Intel EP80579 Integrated Processor Product Line

Transcription

1 Intel EP80579 Integrated Processor Product Line Thermal/Mechanical Design Guide October 2008 Reference Number: US

2 Legal Lines and Disclaimers INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined. Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See for details. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature may be obtained by calling or by visiting Intel's website at Quick Assist Technology, EP80579, Intel Inside, Intel Inside logo, Intel. Leap ahead., Intel. Leap ahead. logo, Pentium, Pentium Inside, Xeon, and Xeon Inside are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others. Copyright 2008, Intel Corporation. All Rights Reserved. Thermal/Mechanical Design Guide October Reference Number: US

3 Contents Contents 1.0 Introduction Design Flow Definition of Terms Reference Documents Package Thermal Models Package Information Thermal Specification Thermal Design Power Maximum Allowed Component Temperature Mechanical Specifications Package Mechanical Requirements Board Level Keep Out Zone Requirements Thermal Solution Requirements Heatsink Design Considerations Heatsink Size Heatsink Mass System Level Thermal Solution Considerations Characterizing the Thermal Solution Requirement Example: Calculating the Required Thermal Performance for Intel EP80579 Integrated Processor Product Line Reference Heatsinks AdvancedTCA* Reference Heatsink Mechanical Design Keep Out Zone Requirements Thermal Performance Small Form Factor Reference Heatsink Mechanical Design Additional Keep Out Zone Requirements Thermal Performance U Form Factor Reference Heatsinks Mechanical Design Keep Out Zone Requirements Thermal Performance Print Imaging Reference Heatsink Mechanical Design Keep Out Zone Requirements Thermal Performance Active Heatsink Keep Out Zone Requirements Torsional Clip Solder-Down Anchors Heatsink Orientation Thermal Interface Material (TIM) Thermal Metrology TCASE Temperature Measurements Supporting Test Equipment Thermal Calibration and Control IHS Groove October 2008 Thermal/Mechanical Design Guide Reference Number: US 3

4 Contents Thermocouple Conditioning and Preparation Thermocouple Attachment to the IHS Curing Process and Thermocouple Wire Management Local Ambient Temperature Measurement Guidelines Active Heatsink Measurements Passive Heatsink Measurements Thermal Test Vehicle Power Simulation Software Reliability Guidelines...42 A Thermal Solution Component Suppliers...43 A.1 Reference Heatsink...43 B Mechanical Drawings...44 B.1 AdvancedTCA* Heatsink Assembly...45 B.2 AdvancedTCA* Heatsink...46 B.3 AdvancedTCA*, 1U and Active Heatsink Keep-Out Zone...47 B.4 1U Heatsink Assembly...48 B.5 1U Heatsink (Sheet 1)...49 B.6 1U Heatsink (Sheet 2)...50 B.7 1U Industrial Temperature Heatsink Assembly...51 B.8 1U Industrial Temperature Heatsink...52 B.9 1U Industrial Temperature Keep-Out Zone...53 B.10 AdvancedMC*/Small Form Factor Heatsink Assembly...54 B.11 AdvancedMC/Small Form Factor Heatsink...55 B.12 AdvancedMC/Small Form Factor Heatsink Backplate...56 B.13 AdvancedMC/Small Form Factor Fastener...57 B.14 AdvancedMC/Small Form Factor Keep-Out Zone...58 B.15 Print Imaging Heatsink Assembly...59 B.16 Print Imaging Heatsink...60 B.17 Print Imaging PCB Keep-Out Zone...61 B.18 Heatsink Torsional Clip...62 Figures 1-1 Thermal Design Process Package Processor Thermal Characterization Parameter Relationship AdvancedTCA* Reference Thermal Solution Assembly AdvancedTCA* Reference Heatsink Thermal Performance Small Form Factor Reference Thermal Solution Assembly Small Form Factor Reference Heatsink Thermal Performance versus Airflow Rate U+ Reference Thermal Solution Assembly U+ Industrial Temperature Thermal solution Assembly U Form Factor Reference Heatsink Thermal Performance U Industrial Temperature Reference Heatsink Thermal Performance Print Imaging Reference Thermal Solution Assembly Print Imaging Reference Heatsink Thermal Performance versus Airflow Rate IHS Groove Orientation of Thermocouple Groove Relative to Package Pin Bending the Tip of the Thermocouple Securing Thermocouple Wires with Kapton Tape Prior to Attach Thermocouple Bead Placement Position Bead on the Groove Step Using 3D Micromanipulator to Secure Bead Location...36 Thermal/Mechanical Design Guide October Reference Number: US

5 Contents 7-8 Measuring Resistance Between Thermocouple and IHS Applying the Adhesive on the Thermocouple Bead Thermocouple Wire Management in the Groove Removing Excess Adhesive from the IHS Filling the Groove with Adhesive Measuring TLA with an Active Heatsink Measuring TLA with a Passive Heatsink Tables 1-1 Terms Thermal Design Power (TDP) and Maximum Case Temperature (TC-MAX) Specification Required Heatsink Thermal Performance (Ψ CA ) Recommended Thermocouple Attach Equipment Reliability Requirements Suppliers October 2008 Thermal/Mechanical Design Guide Reference Number: US 5

6 Revision History Revision History Date Revision Description October Changed TDP for processor ID 7 in Table 3-1 August Initial release Thermal/Mechanical Design Guide October Reference Number: US

7 1.0 Introduction 1.0 Introduction The power dissipation required for electronic components has risen along with the increase in complexity of computer systems. To ensure quality, reliability, and performance goals are met over a product's life cycle, the heat generated by the component must be properly dissipated. Typical methods to improve heat dissipation include selective use of airflow ducting, and/or the use of heatsinks. The goals of this document are to: Describe the thermal and mechanical specifications for Intel EP80579 Integrated Processor product line Describe reference solutions that meet the Intel EP80579 Integrated Processor product line s thermal and mechanical specifications A properly designed thermal solution adequately cools the device die temperature at or below the thermal specification. This is accomplished by providing a suitable localambient temperature, ensuring adequate local airflow, and minimizing the die to localambient thermal resistance. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component. This document addresses thermal and mechanical design specifications for Intel EP80579 Integrated Processor product line only. For thermal design information about other Intel components, refer to the respective component s Datasheet. Note: Unless otherwise specified, the term SOC (System on a Chip) refers to the Intel EP80579 Integrated Processor product line. 1.1 Design Flow Several tools are available from Intel to assist in the development of a reliable, costeffective thermal solution. Figure 1-1 illustrates a typical thermal solution design process with available tools noted. The tools are available through your local Intel field sales representative. October 2008 Thermal/Mechanical Design Guide Reference Number: US 7

