THERMAL. MANAGEMENT SOLUTIONS FOR BGAs DESIGN ANALYSIS FABRICATION

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1 THERMAL MANAGEMENT SOLUTIONS FOR BGAs DESIGN ANALYSIS FABRICATION

2 INTRODUCTION This short form catalog features Wakefield Thermal Solutions product offering for BGAs, Super BGAs, PBGAs and FPBGAs. Applications include Network routers and switches, high resolution printers, digital cameras, video games, digital video disk (DVD) and global positioning systems (GPS). A full line catalog is also available. To receive your copy, please contact your local sales representative, our corporate headquarters, us at info@wakefield.com, or visit us on the web at ABOUT WAKEFIELD THERMAL SOLUTIONS Thermal Management Solutions for Electronics Leadership in design Applications Engineering and sales support worldwide Aggressive implementation of world-class manufacturing concepts Wakefield is recognized as the worldwide leader in innovative thermal management solutions for a diverse range of commercial, industrial, and military markets. Nearly half a century of heat transfer design, analysis, manufacture, and fabrication expertise of components, systems, and assemblies is now joined with an aggressive commitment to customer support, product designs, and engineering services. Wakefield Engineering offers components and system level thermal management solutions for utilization in business equipment, computers, consumer electronics, automotive, industrial controls, instrumentation, integrated circuits, medical, laser, power conversion, telecommunications, transportation, and welding applications. ORDERING INFORMATION Once you have chosen heat sink and thermal interface material that meets your thermal & mechanical requirements it is easy to designate the part number. Simply add the interface material suffix (from the table on page ) to the base part number for the heat sink. The base part number already includes information regarding its size and finish. Example: To Order the 8 Series heat sink at. tall with the T thermal interface material, specify part number: 8-AB - T From Catalog Page From Table on Page Wakefield Thermal Solutions believes that information provided in this product catalog is accurate as of publication date. Product testing for proper performance in customer applications is recommended for all component designs and adhesives. Obtain mechanical samples of all assembly components and test to determine suitability. The physical properties reported herein are representative of performance values obtained by standard predictive and testing methods and typically exclude the interface resistance of any adhesive or other interface material in heat sink data. Wakefield Thermal Solutions is a manufacturer of heat dissipation products and reserves the right to make changes to its products without notice to improve the design or performance characteristics. All trademarks and tradenames used in this publication are for identification purposes only and may be trademarks of their respective companies. All specifications subject to change without notice. Normally stocked

3 THERMAL INTERFACE MATERIAL PART NUMBER GUIDE All of the heat sinks shown in this brochure are available with any of the following thermal tape and interface materials, pre-applied at the factory. Use the T series, thermally enhanced, pressure sensitive adhesives to attach the heat sink to the electronic package and provide a good thermal link to the heat sink. The S series interface materials have adhesives on only one side, for pre-attachment to the heat sink, and provide superior thermal performance. Specify these materials in applications where the heat sink will be fixed to the electronic package by some mechanical means other than a tape. Please note that none of these materials are for use in applications requiring electrical isolation from the electronic device. Note: To obtain the estimated thermal resistance of the interface material in your application, divide the thermal impedance value by the area of the pad in square inches. For example, a x piece of T has a resistance of. C-in^/W in^=.7 C/W T SERIES THERMALLY ENHANCED PRESSURE SENSITIVE ADHESIVES Manufacturer Thermal Impedance Thickness, Suffix Product C-in^/W Inches Package Surface, Comments -T Chomerics, T.7. Metal/ceramic; aluminum carrier -T Adhesives Research, 8.. -T Chomerics, T..9 THERMAL INTERFACE MATERIAL PART NUMBER GUIDE Metal/ceramic; very good thermal performance Metal/ceramic; very good performance and conformity -T Chomerics, T..7 Plastic -T Chomerics, T.. Plastic; conforms to out-of-flat packages -T M, Metal/ceramic; very good adhesion and conformity -T7 Bergquist, BP Metal/ceramic; electrically insulating P/N -AB -AB -AB -7AB -77AB 7-AB 9-AB 9-B -AB -AB -8AB -AB -AB -AB -AB -AB -AB -8AB 7-8AB 8-AB 8-AB 9-9AB T T T T T T T7 See Page P/N T T T T T T T7 -AB -8AB -AB -AB -AB -AB -AB -AB -AB -AB 8-AB 8-AB 8-AB 8-AB 8-AB -AB -AB -AB -AB -AB -AB -AB P/N T T T T T T T7 -AB -AB -AB -AB 8-AB 8-AB 8-AB 8-AB 9-AB -9AB -AB 98-AB 98-AB 98-AB 98-8AB 798-AB 798-AB 798-AB 798-8AB D- D8- D8- Normally stocked

