Power Semiconductors. Clamps. Heat Sinks. Chill Blocks. SCR & Diode Assemblies

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2 C & H Technology is a deeply experienced and highly specialized supplier able to provide complete solutions to virtually any high power application. In addition to Engineered Bonded Fin Heat Sinks, C & H Technology offers a complete line of high power semiconductors, hockey puk clamps, extruded heat sinks and chill blocks. We also provide a number of specialized services tailored to help today s OEMs compete effectively in their industries. Power Semiconductors Engineering and CAD Capabilities Electrical Testing Blocking Voltage Forward Voltage Drop Matching SCR Gate and Latching Current Leakage Testing Custom Parts Marking Lead and Terminal Modifications Bar Coding Just-In-Time (JIT) Delivery Heat Sinks Clamps SCR & Diode Assemblies Chill Blocks

3 Introduction I This catalog is designed to provide the user with the easiest and most direct way of selecting common power semiconductor assemblies. Each page represents a specific electrical circuit, for example; a three phase bridge rectifier. Determine the output current required and type of cooling (natural convection or forced air), then determine the assembly part number from the ordering information table. The heat sink shapes were selected from the most common industry extrusions. The output currents are optimized based on the most cost effect device versus the length of the heatsink. In other words, the highest output at the lowest cost. Engineered Heatsinks provide more heat dissipation in a smaller, lighter weight package than that of an extruded heatsink. Utilizing the latest technology in fin bonding, this type of heatsink can outperform an extruded type heatsink by exposing more fin surface area to ambient air. Thus greater heat transfer can take place in a smaller package. This type of heatsink is ideal for mounting modules. The output currents listed are calculated in full wave conduction with a 45 C maximum ambient temperature. Forced air cooled module assemblies are supplied with a 110 CFM fan mounted to the heatsink. Forced air cooled hockey puk assemblies are supplied without a fan. If you require, we can supply a fan as a separate item. The mounting position of the assembly is important and is recommended that the heatsink fins be mounted vertically, so it will allow heat to rise. The PIV (peak inverse voltage) rating of the device is generally calculated by multiplying the AC line voltage times a safety factor of 2.5. For example operating line voltage of 480 VAC, should have minimum of 1200 volt semiconductors. This is only a guide and if the AC line has the potential of voltage spikes, a higher voltage device or MOV voltage suppression should be used. The semiconductor mounting surface area is machined flat to with.001 inch/inch to enhance their electrical and thermal conductivity characteristics. The heatsinks have T slots which accept standard hex head machine bolts which gives reliable high current bus bar connections and easy mounting to your cabinet. Heatsinks come in a variety of finishes to prevent aluminum from oxidizing. The information presented in the book is believed to be accurate and reliable. However, C & H Technology, Inc. can assume no responsibility for its use nor any infringements of patents, or other rights of third parties which may result from its use. No patent liability shall be incurred for the use of the circuits, devices, or assemblies described herein. We reserve the right to change specifications and data without notice. Revision 6

4 Index I. Introduction Assembly checklist Circuits II. Air Cooled Assemblies Diode Assemblies -Single Phase Bridges -Three Phase Bridges Pages 1-3 Pages 4-9 Thyristor Assemblies -Single Phase Fully Controlled -Three Phase Fully Controlled AC Switches -Single Phase -Three Phase III. Liquid Cooled Assemblies Diode Assemblies -Single Phase Bridges -Three Phase Bridges Pages Thyristor Assemblies -Single Phase Fully Controlled -Three Phase Fully Controlled AC Switches -Single Phase -Three Phase IV. Hockey Puk Mounting Clamps Bar Type Box Type V. Liquid Cooled Heat Sinks Chill Blocks IGBT Chill Plates VI. Heat Sink Extrusions Vll. Outlines VlIl. Accessories IX. Solid State Relay Assemblies Pages Pages Page 37 Page Page 65 Page 66 1

5 Checklist I ASSEMBLY CHECKLIST PLEASE COPY THIS FORM, FILL OUT AND FAX TO C & H TECHNOLOGY AT (952) From: Company Name Contact Address City State Zip Fax # ( ) Telephone # ( ) Application Information 1. Application 2. Circuit Configuration 3. Circuit Voltage Maximum AC voltage (RMS) Desired voltage safety factor Maximum transient voltage 4. Circuit Current Maximum output current Avg. RMS Peak If paralleling is required, state method of current sharing 5. Type of Load Resistive Inductive Capacitive 6. Thermal Maximum ambient air temperature? C Cooling medium Air - Convection: ˇ Natural ˇ Forced (CFM) Water - GPM C Max. Other 7. Mechanical Heatsink finish? Anodize Iridite Chromate None Color? Mounting method Insulating Non - Insulating How much space is available for this assembly? Length Width Height in or mm 8. Estimated Annual Usage (EAU) 9. Special considerations 2