8 1.0 Introduction Figure 1-1. Thermal Design Process Step 1: Thermal Simulation Package Level Thermal Models Thermal Model User s Guide Step 2: Heatsink Design and Selection Reference Heatsinks Reference Mounting Hardware Vendor Contacts Step 3: Thermal Validation Thermal Testing Software Thermal Test Vehicle User Guides 1.2 Definition of Terms IA Table 1-1. Table 1-1 defines terms that are used throughout this document. Terms FC-BGA IHS Term Intel EP80579 Integrated Processor product line T CASE T CASE-MAX T SINK TDP T LA Definition Flip Chip Ball Grid Array. A package type defined by a plastic substrate where a die is mounted using an underfill C4 (Controlled Collapse Chip Connection) attach style. The primary electrical interface is an array of solder balls attached to the substrate opposite the die. Note: The device arrives at the customer with solder balls attached. Integrated Heat Spreader An integrated system on a chip that integrates the following features into a single device: Low power and high performance Intel architecture processor (IA-32 core), integrated IA compatible chipset containing a Memory Controller Hub (IMCH) and I/O Controller Hub (IICH), and an extensive integration of high-speed communications interfaces and hardware accelerators for high throughput packet and security processing. The hardware integration includes PCI Express*, Gigabit Ethernet, Time Division Multiplexing (TDM), security acceleration for bulk encryption, hashing and public/private key generation, and network protocol acceleration. The temperature of the component. This temperature is measured at the geometric center of the top of the package IHS. Also referred to as T C. Maximum allowed component temperature. This temperature is measured at the geometric center of the top of the package IHS. Also referred to as T C-MAX. Temperature measured on the bottom surface of the heat sink base at the location that corresponds to T CASE. Also referred to as T S. Thermal Design Power. Target power dissipation level for thermal solution design. TDP is based on worst-case real world applications and benchmarks at maximum component temperature. TDP is not theoretical maximum power. Local ambient temperature. This is the temperature measured inside the chassis, approximately 1" upstream of a component heatsink. Also referred to as T A. Thermal/Mechanical Design Guide October Reference Number: US

9 1.0 Introduction Table 1-1. Terms Term Definition Ψ CA Ψ SA Ψ CS TIM Case-to-ambient thermal characterization parameter. A measure of the thermal solution thermal performance using the total package power. Defined as (T CASE - T LA ) / Total Package Power. Note: Heat source must be specified for Ψ measurements. Sink-to-ambient thermal characterization parameter. A measure of the heat sink thermal performance using the total package power. Defined as (T S - T LA ) / Total Package Power. Note: Heat source must be specified for Ψ measurements. Case-to-sink thermal characterization parameter. A measure of the thermal interface material performance using the total package power. Defined as (T CASE - T S ) / Total Package Power. Also referred to as Ψ TIM. Note: Heat source must be specified for Ψ measurements. Thermal Interface Material: thermally conductive material installed between two surfaces to improve heat transfer and reduce interface contact resistance. 1.3 Reference Documents The reader of this specification should also be familiar with material and concepts presented in the documents: Datasheet Platform Design Guide Thermal Test Vehicle User s Guide Thermal Model User s Guide Power Thermal Utility Program Server Systems Infrastructure (SSI) - Thin electronics bay specifications: ssiforum.org PICMG Specifications (AdvancedTCA, AdvancedMC, etc.): Note: Unless otherwise noted, technical documents are available through your Intel field sales representative or from Package Thermal Models Intel provides thermal simulation models of the device and a Thermal Model User's Guide to aid designers in simulating, analyzing, and optimizing thermal solutions in an integrated, system-level environment. The models are for use with commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tools including Flotherm* (version 3.1 or higher) by Flomerics*, Inc. or Icepak* by Fluent*, Inc. Contact your Intel representative to order the thermal models and associated user's guides. October 2008 Thermal/Mechanical Design Guide Reference Number: US 9

10 2.0 Package Information 2.0 Package Information The Intel EP80579 Integrated Processor product line utilizes a 37.5 x 37.5 mm, FC-BGA package with an Integrated Heat Spreader (IHS) (see Figure 2-1). The data in this chapter is provided for reference purposes only. See the Intel EP80579 Integrated Processor Product Line Datasheet for up-to-date data. In the event of a conflict, the Datasheet supersedes the data shown in Figure 2-1. Note: The dimensions in Figure 2-1 are in millimeters [inches]. The dimensions shown are preliminary and subject to change. Thermal/Mechanical Design Guide October Reference Number: US

11 2.0 Package Information Figure 2-1. Package October 2008 Thermal/Mechanical Design Guide Reference Number: US 11

12 3.0 Thermal Specification 3.0 Thermal Specification 3.1 Thermal Design Power Table 3-1 lists the Thermal Design Power (TDP) specification. TDP is the recommended design point for thermal solution power dissipation. TDP is based on running worstcase, real-world applications and benchmarks at maximum component temperature. TDP is not the theoretical maximum power dissipation. Heat transfer through the FC-BGA package and into the baseboard is limited. The cooling capacity without a thermal solution is also limited, so Intel recommends the use of a heatsink for all usage conditions. 3.2 Maximum Allowed Component Temperature The Intel EP80579 Integrated Processor product line must maintain a maximum temperature at or below the value specified in Table 3-1. The thermal solution is required to meet the temperatures specification while dissipating the Thermal Design Power. Chapter 7.0, Thermal Metrology includes guidelines for accurately measuring the package temperature. Table 3-1. Thermal Design Power (TDP) and Maximum Case Temperature (T C-MAX ) Specification Intel EP80579 Integrated Processor Intel EP80579 Integrated Processor with Intel Quick Assist Technology ID Processor Frequency (MHz) TDP 1 (W) T CASE-MAX ( C) Notes: 1. Thermal Design Power (TDP) is a thermal solution design target associated with the maximum component operating temperature specifications. TDP values are based on typical DC electrical specifications and maximum component temperature for a realistic-case application running at maximum utilization. 2. T C-MAX values are subject to change without notice. 3. See the Datasheet for ID definitions. Thermal/Mechanical Design Guide October Reference Number: US

13 4.0 Mechanical Specifications 4.0 Mechanical Specifications 4.1 Package Mechanical Requirements The FC-BGA package for the Intel EP80579 Integrated Processor product line has an Integrated Heat Spreader (IHS) that provides the interface with the thermal solution. The maximum allowable static force for the processor package is 15 lbf normal to the IHS. Any force larger than this could damage the device. 4.2 Board Level Keep Out Zone Requirements A general description of the keep-out zones and mounting hole pattern for the reference thermal solutions is shown in Appendix B, Mechanical Drawings. When using heatsinks that extend beyond the Intel EP80579 Integrated Processor product line reference heatsink envelopes shown in Appendix B, Mechanical Drawings, motherboard components placed between the underside of the heatsink and the motherboard cannot exceed 2.54 mm [0.10 in] in height. October 2008 Thermal/Mechanical Design Guide Reference Number: US 13

