DIP Power Inductor KL Scope This specification applies to DIP Power Choke. High power Features Magnetic shielded construction for high density board assembly High performance excellent DC current characteristics Large energy storage capacity Up to 40 amps continuous Custom designs available Construction: Dimension C D A R30 R60M 0403 E F B Unit: mm TYPE A B C D E F KL1409 14.0MAX 14.0MAX 8.5MAX 3.4±0.5 11.5±0.5 5.5±0.5 KL1410 14.0MAX 14.0MAX 10MAX 3.4±0.5 11.5±0.5 5.5±0.5 How to Order KL 1410 M T R60 SEI Type Dimensions Tolerance Packaging Inductance Type Code Dimensions (mm) Code Tolerance Packaging Code Inductance DIP Power Choke 1409 14 x 14 x 8.5 M 20% T = Tape and Reel R60 0.6uH 1410 14 x 14 x 10 1R0 1.0uH 100 10uH Tel: 1-888-734-7347 Fax: 919-850-9504 E-mail marketing@seielect.com http://www.seielect.com 1
Electrical Characteristics 1409 TYPE Part Number L (uh) Tole. (%) Test Frequency RDC (mω) Max IDC (A) Min KL1409MBR60 0.6 20% 100 1 30 KL1409MB1R0 1.0 20% 100 2 30 KL1409MB1R5 1.5 20% 100 2 25 KL1409MB2R2 2.2 20% 100 3 20 KL1409MB3R3 3.3 20% 100 4.5 20 1410 TYPE Part Number L (uh) Tole. (%) Test Frequency RDC (mω) Max IDC (A) Min KL1410MBR30 0.3 20% 100 0.8 60 KL1410MBR50 0.5 20% 100 1 40 KL1410MBR60 0.6 20% 100 1 40 KL1410MBR90 0.9 20% 100 1.8 30 KL1410MB1R2 1.2 20% 100 2 30 KL1410MB1R5 1.5 20% 100 2.2 25 KL1410MB2R2 2.2 20% 100 3 20 KL1410MB3R3 3.3 20% 100 3 15 KL1410MB4R7 4.7 20% 100 5 15 Note:*AT 25MHZ **AT7.9MHZ When ordering please specify tolerance and packaging code. Ex : PMC129- R60M- S Tolerance: M ± 20% L ± 15% K ± 10% Packaging: Clear Tape and Reel( Standard) L Q :HP4287A SRF :HP8753D/E4991A RDC:Digital Multimeter SC-7401 Operating Temperature Range-40 to+125 *Storage Temperature :25±3 ; <80%RH Reliability of Ferrite Wire Wound Power Inductor Tel: 1-888-734-7347 Fax: 919-850-9504 E-mail marketing@seielect.com http://www.seielect.com 2
Mechanical Performance No Item Specification Test Method 1-1-1 Vibration Appearance: No damage L change: within±10% Q change: within±30% RDC: within specification Test device shall be soldered on the substrate Oscillation Frequency: 10 to 55 to 10Hz for 1min Amplitude: 1.5mm Time: 2hrs for each axis (X, Y & Z), total 6hrs 1-1-2 Resistance to Soldering Heat Appearance: No Damage Pre-heating:150,1Min. Solder Composition: Sn/Pb= 63/37 Solder Temperature: 260±5 Immersion Time: 4±1Sec. 1-1-3 Solderability Pre-heating: 150, 1min The electrodes shall be at least Solder Composition: Sn/Pn = 60/40 90% covered with new solder Solder Temperature: 230±5 coating Immersion Time: 4±1sec Environmental Performance No Item Specification Test Method 1-2-1 Temperature Shock 10 cycles (Air to Air) 1 cycles shall consist of: 30 minutes exposure to 55 30 minutes exposure to 125 15 seconds maximum transition between temperatures Appearance: No damage L change: within±10% Q change: within±30% RDC: within specification One cycle: Step Temperature () Time (min) 1-25±3 30 1-2-2 Temperature Cycle 2 25±2 3 3 85±3 30 4 25±2 3 Total: 100cycles 1-2-3 Humidity Resistance 1-2-4 Heat Temperature Resistance 1-2-5 Low Temperature Resistance Temperature: 40±2 Relative Humidity: 90 ~ 95% Temperature: 85±3 Relative Humidity: 20% Applied Current: Rated Current Temperature: -25±3 Relative Humidity: 0% Tel: 1-888-734-7347 Fax: 919-850-9504 E-mail marketing@seielect.com http://www.seielect.com 3
Packaging Info Tape and Reel specifications Dimensions are in mm Tel: 1-888-734-7347 Fax: 919-850-9504 E-mail marketing@seielect.com http://www.seielect.com 4
SMT Power Inductor Environmental Specifications General Items Specifications 1. Shelf Storage conditions Temperature range: 25±3; Humidity: <80% relative humidity. Recommended product should be used within six months from the time of delivery. 2. Storage temperature range Temperature range: -40 to +85. 3. Operating temperature range Temperature range: -20 to +80. Environmental test Test Items Specifications Test Conditions / Test Methods 1. High temperature Storage test Temperature 85±2, Time: 48±2 hours, 2. Low temperature Temperature -25±2, Storage test No case deformation or change in appearance. Time: 48±2 hours, 3. Humidity test L/L 10% L/L 30% (PS1608) Temperature 40±2, 90~95% relative humidity Time: 96±2 hours, apply rated current, 4. Thermal shock test First -25 30minutes then 25 10 minutes last 85 30 minutes, as 1 cycle. Go through 5 cycles. Tested after 1 hour at room temperature. Mechanical test Test Items Specifications Test Conditions / Test Methods 1. Solder ability test Product with Lead plating: Dip pads in flux then dip in solder pot (63Sn/37Pb Terminal area must have 90% minimum solder coverage. solder) at 230±5 for 5 seconds. Product with Lead-free terminal: Dip pads in flux then dip in solder pot (100Sn solder) at 260±5 for 5 seconds. 2. Heat endurance of Refer to the reflow soldering condition. Go Reflow soldering No case deformation or change in through 3 times. 3. Vibration test appearance. L/L 10% Apply frequency 10~55Hz. 1.5mm amplitude in each of perpendicular direction for 2 hours. 4. Shock resistance Drop down with 981m/s 2 (100G) shock attitude L/L 30% (PS1608) upon a rubber block method shock testing machine, for 1 time. In each of three orientations. The codition of reflow (recommendation): Lead-free Lead Temp. ( ) Temp. ( ) 300 300 250 200 260 250 200 230 150 150 100 50 130 40 10 100 50 130 40 10 0 0 20 40 60 80 100 120 140 160 180 200 220 240 260 Time (sec) Solder : Sn96.5/Ag3/Cu0.5 0 0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 Time (sec) Solder : Sn63/Pb37 Tel: 1-888-734-7347 Fax: 919-850-9504 E-mail marketing@seielect.com http://www.seielect.com 5