6 Circuits I 1 and 3 Phase full wave rectifier bridge: Uncontrolled (Diode/Diode) These assemblies convert alternating (AC) input current to unidirectional (DC) output current. Thus allowing DC machines and Motors to draw operating power from standard AC lines. 1 and 3 Phase full wave thyristor bridge: Half controlled (SCR/Diode) These assemblies use Diodes and SCR s (silicon controlled rectifier) to not only convert AC to DC, but allow partial control of the DC output current, even though the input voltage does not change. Fully controlled (SCR/SCR) bridge: These assemblies use SCR s (silicon controlled rectifier) to not only convert AC to DC, but allow full control of the DC output current, even though the input voltage does not change. this is accomplished by varying the conduction or firing angle of the SCR. You can control several thousand amps from zero to full output by simultaneously varying a very small gate control current. 1 and 3 Phase AC switch: These assemblies vary the output voltage with control current. The input is AC and the output is a variable AC, controlled from zero to full output. 3

7 1 Phase Bridge II 1 FULL WAVE DIODE BRIDGE (UNCONTROLLED) + - Output Current I (avg) Natural Fan Cooled Convection 0 LFM 500 LFM 1000 LFM 2..5 m/s 5.0 m/s DEVICE P/N MAXIMUM VOLTAGE Max. Ambient Temp. = 45 C Heat Sink Outline Assembly Assembly Outline IRKD91/ A IRKD236/ A IRKD A IRKD CH IRKD CH SD400C..C 2400 D SD1100C..C 3200 D SD1500C..L 3000 F SD2500C..K 2500 F SD3000C..K 1000 F 35 ORDERING INFORMATION EXAMPLE CHA 1BU 150 F 12 J MT ASSY CIRCUIT CIRCUIT CURRENT F = FAN COOLED N = NATURAL CONVECTION VOLTAGE X 100 HEATSINK TYPE RC = SNUBBER CIRCUIT T = THERMOSTATS M = FIBERGLASS MOUNTING HWDR. 4

8 3 Phase Bridge 3 FULL WAVE DIODE BRIDGE (UNCONTROLLED) + II - Output Current I (avg) Natural Fan Cooled Convection 0 LFM 500 LFM 1000 LFM 2.5 m/s 5.0 m/s DEVICE P/N MAXIMUM VOLTAGE Max. Ambient Temp. = 45 C Assembly Heat Sink Outline Assembly Outline IRKD91/ A IRKD236/ A IRKD A IRKD CH IRKD CH SD400C..C 2400 D SD1100C..C 3200 D SD1500C..L 3000 D SD2500C..K 2500 F SD3000C..K 1000 F 36 ORDERING INFORMATION EXAMPLE CHA 3BU 190 F 12 A MT ASSY CIRCUIT CIRCUIT CURRENT F = FAN COOLED N = NATURAL CONVECTION VOLTAGE X 100 HEATSINK TYPE RC = SNUBBER CIRCUIT T = THERMOSTATS M = FIBERGLASS MOUNTING HWDR. 5

9 1 Phase SCR Bridge II 1 FULL WAVE THYRISTOR BRIDGE (FULLY CONTROLLED) + - Output Current I (avg) Natural Fan Cooled Convection 0 LFM 500 LFM 1000 LFM / 2.5 m/s 5.0 m/s DEVICE P/N MAXIMUM VOLTAGE CHA 1BF* 125 F 12 J MT Max. Ambient Temp. = 45 C Assembly Heat Sink Outline Assembly Outline IRKT91/ A IRKT162/ A IRKT A IRKT CH IRKT CH ST180C..C D ST330C..C D ST700C..L D AT818S D AT1007S F AT1003S F AT607S G CH H 20 ORDERING INFORMATION EXAMPLE ASSY CIRCUIT CIRCUIT CURRENT F = FAN COOLED N = NATURAL CONVECTION VOLTAGE X 100 HEATSINK TYPE *When ordering Half Controlled Assemblies, (Specify Circuit = 1 BH) RC = SNUBBER CIRCUIT T = THERMOSTATS M = FIBERGLASS MOUNTING HWDR. 6

10 3 Phase SCR Bridge 3 FULL WAVE THYRISTOR BRIDGE (FULLY CONTROLLED) + II - Output Current I (avg) Natural Fan Cooled Convection 0 LFM 500 LFM 1000 LFM 2.5 m/s 5.0 m/s DEVICE P/N MAXIMUM VOLTAGE Max. Ambient Temp. = 45 C Assembly Heat Sink Outline Assembly Outline IRKT91/ A IRKT162/ A IRKT A IRKT CH IRKT CH ST180C..C D ST330C..C D ST700C..L D AT818S D AT1007S F AT1003S F AT607S G CH H 19 ORDERING INFORMATION EXAMPLE CHA 3BF* 140 F 12 A MT ASSY CIRCUIT CIRCUIT CURRENT F = FAN COOLED N = NATURAL CONVECTION VOLTAGE X 100 HEATSINK TYPE RC = SNUBBER CIRCUIT T = THERMOSTATS M = FIBERGLASS MOUNTING HWDR. *When ordering Half Controlled Assemblies, (Specify Circuit = 3BH) 7

