Challenges of smart systems integration by using micro and nano technologies

Transcription

1 Challenges of smart systems integration by using micro and nano technologies K. Hiller, M. Wiemer, T. Gessner Fraunhofer Research Institution for Electronic Nano Systems Center for Microtechnologies, Chemnitz University of Technology Page 1

2 OUTLINE 1. Introduction TUC/ZfM und 2. MEMS und Smart Systems Integration 3. Examples 4. Conclusion Page 2

3 The Fraunhofer-Gesellschaft in Germany 80 research units (56 Institutes) at approx. 40 locations Itzehoe Rostock Institutes Branches of Institutes, Research Institutions, Working Groups, Branch Labs and Application Centers Bremen Berlin Hannover Potsdam Braunschweig Teltow Nuthetal Paderborn Magdeburg Oberhausen Dortmund Cottbus Halle Leipzig DuisburgSchmallenberg Schkopau Dresden Erfurt Sankt Augustin Aachen Ilmenau Jena Euskirchen Chemnitz Darmstadt Würzburg Wertheim Kaiserslautern Erlangen St. Ingbert Fürth Saarbrücken Nürnberg Pfinztal Karlsruhe Stuttgart Freising München Freiburg Oberpfaffenhofen Efringen- Holzkirchen Kirchen Page 3

4 Chemnitz University of Technology Basic Research Applied Research Page 4

5 ENAS Fraunhofer ENAS MEMS Packaging / Multi Device Integration System Integration / BEOL Reliability Printed Functionalities Advanced System Engineering ZfM Basic research focus on nano materials and technology Design of systems and components Basic processes for demonstrators (sensors, actors, arrays, BEOL) Page 5

6 OUTLINE 1. Introduction TUC/ZfM und 2. MEMS und Smart Systems Integration 3. Examples from ZfM/ENAS 4. Conclusion Page 6

7 Definition Smart Systems Integration Page 7

8 Smart Systems Integration & Packaging MEMS / NEMS Electronic Components Communication Unit Processor & Memory Power Radio Sensor & Actuator CMOS Microsystem technologies Hetero system integration Page 8

9 Characteristics of Smart Systems Integration MULTIFUNCTIONALITY Multi Device Integration MULTITECHNOLOGY Combination of different technology approaches MULTIMATERIALS Combination and integration of advanced materials SSI Improved functionality and performance New components or subsystems New approaches required concerning: System / Component design Reliability aspects Usage of huge effective technologies Page 9

10 Trends MEMS / Nanointegration NEMS Page 10

11 In-Process Sensing Gap Reduction of Capacitive Transducers before - Output voltage [mv rms ] Sensitive gap 0.6 µm µm trench depth reference structure Frequency [Hz] new principle after displacing Gap width down to < 100 nm for increased sensitivity of shrinking devices Page 11

12 Trends MEMS / Nanointegration NEMS MEMS / Semiconductor Integration SiP Page 12

13 3D Wafer-to-Wafer or Chip-to-Wafer Technologies Through Si Via (TSV) Technology with CVD-Cu or ECD Cu 72 µm AR: 20 : 1 Schematic of ICV technology (FhG IZM Munich) High aspect ratio Si etching Page 13

14 Trends MEMS / Nanointegration NEMS MEMS / Semiconductor Integration SiP Multiple MEMS Integration multi device Page 14

15 SOC for Noise Reduction: Integrated Vibration Sensor / Resonator SOC in standard package CMOS on-chip readout amplifier including selfexcitation for oscillator mode (fabricated by ZMD) layout transconductance spectrum in sensor mode SCS resonator: ENAS/ ZfM post CMOS process Page 15

16 OUTLINE 1. Introduction TUC/ZfM und 2. MEMS und Smart Systems Integration 3. Examples RFID label Spectrometer Lab on a chip 4. Conclusion Page 16

17 RFID Applications Material Tracing Box Management Facility Management Quelle: ITM/Ruhr-Universität-Bochum Quelle: ITM/Ruhr-Universität-Bochum Quelle: ITM/Ruhr-Universität-Bochum RFID Application with Complex Additional Functions Detection of temperature - acceleration pressure- light Combination of display and RFID Data processing and storage partly on the label Page 17

18 Project ASIL: Active Smart ID Label BMBF collaborative project: priority topic of the Microsystems framework programme: Microsystems Technology for Smart Label Applications in Logistics Objective: development of an active radio frequency identification (RFID) label for the monitoring of shock, inclination and temperature during transportation processes Partner: KSW Microtec AG ELMOS Semiconductor AG Schenker AG Memsfab GmbH TUC-ZfM/ Page 18

