, XIDs should be wired in parallel to a power supply that has sufficient output power to operate all drivers in the circuit. Do not wire XIDs in series. While the XID can control LED arrays with forward voltages (V F ) as low as 2.5V and as high as 45V, Xicato recommends pairing the XID with arrays that have a V F range between 2.7V and 39V for best dimming performance and stability. Under all conditions, the V F of the LED array being driven must be at least 3V below the voltage applied at the input of the XID. For example, an XID programmed for 24VDC input should not operate an array with a V F above 21V. Constant current sources such as the XID are typically designed to have the LED array connected prior to applying power to the driver. Connecting an LED array to the XID after the XID has been powered on may result in an over current condition that can damage the array. There are 2 methods of safely connecting an LED array to the XID:

2 1. Turn off power to the XID by either unplugging the AC side of the power supply or disconnecting the XID from the power supply. Attach the LED module to the XID. Reconnect the XID to the power supply, if needed, and turn on the power source. 2. Turn on power to the XID with the LED array disconnected. In the Xicato Control Panel software, reduce the output intensity of the XID to 0%. Connect LED array to XID. The XID is equipped with an inrush current limiting device that protects the XID from large transient current and voltage spikes. This will protect the XID when used in hot plug applications (e.g., inserting the driver into a live 48V DC track). Wiring Diagrams No Control Wires 0-10V Dimming with Relay to Switch Power

3 0-10V Dimming (No Relay) Wire Harness Connection Both input and output wire harnesses use 1.5mm AMP mini CT connectors manufactured by TE Connectivity and available from Xicato and several electrical component distributors. A 3-pin wire harness (XSA-332, TE part number ) is used for input into the XID and a 4-pin wire harness (XSA-333, TE part number ) is used for output. The following tables show the electrical pinout of the wire harness assemblies. XSA-332 TE: Pin Input Wire Harness Pin # Function Rating Color Length 1 V IN +; 48VDC by default; 24VDC as programmed option 24 AWG, UL1061 Red mm (6.25 ) 2 V IN - 24 AWG, UL1061 Black mm (6.25 ) V DIM Control; Positive Voltage Referenced to V IN - 24 AWG, UL1061 Blue mm (6.25 ) XSA-333 TE: Pin Output Wire Harness Pin # Function Rating Color Length 1 LED + 24 AWG, UL1061 Red mm (6.25 ) 2 LED - 24 AWG, UL1061 Black mm (6.25 ) 3 NTC + (Optional) 24 AWG, UL1061 Blue mm (6.25 ) 4 NTC (Optional) 24 AWG, UL1061 Orange mm (6.25 ) To install a wire harness, hold the harness connector firmly with two fingers and verify that the connector and XID harness receptacle match, and that the connector is oriented correctly by confirming the red positive power wire is located on the left when looking down on the XID. Insert the connector into the harness receptacle of the XID until an audible click is heard. This signals that the harness connector is fully engaged with the pins of the driver. To disengage, pull the wire harness out by its connector. Do not pull directly from the wires.

4 For more information on harness connectors or to order harnesses, contact your Xicato account manager or technical representative. NTC Usage An external 47kΩ negative temperature coefficient (NTC) thermistor can be connected to the XID using the NTC wires of the output wire harness (pins 3 & 4). Output current will decrease by 15% whenever the NTC exceeds the maximum programmed allowable temperature limit. The XID s NTC foldback and shutdown temperature thresholds can be modified using the XCT tool. For more information on programming the XID using the XCT Tool, please refer to the XCT application documentation. Xicato has tested and approved the following 47kΩ NTCs for use with the XID. Mounting Type Manufacturer Part Number Through Hole Vishay Threaded Vishay NTCASCWE3473J Surface Mount Murata NCP15WB473F03RC 0-10V Dimming The XID is compatible with a wide range of both 0-10V and 1-10V control types from leading industry manufacturers. The control signal is a DC voltage that varies between 0 and 10V. The XID sources the control current and the dimmer position determines the control voltage. When an XID is on and the control voltage is between 0.5V and 1.0V, the intensity will be 1.0%. When the control voltage is greater than 9.0V, the intensity will be 100%. These settings can be adjusted using the XCT Tool or Xicato Control Panel software. If you wish to know more about dimmer compatibility with XID, please refer to dimming compatibility documentation at or contact your Xicato technical representative. Distance and Wire Gauge between PSUs and XID In the US, a circuit is considered Class 2 low voltage if the power supplied to the circuit is 60V or less and 100W or less. That means the maximum current from a Class 2 source is limited to 2.08A for 48VDC. If a maximum current of 2.08A is assumed in the circuit, the wire gauge needed to connect a 48V PSU to an XID can be determined based on the distance between the two components. In the following example, the maximum allowable voltage drop across the length of the wire is assumed to be 2.4V (5%) or less. By applying Ohm s Law, R = V I = 2.4V 2.08A = 1.15Ω the total resistance of the wire is calculated to be 1.15 Ohms. Using an AWG resistance table, the maximum distance between the PSU and XIM can be determined based on gauge size.