11 1 Phase AC Switch II Output Current I (rms) Natural Fan Cooled Convection 0 LFM 500 LFM 1000 LFM 2.5 m/s 5.0 m/s DEVICE P/N MAXIMUM VOLTAGE Max. Ambient Temp. = 45 C Assembly Heat Sink Outline Assembly Outline IRKT91/ A IRKT162/ A IRKT A ST330C..C 1800 D AT807S E AT1007S G AT1003S G AT607S G CH H 23 ORDERING INFORMATION EXAMPLE CHA 1AC 160 F 12 M MT ASSY CIRCUIT CIRCUIT CURRENT F = FAN COOLED N = NATURAL CONVECTION VOLTAGE X 100 HEATSINK TYPE RC = SNUBBER CIRCUIT T = THERMOSTATS M = FIBERGLASS MOUNTING HWDR. 8

12 3 Phase AC Switch II Output Current I (rms) Natural Fan Cooled Convection 0 LFM 500 LFM 1000 LFM 2.5 m/s 5.0 m/s DEVICE P/N MAXIMUM VOLTAGE Max. Ambient Temp. = 45 C Heat Sink Outline Assembly Assembly Outline IRKT91/ A IRKT162/ A IRKT A ST230C..C 1800 D ST330C..C 1800 D AT807S E AT1007S G AT1003S G AT607S G CH H 23 Three assemblies required to make up a 3-phase switch ORDERING INFORMATION EXAMPLE CHA 3AC 110 F 12 A MT ASSY CIRCUIT CIRCUIT CURRENT F = FAN COOLED N = NATURAL CONVECTION VOLTAGE X 100 HEATSINK TYPE RC = SNUBBER CIRCUIT T = THERMOSTATS M = FIBERGLASS MOUNTING HWDR. 9

13 1 Phase Bridge Water Cooled + 1 FULL WAVE DIODE BRIDGE (UNCONTROLLED) - III Water temp = 25ºC Water temp = 40ºC Water Flow Rate : gal. / min DEVICE P/N MAXIMUM VOLTAGE Assembly* Outline SD400C..C SD400C..C SD1100C..C SD1500C..L SD1500C..L SD2500C..K CH *Two assembly stacks required to build a single phase bridge ORDERING INFORMATION EXAMPLE CHA 1BU 1300 W 12 MT ASSY CIRCUIT CURRENT W = WATER COOLED VOLTAGE X 100 T = THERMOSTATS M = MOUNTING HWDR. A = HOSE FITTINGS (see chart) 10

14 3 Phase Bridge Water Cooled 3 FULL WAVE DIODE BRIDGE (UNCONTROLLED) + - Output Current I (avg) Water temp = 25ºC Water temp = 40ºC Water Flow Rate : gal. / min DEVICE P/N MAXIMUM VOLTAGE Assembly* Outline SD400C..C SD400C..C SD1100C..C SD1500C..L SD1500C..L SD2500C..K CH III *Three assembly stacks required to build a three phase bridge ORDERING INFORMATION EXAMPLE CHA 3BU 1800 W 12 MT ASSY CIRCUIT CURRENT W = WATER COOLED VOLTAGE X 100 T = THERMOSTATS M = MOUNTING HWDR. A = HOSE FITTINGS (see chart) 11

15 1 Phase SCR Bridge Water Cooled 1 FULL WAVE THYRISTOR BRIDGE (FULLY CONTROLLED) + - III Output Current I (avg) Water temp = 25ºC Water temp = 40ºC Water Flow Rate : gal. / min DEVICE P/N MAXIMUM VOLTAGE Assembly* Outline ST330C..C ST330C..L ST730C..L ST1230C..K CH *Two assembly stacks required to build a single phase bridge ORDERING INFORMATION EXAMPLE CHA 1BF* 1050 W 12 MT ASSY CIRCUIT CURRENT W = WATER COOLED VOLTAGE X 100 T = THERMOSTATS M = MOUNTING HWDR. A = HOSE FITTINGS (see chart) *When ordering Half Controlled Assemblies, (Specify Circuit = 1 BH) 12

16 3 Phase SCR Bridge Water Cooled 3 FULL WAVE THYRISTOR BRIDGE (FULLY CONTROLLED) + - Output Current I (avg) Water temp = 25ºC Water temp = 40ºC Water Flow Rate : gal. / min DEVICE P/N MAXIMUM VOLTAGE Assembly* Outline ST330C..C ST330C..L ST730C..L ST1230C..K CH III *Three assembly stacks required to build a three phase bridge ORDERING INFORMATION EXAMPLE CHA 3BF* 1500 W 12 MT ASSY CIRCUIT CURRENT W = WATER COOLED VOLTAGE X 100 T = THERMOSTATS M = MOUNTING HWDR. A = HOSE FITTINGS (see chart) *When ordering Half Controlled Assemblies, (Specify Circuit = 3BH) 13