4 BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink evaluation kit. BGA Heat Sink Heat Sink Height Recommended Attachment Sizes (mm) Footprint (mm) (inches) Series # Method 7 7 x 7. D Adhesive 9 9 x 9. Adhesive x. D8/D8 Adhesive x.... Adhesive x.. Adhesive x.7 Adhesive x.... Adhesive 7 8 x Adhesive 9 x.77 Adhesive x 8. 7 Adhesive x.8 Adhesive x.. Adhesive x. Adhesive x.... Adhesive x.... Adhesive 7. 7 x 7. Adhesive 7. 7 x 7. 9 Adhesive.7 x. 7 x Adhesive 8 x 8... Adhesive 7. 8 x 8.9 Adhesive x 8. Clip x.. Adhesive. x. Adhesive x Adhesive x. Adhesive 7. 7 x 7.8 Adhesive x Adhesive x.. 8 Adhesive x.8 Adhesive x Adhesive x. Adhesive up to 7 x.. 9 Clip up to 7 x.9 9 Clip Normally stocked

5 SERIES Omnidirectional Pin Fin Heat Sink for BGAs Fin Height Standard Base Dimensions A Typical Weight P/N in. Sq. in. (mm) Applications lbs. (grams) -AB.87 (). (.) mm BGA.9 (.9) -AB.87 (). (8.9) mm BGA. (.99) -AB.87 (). (.) mm BGA. (.8) -AB.87 (). (.) mm BGA. (.8) Material: Aluminum, Black Anodized The Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks (DVD) and global positioning systems (GPS). PRODUCT FEATURES Available in four standard heights,. inch,. inch,. inch, and. inch. Available with pressure sensitive adhesives for quick and easy mounting. See Page SERIES THERMAL PERFORMANCE Case-to-Ambient Thermal Resistance, C/W --T --T --T --T Approach Velocity, LFM Dimensions: in. SERIES Omnidirectional Pin Fin Heat Sink for BGAs Fin Height Standard Base Dimensions A Typical Weight P/N in. Sq. in. (mm) Applications lbs. (grams) -AB.98 (). (.) mm BGA. (.) -AB.98 (). (8.9) mm BGA. (.) -AB.98 (). (.) mm BGA.8 (8.7) -AB.98 (). (.) mm BGA. (.) Material: Aluminum, Black Anodized The Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks (DVD) and global positioning systems (GPS). PRODUCT FEATURES Available in four standard heights,. inch,. inch,. inch, and. inch. Available with pressure sensitive adhesives for quick and easy mounting. See Page SERIES THERMAL PERFORMANCE Case-to-Ambient Thermal Resistance, C/W T --T --T --T Approach Velocity, LFM Dimensions: in. Normally stocked

6 9 SERIES Unidirectional Fin Heat Sink for BGAs Standard Base Dimensions Height Typical Heat Sink Weight P/N in. (mm) in. (mm) Application Finish lbs. (grams) 9-AB. (.8) sq. (.) 7mm BGA Black Anodized. (.8) Notes:. Optional factory preapplied pressure-sensitive adhesive. See Page NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) SERIES Omnidirectional Pin Fin Heat Sink for BGAs and PowerPC Standard Base Dimensions Dimension A Dimension B Typical Heat Sink Weight P/N in. (mm) in. (mm) in. (mm) Applications Finish lbs. (grams) -AB. (.) sq. (.). (.) mm BGA Black Anodized.8 (7.) -AB. (.) sq. (.). (.7) mm BGA Black Anodized. (.8) Notes:. Optional factory preapplied pressure-sensitive adhesive. See Page NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) 8 SERIES Omnidirectional Pin Fin Heat Sink for BGAs and PowerPC Standard Base Dimensions Dimension A Typical Heat Sink Weight P/N in. (mm) in. (mm) Applications Finish lbs. (grams) 8-AB. (7.9) sq. (.) 7mm BGA Black Anodized. (.7) 8-AB. (7.9) sq. (8.9) 7mm BGA Black Anodized. (.7) 8-AB. (7.9) sq. (.) 7mm BGA Black Anodized.9 (8.) 8-AB. (7.9) sq. (.) 7mm BGA Black Anodized. (.7) Notes:. Optional factory preapplied pressure-sensitive adhesive. See Page NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) KEY: 8-AB +8-AB 8-AB 8-AB Normally stocked