14 5.0 Thermal Solution Requirements 5.0 Thermal Solution Requirements 5.1 Heatsink Design Considerations To remove the heat from the Intel EP80579 Integrated Processor product line, three basic parameters should be considered: The area of the surface on which the heat transfer takes place. Without any enhancements, this is the surface of the processor package IHS. One method improve thermal performance is to attach a heatsink to the IHS. A heatsink increases the effective heat transfer surface area by conducting heat out of the IHS and into the surrounding air through fins attached to the heatsink base. Note: The Intel EP80579 Integrated Processor product line requires a heatsink in all applications. The conduction path from the heat source to the heatsink fins. Providing a direct conduction path from the heat source to the heatsink fins and selecting materials with higher thermal conductivity typically improves heatsink performance. The length, thickness, and conductivity of the conduction path from the heat source to the fins directly impact the thermal performance of the heatsink. In particular, the quality of the contact between the package IHS and the heatsink base has a higher impact on the overall thermal solution performance as processor cooling requirements become stricter. Thermal interface material (TIM) is used to fill the gap between the IHS and the bottom surface of the heatsink, and thereby improve the overall performance of the stack-up (IHS-TIM-Heatsink). With extremely poor heatsink interface flatness or roughness, TIM may not adequately fill the gap. The TIM thermal performance depends on its thermal conductivity as well as the pressure applied to it. See Section 6.9 for further information on TIM and on bond line management between the IHS and the heatsink base. The heat transfer conditions on the surface on which heat transfer takes place. Convective heat transfer occurs between the airflow and the surface exposed to the flow. It is characterized by the local ambient temperature of the air, T LA, and the local air velocity over the surface. The higher the air velocity over the surface and the cooler the air, the more efficient is the resulting cooling. The nature of the airflow can also enhance heat transfer via convection. Turbulent flow can provide improvement over laminar flow. In the case of a heatsink, the surface exposed to the flow includes in particular the fin faces and the heatsink base. Active heatsinks typically incorporate a fan that helps manage the airflow through the heatsink. Passive heatsink solutions require in-depth knowledge of the airflow in the chassis. Typically, passive heatsinks see lower air speed. These heatsinks are therefore usually larger (and heavier) than active heatsinks due to the increase in the fin surface required to meet the required performance. As the heatsink fin density (the number of fins in a given cross-section) increases, the resistance to the airflow increases: it is more likely that the air travels around the heatsink instead of through it, unless air bypass is carefully managed. Using air-ducting techniques to manage the bypass area can be an effective method for controlling airflow through the heatsink. Thermal/Mechanical Design Guide October Reference Number: US

15 5.0 Thermal Solution Requirements Heatsink Size The size of the heatsink is dictated by height restrictions for installation in a system and by the space available on the motherboard and other considerations for component height and placement in the area potentially impacted by the heatsink. The height of the heatsink must comply with the requirements and recommendations published for the motherboard form factor of interest. See the form factor specifications for height restrictions. Links to some of these specifications are listed in Section 1.3, Reference Documents. All reference thermal solutions keep-out zones for multiple form factors are shown in Appendix B. The resulting space available above the motherboard is generally not entirely available for the heatsink. The target height of the heatsink must take into account airflow considerations (for fan performance for example) as well as other design considerations (air duct, etc.) Heatsink Mass With the need for pushing air cooling to better performance, heatsink solutions tend to grow larger (increase in fin surface) resulting in increased weight. The insertion of highly thermally conductive materials, like copper, to increase heatsink thermal conduction performance results in even heavier solutions. The heatsink weight must take into consideration the package load limits, the heatsink attach mechanical capabilities, and the mechanical shock and vibration profile targets. Beyond a certain heatsink weight, the cost of developing and implementing a heatsink attach mechanism that can ensure the system integrity under the mechanical shock and vibration profile targets may become prohibitive System Level Thermal Solution Considerations The heat generated by components within the chassis must be removed to provide an adequate operating environment for both the processor and other system components. Moving air through the chassis brings in air from the external ambient environment and transports the heat generated by the processor and other system components out of the system. The number, size and relative position of fans and vents determine the chassis thermal performance, and the resulting ambient temperature around the processor. The size and type (passive or active) of the thermal solution and the amount of system airflow can be traded off against each other to meet specific system design constraints. Additional constraints are board layout, spacing, component placement, acoustic requirements and structural considerations that limit the thermal solution size. For more information, see the appropriate form factors Thermal Design Suggestions. In addition to passive heatsinks, fan heatsinks, and system fans, other solutions exist for cooling integrated circuit devices. For example, ducted blowers, heat pipes and liquid cooling are all capable of dissipating additional heat. Due to their varying attributes, each of these solutions may be appropriate for a particular system implementation. To develop a reliable, cost-effective thermal solution, thermal characterization and simulation should be carried out at the entire system level, accounting for the thermal requirements of each component. In addition, acoustic noise constraints may limit the size, number, placement, and types of fans that can be used in a particular design. 5.2 Characterizing the Thermal Solution Requirement The idea of a thermal characterization parameter, Ψ (greek letter Psi), is a convenient way to characterize the performance needed for the thermal solution and to compare thermal solutions in identical situations (i.e. heating source, local ambient conditions, etc.). The thermal characterization parameter is calculated using total package power, October 2008 Thermal/Mechanical Design Guide Reference Number: US 15

16 5.0 Thermal Solution Requirements whereas actual thermal resistance, Θ (theta), is calculated using actual power dissipated between two points. Measuring actual power dissipated into the heatsink is difficult, since some of the power is dissipated via heat transfer into the package and the board. The case-to-local ambient thermal characterization parameter (Ψ CA ) is used as a measure of the thermal performance of the overall thermal solution. Ψ CA is measured in units of C/W and defined by the following equation: Equation 5-1.Case-to-Local Ambient Thermal Characterization Parameter (Ψ CA ) TCASE TLA ΨCA= TDP The case-to-local ambient thermal characterization parameter, Ψ CA, is comprised of Ψ CS, the thermal interface material thermal characterization parameter, and of Ψ SA, the sink-to-local ambient thermal characterization parameter. Ψ CA is defined by the following equation: Equation 5-2.Case-to-Local Ambient Thermal Characterization Parameter Ψ = Ψ + Ψ CA CS SA Ψ CS is strongly dependent on the thermal conductivity and thickness of the TIM between the heatsink and device package. Ψ SA is a measure of the thermal characterization parameter from the bottom of the heatsink to the local ambient air. Ψ SA is dependent on the heatsink material, thermal conductivity, and geometry. Ψ SA is also strongly dependent on the air velocity through the fins of the heatsink. Figure 5-1 illustrates the combination of the different thermal characterization parameters. Figure 5-1. Processor Thermal Characterization Parameter Relationship T A Ψ SA Ψ CA TIM Device T S T C Ψ CS Example: Calculating the Required Thermal Performance for The cooling performance,ψ CA, is then defined using the thermal characterization parameter previously described. The process to determine the required thermal performance to cool the device includes: Thermal/Mechanical Design Guide October Reference Number: US