17 1 Phase AC Switch Water Cooled III Output Current I (rms) Water temp = 25ºC Water temp = 40ºC Water Flow Rate : gal. / min. DEVICE P/N MAXIMUM VOLTAGE Assembly Outline ST230C..C ST330C..C ST730C..L ST1000C..K ST1200C..K ORDERING INFORMATION EXAMPLE CHA 1AC 700 W 12 MT ASSY CIRCUIT CURRENT W = WATER COOLED VOLTAGE X 100 T = THERMOSTATS M = MOUNTING HWDR. A = HOSE FITTINGS (see chart) 14

18 3 Phase AC Switch Water Cooled Output Current I (rms) III Water temp = 25ºC Water temp = 40ºC Water Flow Rate : gal. / min DEVICE P/N MAXIMUM VOLTAGE Assembly Outline J, K J, K L, M L, M N, O *Three assembly stacks required to build a three phase AC switch ORDERING INFORMATION EXAMPLE CHA 3AC 700 W 12 MT ASSY CIRCUIT CURRENT W = WATER COOLED VOLTAGE X 100 T = THERMOSTATS M = MOUNTING HWDR. A = HOSE FITTINGS (see chart) 15

19 Clamps Clamps for Hockey Pucks These two types of clamps have a preloaded cup shaped springs system which guarantees the perpendicularity of the clamping force even without ball joints. A washer on the spring guide indicate the achievement of the right force. In order to have a correct mounting, the following is recommended: Technical Characteristics The bars of clamps type CO70, CO89 and CO102 are made of high resistant steel. The cup shaped springs are made of steel UNI 50CrV4. Upon request they can be made of stainless steel. The screws and bolts are made of steel class 8.8. All metal parts are galvanically treated in order to be corrosion proof. Insulator Properties The insulators for the clamp are made of polyammide 6.6 with 50% glass fiber added. The have dielectric property of 85KV/mm. The thickness of the IB8 insulator is 1.7mm, the IB10 is 2.7mm working temperature of 105 C. IV Clamping force conversion; 1 KN=225 LBS, 1 Kg=9.806N, 1 Kg=2.2 LBS. Clamp Selection The choice of the clamp suitable for each different application can be made according to three main parameters: a.) Type of semiconductor (diameter and thickness) b.) Requested clamping force c.) Total thickness of heatsink 16

20 Clamps MOUNTING INSTRUCTIONS FOR CLAMPS TYPE C070-C089 These two types of clamps have a preloaded cup shaped springs system which guarantees the perpendicularity of the clamping force even without ball joints. A washer on the spring guide indicate the achievement of the right force. In order to have a correct mounting, the following is recommended: 1. The two contact surfaces of semiconductor should be covered with a thin coating of an approved joint compound and then the possible surplus should be removed. 2. Locate the semiconductor on one of the two heatsinks centrally by using the provided pin after having checked the polarity. Then the semiconductor should be rotated to spread the compound. 3. Position the second heatsink on the semiconductor and located it centrally by using a sec ond pin. Then slightly rotate the heatsink to spread the compound. 4. Mount the clamp on the heatsinks by tightening alternately the bolts with a wrench up to the contact with the metal washer of the insulator checking the alignment of heatsinks semiconductor. 5 Tighten alternately both bolts each time about 1/6 turn until the indicating washer turns free, then tighten both bolts once more about 1/10 turn. IV 17

21 Clamps MOUNTING INSTRUCTIONS FOR CLAMPS TYPE C102 This type of clamp has a preloading system consisting of two sets of springs, a ball joint which assures the perpendicularity of the load force and two tangs which indicate the achievement of loading force. An advantage of this kind of clamp is the reduced overall size in comparison with the other with central spring bolts. In order to have a correct mounting, the following is recommended: The two contact surfaces of semiconductor should be covered with a thin coating of an approved joint compound and any surplus should be removed. Locate the semiconductor on one of the two heatsinks centrally by using the provided pin. The semiconductor should be rotated to spread the compound. Position the second heatsink on the semiconductor locate it centrally by using a second pin. Then slightly rotate the heatsink to spread the compound. IV Tighten the two bolts on the short threaded side. Position the ball joint on the back of the heatsink by using the proper split dowel pin. Mount the clamp on heatsinks semiconductor set by tightening alternately the nuts on the bolts up to the contact with metal washers of the insulator, taking care that the bar is parallel to the heatsink and the heatsinks semiconductor set is aligned and parallel. Tighten alternately the nuts about 1/8 turn each until the indicating tanks are free. Tighten both nuts once more about 1/12 turn. 18