5 AWG Resistance/length Total Length (copper wire) 24VDC* 48VDC mω/ft 11 ft 44 ft mω/ft 28 ft 112 ft mω/ft 45 ft 179 ft mω/ft 71 ft 286 ft mω/ft 114 ft 454 ft *maximum current from a Class 2 source is limited to 4.16A for 24VDC BLE Performance In a similar way to light, BLE radio waves travel in straight lines and are affected by obstructions (people, walls, objects) and reflections that can alter the signal. The received signal strength indicator (RSSI) of any non-line-ofsight signal can vary rapidly as that signal penetrates different media and interacts with different objects. Bluetooth signals will penetrate certain materials such as brick, stone and steel and the signal strength reduction depends on the density of the material. The material your luminaire or enclosure is made of will affect the XID s BLE range and performance. Metal is especially detrimental to antenna performance because it is conductive and should be kept away from the antenna if possible. Below is a general guideline on how different materials reduce BLE radio signal strength. Material Range Reduction vs lineof-sight conditions Wood, Drywall, Glass 0-10% Brick, Particle Board 5-35% Metal, Ferro Concrete, Mirrors 10-90% When placing the XID in your assembly, it is necessary to care about the radiation pattern of the device and also about possible attenuation elements in the environment. For best results, create as much distance between the antenna and the side walls of the fixture or enclosure as possible. The location of the BLE antenna is indicated by the IEC antenna symbol ( ) found on the top label of the XID. T C Measurement On the bottom surface of the XID, between the screw head and the plastic housing case, is the XID s case temperature (T C ) measurement location. This site can be utilized for attaching a thermocouple in order to verify

6 that the XID is running below its maximum design case temperature limit of 75 C. Xicato recommends attaching the thermocouple using the following method accepted by UL , Section , Rev January 11, Verify that the T C location is clean, dry, and free from debris. Any debris between the surface and the thermocouple bead may add thermal resistance to the test and could deliver erroneous results. 2. Apply cyanoacrylate adhesive sparingly to the surface of the thermocouple bead. Press surface of bead to TC location immediately. Hold in place until bond sets per manufacturer s instructions. Do not reposition. 3. In a separate mixing container, add recommended ratio of two-part thermally conductive adhesive and blend per adhesive manufacturer s instructions. Avoid high mixing speeds which could entrap excessive amounts of air or cause overheating of the mixture resulting in reduced working life. 4. Apply the adhesive around the surfaces of the bonded thermocouple bead such that the bead is fully contained within the adhesive. Let the adhesive fully cure per the manufacturer s instructions. Stress relieve the thermocouple wire to further protect the joint. Important: The thermocouple bead must make direct, reliable contact with the bottom surface of the XID; otherwise, there will be an unknown thermal impedance between the aluminum surface and the thermocouple. This could result in lower temperature readings. It is the responsibility of the test engineer or test party to ensure the thermocouple bead is properly attached to the identified T C point. Alternative PCB Temperature Reading The XID contains internal sensors that detect the temperature of the internal electronics. If the Xicato Control Panel is running and within communication range of the XID, the control panel will collect and log the temperature readings of the XID s internal PCB (and external NTC temperature if utilized). These readings can be used to evaluate the thermal performance of the XID without instrumenting the driver s case temperature (T C ) point with thermocouples. While the case temperature of the XID should not exceed 75 C, the internal PCB temperature threshold limit is slightly higher at 83 C. Above this temperature, XID will enter thermal foldback mode to protect its electronic components from damage due to excessive heat. In the example below, an XID was mounted to a 4 x 4 inch, 2-gang, zinc plated steel outlet box cover to assess the cover s ability to transport heat away from the driver. An LED array was fully powered to 1.4A and the temperature rise of the XID was monitored.

7 From the Real Time Device Graph (launched through the Log tab of the Xicato Control Panel), we found that the XID reached a peak steady-state temperature of 50 C after 50 min of full power. Ambient temperature during testing was 25 C. Since we need to keep the PCB temperature below 83 C, we know that the highest ambient temperature the driver in this configuration can be installed in is 58 C.