Hardened Hybrid. Hybrid Air/Conduction Cooled MicroTCA.2 Thermal Test Report. March 19, 2012 Revision 1.0. Written by: Approved by:
|
|
- Samuel Doyle
- 6 years ago
- Views:
Transcription
1 Hardened Hybrid Hybrid Air/Conduction Cooled MicroTCA.2 Thermal Test Report March 19, 2012 Revision 1.0 Written by: James Chan, BAE Systems Mark Leibowitz, BAE Systems Eike Waltz, Elma Electronic Inc. Approved by: Michael Borthwick, BAE Systems Jon Leach, BAE Systems Fred Fons, Foxconn David Pursley, Kontron Paul Rutherford, Pentair/Schroff Rodney Bame, Wavetherm David Mosier, Wavetherm Steve Richardson, CBT Technology Vollrath Dirksen, NAT Saeed Karamooz, VadaTech
2 Revision March 19, 2012 EXECUTIVE SUMMARY The purpose of the testing conducted as described in this report was to identify and characterize the primary (forced-air) and the secondary (conduction) thermal performance contributions inherent in the proposed Hybrid Air/Conduction Cooled MicroTCA.2 specification. The clamshelled AMC module design defined in MicroTCA.2 has been leveraged, in large part, from the ratified MicroTCA.3 Hardened Conduction Cooled Specification. This partial duplication of design serves to ensure that the proposed MicroTCA.2 module/chassis systems will meet established Hardened MIL levels of shock and vibration. The wedge lock (card retainer) design concept is considered unique to the new specification by virtue of it allowing airflow through its cross section. Using two versions of a reference design chassis, one version with non-heat conductive sidewalls and one with traditional aluminum sidewalls, the testing characterized multiple combinations of low-power and high-power AMC thermal load modules (TLMs). Over three days of activity, various system setups generated an extensive data set, capturing chassis inlet airflow velocity, module slot airflow velocity, inlet ambient air temperatures, and module onboard sensor temperatures. Distillation of the test results confirms that a significant thermal dissipation benefit is provided by the secondary (conduction) heat sharing of MicroTCA.2 Hybrid cooling. While this benefit will vary by specific application, the testing documented a contribution of up to 33% in component temperature reduction as compared to standard MicroTCA.0/MicroTCA.1 forced air-only solutions (see Table 6). It is envisioned that thermal engineers and systems architects will choose to exploit this secondary (Hybrid) benefit differently some following the path of increased temperature headroom in the event of a forced air failure, others opting to reduce fan speeds or perhaps saving the investment for a rainy day processor upgrade. ES-1
3 Revision March 19, 2012 Table of Contents Section Page EXECUTIVE SUMMARY INTRODUCTION Scope Objective Applicable Documents Test Location and Schedule TEST SUMMARY AND CONCLUSIONS Deviations from Test Plan Summary of Cooling Effectiveness Sensor Temperature Comparison Airflow Temperature Comparison Conclusion TEST SETUP Thermal Test Chassis with Backplane Test Configurations Thermal Load Module (TLM) MicroTCA.2 AMC Characterization Module (MACM) Environmental Testing Conditions Tests Performed Test Sequence Flowchart Pretest Checkout TEST RESULTS CCS Test 1 Chassis Calibration MACM Test 2 Velocity Measurements HP-TLM Test Velocity Measurements HP-TLM Module Airflow Resistance and System Impedance HP-TLM Module Test 4a, b, c, d, e and f Temperature and Flow Measurements with Aluminum Chassis Test 5a, b, e and f Temperature and Flow Measurements with Plastic Chassis A.1 Test Setups... A-2 A.2 Test Modules... A-7 A.3 Supporting Drawings... A-9 A.3.1 Test Chassis... A-9 A.3.2 Test Modules... A-19 iii
4 Revision March 19, 2012 Figure List of Figures Page 1 3-Slot Thermal Test Chassis with Integrated Chassis Slot Sidewalls Notional View of HP-TLM, based on MicroTCA.2 High Power Module Notional View of MACM, based on MicroTCA.2 Low Power Module Blank MACM MicroTCA.2 Module Blank MACM MicroTCA.2 Module, Side View Thermocouple Placement Location of Temperature Sensors MicroTCA.2 Module Test Flow Slot Thermal Test Chassis Attached to Round Pressure Plate via Air Duct System Impedance Curve (three slots populated with HP-TLM modules) System Impedance Curve (single slot populated with HP-TLM module) A CFM Airflow Testing Chamber... A-2 A2 Airflow Nozzle Plate... A-2 A3 Blower Assembly Attached to Wind Tunnel... A-3 A4 Static Pressure Taps between Nozzle Array Plate... A-3 A5 Blast Gate with Controller... A-4 A6 Room Ambient Condition Monitor... A-4 A7 Setra Datum 2000 Pressure Meter... A-5 A8 Power Supplies and Test Laptop PC... A-5 A9 ATM2400 and Thermocouple Setup... A-6 A10 HP-TLM Test Module Topside... A-7 A11 HP-TLM Test Module Bottom Side... A-7 A12 Blank MACM MicroTCA.2 Test Module... A-8 A13 Blank MACM MicroTCA.2 Test Module, Side View... A-8 A14 Test Chassis Top Cover... A-9 A15 Test Chassis Front Cover... A-10 A16 Test Chassis, Exhaust Bracket... A-11 A17 Test Chassis, Sensor Bracket... A-12 A18 Test Chassis Sidewall, Right... A-13 A19 Test Chassis Sidewall, Left... A-14 A20 3-Slot Test Chassis Backplane... A-15 A21 Wind Tunnel Mounting Plate... A-16 A22 Upper Side Bracket Mount... A-17 A23 Lower Side Bracket Mount... A-18 A23 Single Mid-size Top Cover (MACM)... A-19 A24 Single Mid-size Top Cover (HP-TLM)... A-20 A25 Single Rear Cover (same for MACM and HP-TLM)... A-21 A26 Hybrid Wedge Lock for Test Modules... A-22 iv
5 Revision March 19, 2012 Table List of Tables Page 1 Test Setup A, Tests 5a and 5e Module Sensor Temperature Measurements Non-Conductive Plastic Chassis Sidewalls Test Setup A, Tests 4a and 4e Module Sensor Temperature Measurements, Conductive Aluminum Chassis Sidewalls Component Temperature Benefit from Hybrid Approach, Three Energized Modules, per Comparison of Measurements Shown in Tables 1 and Test Setup B, Tests 5b and 5f Module Sensor Temperature Measurements, Non-Conductive Plastic Chassis Sidewalls Test Setup B, Tests 4b and 4f Module Sensor Temperature Measurements, Conductive Aluminum Chassis Sidewalls Component Temperature Benefit from Hybrid Approach, Single Energized Module, per Comparison of Measurements Shown in Tables 4 and Test Setup A, Tests 5a and 5e Module Airflow Temperature Measurements, Non-Conductive Plastic Chassis Sidewalls Test Setup A, Tests 4a and 4e Module Airflow Temperature Measurements, Conductive Aluminum Chassis Sidewalls Airflow Temperature Rise Difference, Three Energized Modules, per Comparison of Measurements Shown in Tables 7 and Test Setup B, Tests 5b and 5f Module Airflow Temperature Measurements, Non-Conductive Plastic Chassis Sidewalls Test Setup B, Tests 4b and 4f Module Airflow Temperature Measurements, Conductive Aluminum Chassis Sidewalls Airflow Temperature Rise Difference, Single Energized Module, per Comparison of Measurements Shown in Tables 10 and Summary of Tests Performed Static Pressure Drop at varied CFM Chassis (Aluminum) B1 Equipment List... B-2 Appendix List of Appendices Page A Test Setup and Supporting Drawings... A-1 B Equipment List... B-1 v
6 Revision March 19, 2012 Revision History Revision Changes Date 1.0 Initial Release March 19, 2012 vi
7 Revision March 19, 2012 LIST OF ACRONYMS/ABBREVIATIONS AMC CFM HP-TLM LED MACM MTCA Advanced Mezzanine Card Cubic Feet per Minute High Power Thermal Load Module Light-Emitting Diode MicroTCA.2 AMC Characterization Module Micro Telecommunications Architecture PC PCB PICMG PQ RH TLM Personal Computer Printed Circuit Board PCI Industrial Computer Manufacturers Group Pressure/Flow Rate Relative Humidity Thermal Load Module iv
8 1 INTRODUCTION 1.1 Scope This report describes the results of thermal testing conducted to determine the thermal and pressure drop characteristics of representative AMC Modules, which follow the mechanical design concepts defined in Micro Telecommunication Computing Architecture PICMG MicroTCA.2 Base Specification. Testing was conducted using both low- and high-power output test Modules in an air-flow controlled test chamber at room ambient conditions in accordance with the Hybrid Air/Conduction Cooled MicroTCA.2 Thermal Test Plan. 1.2 Objective The objective of these tests was to verify the functional attributes of the unit under test to determine the cooling capability of the AMC Module concepts proposed for adoption of the Hybrid MicroTCA.2 PICMG specification. These thermal characteristics were defined by measuring airflow resistance, velocity and temperature rises on one or more powered Thermal Load Modules (TLMs) under test. Two types of dimensionally identical reference Chassis designs, one constructed with Aluminum Sidewalls and the other with Plastic Sidewalls, were used to assess the effectiveness of conduction cooling under different power dissipation and airflow conditions. 1.3 Applicable Documents Unless otherwise specified, the following documents of issue in effect at the time of testing form a part of this report to the extent specified herein. The requirements of subtier specifications and/or standards apply only when specifically referenced in this test report. The following specifications used are from direct or derived requirements to support the testing and generation of the MicroTCA.2 specification. Hybrid/Air Conduction Cooled MicroTCA.2 Thermal Test Plan Revision 1.1, November 07, 2011 Hybrid/Air Conduction Cooled MicroTCA.2 Thermal Test Procedure Revision 1.0, November 07, Test Location and Schedule All tests were performed from November 8 to 11, 2011 at the test facility below: Degree Controls, Inc. 18 Meadowbrook Drive Milford, NH 03055, USA Tel: (603) or (877)
