9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :

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1 9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) info@systemplus.fr - website : July Version 1 Written by: Romain FRAUX DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners by SYSTEM PLUS CONSULTING, all rights reserved. Freescale MPXY8300A TPMS 1

2 Table of Contents Glossary 1. Overview / Introduction Executive Summary Reverse Costing Methodology 2. Freescale Company Profile Manufacturing Process Flow 56 Overview MCU process flow RFX process flow G-die process flow P-die process flow Description of the Wafer Fabrication Units 3. Physical Analysis Synthesis of the physical analysis Physical analysis methodology Tire Pressure Monitoring System (TPMS) Multi-Chip Package Package characteristics & markings Package opening MCU markings MCU dimensions MCU minimal dimension and metal layers MCU process characteristics RFX markings RFX dimensions RFX minimal dimension and metal layers RFX process characteristics G-die markings G-die dimensions G-die : cap opening G-die : sensors dimensions G-die : x-axis & z-axis structure G-die : x-axis & z-axis process characteristics G-die process characteristics P-die markings P-die dimensions P-die minimal dimension and metal layers P-die : sensors dimensions P-die : sensors process characteristics P-die process characteristics 5. Cost Analysis Synthesis of the cost analysis Main steps of economic analysis Yields explanation MCU wafer cost MCU probe & dicing cost MCU die Cost RFX wafer cost RFX probe & dicing cost RFX die cost G-die wafer cost G-die probe & dicing cost G-die cost P-die wafer cost P-die probe & dicing cost P-die cost MPXY8300A packaging cost MPXY8300A final test cost MPXY8300A component manufacturing Cost Yield synthesis 6. Estimated Manufacturer Price Analysis Supply Chain Analysis Manufacturer ratios Estimated manufacturer Price Conclusion 2009 by SYSTEM PLUS CONSULTING, all rights reserved. Freescale MPXY8300A TPMS 2

3 Executive Summary 2009 by SYSTEM PLUS CONSULTING, all rights reserved. Freescale MPXY8300A TPMS 3

4 Tire Pressure Monitoring System (TPMS) Direct TPMS Architecture Use absolute pressure sensor inside the tire volume Communication via LF and/or RF links Mounted inside the tire/wheel On the wheel (valve stem or drop center) On the tire (side wall, bead area or tread belt) Powered by energy source Internal battery Freescale document Freescale document 2009 by SYSTEM PLUS CONSULTING, all rights reserved. Freescale MPXY8300A TPMS 4

5 Package Opening Bondings number 2009 by SYSTEM PLUS CONSULTING, all rights reserved. Freescale MPXY8300A TPMS 5

6 RFX Dimensions 2009 by SYSTEM PLUS CONSULTING, all rights reserved. Freescale MPXY8300A TPMS 6

7 G-die Dimensions 2009 by SYSTEM PLUS CONSULTING, all rights reserved. Freescale MPXY8300A TPMS 7

8 G-die : Z-axis Process Characteristics 2009 by SYSTEM PLUS CONSULTING, all rights reserved. Freescale MPXY8300A TPMS 8

9 P-die minimal dimensions and metal layers 2009 by SYSTEM PLUS CONSULTING, all rights reserved. Freescale MPXY8300A TPMS 9

10 P-die Process Flow ASIC Specific Steps Sensor Specific Steps Common Steps 2009 by SYSTEM PLUS CONSULTING, all rights reserved. Freescale MPXY8300A TPMS 10

11 Synthesis of the cost analysis The MPXY8300A component is designed and manufactured by Freescale. Production is assumed to take place. The component has been released to production at the beginning of The MCU wafer cost is estimated at $xxxxx.xx, the die cost is estimated at $xxxxx.xx The RFX wafer cost is estimated at $xxxxx.xx, the die cost is estimated at $xxxxx.xx The P-die wafer cost is estimated at $xxxxx.xx, the die cost is estimated at $xxxxx.xx The G-die wafer cost is estimated at $xxxxx.xx, the die cost is estimated at $xxxxx.xx The packaging cost is estimated at $xxxxx.xx The component manufacturing cost is $xxxxx.xx in 2009 and $xxxxx.xx in by SYSTEM PLUS CONSULTING, all rights reserved. Freescale MPXY8300A TPMS 11

12 MCU Wafer Cost Very low wafer cost decrease between 2009 and 2011 because the technology is mature. The main part of the wafer cost is due to the consumables with xx%. The salary part is xx%. The manufacturing yield ranges from xxx% to xxx%, from 2009 to The mature technology explains this value by SYSTEM PLUS CONSULTING, all rights reserved. Freescale MPXY8300A TPMS 12

13 G-die Wafer Cost per equipment family G-die Equipment Cost per Family 2009 by SYSTEM PLUS CONSULTING, all rights reserved. Freescale MPXY8300A TPMS 13

14 MPXY8300A Packaging Cost per step 2009 by SYSTEM PLUS CONSULTING, all rights reserved. Freescale MPXY8300A TPMS 14