NB 21 IEC SIZE : (.063) 0.2 (.008) 0.8 (.031) ±0.2 (.008) 0.8 (.031) ±0.2 (.008) 0.2 (.008) min 0.2 (.008) min

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1 NC SMD hermistors NB 21 (Ni Barrier/100% Sn ermination) Chip thermistors are high quality and low cost devices especially developed for surface mounting applications. hey are widely used for temperature compensation but can also achieve temperature control of printed circuits. A nickel barrier metallization provides outstanding qualities of solderability and enables this chip to meet the requirements of the most severe soldering processes including lead free soldering with peak termperatures up to 270ºC. ypes NB 21 IEC SIZE : (.063) 0.2 (.008) DIMENSIONS: millimeters (inches) 0.8 (.031) ±0.2 (.008) 0.8 (.031) ±0.2 (.008) 0.2 (.008) min 0.2 (.008) min erminations Nickel Barrier/100% in Marking On packaging only Climatic category 40/125/56 Operating temperature -55 C to +150 C olerance on Rn (25 C) ±3%*, ±5%, ±10%, ±20% Maximum dissipation at 25 C 0.07 W hermal dissipation factor 1 mw/ C hermal time constant 4 s Resistance - emperature characteristics: pages 29 to 33. FEAURES Fast thermal response Commercial, Industrial and Automotive Applications Ni Barrier/100% Sn ermination Suitable for lead free reflow or wave soldering AEC-Q200 qualified HOW O ORDER NB 21 K APPLICAIONS LCD compensation Battery packs Mobile phones CD players Heating systems Air-conditioning systems Refrigeration emperature control of Switch Mode Power Supplies Compensation of pressure sensors Protection of power transistors in various electronic circuits and more M BB ype NB21 (0603) Material Code K (See tables pages 11) Resistance 10,000 Ω (See tables page 11) olerance H (±3%)* J (±5%) K (±10%) M (±20%) Suffix: Packaging --: Bulk (5000 pcs/bag) BB: Cardboard tape (180mm diam. reel, 4000 pcs/reel) BF: Cardboard tape (1/2 reel, 2000 pcs/reel) BD: Cardboard tape (330mm diam. reel, 10,000 pcs/reel) * Optional tolerance, please contact factory

2 NC SMD hermistors NB 21 (Ni Barrier/100% Sn ermination) ABLE OF VALUES ypes NB 21 IEC SIZE : 0603 Rn at 25 C Material B (K) at 25 C (1) ± 5% (Ω) Code ( B/B (2) ± 3% ) (%/ C) NB 21 KC NB 21 KC KC 3470 ± 5% 3.9 NB 21 KC NB 21 MC ,000 MC 3910 ± 3% 4.4 NB 21 J ,700 J 3480 ± 3% 3.9 NB 21 J , ± 3% 3.9 NB 21 J ,000 J ± 3% 3.9 NB 21 K ,000 NB 21 K ,000 K 3630 ± 3% 4.0 NB 21 L ,000 L 3790 ± 3% 4.2 NB 21 M ,000 NB 21 M ,000 M 3950 ± 3% 4.4 NB 21 L ,000 L ± 3% 4.1 NB 21 N ,000 N 4080 ± 3% 4.6 NB 21 N ,000 N ± 3% 4.7 NB 21 P ,000 P 4220 ± 3% 4.7 NB 21 Q ,000 NB 21 Q ,000 Q 4300 ± 3%

3 Packaging for Automatic Insertion NC Chip hermistors / NC/NB Series AUOMAIC INSERION 8mm Paper ape Packaging: he mechanical and dimensional reel characteristics are in accordance with the IEC publication D 0 P 2 P 0 10 PICHES CUMULAIVE OLERANCE ON APE 0.20mm (0.008) E 1 BOOM COVER APE OP COVER APE B 0 F E 2 W G 1 1 CAVIY SIZE SEE NOE 1 A0 CENER LINES OF CAVIY P 1 User Direction of Feed Designation Symbol Value olerance ape width W /+0.3 ape thickness 1.1 max. Pitch of the sprocket holes P0 4 ±0.1 Diameter of the sprocket holes 1.5 D0-0/+0.1 ±0.1 Distance E ±0.1 Distance (center to center) F 3.5 ±0.05 Distance (center to center) P2 2 ±0.05 Cover tape thickness max. Distance E min. Distance G 0.75 min. Component pitch 0805/ ±0.1 P ±0.1 ø180 (7.09) (.079) ø 62 (2.44) ± 1.5 (.059) 14.4 (.567) max. 8.4 (.331) (.006) (.020) ø 20.5 (.087) (.006) ø (.502) - 0 Reel according to ISO/DIS Direction of unreeling Bottom side Reel Upper side QUANIY PER REEL ype Suffix Description Qty Per Reel NB12 BB Cardboard tape (180mm diam. reel) 4,000 pcs NC12 BF Cardboard tape (1/2 reel) 2,000 pcs NB21 BD Cardboard tape (330mm diam. reel) 10,000 pcs