9 2 TEST SUMMARY AND CONCLUSIONS 2.1 Deviations from Test Plan Hybrid/Air Conduction Cooled MicroTCA.2 Thermal Test Plan Revision 1.1 includes a section entitled Thermal Test and Analysis Data (Tests to be run at 50W, 25W & 8W), which states that Analysis to be performed to fill in data for Tables 1 and 2. These tables include rows to record data for a total of six different Module sizes. However, during testing it was determined that the testing of one (popular) Module size would be sufficient to prove the advantage of the Hybrid cooling approach as defined in MicroTCA.2. Thus, the data and conclusions in this Test Report are based on the testing of Mid-Size Single Modules only. In this respect, the Test Report supersedes the test regimen as defined in the Test Plan. 2.2 Summary of Cooling Effectiveness Under the same range of airflow conditions, Modules set for equal power dissipation were tested in a Chassis with conductive Aluminum Sidewalls, and alternatively in the same Chassis with non-conductive Plastic Sidewalls. Sensor temperature and Module airflow measurements indicative of cooling effectiveness under the given conditions are shown in sections and Section 2.3 highlights the conclusions drawn from the testing Sensor Temperature Comparison For the summary tables in this subsection, refer to Section 3 for test setups, in particular the Test Sequence Flowchart in Section 3.5, which identifies test setups A and B. Refer also to Section 4 for detailed test results, Appendix A for Test Setups and Supporting Drawings, and Appendix B for a list of equipment used to perform the tests. Data in Tables 1, 2, 4 and 5 demonstrate that the sensor temperature rises observed for the chassis with Aluminum Sidewalls were consistently lower than those for chassis with the Plastic Sidewalls. Tables 3 and 6 summarize the component temperature benefit of the Hybrid cooling approach based on these measurements Airflow Temperature Comparison For the summary tables in this subsection, refer to Section 3 for test setups, in particular the Test Sequence Flowchart in Section 3.5, which identifies test setups A and B. Refer also to Section 4 for detailed test results, Appendix A for Test Setups and Supporting Drawings, and Appendix B for a list of equipment used to perform the tests. Data in Tables 7, 8, 10 and 11 demonstrate that the inlet-exit temperature rises observed for the chassis with Aluminum Sidewalls were consistently lower than those observed for the chassis with Plastic Sidewalls. Tables 9 and 12 summarize this inletexit temperature rise difference as a percentage of reduction. 2
10 Table 1. Test Setup A, Tests 5a and 5e Module Sensor Temperature Measurements, Non-Conductive Plastic Chassis Sidewalls Plastic Chassis Sidewall 3 Energized Modules 3 Energized Modules Test 5a Total 154 Watts Test 5e Total 265 Watts Chassis Airflow [CFM] Airflow per Slot [CFM] Inlet Ambient Air Temp [ C] Avg Sensor Temp [ C] Sensor Temperature Rise (Sensor-Inlet) [ C] Table 2. Test Setup A, Tests 4a and 4e Module Sensor Temperature Measurements, Conductive Aluminum Chassis Sidewalls Aluminum Chassis Sidewall 3 Energized Modules 3 Energized Modules Test 4a Total 154 Watts Test 4e Total 265 Watts Chassis Airflow [CFM] Airflow per Slot [CFM] Inlet Ambient Air Temp [ C] Avg Sensor Temp [ C] Sensor Temperature Rise (Sensor-Inlet) [ C] Table 3. Component Temperature Benefit from Hybrid Approach, Three Energized Modules, per Comparison of Measurements Shown in Tables 1 and 2. Delta T (Plastic Chassis Sensor Avg - Aluminum Chassis Sensor Avg) [ C] Component Temperature Hybrid Benefit % % 7% 6% 4% 10% 3
11 Table 4. Test Setup B, Tests 5b and 5f Module Sensor Temperature Measurements, Non-Conductive Plastic Chassis Sidewalls Plastic Chassis Sidewall Single Energized Module Center Slot Test 5b 51.6 Watts Single Energized Module - Center Slot Test 5f 93.6 Watts Chassis Airflow [CFM] Airflow per Slot [CFM] Inlet Ambient Air Temp [ C] Avg Sensor Temp [ C] Sensor Temperature Rise (Sensor-Inlet) [ C] Table 5. Test Setup B, Tests 4b and 4f Module Sensor Temperature Measurements, Conductive Aluminum Chassis Sidewalls Aluminum Chassis Sidewall Single Energized Module Center Slot Test 4b 51.6 Watts Single Energized Module - Center Slot Test 4f 93.6 Watts Chassis Airflow [CFM] Airflow per Slot [CFM] Inlet Ambient Air Temp [ C] Avg Sensor Temp [ C] Sensor Temperature Rise (Sensor-Inlet) [ C] Table 6. Component Temperature Benefit from Hybrid Approach, Single Energized Module, per Comparison of Measurements Shown in Tables 4 and 5. Delta T (Plastic Chassis Sensor Avg - Aluminum Chassis Sensor Avg) [ C] Component Temperature Hybrid Benefit % % 12% 8% 7% 18% 7% 10% 4
12 Table 7. Test Setup A, Tests 5a and 5e Module Airflow Temperature Measurements, Non-Conductive Plastic Chassis Sidewalls Plastic Chassis Sidewall 3 Energized Modules 3 Energized Modules Test 5a Total 154 Watts Test 5e Total 265 Watts Chassis Airflow [CFM] Airflow per Slot [CFM] Inlet Ambient Air Temp [ C] Avg. Slot Exit Temp [ C] Airflow Temperature Rise (Exit-Inlet) [ C] Table 8. Test Setup A, Tests 4a and 4e Module Airflow Temperature Measurements, Conductive Aluminum Chassis Sidewalls Aluminum Chassis Sidewall 3 Energized Modules 3 Energized Modules Test 4a Total 154 Watts Test 4e Total 265 Watts Chassis Airflow [CFM] Airflow per Slot [CFM] Inlet Ambient Air Temp [ C] Avg Slot Exit Temp [ C] Airflow Temperature Rise (Exit-Inlet) [ C] Table 9. Airflow Temperature Rise Difference, Three Energized Modules, per Comparison of Measurements Shown in Tables 7 and 8 Delta T inlet-exit (Plastic Chassis Sidewall Avg - Aluminum Chassis Sidewall Avg) [ C] Air Temperature Rise Difference % % 4% 4% 5% 4% 2% 1% 10% 5
13 Table 10. Test Setup B, Tests 5b and 5f Module Airflow Temperature Measurements, Non-Conductive Plastic Chassis Sidewalls Plastic Chassis Sidewall Single Energized Module - Center Slot Test 5b 51.6 Watts Single Energized Module - Center Slot Test 5f 93.6 Watts Chassis Airflow [CFM} Airflow per Slot [CFM] Inlet Ambient Air Temp [ C] Avg Slot Exit Temp [ C] Airflow Temperature Rise (Exit-Inlet) [ C] Table 11. Test Setup B, Tests 4b and 4f Module Airflow Temperature Measurements, Conductive Aluminum Chassis Sidewalls Aluminum Chassis Sidewall Single Energized Module - Center Slot Test 4b 51.6 Watts Single Energized Module - Center Slot Test 4f 93.6 Watts Chassis Airflow [CFM} Airflow per Slot [CFM] Inlet Ambient Air Temp [ C] Avg Slot Exit Temp [ C] Airflow Temperature Rise (Exit-Inlet) [ C] Table 12. Airflow Temperature Rise Difference, Single Energized Module, per Comparison of Measurements Shown in Tables 10 and 11 Delta T inlet-exit (Plastic Chassis Sidewall Avg - Aluminum Chassis Sidewall Avg) [ C] Air Temperature Rise Difference % % 16% 11% 9% 24% 9% 6% 6
14 2.3 Conclusion Modules of all power levels benefit from the Hybrid Air/Conduction cooling approach, in which conduction allows thermal sharing among modules and with the chassis. This thermal sharing effect allows additional surface area to be exposed to the airflow through the chassis to more effectively dissipate the system s total thermal load. Though forced-air convection yields the dominant cooling effect in MicroTCA.2 systems, there is a significant secondary conduction cooling benefit associated with the Module Clamshell and Wedge Lock designs. By taking advantage of complementary conductive heat transfer through finned clamshelled Module surfaces and Aluminum Chassis Sidewalls, as well as heat sharing between adjacent Chassis slots, the MicroTCA.2 hybrid cooling solution effectively provides increased thermal margin over other MicroTCA modes in environments with higher ambient air temperature or decreased airflow. At a flow condition of 6.7 CFM per slot, a Single Module dissipating 51.6 watts of power recorded a 6.6 C reduction in component temperature a 33% component temperature benefit using the MicroTCA.2 hybrid cooling approach compared to the performance of a standard MicroTCA.0/MicroTCA.1 forced air-only solution (see Table 6). To optimize thermal design objectives, thermal engineers can exploit the increased thermal margin offered by the MicroTCA.2 hybrid cooling concept in several ways: Reserve the thermal benefit as a back-up (mini fail-safe) for use during a cooling malfunction, thus maintaining safe component temperatures prior to an unplanned loss or reduction in airflow Invest the thermal benefit towards the migration path of future system upgrades, allowing more powerful processors to be substituted without adding additional cooling overhead Reduce the amount of airflow through a MicroTCA.2 system to reduce energy consumption, minimize acoustic disturbance and increase fan reliability Extend the benefit to a natural convection application (no forced air), allowing natural convection cooling at higher ambient air temperatures For a dirty environment, use MicroTCA.2 in a sealed enclosure with Chassis internal airflow 7