19 Project ASIL- RFID label concept The label components: - RF-chip with antenna - battery for energy supply - sensor system consisting of the micromechanical transducer and the signal processing electronic The system has to detect and record inclination and mechanical shock. In order to reduce the complexity of the system, it is reasonable to measure both with the same microstructure KSW Microtec Battery Interposer ELMOS Signal Processing A/D Conversion ASIC-Chip Temperature Sensor KSW Microtec Logic / Memory RFID-Chip Smart RFID label TUC-ZfM/Memsfab Shock Sensing Inclination Sensing MEMS-Chip Submodule RF- Front End Antenna Specific requirements for the sensor system: - low energy consumption - high signal to noise ratio - high temperature stability - low device / sensor thickness Page 19

20 Projekt ASIL: Interposer and packaging fabrication Packaging Concepts KSW-RFID-ASIC Sensor ASIC RFID-Chip ASIC Sensor RFID-Chip Sensor chip Sensor-ASIC Interposer with sensor chip, RFID-chip and ASIC Page 20

21 ASIL Sensor Capping by Thin Film Encapsulation capping wafer seal glass sealing layer contact pad > 200 µm ~ 10 µm Reduction of sensor cap thickness by factor 20 Page 21

22 RFID label with active elements Interposer with: KSW- RFID chip Acceleration sensor ASIC RFID label with: Interposer Batteries Antenna Page 22

23 OUTLINE 1. Introduction TUC/ZfM und 2. MEMS und Smart Systems Integration 3. Examples RFID label Spectrometer Lab on a chip 4. Conclusion Page 23

24 Micro Spectrometer - Optical Setup & Functional Principle NIR-Spectrometer NIR-Spectrometer MIR-Spectrometer MIR-Spectrometer Spherical mirror Spherical mirror Diffraction grating Diffraction grating Entrance slit MCZT-Detector Fiber optic Detectorslits Micromirror Detector slit InGaAs-Detectors Entrance slit Micromirror Page 24

25 Micro Mirror Spectrometer for Chemical Analysis Current specifications: Spectral Range: 2-5 µm Spectral resolution (FWHM): < 30 nm Spectra acquisition time: < 2 ms Signal to Noise Ratio : 300 to 1 Spherical mirror Diffraction grating Rapid prototyping polyamide package Stray light traps Micro mirror (with electrical connectors) Detector slit Page 25 Entrance slit with collimator lens SMA connector Silicon Micromirror

26 Environmental applications fuel quality Assessment of ignition capability of fuel for reduced emission in start phase Detect fuel quality for optimized combustion control Target is cetane number, octane number Studies forecast a dramatic increase in fuel diversity in the coming 10 years EUCAR EUCAR vision vision // Th. Th. Spoormanns Spoormanns updated updated New New Passenger Passenger Cars Cars & Light Light Commercial Commercial Vehicle Vehicle ( ( 5t 5t )) M arket Share S ale (% ) D iesel iesel G asoline asoline Variable Variable DI- DI- Gasoline Gasoline DI- DI- Gasoline Gasoline Combined Combined Combustion Combustion System System Combined Combined Homogeneous/ Homogeneous/ Heterogeneous Heterogeneous Combustion Combustion Diesel Diesel DI-Diesel DI-Diesel Gas Gas vehicles vehicles Power Hybrid Power Hybrid Fuel Cell Fuel Cell EUCAR EUCAR Roadmap Roadmap forecasts forecasts dominance dominance (~83%) (~83%) of of combustion combustion engines engines until until the the rest rest will will be be Gas Gas (~10%), (~10%), Hybrides Hybrides (~5%) (~5%) and and FC FC (~2%) (~2%) Analysis of gas phase in tank (above level) of fuel itself Detection of main fuel components using e.g. a microspectrometer to get the finger print of the fuels Main constituents determine fuel type MTBE Toluen Pentan Propan Isopentan Isobutan Butan Analysis of gas phase above fuel bad fuel Californian fuel federal fuel cold start fuel Page 26

27 Environmental applications fuel quality benzine benzine - 10 % ethanole benzine - 20 % ethanole benzine - 50 % ethanole benzine - 85 % ethanole ethanole Measurement setup: transmission cuvette 10mm path length Absorption Information clearly visible in the range 1,5-1,6µm wavelength (µm) Page 27

28 Tunable Fabry-Perot Filters for IR (3-5 µm) spectral analysis Broadband Pass IR (3 5 µm) Spring r Fz Elektrode r Fz Silicon Air Gap Reflector USignal Broadband IR Detector Transmission [nm] 100 Foto: FP filter on detector, mounted in a TO-8 housing (by courthesy of InfraTec GmbH, Dresden) Page 28 0V 15 V 20 V 25 V 27 V Wavelength [nm]

