WF12SR360JTL. Size Surge 5% chip resistors. Customer : Approval No : Issue Date : Customer Approval :
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1 SPECIFICATION OF SURGE 5% CHIP RESISTOR Ver: 1 Page: 1 of 7 ROHS compliance WF12SR360JTL Surge 5% chip resistors Size 1206 Customer : Approval No : Issue Date : Customer Approval :
2 SPECIFICATION OF SURGE 5% CHIP RESISTOR Ver: 1 Page: 2 of 7 FEATURE 1. Small size and light weight 2. High reliability and stability 3. Reduced size of final equipment 4. Surge application APPLICATION Power supply Digital multimeter Telecommunication Computer Automotive industry Medical and military equipment DESCRIPTION The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The composition of the paste is adjusted to give the resistance required The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For ease of soldering the outer layer of these end terminations is a Lead-tin or Tin (lead free) alloy. Fig 1. Consctruction of Chip-R
3 SPECIFICATION OF SURGE 5% CHIP RESISTOR Ver: 1 Page: 3 of 7 QUICK REFERENCE DATA Item General Specification Series No. WF12S Size code 1206 ( 3216 ) Resistance Tolerance ±5% Resistance Range R360 TCR (ppm/ C) -55 C ~ +125 C Max. dissipation at T amb=70 C Max. Operation Voltage (DC or RMS) ± 500 ppm/ C 1/4 W 200V Climatic category (IEC 60068) 55/125/56 Basic specification JIS C 5202 / IEC Note : 1. This is the maximum voltage that may be continuously supplied to the resistor element, see IEC publication Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by RCWV = Rated Power Resistance Value or Max. RCWV listed above, whichever is lower. Dimensions: Part No WF12S L 3.10 ± 0.1 W 1.60 ± 0.1 Tt 0.50 ± 0.2 Tb 0.45 ± 0.2 t 0.65 ± 0.15 R360 Marking 4-digits marking R360 FUNCTIONAL DESCRIPTION Products are specially designed to fit for surge application. the time of the sequence, no more ms 1.5 the period of pulses in the sequence, about us 10 the magnitude of pulse current, no more A 35 pulse current, RMS value of one period, no more ARMS 10 * 3 times per day!
4 SPECIFICATION OF SURGE 5% CHIP RESISTOR Ver: 1 Page: 4 of 7 De-Rating The power that the resistor can dissipate depends on the operating temperature; see Fig.2 MOUNTING Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for handling by automatic placement systems. Chip placement can be on ceramic substrates and printed-circuit boards (PCBs). Electrical connection to the circuit is by individual soldering condition. The end terminations guarantee a reliable contact. SOLDERING CONDITION The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260 C for one minute. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other discrete components on the reverse (mixed PCBs). Surface Mount Resistors are tested for solderability at 245 C during 3 seconds. The test condition for no leaching is 260 C for 60 seconds. Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 3. CATALOGUE NUMBERS The resistors have a catalogue number starting with. WF12 S R360 J T L
5 SPECIFICATION OF SURGE 5% CHIP RESISTOR Ver: 1 Page: 5 of 7 Size code Type code Resistance code Tolerance Packaging code Termination code WF12 : 1206 S : Surge J : ±5% T : 7 Reeled taping L = Sn base (lead free) Reeled tape packaging : 8mm width paper taping 5000pcs per 7 reel. TEST AND REQUIREMENTS Basic specification : JIS C 5202 / IEC The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical robustness testing procedure for electronic components" and under standard atmospheric conditions according to IEC 68-1, subclause 5.3, unless otherwise specified. Temperature: 15ºC to 35ºC. Relative humidity: 45% to 75%. Air pressure: 86kPa to 106 kpa (860 mbar to 1060 mbar). TEST PROCEDURE REQUIREMENT Temperature Coefficient of Resistance (TCR ) Short time overload (STOL ) Resistance to soldering heat Solderability Natural resistance change per change in degree centigrade. R R 1 R ( t t ) 2 1 (ppm/ C) R 1 : Resistance at reference temperature R 2 : Resistance at test temperature t 1 : 25 C Permanent resistance change after a 5second application of a voltage 5 times RCWV or the maximum overload voltage specified in the above list, whichever is less. Unmounted chips 10±1 seconds, 260±5ºC Termination SnPb base : Unmounted chips completely immersed for 2±0.5 sec. in a solder bath at 230±5ºC Termination Sn base (lead free) : Unmounted chip completely immersed in a lead free solder bath, 245 C±5 C, 3±1 sec Temperature cycling minutes at -55 C±3 C, 2. 2~3 minutes at room temperature, minutes at +125 ±3 C, 4. 2~3 minutes at room temperature, Total 5 continuous cycles Load life (endurance) 70±2ºC, 1000 hours, loaded with RCWV or Vmax,1.5 hours on and 0.5 hours off Load life in Humidity 1000 hours, at rated continuous working voltage in humidity chamber controller at 40 C±2 C and 90~95% relative humidity, 1.5hours on and 0.5 hours off Test temperature 55~+125 C ±500ppm/ C R/R max. ±(2%+0.05Ω) no visible damage R/R max. ±(1%+0.05Ω) good tinning (>95% covered) no visible damage no visible damage R/R max. ±(1%+0.05Ω) R/R max. ±(3%+0.05Ω) R/R max. ±(3%+0.05Ω)
6 SPECIFICATION OF SURGE 5% CHIP RESISTOR Ver: 1 Page: 6 of 7 Bending and Termination strength Resistors mounted on a 90mm glass epoxy resin PCB(FR4); bending : 2 mm, once for 10 seconds Pulling test : 500grams, 30seconds R/R max. ±(1%+0.05Ω) PACKAGING Paper Tape specifications (unit :mm) Component Size / Series W F E P0 ΦD WF12S 8.00± ± ± ±0.10 Φ Component Size / Series A B P1 T WF12S 3.60± ± ±0.10 Max. 1.0 Reel dimensions
7 SPECIFICATION OF SURGE 5% CHIP RESISTOR Ver: 1 Page: 7 of 7 Symbol A B C D (unit : mm) Φ178.0±2.0 Φ60.0± ± ±0.5 Taping quantity - Chip resistors 5,000 pcs/reel
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