15 3 TEST SETUP Testing was conducted using an airflow wind tunnel chamber designed for measuring fan performance and/or system impedance. The chamber size was 30 inches in diameter and approximately 8 feet long. The standard flow range was from 3 to 2000 cubic feet per minute (CFM). The chamber was equipped with a Blower hook-up at one end and a round pressure adapter plate with the Test Chassis installed at the other end. The middle of the chamber had a nozzle array plate containing different diameter nozzles to accommodate testing of various flow ranges. The pressure taps on both sides of the Nozzle Plate within the chamber monitored the differential and static pressures corresponding to the test flow. The control of the airflow was accomplished by means of a blast gate in conjunction with the blower speed controller to vary and fine tune the desired flow through the chamber. Details of tests performed, test configurations, test sequence and pre-test checkout are described below. See Appendix A for photos of the Test Setup and Appendix B for equipment used for testing. 3.1 Thermal Test Chassis with Backplane The two dimensionally identical thermal Test Chassis used in testing are described below, and shown in Figure 1. 3-slot thermal Test Chassis with thermally conductive Sidewalls and 3-slot Backplane. This Test Chassis is referred to as Aluminum Chassis in this report. 3-slot thermal Test Chassis with thermally non-conductive Sidewalls and 3-slot Backplane. This Test Chassis is referred to as Plastic Chassis in this report. Figure 1. 3-Slot Thermal Test Chassis with Integrated Chassis Slot Sidewalls Backplane The three-slot Backplane to support MicroTCA.0 physical requirements for three Single, Mid-Size AMCs, +12VDC payload and +3.3VDC management power, no fabric or IPMI support is shown in Appendix A, Figure A-20. 8
16 3.2 Test Configurations The following Module samples were used for testing Qty 4 (3 + 1 spare) MicroTCA.2 Single, Mid-Size High- Power Thermal Load Modules (HP-TLM) compliant with AMC.0 Revision 2 Qty 1 MicroTCA.2 AMC Characterization Module (MACM), consisting of a blank AMC air baffle module (Single, Mid-Size) inside a low-power MicroTCA.2 clamshell Thermal Load Module (TLM) The Thermal Load Module (TLM) was designed using an Advanced Mezzanine Card (AMC) Single, Mid-Size Thermal Load Module inside of a MicroTCA.2 Clamshell, which incorporates cooling fins (see Figure 2). Figure 2. Notional View of HP-TLM, based on MicroTCA.2 High Power Module MicroTCA.2 AMC Characterization Module (MACM) The MicroTCA.2 AMC Characterization Module (MACM) was used for maximum airflow and minimum impedance testing. These Modules had Side 1 and Side 2 Covers but no external fins and no components on the PCB other than the Hot Swap Switch and LED holder. The MACM is shown in Figures 3 through 5. 9
17 Figure 3. Notional View of MACM, based on MicroTCA.2 Low Power Module WEDGE LOCK NOT SHOWN FOR CLARITY Figure 4. Blank MACM MicroTCA.2 Module 10
18 WEDGE LOCK NOT SHOWN FOR CLARITY Figure 5. Blank MACM MicroTCA.2 Module, Side View 3.3 Environmental Testing Conditions All measurements were taken at room ambient conditions as monitored with calibrated instruments. Environmental test conditions and measurement tolerances were as follows: Environmental Conditions: Wind Tunnel Nozzle diameter of 6.0 inches Chassis airflow provided: 20 CFM; 40 CFM; 60 CFM; 87 CFM Ambient Pressure from hpa to hpa % Relative Humidity from 32.5 % RH to 47.0 % RH Ambient Temperature from 21.8 C to 23.4 C Tolerances: Temperature: ±2.0 C Airflow: ±2.5% Thermocouple setup accuracy: +/- 1.5% Thermocouple repeatability: +/- 0.01% Thermocouple and temperature sensor location and placement are as shown in Figures 6 and 7. 11
19 Figure 6. Thermocouple Placement. One Thermocouple was placed inside the air duct to monitor input temperatures and nine Thermocouples were placed in the air outlet to monitor exit temperatures. Figure 7. Location of Temperature Sensors. Numbered squares show location of six built-in temperature sensors on HP-TLM Module. 12
20 3.4 Tests Performed A summary of the tests performed is provided in Table 13. Test Table 13. Summary of Tests Performed Description 1 Chassis Calibration - Balancing/measuring the airflow distribution of the Test Chassis 2 Velocity Measurements MACM Module 3 Velocity Measurements HP-TLM Module Airflow Resistance and System Impedance Measurement HP-TLM Module 4a Temperature Measurements HP-TLM (A) Test 4a Aluminum Chassis: all slots (A,B and C) populated with HP-TLM, each Module (slots A,B,C) dissipates 51.6 watts for total of 154 watts 4b Temperature Measurements HP-TLM (B) Test 4b Aluminum Chassis: all slots (A, B and C) populated with HP-TLM, only the middle module (slot B) dissipates 51.6 watts. Other two modules were installed, but power off. 4c Temperature Measurements HP-TLM (A) Test 4c Aluminum Chassis: all slots (A, B and C) populated with HP-TLM, each Module (slots A, B and C) dissipates 25.2 watts for total of 76.9 watts 4d Temperature Measurements HP-TLM (B) Test 4d Aluminum Chassis: all slots (A, B and C) populated with HP-TLM, only the middle module (slot B) dissipates 25.2 watts. Other two modules were installed, but power off. 4e Temperature Measurements HP-TLM (A) Test 4e Aluminum Chassis: all slots (A,B and C) populated with HP-TLM, each Module (slots A, B and C) dissipates max power of 88 watts for total of 265 watts. 4f Temperature Measurements HP-TLM (B) Test 4f Aluminum Chassis: all slots (A, B and C) populated with HP-TLM, only the middle module (slot B) dissipates 93.6 watts. Other two modules were installed, but power off. 5a Temperature Measurements HP-TLM (A) Test 5a Plastic Chassis: all slots (A,B and C) populated with HP-TLM, each Module (slots A,B and C) dissipates 51.6 watts for total of 154 watts. 5b Temperature Measurements- HP-TLM (B) Test 5b Plastic Chassis: all slots (A, B and C) populated with HP-TLM, only the middle module (slot B) dissipates 51.6 watts. Other two modules were installed, but power off. 5c 5d Not Used Not Used 5e Temperature Measurements HP-TLM (A) Test 5e Plastic Chassis: all slots (A,B and C) populated with HP-TLM, each Module (slots A, B and C) dissipates max power of 88 watts for total of 265 watts 5f Temperature Measurements HP-TLM (B) Test 5f Plastic Chassis: all slots (A, B and C) populated with HP-TLM, only the middle module (slot B) dissipates 93.6 watts. Other two modules were installed, but power off. 13
21 3.5 Test Sequence Flowchart Figure 8 shows the test sequence for the Module assemblies tested. This sequence of thermal testing was conducted to show compliance of the Modules to the thermal requirements stated within this document. Figure 8. MicroTCA.2 Module Test Flow 14
22 3.6 Pretest Checkout The thermal Test Chassis was mounted to a transition air duct connected to the wind tunnel pressure plate, as shown in Figure 9. Two pressure plate assemblies with different Chassis configurations were tested as standalone units with electrical connections to Power Supplies and the Test PC: Aluminum Chassis Pressure Plate Assembly Plastic Chassis Assembly Figure 9. 3-Slot Thermal Test Chassis Attached to Round Pressure Plate via Air Duct All necessary supporting equipment including power supplies, test PC, thermocouples and pressure transducer were attached as required. Model numbers, serial numbers and calibration date of all test equipment were recorded on the equipment list data sheet. Measurements were taken at room ambient condition as monitored with calibrated instruments. Functional checks were performed on Modules, and the Test PC was monitored for on-board HP-TLM temperature sensor hexadecimal value readings in accordance with Hybrid/Air Conduction Cooled MicroTCA.2 Thermal Test Procedure, Appendix C: TLM Setup and Software Control. See Appendix A for photos of Test Setup and equipment used for tests. Pretesting was performed under standard laboratory conditions, with ambient forced airflow across thermal Test Chassis in the direction as shown in Figure 9. A 1.60 inch diameter nozzle array plate was used for all tests with the flow rate ranging from 16.8 to 121 CFM and differential pressure drops across nozzles from 0.10 to 5.00 inches of water, respectively. Flow rates of 20, 30, 40, 60 and 87 CFM were selected for velocity measurements and 20, 40, 60 and 87 CFM were selected for all temperature measurements. 15
23 Measurements were conducted to determine time required to achieve temperature stabilization using lowest flow rate of 20 CFM. The result of the testing indicated that temperature measurements set to record at 10-second intervals for 15 minutes duration was sufficient for thermal stabilization. Stabilization is defined as when temperature gradient on readings does not vary by more than 2.0 degrees C per hour. In order to complete all required testing within the allocated schedule, it was decided that only the Middle HP-TLM sensor temperature readings would be taken during the test, and that the Top and Bottom HP-TLM modules sensor temperature readings would not be recorded. 16
24 4 TEST RESULTS 4.1 CCS Test 1 Chassis Calibration Measure flow rate at various air inlet openings on Aluminum Chassis. Measurement taken with a Velocity meter at different locations with Top Sidewall removed and all slots open. Velocity measurements were taken in this configuration Flow Rate (CFM) Side view of Chassis in the direction of airflow Velocity (ft/min) Row #1 #2 #3 #4 #5 #6 #7 #8 Min. Max. Average 20 A B C A B C A B C
25 4.2 MACM Test 2 Velocity Measurements Slots A and C were blocked, each with a taped HP-TLM. Air exit Sidewall openings for Slot A and C were blocked with tape. The middle slot B was open and populated with a MACM module. Velocity measurements were taken in this configuration Side view of Chassis in the direction of airflow Flow Rate (CFM) Velocity (ft/min) #1B #2B #3B #4B #5B #6B #7B #8B Min. Max. Average
26 4.3 HP-TLM Test Velocity Measurements HP-TLM Module Slots A and C were blocked, each with taped a HP-TLM. Air exit Sidewall openings for Slot A and C were blocked with tape. The middle slot B was open and populated with a HP-TLM module. Velocity measurements were taken in this configuration Flow Rate (CFM) Side view of Chassis in the direction of airflow Velocity (ft/min) #1B #2B #3B #4B #5B #6B #7B #8B Min. Max. Average