29 Application examples of IR spectrometers GAS MEASUREMENT ENVIRONMENTAL SENSING Determination of elementary process gases and liquids Page 29

30 OUTLINE 1. Introduction TUC/ZfM und 2. MEMS und Smart Systems Integration 3. Examples RFID label Spectrometer Lab on a chip 4. Conclusion Page 30

31 Polymer µsystems: Disposable, fully functional Labs-on on-a-chip Sample (e.g. blood, ) all-included Lab-on-Chip Micro Fluidics (active and passive) Integrated (on-chip) polymer based fluid handling microfluidic reservoirs, channels, and actuators (pumps and valves) Sample preparation Micro Optics Integrated microoptical elements in microfluidic polymer chips Waveguides, gratings,... Sample analysis Diagnosis Page 31

32 Polymer µsystems: Micro Optical Fluidic Systems Microfluidic Polymer Chips with integrated waveguides Different analyses of liquid samples Sealed PMMA Chip with integrated waveguides, structures fabricated by hot embossing Absorption / colorimetric measurements Stray light measurement Absorption log(p0/p) Wavelength [nm] Absorption Spectrum of Methylene Blue in water for different concentrations Light source Cell counting Integrated waveguide fluidic channel Working principle of the optical-fluidic chip Polymer substrate Detector Page 32

33 Integration of optics and fluidics: The SEMOFS biocard SEMOFS = Surface enhanced micro optical fluidic systems Goal: fully integrated micro optics and micro fluidics (both active and passive) based on a polymer substrate for biosensing application Partners: CSEM, CEA, ZEPTOSENS, EUROGENTEC, CHR cidadelle, Cardiff University, ALMA Reader Cardridge/chip Application Electrical interface µf Actuator Channel Surface Funct. µfluidic Channel Substrate Biological interface Different functional parts and its interfaces of the fully integrated system: Reader Fluidicoptical interface OLEDs Waveguide Substrate SPR-Layer Biological Surface Functionalization Sample / Reagents Page 33

34 Bio sensing based on NEMS optical sensors Sensing layer: SPR sensor with waveguides: Multi layer stack based on Au or Ag, thickness < 150 nm molecules Sensing layer system waveguide Phase matching of waveguide mode and plasmon mode Transmission n1 n2 substrate wavelength Sensing principle: Surface plasmon resonance at a metal-dielectric interface Interaction with mode guided in the waveguide Absorption peak depending on the refractive index Refractive index changes due to bio molecules attached to the surface Page 34

35 Micro Fluidics Integrated Polymer Actuators Electrochemical generation of gas Anode: 2H 2 O Kathode: 2H 2 O + 2e - Net reaction: 2H 2 O Direct actuation 4H + + 4e - + O 2 (g) 2OH - + H 2 (g) O 2 (g) + 2H 2 (g) Gel filled cavity with drive electrodes Employing a water based gel PAA-gel amount of gas can be controlled by current Page 35

36 Integration (Microfluidics + SPR + bio) Complete microfluidic cartridge with SPR slide Page 36

37 OUTLINE 1. Introduction TUC/ZfM und 2. Trends und Smart Systems Integration 3. Examples from ZfM/ENAS 4. Outlook and Conclusion Page 37

38 Functional Polymers and Nano Composites Porous polymers Nanomers Polymer nanocomposites Properties for sensor applications: piezoelectric or piezoresisitve dielectric magnetic conductive Examples for piezoelectric properties: ppp (porous PolyPropylen with KNO 3 ) P(VDF-TrFE) (Polyvinylidenenfluoride + Trifluoethylene) PVDF PZT (Polyvinylidenenfluoride + PZT) Sensor design: Top electrode Nano composite Substrate with electrodes Page 38

39 CNT application in electronics and as sensor Carbon Nanotubes as via material in IC-devices Simulation: CNT-CVD-Reactor Research Goal: - Low temp. CMOS-compatible CNT growth on structured wafers - Reversible contacting of (Bio-)Chips at room temperature - Aligned CNT-growth with high density and crystallinity at T < 450 C (IRTG) Nanosized Catalyst CNT Page 39

40 Conclusions The Fraunhofer Organization is a worldwide successful provider of research services Many products (prototypes) and technologies were developed and transferred in the field of Microelectronics and MEMS at the Fraunhofer ENAS Future trends are increasing functionality in one system at the same time with degreasing size and improved package Smart systems integration needs multi device integration by using different technologies as well as different materials Page 40