WinMate Communication Inc. 9F, No Hsing Teh Road, San-Chung, Taipei, Taiwan, R.O.C TEL: FAX: Thermal Test Report

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1 Thermal Test Report Issue by Design Technology Department Product Model Product Description 7 Rugged Handheld Device : M700D Rugged Handheld Device New product Rugged Handheld Device Renew product PCB : BIOS: Test Reason Revision change PCB : BIOS: Component: 2013/02/22 Lindon Lin Eric Su Issue date Approved Test Engineer 1

2 1. Document Introduction This document describes how we conduct the environment conditions and test procedure. It includes the test equipment we use, the test condition, and the test procedure we take. We also define our test criteria and the way to conclude the test result. (According to client s test specification, please see following sheets in detail.) Table of Testing Summary Results NO Test Item Condition Description Sect. / Page 1 Thermal Profile -Operating 4 Test -Thermal Cycle: 30/40/50/55/60 ± 2 / 5 -Every stage of 2 Hours Reference to IEC

3 2. Product Configuration 1. M/B :ID8C CPU:Intel Atom 3.5W 3. System Chipset:Intel NM10 Chipset 4. Panel:CMO EJ070NA-01J 1024x600/*500Nits LED 5. RAM:DSL D3SH56081XH15AA DDR GB(Hynix chip * 8pcs) 6. SSD:Transcend TS32GMSA310 msata SSD 32G 7. BIOS/EC:ID8CV107 C002 / ID8CD107C Touch:EDT EP0700MLF9 85%/1.80mm 9. Bluetooth & Wifi:Intel Centrino Advanced N G:HUAWEI EM770W 11. Battery:JHT M700D,2S1P,2270mAh 12. Hot Tab Version:HotTab A Camera:Fangtec AG3820A11-S1-3ND_I6R I/O Board:M700DLED-110 / M700DKB-110 / M700DIO-200 /M700DPOGO Adapter:EDAC EA11001C-120 / AC IN V~2.5A,50-60Hz / DC OUT 12V,6.6A 3

4 3. Photo of Product Configuration Photo of EUT Top View Bottom View Front View Back View Left Side View Right Side View 4

5 4. Thermal Profile Test A. Test Equipment: Test Site: Winmate LAB Programmable Temperature & Humidity Chamber KSON / THS-G4T-100 / S/N: 5887K YOKOGAWA /μr20000 / SN: S5G B. LAB Environmental Conditions: Ambient Temperature: 25 +/- 3 Relative Humidity: 55 +/- 20% RH C. Test Method / Specification : Reference to IEC Thermal Cycle: 30 /40 /50 /55 /60 ±2 Test software Running Windows 7 with PassMark BurnIn Test Professional V7.0 (Build 1004) Quantity: Total 1 Set Testing Period: Jan. 25, 2013 to Jan. 28, 2013 Figure 1:High temperature thermal cycle 5

6 D. Check Condition and Requirements: It is to check the thermal profile of the test unit, and also test unit can work under different environment temperature condition. The highest temperature /position, lowest temperature /position and the average temperature value will be display at the thermal profile record. The equipment in its high temperature mode, shall exposed to daily high-low temperature cycles between and 60.The equipment shall withstand the required environmental conditions and shall meet, without any functional damage, all performance requirements after being exposed to 1 cycle of high temperatures, as illustrated in Figure1. E. Test Result: Examine the appearance of specimen(s) by visual check and perform functional check after this test. Connect the specimen with rated power then examine whether the display function of specimen could be work normally or not. Functional Check & Mechanical Structure: Normal Appearance check (Visual check): No visible damage Test Point of Temperature: Temperature rise of part : CPU Sink:Intel Atom N2600@1.6GHz Chipset Sink:Intel NM RAM:DSL DDR GB SSD:Transcend msata SSD 32G Middle Plate Battery System Inside(air) Back Cover(Inside) Back Cover(Outside) Panel(Up) Panel(Middle) Panel(Down) Ambient Note: The table shows the examine of system health status. In comparison with the component Spec, the examine result will be minor inconsistency. Although the temp is a bit overheating, it s still in tolerating ranges and working properly. 6

7 (1) Temperature Point of Number Description Ambient NOTE: 13-Ambient in Chamber 7

8 F. Test Judgment: Test Result as below: Check Item Appearance check (Visual check) Functional & Style Item No. Initial Final Performance check 7 Rugged Handheld Device : M700D No visible damage No visible damage Normal 8