27 4.3.2 Airflow Resistance and System Impedance HP-TLM Module The purpose of the system impedance test was to determine the pressure required to move the appropriate amount of volume flow through the system. For the impedance test, an air-flow test chamber blast gate was used to control different flow rates of air in Cubic Feet per Minute (CFM) that was forced through the Test Chassis, resulting in various pressure drops flow points. Table14 shows static pressure drop measurements associated with different CFM using Chassis with Aluminum Sidewalls. Data plot of System Impedance Curve for 3 slots and 1 slot is as shown in Figures 10 and 11. None of the populated HP-TLMs were powered on or monitored during testing. Table 14. Static Pressure Drop at varied CFM Chassis (Aluminum) Differential Pressure across nozzles (Inches of Water) Flow Rate (CFM) Static Pressure 1 (A, B and C Slots) (Inches of Water) Static Pressure 2 (B Slot) (Inches of Water) Notes: ) Static pressure drop data from different flow rates were taken using all three slots populated with HP-TLM modules. 2) Static pressure drop data from different flow rates were taken using all three slots populated with HP-TLM modules; slot A and C were blocked modules and slot B was tested opened. 20
28 Figure 10. System Impedance Curve (three slots populated with HP-TLM modules) Figure 11. System Impedance Curve (single slot populated with HP-TLM module) 21
29 4.4 Test 4a, b, c, d, e and f Temperature and Flow Measurements with Aluminum Chassis Thermocouples Location for Aluminum Chassis Setup HP-TLM Modules Board Sensor Location and Airflow Direction 22
30 Test 4a (154 Watts) - All Modules PS 1 PS 2 Voltage Input (Volts) Total Current (A) Total Power Dissipation (Watts) Flow Rate (CFM) Static Pressure Readings ( inch of Water) Average Temperature across slot ( C) (Note 1) Average Inlet Air Temperature ( C) Average Temperature Rise across slots ( C) (Note 2) Sensor 1 Temperature ( C) Sensor 2 Temperature ( C) Sensor 3 Temperature ( C) Sensor 4 Temperature ( C) Sensor 5 Temperature ( C) Sensor 6 Temperature ( C) CFM Notes: Thermocouple Temperature ( C) A1 A2 A3 B1 B2 B3 C1 C2 C Average temperature across all slots is an average temperature value across Rows A1, A2, A3, B1, B2, B3 and C1, C2, C3. 2. Average temperature rise across slots is an average temperature value across Rows A1, A2, A3, B1, B2, B3 and C1, C2, C3. 23
31 Test 4b (51.6 Watts) - Single Module PS 1 PS 2 Voltage Input (Volts) Total Current (A) Total Power Dissipation (Watts) Flow Rate (CFM) Static Pressure Readings (Inch of Water) Average Temperature across slot B ( C) (Note 1) Average Inlet Air Temperature ( C) Average Temperature Rise across slot B ( C) (Note 2) Sensor 1 Temperature ( C) Sensor 2 Temperature ( C) Sensor 3 Temperature ( C) Sensor 4 Temperature ( C) Sensor 5 Temperature ( C) Sensor 6 Temperature ( C) CFM Thermocouple Temperature ( C) A1 A2 A3 B1 B2 B3 C1 C2 C Notes: 1. Average temperature across slots is an average temperature value across Rows B1, B2, B3 as Rows A and C were not dissipating in this case. 2. Average temperature rise across slots is an average temperature value across Rows B1, B2, B3 as Rows A and C were not dissipating in this case. 24
32 Test 4c (76.9 Watts) All Modules PS 1 PS 2 Voltage Input (Volts) Total Current (A) Total Power Dissipation (Watts) Flow Rate (CFM) Static Pressure Readings (Inch of Water) Average Temperature across slots ( C) (Note 1) Average Inlet Air Temperature ( C) Average Temperature Rise across slots ( C) (Note 2) Sensor 1 Temperature ( C) Sensor 2 Temperature ( C) Sensor 3 Temperature ( C) Sensor 4 Temperature ( C) Sensor 5 Temperature ( C) Sensor 6 Temperature ( C) CFM Thermocouple Temperature ( C) A1 A2 A3 B1 B2 B3 C1 C2 C Notes: 1. Average temperature across all slots is an average temperature value across Rows A1, A2, A3, B1, B2, B3 and C1, C2, C3. 2. Average temperature rise across all slots is an average temperature value across Rows A1, A2, A3, B1, B2, B3 and C1, C2, C3. 25
33 Test 4d (25.2 Watts) - Single Module PS 1 PS 2 Voltage Input (Volts) Total Current (A) Total Power Dissipation (Watts) Flow Rate (CFM) Static Pressure Readings (Inch of Water) Average Temperature across slot B ( C) (Note 1) Average Inlet Air Temperature ( C) Average Temperature Rise across slot B ( C) (Note 2) Sensor 1 Temperature ( C) Sensor 2 Temperature ( C) Sensor 3 Temperature ( C) Sensor 4 Temperature ( C) Sensor 5 Temperature ( C) Sensor 6 Temperature ( C) Thermocouple Temperature ( C) CFM A1 A2 A3 B1 B2 B3 C1 C2 C Notes: Average temperature across slots is an average temperature value across Rows B1, B2, B3 as Rows A and C were not dissipating in this case. 2. Average temperature rise across slots is an average temperature value across Rows B1, B2, B3 as Rows A and C were not dissipating in this case. 26
34 Test 4e (265 Watts) - All Modules PS 1 PS 2 Voltage Input (Volts) Total Current (A) Total Power Dissipation (Watts) Flow Rate (CFM) Static Pressure Readings (Inch of Water) Average Temperature across slots ( C) (Note 1) Average Inlet Air Temperature ( C) Average Temperature Rise across slots ( C) (Note 2) Sensor 1 Temperature ( C) 53.5 Sensor 2 Temperature ( C) 56.5 Sensor 3 Temperature ( C) 57.0 Sensor 4 Temperature ( C) 58.0 Sensor 5 Temperature ( C) 60.0 Sensor 6 Temperature ( C) 60.0 Note 3 CFM Thermocouple Temperature ( C) A1 A2 A3 B1 B2 B3 C1 C2 C Notes: 1. Average temperature across all slots is an average temperature value across Rows A1, A2, A3, B1, B2, B3 and C1, C2, C3 2. Average temperature rise across all slots is an average temperature value across Rows A1, A2, A3, B1, B2, B3 and C1, C2, C3 3. Module sensor temperature readings were not recorded due to software issue. 27
35 Test 4f (93.6 Watts) - Single Module PS 1 PS 2 Voltage Input (Volts) Total Current (A) Total Power Dissipation (Watts) Flow Rate (CFM) Static Pressure Readings (Inch of Water) Average Temperature across slot B ( C) (Note1) Inlet Air Temperature ( C) (Note 4) Average Temperature Rise across slot B ( C) (Note 2) Sensor 1 Temperature ( C) Sensor 2 Temperature ( C) Sensor 3 Temperature ( C) Note 3 Sensor 4 Temperature ( C) Sensor 5 Temperature ( C) Sensor 6 Temperature ( C) CFM Thermocouple Temperature ( C) A1 A2 A3 B1 B2 B3 C1 C2 C Notes: 1. Average temperature across slots is an average temperature value across Rows B1, B2, B3 as Rows A and C were not dissipating in this case. 2. Average temperature rise across slots is an average temperature value across Rows B1, B2, B3 as Rows A and C were not dissipating in this case. 3. Module sensor temperature readings were not recorded due to software issues. 4. Inlet air Thermocouple was wired incorrectly; ambient temperature was used for inlet air temperature on above calculation. 28
36 4.5 Test 5a, b, e and f Temperature and Flow Measurements with Plastic Chassis Thermocouples Location for Plastic Chassis Setup HP-TLM Modules Board Sensor Location and Airflow Direction 29
37 Test 5a (154 Watts) - All Modules PS 1 PS 2 Voltage Input (Volts) Total Current (A) Total Power Dissipation (Watts) Flow Rate (CFM) Static Pressure Readings (Inch of Water) Average Temperature across slots ( C) (Note1) Average Inlet Air Temperature ( C) Average Temperature Rise across slots ( C) (Note 2) Sensor 1 Temperature ( C) Sensor 2 Temperature ( C) Sensor 3 Temperature ( C) Sensor 4 Temperature ( C) Sensor 5 Temperature ( C) Sensor 6 Temperature ( C) CFM Thermocouple Temperature ( C) A1 A2 A3 B1 B2 B3 C1 C2 C Notes: 1. Average temperature across slots is an average temperature value across Rows A1, A2, A3, B1, B2, B3 and C1, C2, C3. 2. Average temperature rise across slots is an average temperature value across Rows A1, A2, A3, B1, B2, B3 and C1, C2, C3. 30
38 Test 5b (51.6 Watts) - Single Module PS 1 PS 2 Voltage Input (Volts) Total Current (A) Total Power Dissipation (Watts) Flow Rate (CFM) Static Pressure Readings (inch of Water) Average Temperature across slot B ( C) (Note 1) Average Inlet Air Temperature ( C) Average Temperature Rise across slot B ( C) (Note 2) Sensor 1 Temperature ( C) Sensor 2 Temperature ( C) Sensor 3 Temperature ( C) Sensor 4 Temperature ( C) Sensor 5 Temperature ( C) Sensor 6 Temperature ( C) CFM Thermocouples Temperature ( C) A1 A2 A3 B1 B2 B3 C1 C2 C Notes: 1. Average temperature across slot B is an average temperature value across Rows B1, B2, B3 as Rows A and C were not dissipating in this case. 2. Average temperature rise across slot B is an average temperature value across Rows B1, B2, B3 as Rows A and C were not dissipating in this case. 31
39 Test 5e (265 Watts) - All Modules PS 1 PS 2 Voltage Input (Volts) Total Current (A) Total Power Dissipation (Watts) Flow Rate (CFM) Static Pressure Readings ( Inch of Water) Average Temperature across slot ( C) (Note 1) Average Inlet Air Temperature ( C) Average Temperature Rise across all slots ( C) (Note 2) Sensor 1 Temperature ( C) Sensor 2 Temperature ( C) Sensor 3 Temperature ( C) Sensor 4 Temperature ( C) Sensor 5 Temperature ( C) Sensor 6 Temperature ( C) CFM Thermocouple Temperature ( C) A1 A2 A3 B1 B2 B3 C1 C2 C Notes: 1. Average temperature across slots is an average temperature value across Rows A1, A2, A3, B1, B2, B3 and C1, C2, C3. 2. Average temperature rise across slots is an average temperature value across Rows A1, A2, A3, B1, B2, B3 and C1, C2, C3. 32