17 5.0 Thermal Solution Requirements Define a target component temperature T CASE and corresponding TDP. Define a target local ambient temperature, T LA. Use Equation 5-1 and Equation 5-2 to determine the required thermal performance needed to cool the device. The following example illustrates how to determine the appropriate performance targets: Note: The following example illustrates how to calculate the thermal resistance. The TDP and T C-MAX used in the example may not be the actual specifications of the device. See the Datasheet for actual power and temperature specifications. Assume: TDP = 13.0 W & T CASE-MAX = 100 C Local processor ambient temperature, T LA = 55 C. Then the following could be calculated using Equation 5-1 for the given processor frequency: T T ο CASE MAX LA Ψ C CA = = = 3.46 TDP 13.0 W To determine the required heatsink performance, a heatsink solution provider would need to determine Ψ CS performance for the selected TIM and mechanical load configuration. If the heatsink solution were designed to work with a TIM material performing at Ψ CS 0.1 C/W, solving for Ψ SA from Equation 5-2, the performance needed from the heatsink is: ο Ψ C SA = Ψ CA Ψ CS = = 2.46 W If the local ambient temperature is relaxed to 40 C, the same calculation can be carried out to determine the new case-to-ambient thermal resistance: TC TLA ο Ψ C CA = = = 4.62 TDP 13.0 W It is evident from the above calculations that a reduction in the local ambient temperature has a significant effect on the case-to-ambient thermal resistance requirement. This effect can contribute to a more reasonable thermal solution including reduced cost, heatsink size, heatsink weight, and a lower system airflow rate. Table 5-1 summarizes the thermal budget required to adequately cool Intel EP80579 Integrated Processor product line. Since the results are based on air data at sea level, a correction factor would be required to estimate the thermal performance at other altitudes. Table 5-1. Required Heatsink Thermal Performance (Ψ CA ) SKU Ψ CA (ºC/W) at T LA = 55ºC 1 Ψ CA (ºC/W) at T LA = 60ºC 1 Ψ CA (ºC/W) at T LA = 85ºC 1 2 (600 MHz, 11 W) N/A 8 (600 MHz, 11 W, Industrial Temp) N/A N/A (1066 MHz, 18 W) N/A 6 (1200 MHz, 19 W) N/A October 2008 Thermal/Mechanical Design Guide Reference Number: US 17

18 5.0 Thermal Solution Requirements Table 5-1. Required Heatsink Thermal Performance (Ψ CA ) SKU Ψ CA (ºC/W) at T LA = 55ºC 1 Ψ CA (ºC/W) at T LA = 60ºC 1 Ψ CA (ºC/W) at T LA = 85ºC 1 1 (600 MHz, 13 W) N/A 3 (1066 MHz, 20 W) N/A 7 (1066 MHz, 20 W, Industrial Temp) N/A N/A (1200 MHz, 21 W) N/A Notes: 1. Local ambient temperature (T LA ) is measured approximately 1 directly upstream of the component thermal solution. 2. Ψ CA calculations will change if T C-MAX, TDP or T LA is changed. Thermal/Mechanical Design Guide October Reference Number: US

19 6.0 Reference Heatsinks 6.0 Reference Heatsinks Intel has developed reference heatsinks designed to meet the cooling needs of Intel EP80579 Integrated Processor product line in embedded form factor applications. This chapter describes the overall requirements for the reference thermal solution including critical-to-function dimensions, operating environment, and verification criteria. This document details solutions that are compatible with the AdvancedTCA*, Advanced Mezzanine Card/Small Form Factor Blade, 1U+, 1U+ for Industrial Temperature environments, and Print Imaging form factors. The reference heatsink designs are not suitable for natural convection cooling and require a prescribed amount of system airflow. The system designer must ensure that suitable airflow is provided when using the reference heatsinks. A third party active heatsink (fan included) is available. Appendix A, Thermal Solution Component Suppliers contains vendor information for each component. Most of the heatsinks are attached to the board using a clip with each end hooked through an anchor soldered to the board. Figure 6-1 illustrates an example of the thermal solution assembly. Detailed mechanical drawings of the heatsinks and clip are provided in Appendix B, Mechanical Drawings. The AdvancedMC/Small Form Factor heatsink is attached with spring loaded screws and a backplate. See the drawing in Appendix B, Mechanical Drawings for more information. The performance curves for each reference heatsink are based on using the Honeywell* PCM45F Thermal Interface Material. A system designer may choose to use a different TIM as long and the thermal performance requirements and the component temperature specifications are satisfied. 6.1 AdvancedTCA* Reference Heatsink This reference heatsink is compatible with the AdvancedTCA and larger form factors. Figure 6-2 demonstrates the heatsink thermal performance at various airflow rates. Equation 5-1 and Equation 5-2 can be used to determine the acceptable ambient temperature range in which this heatsink can be used Mechanical Design The reference heatsink is shown in Figure 6-1. The maximum heatsink height is constrained to 16.7 mm for the AdvancedTCA Form Factor, which enables use in most embedded form factors. The heatsink uses the torsional clip assembly (refer to Section 6.6) to mount to the PCB. Detailed drawings of this heatsink are provided in Appendix B, Mechanical Drawings. October 2008 Thermal/Mechanical Design Guide Reference Number: US 19

20 6.0 Reference Heatsinks Figure 6-1. AdvancedTCA* Reference Thermal Solution Assembly Keep Out Zone Requirements The PCB keep-out zones for this heatsink assembly are shown in Appendix B, Mechanical Drawings Thermal Performance The reference thermal solution is an extruded aluminum heatsink. The heatsink performance versus airflow velocity is shown in Figure 6-2. Based on the target boundary conditions, this heatsink can meet the thermal performance needed to cool the Intel EP80579 Integrated Processor product line in the AdvancedTCA form factor and meet the NEBS short term operating ambient temperature of 55 C. See the performance curve for the required amount of airflow. However, it is up to the system designer to validate the entire thermal solution (heatsink, attach method, TIM) in its final intended system. The performance data is based on lab verification testing. The airflow approach velocity is measured approximately 1 upstream of the thermal solution. Thermal/Mechanical Design Guide October Reference Number: US