22 Clamps MOUNTING INSTRUCTIONS FOR CLAMPS TYPE C155 This type of clamp uses the elasticity of bar material. The indicator of the load force is a tang which is fixed on one side and free on the other. The perpendicularly of the load force is guaranteed by a proper floating joint. In order to have a correct mounting, the following is recommended: The two contact surfaces of semiconductor should be covered with a thin coating of an approved joint compound and then any surplus should be removed. Locate the semiconductor on one of the two heatsinks centrally by using provided pin after having checked the polarity. Then the semiconductor should be rotated to spread the compound. Position the second heatsink on the semiconductor and locate it centrally by using a second pin. Then slightly rotate the heatsink to spread the compound. Position on the back of the heatsink the floating joint by using the proper split dowel pin. Mount the clamp on the heat sink semiconductor set using two wrenches to tighten the nuts on the screws up to the contact with the metal washers of the insulator, taking care that the above set is aligned and parallel. IV Tighten alternately the nuts about 1/6 turn each until the indicating tangs are free. Tighten both nuts once more about 1/12 turn. In care of disassembly of the clamp for a possible replacement of the semiconductor, before loosening the nuts, flex the tank slightly outward to the point that it gets free from the bar. 19

23 Clamps BAR CLAMPS WITH PRECALIBRATED FORCE BOLT INTERAXYS - 54MM PRESET PRESSURE UP TO 4.9KN MAXIMUM PUK DIAMETER - 42MM CLAMP #: C054 NOTE: ALL DIMENSIONS ARE IN MM L S MIN S MAX IV L S 1/ ORDERING INFORMATION EXAMPLE: CO CLAMP MODEL PRECALIBRATED CLAMPING FORCE = 4.9 KN BOLT LENGTH =100 MM 20

24 Clamps BAR CLAMPS WITH PRECALIBRATED FORCE BOLT INTERAXYS - 70MM PRESET PRESSURE UP TO 12KN MAXIMUM PUK DIAMETER - 56MM CLAMP #: C070D NOTE: ALL DIMENSIONS ARE IN MM L S MIN S MAX H 15 L H+S+47 IV O12.5 S 17 M8 70 ORDERING INFORMATION EXAMPLE: C070D PRECALIBRATED CLAMPING FORCE = CLAMP MODEL 9.8 KN BOLT LENGTH = 90 MM 21

25 Clamps BAR CLAMPS WITH PRECALIBRATED FORCE BOLT INTERAXYS - 89MM PRESET PRESSURE UP TO 18KN MAXIMUM PUK DIAMETER - 76MM CLAMP #: C089D NOTE: ALL DIMENSIONS ARE IN MM L S MIN S MAX H H+S+55 IV L O12.5 S ORDERING INFORMATION EXAMPLE: C089D CLAMP MODEL PRECALIBRATED CLAMPING FORCE = 18 KN BOLT LENGTH =130 MM 22

26 Clamps BAR CLAMPS WITH PRECALIBRATED FORCE BOLT INTERAXYS - 102MM PRESET PRESSURE UP TO 25KN MAXIMUM PUK DIAMETER - 88MM CLAMP #: C102A NOTE: ALL DIMENSIONS ARE IN MM L S MIN S MAX O20 IV L O12.5 S M8 102 ORDERING INFORMATION EXAMPLE: C102A CLAMP MODEL PRECALIBRATED CLAMPING FORCE = 22 KN BOLT LENGTH =110 MM 23

27 Clamps BAR CLAMPS WITH PRECALIBRATED FORCE BOLT INTERAXYS - 102MM PRESET PRESSURE UP TO 25 KN MAXIMUM PUK DIAMETER - 88MM CLAMP #: C102B NOTE: ALL DIMENSIONS ARE IN MM L S MIN S MAX IV O20 L O12.5 S H+S+52 H+12 M8 102 ORDERING INFORMATION EXAMPLE: C102B CLAMP MODEL PRECALIBRATED CLAMPING FORCE = 22 KN BOLT LENGTH =110 MM 24

28 Clamps BAR CLAMPS WITH PRECALIBRATED FORCE BOLT INTERAXYS - 102MM PRESET PRESSURE UP TO 35KN MAXIMUM PUK DIAMETER - 85MM 138 CLAMP #: K102 NOTE: ALL DIMENSIONS ARE IN MM L S MIN S MAX M L=S+85 O16 O31.5 S S+129 IV ORDERING INFORMATION EXAMPLE: K CLAMP MODEL PRECALIBRATED CLAMPING FORCE = 30 KN BOLT LENGTH = 160 MM 25

29 Clamps BAR CLAMPS WITH PRECALIBRATED FORCE BOLT INTERAXYS - 140MM PRESET PRESSURE UP TO 50KN MAXIMUM PUK DIAMETER - 101MM CLAMP #: K140 NOTE: ALL DIMENSIONS ARE IN MM L S MIN S MAX M O IV L=90+S S O ORDERING INFORMATION EXAMPLE: K PRECALIBRATED CLAMPING FORCE = CLAMP MODEL 45 KN BOLT LENGTH =180 MM 26