7 SERIES Unidirectional Fin Heat Sink for BGAs Standard Base Dimensions Height Typical Heat Sink Weight P/N in. (mm) in. (mm) Application Finish lbs. (grams) -9AB.SQ. (8.9)SQ..8 (7.) 7mm BGA Black Anodized. (.7) Notes:. Optional factory preapplied pressure-sensitive adhesive. See Page MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) SERIES Unidirectional Fin Heat Sink for BGAs Standard Base Dimensions Fin Height "A" Typical Weight P/N in. Sq. in. (mm) Applications lbs. (grams) -AB.78 (). (.) mm BGA. (9.99) -AB.78 (). (8.9) mm BGA.7 (.) -AB.78 (). (.) mm BGA. (.7) -AB.78 (). (.) mm BGA.9 (7.7) Material: Aluminum, Black Anodized The Series is an unidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks (DVD) and global positioning systems (GPS). PRODUCT FEATURES Available in four standard heights,. inch,. inch,. inch, and. inch. Available with pressure sensitive adhesives for quick and easy mounting. See Page SERIES THERMAL PERFORMANCE Case-to-Ambient Thermal Resistance, C/W 8 --T --T --T --T Approach Velocity, LFM Performance shown is with T thermal adhesive applied. Dimensions: in. (mm) Normally stocked

8 SERIES Omnidirectional Pin Fin Heat Sink for Limited Height BGAs Standard Base Dimensions Height Typical Heat Sink Weight P/N in. (mm) in. (mm) Applications Finish lbs. (grams) -AG.7 (.) sq. (.8) mm BGA Gold Iridite.9 (8.) -AB.7 (.) sq. (.8) mm BGA Black Anodized.9 (8.) Notes:. Optional factory preapplied pressure-sensitive adhesive. See Page NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) 8 SERIES Omnidirectional Pin Fin Heat Sink for BGAs Standard Base Dimensions Dimensions A Typical Heat Sink Weight P/N in. (mm) in. (mm) Applications Finish lbs. (grams) 8-AB.7 (.) x.7 (.). (.) mm BGA Black Anodized. (.7) 8-AB.7 (.) x.7 (.). (.) mm BGA Black Anodized.8 (7.) 8-AB.7 (.) x.7 (.). (8.9) mm BGA Black Anodized. (9.8) 8-AB.7 (.) x.7 (.). (.) mm BGA Black Anodized. (.8) 8-AB.7 (.) x.7 (.). (.) mm BGA Black Anodized. (.) Notes:. Optional factory preapplied pressure-sensitive adhesive. See Page NATURAL CONVECTION CHARACTERISTICS FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) KEY: 8-AB 8-AB 8-AB 8-AB 8-AB Normally stocked 7

9 SERIES Omnidirectional Pin Fin Heat Sink for BGAs Fin Height Standard Base Dimensions A Typical Weight P/N in. Sq. in. (mm) Applications lbs. (grams) -AB.78 (). (.) mm BGA.9 (.9) -AB.78 (). (8.9) mm BGA. (.99) -AB.78 (). (.) mm BGA. (.8) -AB.78 (). (.) mm BGA. (.8) Material: Aluminum, Black Anodized The Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks (DVD) and global positioning systems (GPS). PRODUCT FEATURES Available in four standard heights,. inch,. inch,. inch, and. inch. Available with pressure sensitive adhesives for quick and easy mounting. See Page SERIES THERMAL PERFORMANCE Dimensions: in. 98 SERIES Omnidirectional Pin Fin Heat Sink For BGAs Standard Base Dimensions Dimensions A Typical Heat Sink Weight P/N in. (mm) in. (mm) Applications Finish lbs. (grams) 98-AB. (.) sq.. (.) sq. mm BGA Black Anodized.7 (.) 98-AB. (.) sq.. (.) sq. mm BGA Black Anodized.9 (.8) 98-8AB. (.) sq..8 (.) sq. mm BGA Black Anodized. (.7) 98-AB. (.) sq.. (.) sq. mm BGA Black Anodized. (.) Notes:. Optional factory preapplied pressure-sensitive adhesive. See Page FORCED CONVECTION THERMAL PERFORMANCE DATA (FLOW PARALLEL TO EXTRUSION DIRECTION) Dimensions: in. (mm) KEY: 98-AB 98-AB 98-8AB 98-AB 8 Normally stocked