21 6.0 Reference Heatsinks Figure 6-2. AdvancedTCA* Reference Heatsink Thermal Performance ATCA Heatsink Performance Case-to-Ambient Thermal Characterization Parameter ΨCA ( C/W) Airflow Approach Velocity (LFM) ATCA Heatsink 6.2 Small Form Factor Reference Heatsink This reference heatsink is compatible with smaller embedded form factors (i.e. AdvancedMC*). Figure 6-4 demonstrates the heatsink thermal performance at various airflow rates. Equation 5-1 and Equation 5-2 can be used to determine the acceptable ambient temperature range at which this heatsink can be used based on available airflow Mechanical Design The small form factor reference thermal solution is shown in Figure 6-3. The maximum heatsink height is constrained to 6.5mm, which enables use in common small form factors such as Compact PCI* and mezzanine cards. The heatsink uses spring loaded screws and a backplate to mount to the PCB. Detailed drawings of this heatsink are provided in the Appendix B, Mechanical Drawings. October 2008 Thermal/Mechanical Design Guide Reference Number: US 21

22 6.0 Reference Heatsinks Figure 6-3. Small Form Factor Reference Thermal Solution Assembly Additional Keep Out Zone Requirements The PCB keep-out zones are shown in Appendix B, Mechanical Drawings Thermal Performance The material for the small form factor reference heatsink is copper. Based on the boundary conditions, this heatsink can meet the thermal performance needed to cool Intel EP80579 Integrated Processor product line in small form factors and meet the NEBS short term operating ambient temperature of 55 C. See the performance curve for the required amount of airflow. However, it is up to the system designer to validate the entire thermal solution (heatsink, attach method, TIM) in its final intended system. The data shown in Figure 6-4 is based on lab verification test data. Thermal/Mechanical Design Guide October Reference Number: US

23 6.0 Reference Heatsinks Figure 6-4. Small Form Factor Reference Heatsink Thermal Performance versus Airflow Rate AdvancedMC/SFF Heatsink Performance Case-to-Ambient Thermal Characterization Parameter, Ψ CA ( C/W) Airflow Approach Velocity (LFM) SFF Heatsink 6.3 1U Form Factor Reference Heatsinks Two reference heatsinks are compatible with 1U and larger form factors. One heatsink is for typical server applications designed for a local ambient temperature of 60 C. The second heatsink is larger and is designed for market segments that require extended temperature support for a local ambient temperature up to 85 C. Note: Some SKUs of Intel EP80579 Integrated Processor product line do not have industrial temperature support. See the Datasheet for more information. Figure 6-7 and Figure 6-8 demonstrates the heatsink thermal performance at various airflow rates for the 1U heatsinks. Equation 5-1 and Equation 5-2 can be used to determine the acceptable ambient temperature range at which this heatsink can be used based on available airflow. October 2008 Thermal/Mechanical Design Guide Reference Number: US 23

24 6.0 Reference Heatsinks Mechanical Design The 1U form factor reference thermal solutions are shown in Figure 6-5 and Figure 6-6. The maximum heatsink height is constrained to 29 mm, which enables use in the 1U SSI* and larger form factors. The heatsinks use the torsional clip assembly (refer to Section 6.6) to mount to the PCB. Detailed drawings of this heatsink are provided in the Appendix B, Mechanical Drawings. Figure U+ Reference Thermal Solution Assembly Figure U+ Industrial Temperature Thermal solution Assembly Keep Out Zone Requirements The PCB keep-out zones are shown in Appendix B, Mechanical Drawings. Thermal/Mechanical Design Guide October Reference Number: US

25 6.0 Reference Heatsinks Thermal Performance The 1U form factor reference heatsinks are designed to be aluminum extrusions to allow for lower cost. Based on the boundary conditions, both heatsinks can meet the thermal performance needed to cool Intel EP80579 Integrated Processor product line in their target ambient temperatures. However, it is up to the system designer to validate the entire thermal solution (heatsink, attach method, TIM) in its final intended system. The performance charts show in Figure 6-7 and Figure 6-8 show thermal performance versus volumetric airflow rate. The airflow in these cases is fully ducted through the heatsink fins. In the case where the thermal solution is does not have fully ducted airflow, one can expect a slight loss in heatsink performance due to airflow bypass. The performance shown is based lab verification test data. Figure U Form Factor Reference Heatsink Thermal Performance 1U Heatsink Performance 4.50 Case-to-Ambient Thermal Characterization Parameter, ΨCA ( C/W) Airflow Through Fins (CFM) 1U Heatsink October 2008 Thermal/Mechanical Design Guide Reference Number: US 25

26 6.0 Reference Heatsinks Figure U Industrial Temperature Reference Heatsink Thermal Performance 1U Industrial Temp Heatsink Performance Case-to-Ambient Thermal Characterization Parameter, ΨCA ( C/W) Airflow Through Fins (CFM) Extended Temp Heatsink 6.4 Print Imaging Reference Heatsink This reference heatsink is compatible for the print imaging market. Figure 6-10 demonstrates the heatsink thermal performance at various airflow rates. Equation 5-1 and Equation 5-2 can be used to determine the acceptable ambient temperature range that this heatsink can be used Mechanical Design The print imaging reference thermal solution is shown in Figure 6-9. The maximum heatsink height is constrained to 25.4 mm, which enables use in a typical print imaging form factor. The heatsink uses the torsional clip assembly (refer to Section 6.6) to mount to the PCB. Detailed drawings of this heatsink are provided in the Appendix B, Mechanical Drawings. Thermal/Mechanical Design Guide October Reference Number: US

27 6.0 Reference Heatsinks Figure 6-9. Print Imaging Reference Thermal Solution Assembly Keep Out Zone Requirements The PCB keep-out zones are shown in Appendix B, Mechanical Drawings Thermal Performance The print imaging reference heatsink is an aluminum extruded heatsink. Based on the boundary conditions, the heatsink will meet the thermal performance needed to cool Intel EP80579 Integrated Processor product line in a target ambient temperature of 60 C. See the performance curve for the required amount of airflow. However, it is up to the system designer to validate the entire thermal solution (heatsink, attach method, TIM) in its final intended system. The data shown in Figure 6-10 is based on lab verification test data. October 2008 Thermal/Mechanical Design Guide Reference Number: US 27

28 6.0 Reference Heatsinks Figure Print Imaging Reference Heatsink Thermal Performance versus Airflow Rate Print Imaging Heatsink Performance Case-to-Ambient Thermal Characterization Parameter, ΨCA ( C/W) Approach Airflow Velocity (LFM) Print Imaging Heatsink 6.5 Active Heatsink An active heatsink that meets the thermal and mechanical requirements for Intel EP80579 Integrated Processor product line is available by third party vendors. The heatsink is suitable for bench top use as well as other applications where system airflow isn't available. The contact information for third party active heatsinks is available in Appendix A, Thermal Solution Component Suppliers. This performance for the active heatsink is: 1.25 C/W Keep Out Zone Requirements The PCB keep-out zones are shown in Appendix B, Mechanical Drawings. 6.6 Torsional Clip Some of the reference solutions use wire clips with hooked ends. The hooks attach to wire anchors to fasten the clip to the board. One instance of the torsional clip is shown in Figure 6-1, see the detailed mechanical drawings in Appendix B, Mechanical Drawings. Thermal/Mechanical Design Guide October Reference Number: US