30 Clamps BAR CLAMPS WITH PRECALIBRATED FORCE BOLT INTERAXYS - 155MM PRESET PRESSURE UP TO 50KN MAXIMUM PUK DIAMETER - 138MM CLAMP #: C155A NOTE: ALL DIMENSIONS ARE IN MM L S MIN S MAX M L=S S S+128 IV O ORDERING INFORMATION EXAMPLE: C155A CLAMP MODEL PRECALIBRATED CLAMPING FORCE = 45 KN BOLT LENGTH = 180 MM 27

31 28 Clamps PART PART IB10-72 IB8-71 IB8-36 IB8-58 IB8-70S IB8-70 CLAMP INSULATORS L H IB10 IB8 ALL DIMENSIONS ARE IN MM NOTE: H L NO. NO. IB IB8-130 IB8-145 IB8-130S IB8-145S O12.5 O10.5 O37 O O25 O21 O8.5 4 O16 IV

32 Clamps BOX CLAMP CAN ACCOMMODATE UP TO 42MM DIAMETER DO-200AA, TO-200AB, (A-PUK) B43, TO-200AB (E-PUK) NOTE: ALL DIMENSIONS ARE IN MM 48 PART NO. SBVR-M M8 34 M5 X PART NO. SBVR-M M10 34 M5 X PART NO. SBTR M5 X IV PART NO. SBMR M10 INTERNAL THREAD PART NO. SBBR M5 X M M5 X

33 Clamps BOX CLAMPS WITH PRECALIBRATED FORCE PRESET PRESSURE UP TO 17 KN MAXIMUM PUK DIAMETER -80 MM NOTE: ALL DIMENSIONS ARE IN MM KX 94 M KX 94 F KX 94 L M12 X 1.75 M12 X 1.75 INTERNAL S S S M8 X1.25 M8 X1.25 M8 X1.25 S MAX = 32 PUK HEIGHT S MAX = 32 PUK HEIGHT S MAX = 29 PUK HEIGHT IV ORDERING INFORMATION EXAMPLE: KX94F CLAMP MODEL PRECALIBRATED CLAMPING FORCE = 12 KN PUK HEIGHT = 26.5 MM 30

34 Chill Blocks FLUID HEAT EXCHANGERS,SEMICONDUCTOR APPLICATIONS MODEL NO. 106 SERIERS CHILLERS TO 38MM LOWER POWER DEVICES MODEL NO. FINISH: BRIGHT NICKEL SURFACE: 32 u FLAT:.001 TIR PARALLEL: +/-.002 FLUID HEAT EXCHANGERS,SEMICONDUCTOR APPLICATIONS 106 SERIERS CHILLERS TO 38MM LOWER POWER DEVICES FINISH: BRIGHT NICKEL SURFACE: 32 u FLAT:.001 TIR PARALLEL: +/-.002 NOTES: WHEN ORDERING CHILL BLOCKS WITH FITTINGS INSTALLED,THE FITTING NUMBER IS ADDED TO THE CHILL BLOCK NUMBER. (SEE EXAMPLE) NOTES: WHEN ORDERING CHILL BLOCKS WITH FITTINGS INSTALLED,THE FITTING NUMBER IS ADDED TO THE CHILL BLOCK NUMBER. (SEE EXAMPLE) 0.25 [6] 1.00 [25] O.375 3/8-18 NPTF FITTINGS SHOWN ARE EXAMPLES. FITTINGS SHOWN ARE EXAMPLES [70] O [41] 2.37 [60] 1.37 [35] 3/8-18 NPTF FITTINGS SHOWN ARE EXAMPLES. FITTINGS SHOWN ARE EXAMPLES..905 [23] O.128 X.209/.219 DEEP, 2 PLCS 6-32 X.25 DEEP 1.37 [35].905 [23] O.128 X.209/.219 DEEP, 2 PLCS 1.37 [35] 2.00 [51] 2.00 [51] CHILL BLOCK ONLY ORDERING INFORMATION EXAMPLE: ORDERING INFORMATION EXAMPLE: CHILL BLOCK AND FITTING NUMBER CHILL BLOCK ONLY CHILL BLOCK AND ORDERING INFORMATION EXAMPLE: FITTING NUMBER ORDERING INFORMATION EXAMPLE: FLUID HEAT EXCHANGERS,SEMICONDUCTOR APPLICATIONS MODEL NO. 120 SERIERS CHILLERS FOR 20-52MM DEVICES MODEL NO. FINISH: BRIGHT NICKEL SURFACE: 32 u FLAT:.001 TIR PARALLEL: +/-.002 FLUID HEAT EXCHANGERS,SEMICONDUCTOR APPLICATIONS 120 SERIERS CHILLERS, STANDARD FOR 20-52MM DEVICES FINISH: BRIGHT NICKEL SURFACE: 32 u FLAT:.001 TIR PARALLEL: +/-.002 NOTES: WHEN ORDERING CHILL BLOCKS WITH FITTINGS INSTALLED,THE FITTING NUMBER IS ADDED TO THE CHILL BLOCK NUMBER. (SEE EXAMPLE) NOTES: WHEN ORDERING CHILL BLOCKS WITH FITTINGS INSTALLED,THE FITTING NUMBER IS ADDED TO THE CHILL BLOCK NUMBER. (SEE EXAMPLE) O [6] 5.50 [140] 1.00 [25] 1.00 [25] O.437 V 2.00 [51] 3/8-18 NPTF FITTINGS SHOWN ARE EXAMPLES. FITTINGS SHOWN ARE EXAMPLES [51] 1.75 [44] 1.37 [35] 3/8-18 NPTF FITTINGS SHOWN ARE EXAMPLES. NOTE: 1 NOTE: 2 NOTE: 3 FITTINGS SHOWN ARE EXAMPLES..905 [23] 6-32 X.25 DEEP 2 PLCS O.128 X.209/.219 DEEP, 2 PLCS 2.00 [51].905 [23] 6-32 X.25 DEEP 2 PLCS O.128 X.209/.219 DEEP, 2 PLCS 2.00 [51] 2.50 [64] NOTE: HOLE, FOR 4" C-C CLAMP. NOTE: HOLE, FOR 3.5" C-C CLAMP. NOTE: HOLE, FOR 2.75" C-C CLAMP [64] CHILL BLOCK ONLY CHILL BLOCK ONLY ORDERING INFORMATION EXAMPLE: CHILL BLOCK AND FITTING NUMBER ORDERING INFORMATION EXAMPLE: CHILL BLOCK AND FITTING NUMBER ORDERING INFORMATION EXAMPLE: ORDERING INFORMATION EXAMPLE:

35 Pressure vs. Flow FLUID HEAT EXCHANGERS,SEMICONDUCTOR APPLICATIONS MODEL NO. 130 SERIERS CHILLERS FOR 67-77MM DEVICES MODEL NO. FINISH: BRIGHT NICKEL SURFACE: 32 u FLAT:.001 TIR PARALLEL: +/-.002 FLUID HEAT EXCHANGERS,SEMICONDUCTOR APPLICATIONS 130 SERIERS CHILLERS FOR 67-77MM DEVICES FINISH: BRIGHT NICKEL SURFACE: 32 u FLAT:.001 TIR PARALLEL: +/-.002 NOTES: WHEN ORDERING CHILL BLOCKS WITH FITTINGS INSTALLED,THE FITTING NUMBER IS ADDED TO THE CHILL BLOCK NUMBER. (SEE EXAMPLE) NOTES: WHEN ORDERING CHILL BLOCKS WITH FITTINGS INSTALLED,THE FITTING NUMBER IS ADDED TO THE CHILL BLOCK NUMBER. (SEE EXAMPLE) [10] [95].375 [10] 7.87 [200] NOTE: D NOTE: C 3.18 [81] 3/8-18 NPTF FITTINGS SHOWN ARE EXAMPLES [140] 5.00 [127] 4.00 [102] 3/8-18 NPTF NOTE: C,D NOTE: B NOTE: A.905 [23] FITTINGS SHOWN ARE EXAMPLES. O.128 X.209/.219 DEEP, 2 PLCS 2.75 [70] 2.60 [66] FITTINGS SHOWN ARE EXAMPLES. FITTINGS SHOWN ARE EXAMPLES [95] 3.18 [81].905 [23] O.128 X.209/.219 DEEP, 2 PLCS 3.18 [81] NOTE: A HOLE FOR 5.5' C-C CLAMP X.25 DEEP 2 PLCS NOTE: B HOLE FOR 132MM.C-C CLAMP. NOTE: C. 2,TWO.4375 HOLES ON 1" CENTERS. NOTE: D. 2,TWO.50 HOLES ON 1.5" CENTERS X.25 DEEP 2 PLCS CHILL BLOCK ONLY CHILL BLOCK ONLY ORDERING INFORMATION EXAMPLE: CHILL BLOCK AND FITTING NUMBER ORDERING INFORMATION EXAMPLE: CHILL BLOCK AND FITTING NUMBER ORDERING INFORMATION EXAMPLE: ORDERING INFORMATION EXAMPLE: /2"-90 Hosebarbs Nylon 1/2"-90 Hosebarbs Brass 5/8"-90 Hosebarbs Nylon/Brass 130 Chiller.04 V PSI: Per Chiller X /2" Straight Hosebarbs Nylon/Brass 5/8" Straight Hosebarbs Nylon/Brass C/W Per Pair of Chillers GPM/H O 32

36 Pressure vs. Flow Chiller.04 PSI: Per Chiller X GPM/H O 4 1/2"-90 Hosebarbs Nylon 1/2"-90 Hosebarbs Brass 5/8"-90 Hosebarbs Nylon/Brass 120 Chiller.04 PSI: Per Chiller X /2" Straight Hosebarbs Nylon/Brass 5/8" Straight Hosebarbs Nylon/Brass V GPM/H O 33