40 Test 5f (93.6 Watts) - Single Module PS 1 PS 2 Voltage Input (Volts) Total Current (A) Total Power Dissipation (Watts) Flow Rate (CFM) Static Pressure Readings ( Inch of Water) Average Temperature across slot B ( C) Average Inlet Air Temperature ( C) Average Temperature Rise across slot B ( C) (Note 2) Sensor 1 Temperature ( C) Sensor 2 Temperature ( C) Sensor 3 Temperature ( C) Sensor 4 Temperature ( C) Sensor 5 Temperature ( C) Sensor 6 Temperature ( C) CFM Thermocouple Temperature ( C) A1 A2 A3 B1 B2 B3 C1 C2 C Notes: 1. Average temperature across slot B is an average temperature value across Rows B1, B2, B3 as Rows A and C were not dissipating in this case. 2. Average temperature rise across slot B is an average temperature value across Rows B1, B2, B3 as Rows A and C were not dissipating in this case. 33
41 APPENDIX A Test Setup and Supporting Drawings A-1
42 A.1 Test Setups Figure A CFM Airflow Testing Chamber Figure A2. Airflow Nozzle Plate A-2
43 Figure A3. Blower Assembly Attached to Wind Tunnel Figure A4. Static Pressure Taps between Nozzle Array Plate A-3
44 Figure A5. Blast Gate with Controller Figure A6. Room Ambient Condition Monitor A-4
45 Figure A7. Setra Datum 2000 Pressure Meter Figure A8. Power Supplies and Test Laptop PC A-5
46 Figure A9. ATM2400 and Thermocouple Setup A-6
47 A.2 Test Modules Figure A10. HP-TLM Test Module Topside Figure A11. HP-TLM Test Module Bottom Side A-7
48 WEDGE LOCK NOT SHOWN FOR CLARITY Figure A12. Blank MACM MicroTCA.2 Test Module WEDGE LOCK NOT SHOWN FOR CLARITY Figure A13. Blank MACM MicroTCA.2 Test Module, Side View A-8
49 A.3 Supporting Drawings A.3.1 Test Chassis Figure A14. Test Chassis Top Cover A-9
50 Figure A15. Test Chassis Front Cover A-10
51 Figure A16. Test Chassis, Exhaust Bracket A-11
52 Figure A17. Test Chassis, Sensor Bracket A-12
53 Figure A18. Test Chassis Sidewall, Right A-13
54 Figure A19. Test Chassis Sidewall, Left A-14
55 Figure A20. 3-Slot Test Chassis Backplane A-15
56 Figure A21. Wind Tunnel Mounting Plate A-16
57 Figure A22. Upper Side Bracket Mount A-17
58 Figure A23. Lower Side Bracket Mount A-18
59 A.3.2 Test Modules Figure A23. Single Mid-size Top Cover (MACM) A-19
60 Figure A24. Single Mid-size Top Cover (HP-TLM) A-20
61 Figure A25. Single Rear Cover (same for MACM and HP-TLM) A-21
62 Figure A26. Hybrid Wedge Lock for Test Modules A-22
63 APPENDIX B Equipment List B-1
64 Table B1. Equipment List Description Part Number Manufacturer Serial Number Calibration Due Qty +12 VDC Power Supply DCS33-33E Sorensen BAE LY Not Required VDC Power Supply BAE LY Fluke DC/AC Meter 337 Fluke 1 Dell Notebook D520 Dell Computer 1 Setra Datum 2000 Pressure Meter 2641OR5WD2DT1F /25/ Flow Test Chamber 2000CFM Degree Control 2718 N/A 1 Monitor Meter Display PTU200 VA/SALA Z /7/ Accusense ATM2400 Degree Control 1 Air Velocity Meter Model 8330 TSI Incorporated N/A 1 Thermocouples UTS1000 AccuSense Degree Control N/A 10 B-2
DESIGN VERIFICATION TEST REPORT HLE/TSM HLE G-DV/TSM G-DV
Project Number: Design Verification Test Report Tracking Code: _Report_Rev_1 Requested by: Mark Shireman Date: 9/30/2010 Product Rev: 0 Lot #: na Tech: Tony Wagoner Eng: Eric Mings Qty to test: 15 Test
More informationSPECIFICATION AND PERFORMANCE TABLE OF CONTENT. 1. Scope Reference Documents Material and Components... 2
TABLE OF CONTENT 1. Scope... 2 2. Reference Documents.. 2 3. Material and Components...... 2 4. Design and Construction..... 2 5. Rating.. 2 6. Performance and Test Descriptions. 2 7. Test Requirements
More informationAUGUST 28, 2008 TEST REPORT # REV.1.1 MIXED FLOWING GAS TESTING CONNECTOR SERIES CLP S-D-A FTSH S-DV-A SAMTEC, INC.
AUGUST 28, 2008 TEST REPORT #208383-3 REV.1.1 MIXED FLOWING GAS TESTING CONNECTOR SERIES CLP-130-02-S-D-A FTSH-130-02-S-DV-A SAMTEC, INC. APPROVED BY: DOMINIC ARPINO PROGRAM MANAGER CONTECH RESEARCH, INC.
More informationAUGUST 28, 2008 TEST REPORT # REV.1.1 MIXED FLOWING GAS TESTING CONNECTOR SERIES SEM H-D-WT TEM H-D-WT SAMTEC, INC.
AUGUST 28, 2008 TEST REPORT #208383-5 REV.1.1 MIXED FLOWING GAS TESTING CONNECTOR SERIES SEM-125-02-03.0-H-D-WT TEM-125-02-03.0-H-D-WT SAMTEC, INC. APPROVED BY: DOMINIC ARPINO PROGRAM MANAGER CONTECH RESEARCH,
More informationSAMTEC POWER CHARACTERIZATION
Project Number: Tracking Code: Report Rev 3 Requested by: Eric Mings Date: 5/20/2013 Product Rev: 0 Part #: ET60T-00-24-06-L-RT-GP Tech: Tony Wagoner Eng: Eric Mings Part description: R/A Plug Ten60 Power
More informationSUMMARY. St-jean-sur-Richelieu, 2016, January 12th Client : J.A. Roby Project :PI model : Polaris; Sirius; Véga; Antares; Centauri; Rigel
SUMMARY St-jean-sur-Richelieu, 2016, January 12th 1 Introduction... 4 1.1 General... 4 1.2 Test unit information... 4 1.3 Results... 4 1.4 Pretest information... 5 2 Summary of test results... 5 2.1 Emissions...
More informationAdvance Data Sheet: idq Series Filter Module. idq Series Filter Module 75V Input, 10A Output
idq Series Filter Module 75V Input, 10A Output idq48 filter modules are designed to help reduce differential and common mode conducted emissions from high frequency switching power supplies. The modules
More informationHIGH SPEED MEZZANINE PRODUCT SPECIFICATION
OARD TO OARD CONNECTOR 75005 Receptacle Assembly 75003 Plug Assembly Table of Contents 1.0 Scope 2.0 Product Description 3.0 Applicable Documents and Specifications 4.0 Ratings 5.0 Performance 5.1 Qualification
More informationDetermining static vacuum pressure required to ventilate Opti Carousel racks at various flow rates. Eric Corell. Page 1
Determining static vacuum pressure required to ventilate Opti Carousel racks at various flow rates Eric Corell Page 1 Objective Due to changes in filter design, cage configuration, and newly introduced
More informationSAMTEC POWER CHARACTERIZATION
Project Number: Tracking Code: Power Report Rev 3 Requested by: Eric Mings Date: 9/11/2012 Product Rev: AE Part #: MMSD-25-24-L-12.00-D-K-LUS Lot #: «Lot_Number» Tech: Tony Wagoner Eng: Eric Mings Part
More information500-YCI SERIES FAN-POWERED AIR TERMINAL UNIT FORM EG2 (404)
500-YCI SERIES FAN-POWERED AIR TERMINAL UNIT Table of Contents General Information...3 500-YCI Features...4-5 Dimensional Data...6-7 ARI Rating Points...8 Statement of Standard Test Conformity...8 Motor
More informationDEVELOPMENTAL HALT Report R XSS S Power Supplies. Michael Farragher Engineering Test Technician Test Performed By
DEVELOPMENTAL HALT Report Product Tested: Service Proposal #: XSS00-24S Power Supplies S00000354 Job #: J09135-5198 Date Received: th March 2014 Test Dates: th to 14 th March 2014 Report Date: 4 th March
More informationTHERMAL CONTROL SYSTEM OPERATION AND MAINTENANCE MANUAL
Macintyre Electronic Design Associates Inc. 43676 Trade Center Place, Suite 145, Dulles, VA 20166 Phone: (703) 996-8990 FAX: (703) 996-8770 e-mail: sales@meda.com THERMAL CONTROL SYSTEM OPERATION AND MAINTENANCE
More informationSummary of HALT, IPx7 & IP69K testing for AT Series connectors
S1-15227 Rev. A1 Corp. SINE Systems Corporation 44724 Morley Drive Clinton Twp, MI 48036 Summary of HALT, IPx7 & IP69K testing for AT Series connectors IPx7 (Submersion) PASS Requirements: Acceptance conditions
More information500-YVI PARALLEL FAN-POWERED AIR TERMINAL UNIT FORM EG3 (404)
500-YVI PARALLEL FAN-POWERED AIR TERMINAL UNIT Table of Contents Introduction...3 500-YVI Features...4-5 Dimensional Data...6-7 ARI Rating Points...8 Statement of Standard Test Conformity...8 Motor Amperage
More informationRev. 0 - March Air System Diagnostics Kit Instructions.indd 1
Air System Diagnostics Kit Instructions Rev. 0 - March 2016 Air System Diagnostics Kit Instructions.indd 1 Air System Diagnostics Kit Instructions.indd 2 Table of Contents Table of Contents...1 Introduction...2
More informationSUMMARY. St-jean-sur-richelieu, January 15th 2016 Client: America s heat Project: PI-20114
SUMMARY 1 Introduction... 4 1.1 General... 4 1.2 Test unit information... 4 1.3 Results... 4 1.4 Pretest information... 4 2 Summary of test results... 5 2.1 table 1A: Data Summary Part A... 5 2.2 table
More informationFan Powered Terminal Units FPV, FDV Series Variable Volume Parallel Flow
Recommended Air Volume Ranges CP 101 Unit Size L/s Min.* L/s Max. cfm Min.* cfm Max. 6 31 212 66 450 8 62 378 132 800 10 104 637 221 1350 12 146 991 310 2100 14 207 1416 439 3000 16 268 1888 568 4000 CP
More informationIESNA LM MEASURING LUMEN MAINTENANCE OF LED LIGHT SOURCES MEASUREMENT AND TEST REPORT. For
IESNA LM-80-2008 MEASURING LUMEN MAINTENANCE OF LED LIGHT SOURCES MEASUREMENT AND TEST REPORT For Room 316, Building 2, No.1, Xianke Yi Road, Huadong Town, Huadu District, Guangzhou, China Model:100B10C10(Ra2)
More information6U µtca Chassis, 12 AMCs Full Size VT895
U µtca Chassis, s KEY FEATURES μtca System Platform x U x. deep (with handles deep) Lightweight aluminum construction Full redundancy with dual MicroTCA Carrier Hub (MCH), dual Cooling Units and dual Power
More informationLSI SAS e HBA Temperature and Airflow
LSI SAS 9206-16e HBA Temperature and Airflow Application Note Preliminary, Version 1.0 DB06-000784-00 Revision History Version and Date Preliminary, Version 1.0, Initial release of this document. Description
More informationPart C: Electronics Cooling Methods in Industry
Part C: Electronics Cooling Methods in Industry Indicative Contents Heat Sinks Heat Pipes Heat Pipes in Electronics Cooling (1) Heat Pipes in Electronics Cooling (2) Thermoelectric Cooling Immersion Cooling
More informationDETAIL SPECIFICATION SHEET
METRIC MIL-DTL-38999/36 30 November 2006 DETAIL SPECIFICATION SHEET CONNECTORS, ELECTRICAL, CIRCULAR, THREADED, PLUG, LANYARD RELEASE, FAIL-SAFE, REMOVABLE CRIMP CONTACTS, PINS, SHELL SIZE 25, SERIES III,
More informationUtilization of Electric Power Laboratory 3 rd Year G2: Testing & Characteristic of MCCB Used in Commercial and Industrial Applications
G2: Testing & Characteristic of MCCB Used in Commercial and Industrial Applications Contents 1. Laboratory Objective... 4 2. MECHANICAL OPERATION TESTS... 4 2.1 Purpose... 4 2.2 Procedure... 4 2.3 Results...