29 6.0 Reference Heatsinks 6.7 Solder-Down Anchors The torsional clip uses a solder-down anchor to attach to the board. It is based on a standard three-pin jumper and is soldered to the board like any common through-hole header. The anchor design includes 45 bent leads to increase the anchor attach reliability over time. See Appendix A, Thermal Solution Component Suppliers for the part number and supplier information. 6.8 Heatsink Orientation Since the Intel EP80579 Integrated Processor product line thermal solutions are based on uni-directional heatsinks, airflow direction must be aligned with the direction of the fins of the heatsink. Figure B.3, Figure B.9 Figure B.14 and Figure B.17 in the appendix illustrate the orientation of the package, solder-down anchors, and heatsink relative to the system airflow. 6.9 Thermal Interface Material (TIM) The thermal interface material provides improved conductivity between the IHS and heatsink. It is important to understand and consider the impact of the interface between the IHS and heatsink base to the overall thermal solution. Specifically, the bond line thickness, interface material area, and interface material thermal conductivity must be selected to optimize the thermal solution. It is important to minimize the thickness of the thermal interface material (TIM), commonly referred to as the bond line thickness. A large gap between the heatsink base and the die yields a greater thermal resistance. The thickness of the gap is determined by the flatness of both the heatsink base and the IHS, plus the thickness of the thermal interface material, and the clamping force applied by the heatsink attachment method. To ensure proper and consistent thermal performance, the TIM and application process must be properly designed. The Intel EP80579 Integrated Processor product line reference thermal solutions use the Honeywell* PCM45F. Alternative materials can be used at the user's discretion. Regardless, the entire heatsink assembly, including the heatsink, and TIM (including attach method), must be validated together for specific applications. October 2008 Thermal/Mechanical Design Guide Reference Number: US 29

30 7.0 Thermal Metrology 7.0 Thermal Metrology The system designer must make measurements to accurately determine the performance of the thermal solution. The heatsink designs should be validated using a thermal test vehicle. The thermal test vehicle is a device that simulates the thermal characteristics of Intel EP80579 Integrated Processor product line. It is also recommended to perform a final verification test of the heatsink with an actual Intel EP80579 Integrated Processor product line in a real-working environment. This chapter provides guidelines on techniques to perform thermal tests, including: Section 7.1, which provides guidelines on how to accurately measure the component temperature. Section 7.3, which details the use of the thermal test vehicle. Section 7.4, which includes information about running power simulation software that will emulate anticipated thermal design powers on an actual Intel EP80579 Integrated Processor product line. 7.1 T CASE Temperature Measurements The component T CASE must be maintained at or below the maximum temperature specification as noted in Table 3-1. The surface temperature at the geometric center of the IHS corresponds to T CASE. Measuring T CASE requires special care to ensure an accurate temperature measurement. Temperature differences between the temperature of a surface and the surrounding local ambient air can introduce errors in the measurements. The measurement errors could be attributed to any of the following: a poor thermal contact between the thermocouple junction and the surface of the package. heat loss by radiation and/or convection. heat loss by conduction through thermocouple leads. contact between the thermocouple attachment epoxy and the heatsink base. To maximize measurement accuracy, only the thermocouple attach approach that is outlined in the following subsections should be used Supporting Test Equipment To apply the reference thermocouple attach procedure, use the equipment (or equivalent) listed in Table 7-1. Thermal/Mechanical Design Guide October Reference Number: US

31 7.0 Thermal Metrology Table 7-1. Recommended Thermocouple Attach Equipment Item Description Part Number Measurement and Output Microscope Olympus* Light microscope or equivalent SZ-40 Digital Multi-meter Digital Multi-meter for resistance measurement Not Available Test Fixture Micromanipulator* (see note) Micromanipulator set from YOU Ltd.* or equivalent Mechanical 3D arm with needle (not included) to maintain thermocouple bead location during the attach process Miscellaneous Hardware YOU-3 Loctite Super Bonder* 498 Thermal Cycling Resistant Instant Adhesive Super Glue with thermal characteristics Adhesive Accelerator Loctite 7452* for fast glue curing Kapton* Tape For holding thermocouple in place or equivalent Not Available Thermocouple Omega, 36 gauge, T Type 5SRTC-TT Calibration and Control Ice Point* Cell Hot Point* Cell Omega, stable 0 C temperature source for calibration and offset Omega, temperature source to control and understand meter slope gain TRClll CL950-A-110 Note: Three axes set consists of (one each U-31CF), (one each UX-6-6), (one each USM6), and (one each UPN-1). More information is available at you/english/products/set/you-3set.htm Thermal Calibration and Control Full and routine calibration of temperature measurement equipment should be performed before attempting to perform temperature case measurements of Intel EP80579 Integrated Processor product line. Intel recommends checking the meter probe against known standards. This should be done at 0 C (using ice bath or other stable temperature source) and at an elevated temperature, around 80 C (using an appropriate temperature source). Wire gauge and length also should be considered, as some less expensive measurement systems are heavily impacted by impedance. There are numerous resources available throughout the industry to assist with implementation of proper controls for thermal measurements. Note: Note: Follow company standard procedures, such as wearing safety glasses and gloves, when cutting the IHS and handling chemicals. Ask your Intel field sales representative if you need assistance to groove and/or install a thermocouple according to the processes in this chapter IHS Groove Cut a groove in the package IHS according to the drawing in Figure 7-1. October 2008 Thermal/Mechanical Design Guide Reference Number: US 31

32 7.0 Thermal Metrology Figure 7-1. IHS Groove Thermal/Mechanical Design Guide October Reference Number: US

33 7.0 Thermal Metrology Figure 7-2. Orientation of Thermocouple Groove Relative to Package Pin Thermocouple Conditioning and Preparation 1. Use a calibrated thermocouple as specified in Table Measure the thermocouple resistance by holding both wires on one probe and the tip of thermocouple to the other probe of the DMM (compare to thermocouple resistance specifications). 3. Straighten the wire for about 3.8 mm (1.5 inch) from the bead to place it inside the channel. 4. Bend the tip of the thermocouple to approximately a 45 degree angle by 0.8 mm (0.030 inch) from the tip (Figure 7-3). Figure 7-3. Bending the Tip of the Thermocouple Thermocouple Attachment to the IHS Caution: To avoid the impact on the thermocouple during the SMT process, reflow must be performed before attaching the thermocouple to the grooved IHS. 1. Clean the thermocouple wire groove with isopropyl alcohol (IPA) and a lint free cloth, removing all residues prior to thermocouple attachment. October 2008 Thermal/Mechanical Design Guide Reference Number: US 33