10 798 SERIES Pin Fin Heat Sink for BGAs Standard Base Dimensions Dimensions A Typical Heat Sink Weight P/N in. (mm) in. (mm) Applications Finish lbs. (grams) 798-AB. (.) x.8 (7.). (.) mm BGA Black Anodized. (8.) 798-AB. (.) x.8 (7.). (.) mm BGA Black Anodized. (8.9) 798-8AB. (.) x.8 (7.).8 (.) mm BGA Black Anodized. (.) 798-AB. (.) x.8 (7.). (.) mm BGA Black Anodized. (9.) FORCED CONVECTION THERMAL PERFORMANCE DATA (FLOW PARALLEL TO EXTRUSION DIRECTION) KEY: 798-AB 798-AB 798-8AB 798-AB Dimensions: in. (mm) Notes:. Heat sink mounting surface flatness:." TIR. Optional factory preapplied pressure-sensitive adhesive. See Page SERIES Omnidirectional Pin Fin Heat Sink for BGAs Standard Base Dimensions Fin Height Typical Weight P/N in. (mm) in. (mm) Applications lbs. (grams) -AP. (.) x. (7.9). (8.89) mm BGA.7 (.78) Material: Aluminum, Plain Finish The Series -AP is an omnidirectional pin fin heat sink for both natural and forced-convection applications designed to fit a mm BGA. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks (DVD) and global positioning systems (GPS). PRODUCT FEATURES Available with pressure sensitive adhesives to ensure good thermal performance. See Pages and Can be ordered with the 89SC clip. Order clip separately. (Clip cannot be purchased without heat sink) -AP SERIES THERMAL PERFORMANCE.. Case-to-Ambient Thermal Resistance, C/W Approach Air Velocity, LFM Performance shown is with S interface material applied. Dimensions: in. Normally stocked 9

11 DELTEM COMPOSITE HEAT SINKS FOR BGAs Deltem D- Pin Fin Heat Sink Standard Base Dimensions Height Weight P/N in. (mm) in. (mm) lbs. (grams) D-. (.) sq. (.). (.7) Notes: Available with pressure sensitive adhesives for quick and easy mounting. See Page Deltem D8- Pin Fin Heat Sink Standard Base Dimensions Height Typical Weight P/N in. (mm) in. (mm) Applications lbs. (grams) D8-.8 (.) sq. (.) mm BGA.9 (8.) Notes: Available with pressure sensitive adhesives for quick and easy mounting. See Page Deltem II D8- Pin Fin Heat Sink Standard Base Dimensions Height Typical Weight P/N in. (mm) in. (mm) Applications lbs. (grams) D8-.8 (.) sq. (.) mm BGA.9 (8.) Notes: Available with pressure sensitive adhesives for quick and easy mounting. See Page DELTEM D- PIN FIN HEAT SINK DELTEM D8- PIN FIN HEAT SINK DELTEM II D8- PIN FIN HEAT SINK NATURAL AND FORCED CONVECTION CHARACTERISTICS NATURAL AND FORCED CONVECTION CHARACTERISTICS NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) Normally stocked