More informationJun 20,2014 Rev A
Product Specification 108-115067 Jun 20,2014 Rev A DDR4 DIMM Through-hole Memory Socket 1. SCOPE 1.1. Content This specification covers performance, tests and quality requirements for the TE Connectivity
More informationTested: written by :
TEST REPORT TEST OF A NON CATALYTIC WOOD BURNING STOVE FOR EMISSIONS AND EFFICIENCY PER EPA METHODS 28 AND 5G-3, FEBRUARY 1988 Client: Hichanse Model name : HCS-01 Attention: Rafaël Sanchez TESTED BY:
More informationPF3100 TROUBLESHOOTING SOLUTIONS TO COMMON PROBLEMS. v1.1 Revised Nov 29, 2016
PF3100 TROUBLESHOOTING SOLUTIONS TO COMMON PROBLEMS v1.1 Revised Table of Contents 1 Common Alarms and Warnings... 1 2 Common Issues... 6 2.1 Communication problems... 6 2.1.1 Controller communication
More informationTested by: written by :
TEST REPORT TEST OF A NON CATALYTIC WOOD BURNING STOVE FOR EMISSIONS AND EFFICIENCY PER EPA METHODS 28 AND 5G-3, FEBRUARY 1988 Client: Hichanse Model name : HCS-02 Attention: Rafaël Sanchez TESTED BY:
More informationSM1206 Series. Overload Interrupt Time (Second) Nominal Rating - Note 2. Cold Resistance (Ohm) Note 1. Maximum I 2 T (Ampere 2 Second) Nominal Rating
SM1206 Series Part Numbering System SM1206-32 - 1.0 Fuse Type Voltage Amp Part Number/Rating Cold Resistance (Ohm) Note 1 Overload Interrupt Time (Second) Nominal Rating - Note 2 Maximum I 2 T (Ampere
More informationKoldLok Integral Raised Floor Grommet
p r o d u c t c e r t i f i c a t i o n r e p o r t KoldLok Integral Raised Floor Grommet Model 1010 Updated May 1, 2002 Prepared for Upsite Technologies, Inc. 2904 Rodeo Park Drive East Santa Fe, New
More informationCRASH TEST REPORT FOR PERIMETER BARRIERS AND GATES TESTED TO SD-STD-02.01, REVISION A, MARCH Anti-Ram Bollards
CRASH TEST REPORT FOR PERIMETER BARRIERS AND GATES TESTED TO SD-STD-02.01, REVISION A, MARCH 2003 Anti-Ram Bollards Prepared for: RSA Protective Technologies, LLC 1573 Mimosa Court Upland, CA 91784 Test
More informationCRASH TEST REPORT FOR PERIMETER BARRIERS AND GATES TESTED TO SD-STD-02.01, REVISION A, MARCH Anti-Ram Bollards
CRASH TEST REPORT FOR PERIMETER BARRIERS AND GATES TESTED TO SD-STD-02.01, REVISION A, MARCH 2003 Anti-Ram Bollards Prepared for: RSA Protective Technologies, LLC 1573 Mimosa Court Upland, CA 91784 Test
More informationELECTRICAL POWER-STATIC INVERTER - BRIDGE ASSEMBLY R170 RELOCATION
ELECTRICAL POWER-STATIC INVERTER - BRIDGE ASSEMBLY R170 RELOCATION I PLANNING INFORMATION A. Effectivity- Static Inverter Part Number 1-002-0102-0265, (Boeing P/N S282T004-5), Model 1C1000-1A, Mod Levels
More informationTABLE OF CONTENTS. 8.3 Online Sensor Specifications. Series TS (Models TS1, TSP, TSH, TSL,TSF, TSB1, TSB2) According to Electromatic factory procedure
8.3 Online Sensor Specifications Series TS (Models TS1, TSP, TSH, TSL,TSF, TSB1, TSB2) Calibration: Accuracy: Remainder of range and other calibration material Overload protection Measuring principle Measuring
More informationNFPA 286 STANDARD METHODS OF FIRE TESTS FOR EVALUATING CONTRIBUTION OF WALL AND CEILING INTERIOR FINISH TO ROOM FIRE GROWTH
NFPA 286 STANDARD METHODS OF FIRE TESTS FOR EVALUATING CONTRIBUTION OF WALL AND CEILING INTERIOR FINISH TO ROOM FIRE GROWTH Contego Latex Fire Barrier Intumescent (Also marketed in Canada by Pyrologistics,
More informationIES LM MEASURING LUMEN MAINTENANCE OF LED LIGHT SOURCES
IES LM-80-2008 MEASURING LUMEN MAINTENANCE OF LED LIGHT SOURCES MEASUREMENT AND TEST REPORT For Guangzhou Hongli Opto-Electronic Co., Ltd. West side of Dongfeng Highway, Automobile industrial Base, Huadu
More informationMatrix APAX. 380V-415V 50Hz TECHNICAL REFERENCE MANUAL
Matrix APAX 380V-415V 50Hz TECHNICAL REFERENCE MANUAL WARNING High Voltage! Only a qualified electrician can carry out the electrical installation of this filter. Quick Reference ❶ Performance Data Pages
More informationPMC-MC-X2-Chassis PMC-MC-X4-Chassis
DYNAMIC ENGINEERING 150 DuBois St Suite 3, Santa Cruz Ca 95060 831-457-8891 Fax 831-457-4793 http://www.dyneng.com sales@dyneng.com Est. 1988 User Manual Four Slot Carrier Two Slot Carrier PMC-MC-X2-Chassis
More informationSEP 2016 Rev D2
Product Specification 108-2112 28 SEP 2016 Rev D2 VAL-U-LOK* Connectors 1. SCOPE 1.1. Content This specification covers performance, tests and quality requirements for VAL-U-LOK* Connectors. 1.2. Qualification
More informationMEZALOK* Stacking Connector System
Product Specification 108-2411 25 FEB 16 Rev D MEZALOK* Stacking Connector System 1. SCOPE 1.1. Content This specification covers performance, tests and quality requirements for the MEZALOK* Stacking Connector
More informationCBAM Load Share (LSL) Series
Features Dual input/single output load share module Six module voltages 3.3V, V, 1V, 1V, V, and 8V Small package design (1. x.8 x. ) Rated up to amps on the output Aluminum substrate technology All applicable
More informationA. General Specifications. B. Dimensional Layout. BTU International Specification: Model 150Nz12 Reflow Solder System Date: 11/05/09 Page: 1/6
Page: 1/6 A. General Specifications Maximum temperature rating (all zones): 350 C Nominal operating temperature: 80-350 C Number of controlled heated zones: 12 Top 12 Bottom Oven atmosphere: Air/N 2 Working
More informationIESNA LM MEASURING LUMEN MAINTENANCE OF LED LIGHT SOURCES MEASUREMENT AND TEST REPORT. For
IESNA LM-80-2008 MEASURING LUMEN MAINTENANCE OF LED LIGHT SOURCES MEASUREMENT AND TEST REPORT For Guangzhou Hongli Opto-Electronic Co., Ltd. No.1, Xianke Yi Road, Huadong Town, Huadu District, Guangzhou,
More informationFEBRRUARY 22, 2008 TEST REPORT # QSH/QTH/QTE SERIES CONNECTOR SHEAR TESTING SAMTEC, INC.
