Product End-of-Life Disassembly Instructions

Transcription

1 Product End-of-Life Disassembly Instructions Product Category: Monitors and Displays Marketing Name / Model [List multiple models if applicable.] HP passport 1912nm 18.5-inch Internet Monitor Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 22/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1. Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Quantity of items Item Description Notes included in product Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) With a surface greater than 1 sq cm 4 Batteries Mercury-containing components Liquid Crystal Displays (LCD) with a surface greater than 1 sq cm All types including standard alkaline and lithium coin or button style batteries For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Includes background illuminated displays with gas discharge lamps 2 Cathode Ray Tubes (CRT) Capacitors / condensers (Containing PCB/PCT) Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height External electrical cables and cords Power cord 1 Gas Discharge Lamps Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above) Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations. Components and waste containing asbestos Components, parts and materials containing EL-MF877- Page 1 Template Revision B PSG instructions for this template are available at EL-MF877-1

2 refractory ceramic fibers Components, parts and materials containing radioactive substances 2. Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable) Description #1 Description #2 #1 Bushing Screw Driver #2 Crossing Screw Driver Description #3 Description #4 Description #5 3. Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1. Lay the Monitor on the desk. 2. Take out the base with finger. 3. Unlock 2 screws for VGA with #1 Bushing Screw Driver. 4. Release the stand arm down with thumb. 5. Unlock the 2 screws which fix the stand arm and Hinge with #2 Crossing Screw Driver. 6. Take the front bezel out. 7. Take the LVDs out 8. Take the panel out from the back cover assy. 9. Take the keypad out and unlocked the 11 screws which fixed the Power Board & I/F board &Arm Board and chassis #2 Crossing Screw Driver. 1. Separated the connect and board. 11. Separated the chassis from the back cover with the shark tool. 12. Take the speakers out from the chassis with hand. 13. Take the 4 pcs VESA Cap out from the chassis with hand. 14. Unlock 2 screws from the hinge and back cover. 3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations). EL-MF877- Page 2 Template Revision B PSG instructions for this template are available at EL-MF877-1

3 Disassembly Flowchart for HP 1912nm Model Action Tool Issue Date:Dec 21, 212 Initiator: Cook Lau Photo Lay the Monitor on the desk. Take out the base with finger Unlock 2 screws for VGA with screw Driver. #1 Bushing Screw Driver Release the stand arm down with thumb Unlock the 2 screws which fix the stand arm and Hinge with screw driver. #2 Crossing Screw Driver Take the front bezel out.

4 Take the LVDs out. Take the panel out from the back cover assy. Take the keypad out and unlocked the 11 screws which fixed the Power Board & I/F board &Arm Board and chassis. #2 Crossing Screw Driver separated the connect and baord. Separated the chassis from the back cover with the shark tool.

5 Take the speakers out from the chassis with hand. Take the 4 pcs VESA Cap out from the chassis with hand. Unlock 2 screws from the hinge and back cover, #2 Crossing Screw Driver

6 Chimei Innolux Corporation No.3, Sec.1, Huansi Road, Tainan County, Southern Taiwan Science Park 74147, Taiwan Page : 1 of 4 Subject : Lamp Assembly Disassembly order Model : M185B1-L7 1. Separate the pcb protector film from the module PCB protector film 2.Remove 3 pcs screws. 3. Release the hooks around the module for remove the front metal frame 4. Separate the isolated film from the metal rear Isolated film No.: F2429-Ver.2

7 5.Remove wire fixing tape from lamp wire Page : 2 of 4 Wire fixing tape 6. Remove lamp wire from the housing Remove all hooks around the rear frame to separate housing. Housing No.: F2429-Ver.2

8 8. Push up the upside film to remove film Page : 3 of 4 Films 9. Push up the side of LGP to remove LGP LGP 1. Release the refector. from the rear frame. Reflector No.: F2429-Ver.2

9 11. Disassemble the lamp ASS Y Page : 4 of 4 Lamp Asssy. 12.Remove rubber cap from lamp Rubber cap 13. Remove lamp holder from metal rear Lamp holder. No.: F2429-Ver.2