34 7.0 Thermal Metrology 2. Place the thermocouple wire inside the groove letting the exposed wire and bead extend about 3.2 mm (0.125 inch) past the end of the groove. Secure it with Kapton tape (Figure 7-4). 3. Lift the wire at the middle of the groove with tweezers and bend the front of the wire to place the thermocouple in the channel, ensuring the tip is in contact with the end of the channel grooved in the IHS (Figure 7-5, A and B). 4. Place the package under the microscope unit (similar to the one used in Figure 7-7) to continue with the process. Use a fixture to help hold the unit in place during the rest of the attach process. 5. Press the wire down about 6 mm (0.236 inch) from the thermocouple bead using the tweezers. Look in the microscope to perform this task. Place a piece of Kapton* tape to hold the wire inside the groove (Figure 7-7). See Figure 7-6 for detailed bead placement. 6. Using the micromanipulator, place the needle near to the end of groove on top of thermocouple. Using the X, Y, and Z axis on the arm, place the tip of the needle on top of the thermocouple bead. Press down until the bead is seated at the end of the groove on top of the set (see Figure 7-6 and Figure 7-7). 7. Measure resistance from thermocouple end wires (hold both wires to a DMM probe) to the IHS surface. This should be the same value as measure during the thermocouple conditioning. See step 2 in Section 7.1.4, Thermocouple Conditioning and Preparation on page 33 and Figure Place a small amount of Loctite 498* adhesive in the groove where the bead is installed. Using a fine point device, spread the adhesive in the groove around the needle, the thermocouple bead, and the thermocouple wires already installed in the groove. Be careful not to move the thermocouple bead during this step (Figure 7-6). Figure 7-4. Securing Thermocouple Wires with Kapton Tape Prior to Attach Thermal/Mechanical Design Guide October Reference Number: US

35 7.0 Thermal Metrology Figure 7-5. Thermocouple Bead Placement Figure 7-6. Position Bead on the Groove Step October 2008 Thermal/Mechanical Design Guide Reference Number: US 35

36 7.0 Thermal Metrology Figure 7-7. Using 3D Micromanipulator to Secure Bead Location Figure 7-8. Measuring Resistance Between Thermocouple and IHS Thermal/Mechanical Design Guide October Reference Number: US

37 7.0 Thermal Metrology Figure 7-9. Applying the Adhesive on the Thermocouple Bead Curing Process and Thermocouple Wire Management 1. Let the thermocouple attach dry in the open air for at least 30 minutes. When using a curing accelerator, such as Loctite 7452* accelerator, for this step is not recommended. Rapid contraction of the adhesive during curing may weaken the bead attachment on the IHS. 2. Reconfirm electrical connectivity with DMM before removing the micromanipulator (Figure 7-8) (see Section 7.1.4, step 2). 3. Remove the 3D arm needle by holding down the package and lifting the arm. 4. Remove the Kapton tape, straighten the wire in the groove so the wire is flat all the way to the end of the groove (Figure 7-10). 5. Using a blade, shave excess adhesive above the IHS surface (Figure 7-11). Caution: Take precautions when using open blades. 6. Install new Kapton tape to hold the thermocouple wire down and fill the rest of groove with adhesive (Figure 7-12). Make sure the wire and insulation is entirely within the groove and below the IHS surface. 7. Curing time for the rest of the adhesive in the groove can be reduced using an accelerator, such as Loctite 7452 accelerator. 8. Repeat step 5 to remove any excess adhesive. This is to ensure the IHS is flat for proper mechanical contact with the heatsink surface. October 2008 Thermal/Mechanical Design Guide Reference Number: US 37

38 7.0 Thermal Metrology Figure Thermocouple Wire Management in the Groove Figure Removing Excess Adhesive from the IHS Thermal/Mechanical Design Guide October Reference Number: US

39 7.0 Thermal Metrology Figure Filling the Groove with Adhesive 7.2 Local Ambient Temperature Measurement Guidelines The local ambient temperature (T LA ) is the temperature of the ambient air surrounding the processor. For a passive heatsink, T LA is defined as the heatsink approach air temperature; for an actively cooled heatsink, it is the temperature of inlet air to the active cooling fan. It is worthwhile to determine the local ambient temperature in the chassis around the processor to understand the effect it may have on the case temperature. T LA is best measured by averaging temperature measurements at multiple locations in the heatsink inlet airflow. This method helps reduce error and eliminate minor spatial variations in temperature. The following guidelines are meant to enable accurate determination of the localized air temperature around the processor during system thermal testing Active Heatsink Measurements It is important to avoid taking measurements in the dead flow zone that usually develops above the fan hub and hub spokes. Measurements should be taken at four different locations uniformly placed at the center of the annulus formed by the fan hub and the fan housing to evaluate the uniformity of the air temperature at the fan inlet. The thermocouples should be placed approximately 3 mm to 8 mm [0.1 to 0.3 in] above the fan hub vertically and halfway between the fan hub and the fan housing horizontally as shown in Figure 7-13 (avoiding the hub spokes). Using an open bench to characterize an active heatsink can be useful, and usually ensures more uniform temperatures at the fan inlet. However, additional tests that include a solid barrier above the test motherboard surface can help evaluate the potential impact of the chassis. This barrier is typically clear Plexiglas*, extending at least 100 mm [4 in.] in all directions beyond the edge of the thermal solution. Typical distance from the motherboard to the barrier is 81 mm [3.2 in.] (this distance can be shortened for more constrained form factors). If a barrier is used, the thermocouple can be taped directly to the barrier with clear tape at the horizontal location as previously described, halfway between the fan hub and the fan housing. For even more realistic airflow, the motherboard should be populated with significant elements like memory cards, graphic card, and chipset heatsink. If a October 2008 Thermal/Mechanical Design Guide Reference Number: US 39

40 7.0 Thermal Metrology variable speed fan is used, it may be useful to add a thermocouple taped to the barrier above the location of the temperature sensor used by the fan to check its speed setting against air temperature. When measuring T LA in a chassis with a live motherboard, add-in cards, and other system components, it is likely that the T LA measurements will reveal a highly non-uniform temperature distribution across the inlet fan section. Note: Testing an active heatsink with a variable speed fan can be done in a thermal chamber to capture the worst-case thermal environment scenarios. Otherwise, when doing a bench top test at room temperature, the fan regulation prevents the heatsink from operating at its maximum capability. To characterize the heatsink capability in the worst-case environment in these conditions, it is then necessary to disable the fan regulation and power the fan directly, based on guidance from the fan supplier. Figure Measuring T LA with an Active Heatsink Note: Drawings are not to scale Passive Heatsink Measurements Thermocouples should be placed approximately 13 mm to 25 mm [0.5 to 1.0 in] away from processor and heatsink as shown in Figure Thermal/Mechanical Design Guide October Reference Number: US