12 9 SERIES Pin Fin Heat Sink/Clip Assembly for BGAs and PowerPC Packages Standard Base Dimensions Dimensions A Typical Heat Sink Weight P/N in. (mm) in. (mm) Applications Finish lbs. (grams) 9-AB.89 (7.) x. (.8). (.7) &mm BGA Black Anodized.9 (.) 9-AB.88 (7.) x.7 (.). (.) &mm BGA Black Anodized. (9.) Note: Optional factory preapplied thermal interface material. S (Bergquist Q-Pad,. C in /w) S (Bergquist Softface,.7 C in /w).88 THERMAL RESISTANCE SINK TO AMBIENT ( C/WATT) FORCED CONVECTION THERMAL PERFORMANCE DATA (FLOW PARALLEL TO EXTRUSION DIRECTION) * 9-AB 9-AB (9-AB) A DIM. (9-AB) *Performance is for shrouded conditions. 9- will perform better than 9- in cases with bypass. 9-AB HEAT SINK AND CLIP ASSEMBLY Dimensions: in. (mm) Designed to fit a. thick PCB electronic package thickness of. 9 SERIES Fan Heat Sink for BGA and PowerPC Packages Standard Base Dimensions Height Typical Heat Sink Thermal Weight P/N in. (mm) in. (mm) Applications Finish Performance lbs. (grams) 99ABD.87 (7.9) x.98 (.9).9 (.) &mm BGA Black Anodized. C/W. (8.) 99ABD.87 (7.9) x.98 (.9).9 (.) &mm BGA Black Anodized. C/W. (8.) Note: Optional factory preapplied thermal interface material. See 9 series. FEATURES AND BENEFITS: Captivated clips for ease of assembly Low acoustic noise Impingement air flow Accommodates BGA packages up to mm in size Dimensions: in. See 9 Series for PCB hole layout for clip attachment Normally stocked

13 SERIES THERMAL PERFORMANCE 7 7 SERIES THERMAL PERFORMANCE 8 -AB -AB 7 Normally stocked

14 SERIES THERMAL PERFORMANCE SERIES THERMAL PERFORMANCE 7 7 Normally stocked

15 7 SERIES 7 THERMAL PERFORMANCE 7 7 SERIES THERMAL PERFORMANCE 9 8 -AB 7 -AB 7 Normally stocked

16 SERIES THERMAL PERFORMANCE 7 7 SERIES THERMAL PERFORMANCE 7 Normally stocked

17 SERIES THERMAL PERFORMANCE 7 SERIES THERMAL PERFORMANCE 8 7 -AB -AP (dashed) -AB 7 Normally stocked

18 SERIES THERMAL PERFORMANCE SERIES THERMAL PERFORMANCE 7 Normally stocked 7

19 7 SERIES 7 THERMAL PERFORMANCE 7 8 SERIES 8 THERMAL PERFORMANCE 7 8-AB 8-AB 7 Normally stocked 8

20 SERIES THERMAL PERFORMANCE 7 SERIES THERMAL PERFORMANCE 7 Normally stocked 9

21 NOTES: Normally stocked

22 FAX: TRANSMITTAL Please copy and complete this form, then fax or mail to: Bridge Street Pelham, NH 7 Phone: () -8 Fax: () -9 FROM: Total # pgs. being faxed Name Title Company Division/Department Mail Stop Address City State Zip Country Telephone ( ) Fax ( ) Product or project APPLICATION INFORMATION REQUIRED:. What type of electronic device will be cooled?. How many of these devices will be cooled?. How many watts of power must be dissipated from each device and in aggregate? Please specify: Each device Total Power A sketch of the heat distribution on the base is attached. Yes No A sketch of the component is also being faxed. Yes No. What is the maximum allowable junction temperature of the device? C (See the manufacturer's data sheet). If no junction temperature has been specified, what is the maximum case temperature? C. What is the thermal resistance of the semiconductor from junction to case - Θj - c? (See the manufacturer's data sheet). Θ j - c. Is electrical isolation required between the device case and the heat sink? At what voltage level? 7. What finish is required on the heat sink? Anodize Paint Chromate Special None What color? 8. What is the maximum ambient air temperature? C 9. What type of convection is required? Forced Natural. If forced convection have you chosen a fan? Yes No Fan Manufacturer/Part Number Fan Size Free Flow (CFM) Static Pressure (Inches ) H. Will you shroud the air flow (i.e., direct the air through the heat sink)? Yes No If no, what is the cross-sectional size of the air space where the heat sink will be located? Width X Height. How much space is available for this heat sink? Length Width Height in. or cm Samples needed by: Prototype completion date: Pre-production target date: Production target date: Rate of usage: Estimated Annual Usage (EAU): Estimated program life expectancy:

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