GE Aviation Systems. Avionics Thermal Management. Peter de Bock, GE Global Research August 2012

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1 GE Aviation Systems Avionics Thermal Management Peter de Bock, GE Global Research August 2012

2 GE Aviation: A global provider of engines, systems and services Segments Commercial Military Business & General Aviation 2

3 GE Global Research Niskayuna, NY Established in 1900 Nearly 100 research labs 1,800 technologists local, 3000 global Developing new technologies for GE Businesses 3

4 Modern platforms use more and more power ARGUS ISR Wing Fold System Nose Gear Steering. Landing Nose Gear Gear Extension/ Extension/ Retraction Retraction Rudder Engine Actuation Lift Fan Actuation LFVG, VAVBN Leading Edge Flap Horizontal Tail Flaperons Ailerons On-board systems Actuation ISR Radar/Jamming/RF Directed Energy Weapon systems Increased power density (SWaP) Faster controls Smart ISR, on-board processing Longer range, faster data transfer More powerful 4

5 Power challenge Trend of increased use of powerful onboard systems Airbus A380-4 x 150kVA VF generation - 2 x 120kVA APU Boeing x 250kVA VF generation - 2 x 225kVA APU Gerstler, W.D., and Bunker, R.S. (2008) Aviation Electric Power. Mechanical Engineering December 2008,

6 Thermal challenge Exists today, projected to rise sharply UAS leading this challenge Next generation UAS have increased on-board processing power needs Operation in harsh environments temperature, sand/dust Current CPU/GPUs are under-clocked to not exceed thermal limits Military Electronics >50% of mission failure due to Thermal management problems Source: NASA/C. Bailey EPTC 2008 UAS thermal challenge No ECS bays, higher ambient temperatures Higher power density, more electronics in smaller bays No heat rejection to fuel option Thermal Management Technology Critical for UAS Thermal Mgmt: Power density, Reliability 6

7 Opp ty to enable next-gen processors Typical thermal budget GE Intelligent Platforms Magic1 Convection main bottleneck for heat removal for next generation high power processors GE Aviation Systems Storage Payload Controller (SPC) 7

8 Solving the convection challenge Challenge: Robust/reliable air cooling computing systems Preferred coolant: Air -MilStd 810G spec: Sand & dust Shock Vibration Salt fog Temperature cycle EMI System power density + Reliable - Capable - Less reliable + Capability Challenging for fans bearing/bushing failures: device overheat, sparking Operating environment temperature 8

9 Dual cool jet technology Piezo actuated thin form factor air mover - Originally developed for fluid boundary layer control - Two piezo disk moving at Hz - Provide direct pulsed air over heat sink/hot chip - 1mm thick no bearings System power density + Reliable - Capable + Reliable +Capability - Less reliable + Capability (compare to human lungs) Operating environment temperature 9

10 New technology for higher SWaP-C Salt fog: passed Sand & dust: passed Video by Ben VanderPloeg, Christina Schroeder, Earl Nicewarner (GE AS) Avg. ΔT Jets Off =46 C Avg. ΔT Jets on =17 C System can now reject 89W (compare to 26W baseline) Or operate in degrees hotter environment Enhancement = 3.4X Shock & vib: passed 10

11 Thermal management Trends are driving more power on-board and more powerful Avionics operating in harsher environments (UAS, no ECS bays) Reliability and power density (SWaP) performance differentiators, thermal technology enabler New thermal technologies needed to reach entitlement on next generation UAS platforms Come see our Thermal Technology Demonstration at the GE Booth! 11

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