41 7.0 Thermal Metrology The thermocouples should be placed approximately 51 mm [2.0 in] above the baseboard. This placement guideline is meant to minimize the effect of localized hot spots from baseboard components. The height above the board may vary depending on the height of the thermal solution and form factor. Note: The location for measuring T LA is also the recommended location for measuring airflow approach velocity for a passive heatsink. Figure Measuring T LA with a Passive Heatsink Note: Drawing not to scale 7.3 Thermal Test Vehicle The thermal test vehicle is designed to simulate the thermal characteristics of Intel EP80579 Integrated Processor product line. However, the device is not a functional Intel EP80579 Integrated Processor product line. Using a custom test board provided with the TTV, the power into the device can be accurately controlled. Using the method described in Section 7.1, the thermal performance of the heatsink can be determined. Contact your Intel field representative to obtain a Thermal Test Vehicle. 7.4 Power Simulation Software The power simulation software is a utility designed to dissipate the thermal design power on Intel EP80579 Integrated Processor product line. To assess the thermal performance of Intel EP80579 Integrated Processor product line thermal solution under worst-case realistic application conditions, Intel has developed a software utility that stresses Intel EP80579 Integrated Processor product line at various power up to and exceeding TDP. The Power Thermal Utility program is available from your Intel representative. October 2008 Thermal/Mechanical Design Guide Reference Number: US 41

42 8.0 Reliability Guidelines 8.0 Reliability Guidelines The mechanical loading of Intel EP80579 Integrated Processor product line might vary by motherboard, heatsink and attach combination. Carefully evaluate the reliability of the completed assembly before high-volume use. Table 8-1 provides some general recommendations. Table 8-1. Reliability Requirements Test (1) Requirement Pass/Fail Criteria (2) Mechanical Shock Random Vibration 50 g, board level, 11 msec, three shocks/axis 7.3 g, board level, 45 min/axis, 50 Hz to 2000 Hz Visual Check and Electrical Functional Test Visual Check and Electrical Functional Test Temperature Life 85 C, 2000 hours total, checkpoints at 168, 500, 1000, and 2000 hours Visual Check Thermal Cycling -5 C to +70 C, 500 cycles Visual Check Humidity 85% relative humidity, 55 C, 1000 hours Visual Check Notes: 1. The above tests should be performed on a sample size of at least 12 assemblies from three lots of material. 2. Additional pass/fail criteria may be added at the discretion of the user. Thermal/Mechanical Design Guide October Reference Number: US

43 Appendix A Thermal Solution Component Suppliers A.1 Reference Heatsink Table 8-2. Suppliers Part Intel Part Number Supplier / Part Number Contact Information AdvancedTCA* Heatsink D Small Form Factor Heatsink E U Form Factor Heatsink assembly 1U Extended Temperature Heatsink D D Print Imaging Heatsink D Active Heatsink D Thermal Interface PCM45F C Heatsink Attach Clip D10234 Solder-Down Anchor A Note: Cooler Master* ECC GP Cooler Master ECC GP CCI CCC C872401A Cooler Master ECC GP Cooler Master ECC GP Cooler Master ECB GP Honeywell* PCM45F CCI/ACK Foxconn* Foxconn (HB96030-DW) Wendy Lin ext 211 wendy@coolermaster.com Wendy Lin ext 211 wendy@coolermaster.com Harry Lin (USA) hlinack@aol.com Monica Chih (Taiwan) , x131 monica_chih@ccic.com.tw Wendy Lin ext 211 wendy@coolermaster.com Wendy Lin ext 211 wendy@coolermaster.com Wendy Lin ext 211 wendy@coolermaster.com Paula Knoll paula.knoll@honeywell.com Harry Lin (USA) hlinack@aol.com Monica Chih (Taiwan) , x131 monica_chih@ccic.com.tw Bob Hall (USA) , x235 bhall@foxconn.com Julia Jiang (USA) juliaj@foxconn.com The enabled components currently may not be available from all suppliers. Contact the supplier directly to verify component availability. October 2008 Thermal/Mechanical Design Guide Reference Number: US 43

44 Appendix B Mechanical Drawings This appendix contains the following mechanical drawings: Appendix B, AdvancedTCA* Heatsink Assembly Appendix B, AdvancedTCA* Heatsink Appendix B, AdvancedTCA*, 1U and Active Heatsink Keep-Out Zone Appendix B, 1U Heatsink Assembly Appendix B, 1U Heatsink (Sheet 1) Appendix B, 1U Heatsink (Sheet 2) Appendix B, 1U Industrial Temperature Heatsink Assembly Appendix B, 1U Industrial Temperature Heatsink Appendix B, 1U Industrial Temperature Keep-Out Zone Appendix B, AdvancedMC*/Small Form Factor Heatsink Assembly Appendix B, AdvancedMC/Small Form Factor Heatsink Appendix B, AdvancedMC/Small Form Factor Heatsink Backplate Appendix B, AdvancedMC/Small Form Factor Fastener Appendix B, AdvancedMC/Small Form Factor Keep-Out Zone Appendix B, Print Imaging Heatsink Assembly Appendix B, Print Imaging Heatsink Appendix B, Print Imaging PCB Keep-Out Zone Appendix B, Heatsink Torsional Clip Thermal/Mechanical Design Guide October Reference Number: US

45 B.1 AdvancedTCA* Heatsink Assembly October 2008 Thermal/Mechanical Design Guide Reference Number: US 45

46 B.2 AdvancedTCA* Heatsink Thermal/Mechanical Design Guide October Reference Number: US

47 B.3 AdvancedTCA*, 1U and Active Heatsink Keep-Out Zone October 2008 Thermal/Mechanical Design Guide Reference Number: US 47

48 B.4 1U Heatsink Assembly Thermal/Mechanical Design Guide October Reference Number: US

49 B.5 1U Heatsink (Sheet 1) October 2008 Thermal/Mechanical Design Guide Reference Number: US 49

50 B.6 1U Heatsink (Sheet 2) Thermal/Mechanical Design Guide October Reference Number: US

51 B.7 1U Industrial Temperature Heatsink Assembly October 2008 Thermal/Mechanical Design Guide Reference Number: US 51

52 B.8 1U Industrial Temperature Heatsink Thermal/Mechanical Design Guide October Reference Number: US

53 B.9 1U Industrial Temperature Keep-Out Zone October 2008 Thermal/Mechanical Design Guide Reference Number: US 53

54 B.10 AdvancedMC*/Small Form Factor Heatsink Assembly Thermal/Mechanical Design Guide October Reference Number: US