FEBRRUARY 22, 2008 TEST REPORT #207908 QSH/QTH/QTE SERIES CONNECTOR SHEAR TESTING SAMTEC, INC. APPROVED BY: DOMINIC ARPINO PROGRAM MANAGER CONTECH RESEARCH, INC. Contech Research REVISION HISTORY DATE
More informationEXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
EXTRUDED HEAT SINS FOR POWER S 621 AND 623 Low-Profile for All Metal-Case Power Semiconductors Footprint Thermal Performance at Typical Load Standard Dimensions Height Mounting Natural Forced Weight P/N
More informationDPX30-xxWDxx DC-DC Converter Module 10 ~ 40VDC, 18 ~ 75VDC input; ±12 to ±15 VDC Dual Output; 30 Watts Output Power
DC-DC Converter Module 10 ~ 40VDC, 18 ~ 75VDC input; ±12 to ±15 VDC Dual Output; 30 Watts Output Power FEATURES NO MINIMUM LOAD REQUIRED 1600VDC INPUT TO OUTPUT ISOLATION SCREW TERMINALS FOR INPUT AND
More informationDPX30-xxWSxx DC-DC Converter Module 10 ~ 40VDC, 18 ~ 75VDC input; 3.3 to 28VDC Single Output 30 Watts Output Power
DC-DC Converter Module 10 ~ 40VDC, 18 ~ 75VDC input; 3.3 to 28VDC Single Output 30 Watts Output Power FEATURES NO MINIMUM LOAD REQUIRED 1600VDC INPUT TO OUTPUT ISOLATION SCREW TERMINALS FOR INPUT AND OUTPUT
More informationHigh Performance Fan Coils FCHG Genesis Series Horizontal
Dimensional Data 5 7 /8 (150) D 14 (356) 2 (51) Diverter - Slides Into Discharge Ductwork Optional: Second Drain Pan Connection E Coil Section X Dimensional Data - IP (in.) / SI [mm] Unit Fan Outlet Duct
More informationMEASUREMENT AND TEST REPORT
IES LM-80-2008 MEASURING LUMEN MAINTENANCE OF LED LIGHT SOURCES MEASUREMENT AND TEST REPORT For Guangzhou Hongli Opto-Electronic Co., Ltd. West side of Dongfeng Highway, Automobile industrial Base, Huadu
More informationPENTAGON PROTECTION USA
PENTAGON PROTECTION USA Shock Tube Testing for Window Systems March 2009 San Antonio, Texas ABS Consulting Project Number 2127174 ABSG Consulting, Inc. 14607 San Pedro, Suite 215 San Antonio, TX 78232
More informationEncoder Installation Manual Dynapar brand SERIES M21 Modular Encoder
Headquarters: 1675 Delany Road Gurnee, IL 60031-1282 USA Visit us at www.dynapar.com Encoder Installation Manual Dynapar brand SERIES M21 Modular Encoder Document No.: 702209-0001 Revision Level: J October
More informationAPPLICATION NOTE QuickStick 100 Power Cable Sizing and Selection
APPLICATION NOTE QuickStick 100 Power Cable Sizing and Selection Purpose This document will provide an introduction to power supply cables and selecting a power cabling architecture for a QuickStick 100
More informationProduct Loss During Retail Motor Fuel Dispenser Inspection
Product Loss During Retail Motor Fuel Dispenser Inspection By: Christian Lachance, P. Eng. Senior Engineer - ment Engineering and Laboratory Services ment Canada Date: Product Loss During Retail Motor
More informationThermal Characterization of Flex Power Modules
Thermal Characterization of Flex Power Modules Design Note 019 Flex Power Modules Abstract The latest power modules feature extremely compact form factors and high efficiency operation. The high packaging
More informationElectrical Test of STATCOM Valves
21, rue d Artois, F-75008 PARIS 619 CIGRE 2016 http : //www.cigre.org Electrical Test of STATCOM Valves Baoliang SHENG 1, Christer DANIELSSON 1, Rolf NEUBERT 2, Juha TURUNEN 3, Yuanliang LAN 4, Fan XU
More informationDPX15-xxWDxx Dual Output: DC-DC Converter Module 9.5 ~ 36VDC, 18 ~ 75VDC input; ±5 to ±15 VDC Dual Output; 15 Watts Output Power
DPX15-xxWDxx Dual Output: DC-DC Converter Module 9.5 ~ 36VDC, 18 ~ 75VDC input; ±5 to ±15 VDC Dual Output; 15 Watts Output Power FEATURES NO MINIMUM LOAD REQUIRED 1600VDC INPUT TO OUTPUT ISOLATION SCREW
More informationReport. PIBCV Tests. Report 52724/1 Edition 2 February 2010
Report www.bsria.co.uk PIBCV Tests This report supersedes Report 52724/1 Report 52724/1 Edition 2 February 2010 Carried out for: Danfoss Trata d.o.o. Jožeta Jame 16 SI-1210 Ljubljana Šentvid ID DDVS190729587
More informationIESNA LM MEASURING LUMEN MAINTENANCE OF LED LIGHT SOURCES MEASUREMENT AND TEST REPORT. For
IESNA LM-80-2008 MEASURING LUMEN MAINTENANCE OF LED LIGHT SOURCES MEASUREMENT AND TEST REPORT For SHENZHEN MTC LIGHTING CO., LTD. NO.65,Chuangyi Road,Dalang Street,Baoan District,Shenzhen,GuangDong Province,CHINA
More informationPRODUCT SPECIFICATION
288 Ckt Vertical Press Fit DDR4 DIMM 2.4mm Seating Plane 1.0 SCOPE This Product Specification covers the 0.85 mm centerline gold plated DDR4 DIMM edge card connector for 1.40 +/- 0.10 thick memory modules.
More informationDPX30-xxSxx DC-DC Converter Module 9.5 ~ 18 VDC and 18 ~ 36 VDC and 36~ 75 VDC input; 3.3 to 28 VDC Single Output; 30 Watts Output Power
DC-DC Converter Module 9.5 ~ 18 VDC and 18 ~ 36 VDC and 36~ 75 VDC input; 3.3 to 28 VDC Single Output; 30 Watts Output Power FEATURES NO MINIMUM LOAD REQUIRED 1600VDC INPUT TO OUTPUT ISOLATION SCREW TERMINALS
More informationDETAIL SPECIFICATION SHEET
METRIC MIL-DTL-38999/31E 12 March 2014 SUPERSEDING MIL-DTL-38999/31D 19 April 2002 DETAIL SPECIFICATION SHEET CONNECTORS, ELECTRICAL, CIRCULAR, THREADED, PLUG, LANYARD RELEASE, FAIL-SAFE, REMOVABLE CRIMP
More informationTo ensure proper installation, digital pictures with contact information to before startup.
Check List for Optimal Filter Performance? There should be no back-pressure on the flush line. A 1 valve should have a 2 waste line, and 2 valve should have a 3 waste line. Do not use rubber hosing or
More informationRA-1250 Thermal Dispersion Fan Inlet Sensors Airflow Measuring System
RA-1250 Thermal Dispersion Fan Inlet Sensors Airflow Measuring System Product Bulletin Code No. LIT-12011620 Issued July 2, 2014 RA-1250 Thermal Dispersion Fan Inlet Sensor Airflow Measuring System averages
More informationAn Automated System for the Acoustical and Aerodynamic Characterization of Small Air Moving Devices
Minneapolis, Minnesota NOISE-CON 2005 2005 October 17-19 An Automated System for the Acoustical and Aerodynamic Characterization of Small Air Moving Devices Jeff G. Schmitt David A. Nelson John Phillips
More informationINSTALLATION INSTRUCTIONS
MiniCOREVentilator ENERGY RECOVERY CORE INSTALLATION INSTRUCTIONS MC500-1ERV JANUARY 10, 2018 SUPERSEDES: NONE INSTALLATION INSTRUCTIONS FOR MINICORE VENTILATOR (MCV) WITH FACTORY INSTALLED OPTIONS USED
More informationF. VAV hoods shall have a restricted bypass plate.
1.01 SUMMARY A. Section Includes: 1. Laboratory fume hoods. B. Related Sections: 1. Section 6500 Laboratory casework 2. Section 15 Mechanical: Furnishing and installation of plumbing utilities and final
More informationDPX30-xxDxx DC-DC Converter Module 9.5 ~ 18 VDC and 18 ~ 36 VDC and 36~ 75 VDC input; ±12 to ±15 VDC Dual Output; 30 Watts Output Power
DC-DC Converter Module 9.5 ~ 18 VDC and 18 ~ 36 VDC and 36~ 75 VDC input; ±12 to ±15 VDC Dual Output; 30 Watts Output Power FEATURES NO MINIMUM LOAD REQUIRED 1600VDC INPUT TO OUTPUT ISOLATION SCREW TERMINALS
More informationWAC Air Curtains Technical Guide
TGWAC-2 WAC Air Curtains Technical Guide FOR WIND STOPPING, INSECT CONTROL, AND ENVIRONMENTAL SEPARATION IN COMMERCIAL AND INDUSTRIAL APPLICATIONS TABLE OF CONTENTS Introduction......................................................................2
More informationLN3 Series Motor and Drives
LN3 Series Motor and Drives Operator's Manual PN 04-01906 C PRECISION MOTION CONTROLS 2175 De La Cruz Blvd. #1 Santa Clara, CA 95050 LN3 Manual CONTENTS Introduction... 3 Description... 3 Features... 3
More informationTechnical Data Sheet FT & FIT-1003 SERIES AIR VOLUME/ VELOCITY TRANSDUCERS. Features DESCRIPTION
Technical Data Sheet FT & FIT-1003 SERIES AIR VOLUME/ VELOCITY TRANSDUCERS DESCRIPTION FT & FIT-1003 Series transducers include Models FT-1003, FT-1003-ZV, FIT-1003-D, FIT-1003-DZV, FIT-1003-M, and FIT-1003-MZV.