4 Surface Mounting Guide Chip hermistor Application Notes SORAGE Wave Good solderability is maintained for at least twelve months, provided the components are stored in their as received packaging at less than 40 C and 70% RH Preheat Natural Cooling SOLDERABILIY / LEACHING erminations to be well soldered after immersion in a 60/40 tin/lead solder bath at 235 ± 5 C for 2 ± 1 seconds. erminations will resist leaching for at least the immersion times and conditions recommendations shown below. Solder emp ºC to 250ºC P/N ermination Solder Solder Immersion ype in/lead emp ºC ime Seconds NC AgPdPt 60/ ± 5 15 max NB Nickel Barrier 60/ ± 5 30 ± 1 NB products are compatible with a wide range of soldering conditions consistent with good manufacturing practice for surface mount components. his includes Pb free reflow processes with peak temperatures up to 270ºC. Recommended profiles for reflow and wave soldering are shown below for reference. NC products are recommended for lead soldering application or gluing techniques. emperature C Solder emp. Reflow min Preheat 1min (Minimize soldering time) 220ºC to 250ºC 10 sec. max Natural Cooling Pre-heating: 150 C ±15 C / 60-90s Max. Peak Gradient: 2.5 C/s Peak emperature: 245 C ±5 C ime at >230 C: 40s Max. ime (s) a) he visual standards used for evaluation of solder joints will need to be modified as lead free joints are not as bright as with tin-lead pastes and the fillet may not be as large. b) Resin color may darken slightly due to the increase in temperature required for the new pastes. c) Lead-free solder pastes do not allow the same self alignment as lead containing systems. Standard mounting pads are acceptable, but machine set up may need to be modified. REFLOW SOLDERING Case Size 0402 NB NB NB NB20 P/N D1 D2 D3 D4 D5 WAVE SOLDERING Case Size 0603 NB NB NB to 2 min 3 sec. max (Preheat chips before soldering) /maximum 150 C RECOMMENDED SOLDERING PAD LAYOU Dimensions in mm (inches) (.067) (.024) (.020) (.024) (.020) (.091) (.031) (.028) (0.31) (.030) (.118) (.039) (.039) (.039) (.049) (.157) (.039) (.079) (.039) (.098) P/N D1 D2 D3 D4 D5 D (.122) (.047) (.028) (.047) (.030) (.157) (.059) (.039) (.059) (.049) (.197) (.059) (.079) (.059) (.063) D2 D3 D4 D5 4

5 ables of Resistance vs emperature I 3250 R() / R25 F (%) α (%/ C) J-J R() / R25 F (%) α (%/ C) K 3630 R() / R25 F (%) α (%/ C) KA 3625 R() / R25 F (%) α (%/ C) KC 3470 R() / R25 F (%) α (%/ C) L 3790 R() / R25 F (%) α (%/ C)

6 ables of Resistance vs emperature L R() / R25 F (%) α (%/ C) M 3950 R() / R25 F (%) α (%/ C) MA 3965 R() / R25 F (%) α (%/ C) MC 3910 R() / R25 F (%) α (%/ C) N 4080 R() / R25 F (%) α (%/ C) NA 4100 R() / R25 F (%) α (%/ C)

7 ables of Resistance vs emperature NC 4080 R() / R25 F (%) α (%/ C) NE 4100 R() / R25 F (%) α (%/ C) N R() / R25 F (%) α (%/ C) P 4220 R() / R25 F (%) α (%/ C) PA 4235 R() / R25 F (%) α (%/ C) Q 4300 R() / R25 F (%) α (%/ C)

8 ables of Resistance vs emperature QA 4250 R() / R25 F (%) α (%/ C) R 4400 R() / R25 F (%) α (%/ C) RA 4380 R() / R25 F (%) α (%/ C) RC 4340 R() / R25 F (%) α (%/ C) S 4520 R() / R25 F (%) α (%/ C) SC 4500 R() / R25 F (%) α (%/ C)

9 ables of Resistance vs emperature 4630 R() / R25 F (%) α (%/ C) U 4840 R() / R25 F (%) α (%/ C)