More informationE-Series and EF-Series Systems
E-Series and EF-Series Systems Site Preparation Guide NetApp, Inc. 495 East Java Drive Sunnyvale, CA 94089 U.S. Telephone: +1 (408) 822-6000 Fax: +1 (408) 822-4501 Support telephone: +1 (888) 463-8277
More informationDH50 SERIES. DATASHEET Rev. A
DATASHEET DH50 SERIES 2:1 Wide Input Voltage Ranges Single Outputs, Efficiency up to 92% 2.0 x 1.0 x 0.4 Encapsulated Shielded Metal Package FEATURES RoHS & UL 94V-0 Compliant 50 Watts Output Power 2:1
More informationVI Chip BCM Bus Converter Thermal Management
APPLICATION NOTE AN: VI Chip BCM Bus Converter Thermal Management Joe Aguilar Product Line Engineer, VI Chip & Paul Yeaman Principal Product Line Engineer, VI Chip Strategic Accounts Contents Page Introduction
More informationIntroducing NJK Precision Airflow Measuring Stations
Introducing Precision Airflow Measuring Stations A new and unique airflow measuring station that accurately measures airflows at very low flow rates and can operate in physically restrictive applications
More informationHeat Transfer Enhancement for Double Pipe Heat Exchanger Using Twisted Wire Brush Inserts
Heat Transfer Enhancement for Double Pipe Heat Exchanger Using Twisted Wire Brush Inserts Deepali Gaikwad 1, Kundlik Mali 2 Assistant Professor, Department of Mechanical Engineering, Sinhgad College of
More informationMETEOROLOGICAL INSTRUMENTS
METEOROLOGICAL INSTRUMENTS INSTRUCTIONS COMPACT ASPIRATED RADIATION SHIELD MODEL 43502 R.M. YOUNG COMPANY 2801 AERO PARK DRIVE, TRAVERSE CITY, MICHIGAN 49686, USA TEL: (231) 946-3980 FAX: (231) 946-4772
More informationCOMMERCIAL DUTY PLENUM FANS
Twin City Fan INDUSTRIAL PROCESS AND COMMERCIAL VENTILATION SYSTEMS COMMERCIAL DUTY PLENUM FANS EPLFN EPLQN CATALOG 455 JUNE 2014 PLENUM FANS Overview EPLFN I EPLQN Plenum fans are unhoused fans designed
More informationElectronic Cooling Solutions Inc. 612 National Avenue, Mountain View, CA Phone: (650) Fax: (650)
Bob Mimlitch III Innovation First, Inc. 1519 Interstate 30 West Greenville, TX 75088 Dear Mr. Mimlitch, Electronic Cooling Solutions Inc completed an airflow evaluation for the list of bezels shown below.
More informationJun06 Rev D
Product Specification High Speed Serial Data 2 Connector 108-1965 27Jun06 Rev D 1. SCOPE 1.1. Content This specification covers performance, tests and quality requirements for the Tyco Electronics High
More informationSynJet MR16 LED Cooler with Heat Sink
PRODUCT SynJet MR16 LED Cooler with Heat Sink Design Guide Version 1.1 June 2009 Version History Document Name: SynJet MR16 LED Cooler with Heat Sink Design Guide Document Number: MKTG-DOC-00029 Version
More informationFAN POWERED SERIES FCI-600 CONSTANT VOLUME FAN TERMINAL UNIT SPECIFIABLE FEATURES
FAN TERMINAL UNIT SPECIFIABLE FEATURES Galvanized steel casing, mechanically sealed for low leakage construction NEMA TYPE 1 rated hinged control enclosure with standoff to prevent penetration of casing
More informationAdvanced Techniques US Inc.
Information PRO 1600 Technology Series Reflow Solutions Ovens Product Overview Key Features Full Convection and Lead Free Compatible Reflow Oven Up to 10 individually programmable zones Small Footprint
More informationQualification Testing of Meritec High Power Conformal Connector 107 position, short (.22 inch stack height) and tall (.33 inch stack height) versions
Qualification Testing of Meritec High Power Conformal Connector 107 position, short (.22 inch stack height) and tall (.33 inch stack height) versions Project 1256 Scope: Test 1 per EIA-364-23 - determine
More informationHybrid Electric Vehicle End-of-Life Testing On Honda Insights, Honda Gen I Civics and Toyota Gen I Priuses
INL/EXT-06-01262 U.S. Department of Energy FreedomCAR & Vehicle Technologies Program Hybrid Electric Vehicle End-of-Life Testing On Honda Insights, Honda Gen I Civics and Toyota Gen I Priuses TECHNICAL
More informationRETROFIT TERMINAL UNITS
GENERAL PROUCT OVERVIEW Retrofit Terminal s Convert Constant Air Volume Systems to Variable Air Volume. Convert Constant Volume ual uct Systems to Variable Air Volume. Convert Multizone Systems to Variable
More informationApplication Note 103 January LTM4600 DC/DC µmodule Regulator Thermal Performance Eddie Beville, Jian Yin AN103-1
Application Note 3 January 2 LTM DC/DC µmodule Regulator Thermal Performance Eddie Beville, Jian Yin INTRODUCTION The LTM DC/DC μmodule regulator is a complete high power density stepdown regulator for
More informationEMI / RFI Shielding Products. Shielding Honeycomb Ventilation Panels and Dust Filtration Characteristics
P.O. Box 699 17540 State Highway 198 Saegertown, PA 16433 EMI / RFI Shielding Products Phone: 877-MAJR PRO 814-763-3211 Fax: 814-763-2952 E-Mail: sales@majr.com Shielding Honeycomb Ventilation Panels and
More informationVORTAB FLOW CONDITIONERS. For Flow Meters, Pumps and Other Flow Profile Critical Equipment
VORTAB FLOW CONDITIONERS For Flow Meters, Pumps and Other Flow Profile Critical Equipment Reduce flow meter straight-run requirements into just a few diameters Balance pump inlet flow to eliminate premature
More informationSECTION ELECTRIC MOTOR ACTUATORS FOR VALVES
SECTION 40 92 10 - ELECTRIC MOTOR ACTUATORS FOR VALVES PART 1 - GENERAL A. Description This section includes materials and installation of electric motor actuators for valves. B. Submittals 1. Submit shop
More informationElectric Furnace KF/KFS Series
Electric Furnace KF/KFS Series KF/KFS 20 20 1 A B C D A: Series B: 20-208V 24-240V 48-480V C: Kilowatts D: 1 or 3-phase Heavy duty open-coil element Direct drive motor Up to 3-speed motor Standard 24 Volt
More informationDigital High Volume Ambient Air Monitoring Systems 110 Volt
Digital High Volume Ambient Air Monitoring Systems 110 Volt DH-60810V.2 DH-504V.2 DH-604V.2 DH-804V.2 DH-30V.2 Revision Date: 01 January 2016 Copyright 2016 This operator manual and information contained
More informationTURNING AIR INTO SOLUTIONS. COMMERCIAL DUTY PLENUM FANS EPLFN EPLQN
TURNING AIR INTO SOLUTIONS. COMMERCIAL DUTY PLENUM FANS EPLFN EPLQN CATALOG 455 June 2014 PLENUM FANS Overview EPLFN I EPLQN Plenum fans are unhoused fans designed to operate inside of field-fabricated
More informationCompliance Certification Services Inc. Report No: MIL(CS101) Date of Issue: August 12, 2009 MIL STD 461E/ F TEST REPORT.
Compliance Certification Services Inc. MIL STD 461E/ F TEST REPORT For 20.1 Multimedia LCD Monitor Model Number: WMRM920-PIP Trade Name: itech Issued to itech Company LLC 41758 Christy Street, Fremont
More informationSAM-e. Engineering Manual
Your guide to selecting and specifying Nortec SAM-e Short Absorption Manifolds! SAM-e Engineering Manual Includes technical specifications, guidelines, and options for selection and application of SAM-e
More informationSDL Single-Duct, Low-Height, VAV Terminals
SDL -Duct, Low-Height, VAV Terminals SDL -Duct, VAV Terminals: Fit more comfort in less space Owners SDL terminals offer the typical benefits provided by single-duct units, while performing at extremely
More informationDual Duct Terminal Units DPS, DDS Series, DPQ, DDQ Series, DPV, DDV Series, DPM, DDM Series, DPUQ, DDUQ Series
DPS, DDS Series, DPQ, DDQ Series, DPV, DDV Series, DPM, DDM Series, DPUQ, DDUQ Series Product Key UQ Ultra Quiet Product Selection Checklist 1] Select Unit Inlet Size based on control and acoustic parameters.
More informationTest Group Description. Total Number. Figure 1. Unless otherwise stated, the following environmental conditions prevailed during testing:
Qualification Test Report 26 November 12 Rev A1 SL Series Jacks, Category 6 1. INTRODUCTION 1.1. Purpose 1.2. Scope Testing was performed on AMP NETCONNECT* SL Series Category 6 Jacks to determine their
More informationRadnoti Modular Wire Myograph System Assembly and Basic Principles
Radnoti Modular Wire Myograph System Assembly and Basic Principles www.radnoti.com info@radnoti.com Copyright 2017 v. 17 List of Components for the M1000 The Radnoti M1000 is the start of the Wire Myograph
More informationIESNA LM MEASURING LUMEN MAINTENANCE OF LED LIGHT SOURCES MEASUREMENT AND TEST REPORT. For
IESNA LM-80-2008 MEASURING LUMEN MAINTENANCE OF LED LIGHT SOURCES MEASUREMENT AND TEST REPORT For No.1, Xianke Yi Road, Huadong Town, Huadu District, Guangzhou, China Model:40B18C12(Ra2) Report Type: 10000
More informationProduct Data PH3Z 13 SEER SINGLE -PACKAGED HEAT PUMP SYSTEM WITH R -22 REFRIGERANT SINGLE AND THREE PHASE 2-5 NOMINAL TONS ( )
13 SEER SINGLE -PACKAGED HEAT PUMP SYSTEM WITH R -22 REFRIGERANT SINGLE AND THREE PHASE 2-5 NOMINAL TONS (024-0) Product Data Fig. 1 - Unit 664B Single -Packaged Heat Pump Units with: S easy installation
More information