37 IGBT Chill Plate MODEL NO. IGBT130 - RDI SURFACE: 32 u FINISH: BRIGHT NICKEL FLAT:.001 TIR IGBT130 RDI V PSI GPM/H O 34

38 IGBT Chill Plate MODEL NO. IGBT190 - RDI SURFACE: 32 u FINISH: BRIGHT NICKEL FLAT:.001 TIR V PSI GPM/H O 35

39 Fittings SAMPLING OF FITTINGS AVAILABLE /4"PIPE-1/2"HOSE /4"PIPE-3/8"HOSE 29E-84 1/4"PIPE-1/2"HOSE /8"PIPE-1/2"HOSE /8"PIPE-1/2"COMPRESSION /8"PIPE-1/2"FLARE V /8"PIPE-3/8"HOSE /8"PIPE-7/16"HOSE 29E-86 3/8"PIPE-1/2"HOSE /8"-1/2"FLARE Notes: Standard Fittings Are Brass Suffix "N" =Nylon Fitting Suffix "SS" = Stainless Steel Fitting 36

40 Extruded Heat Sink Profiles CHEH0011 Outline G CHEHK7 Outline E Per IN 2 /IN Wt LB/FT sa. O.71C/W/3" Per IN 2 /IN Wt. 6.7 LB/FT sa. 1.2 C/W/3" CHEH0013 Outline H CHEHK18 Outline A Per IN 2 /IN Wt LB/FT sa C/W/3" Per IN 2 /IN Wt LB/FT sa. 0.7 C/W/3" CHEH13450 Outline D CHEH0017 Outline F VI Per IN 2 /IN Wt. 4.3 LB/FT sa. 1.4 C/W/3" Per IN 2 /IN Wt LB/FT sa. 0.8 C/W/3" 37

41 Air Cooled Assemblies outline DC DC AIR outline DC DC AIR VII

42 Air Cooled Assemblies outline DC AIR DC AC AC outline DC DC AIR VII

43 Air Cooled Assemblies outline DC DC AIR outline VII.75 DC DC AIR AC AC AC

44 Air Cooled Assemblies outline AIR outline AIR VII

45 Air Cooled Assemblies outline AIR AC outline FLEX JUMPER APPROX 5.65 VII

46 Air Cooled Assemblies outline FLEX JUMPER APPROX outline FLEX JUMPERS APPROX 6.34 VII

47 Air Cooled Assemblies outline 13 Ø APPROX 7.30 VII

48 Air Cooled Assemblies outline 14 Ø APPROX VII

49 Air Cooled Assemblies outline 15 Ø APPROX 7.75 VII

50 Air Cooled Assemblies outline Ø APPROX 9.50 VII

51 Air Cooled Assemblies outline APPROX VII 48

52 Air Cooled Assemblies outline APPROX VII 49

53 Air Cooled Assemblies outline Ø.50 APPROX VII 50

54 Air Cooled Assemblies outline APPROX 9.15 VII

55 Air Cooled Assemblies outline APPROX 5.95 FLEX JUMPER outline APPROX 8.50 FLEX JUMPER VII APPROX

56 Water Cooled Assemblies outline /16" X 3/4" MOUNTING SLOT APPROX 4.35 APPROX FITTINGS ARE EXAMPLES ONLY outline /16" X 3/4" MOUNTING SLOT VII APPROX 4.35 APPROX FITTINGS ARE EXAMPLES ONLY 53

57 Water Cooled Assemblies outline /16" X 3/4" MOUNTING SLOT APPROX 5.19 APPROX FITTINGS ARE EXAMPLES ONLY outline VII 7/16" X 3/4" MOUNTING SLOT APPROX 5.19 APPROX FITTINGS ARE EXAMPLES ONLY 54

58 Water Cooled Assemblies outline /16" X 3/4" MOUNTING SLOT APPROX 4.85 APPROX FITTINGS ARE EXAMPLES ONLY outline [95] 0.38 [10] [275] APPROX 6.10 [155] (2) 7/16" X 3/4" MOUNTING SLOTS APPROX [339] VII FITTINGS ARE EXAMPLES ONLY 55

59 Air Cooled Assemblies outline APPROX 7.87 Ø.281 DIA THRU(6) SHROUD AIR (18).252 TYP outline APPROX 7.87 Ø.281 DIA THRU(6) SHROUD AIR 6.03 VII.050 (18).252 TYP

60 Air Cooled Assemblies outline 32 AIR AIR 6.00 AC Ø.281 AC 1.30 DC - DC APPROX 7.88 VII

61 Air Cooled Assemblies outline 34 AIR AIR AC 8.00 AC Ø AC 1.30 DC DC APPROX 8.36 VII

62 Air Cooled Assemblies outline ÿ APPROX 9.50 VII

63 Air Cooled Assemblies outline ÿ APPROX 9.50 VII

64 Air Cooled Assemblies outline 37 AIR AIR AC 8.00 AC ÿ DC - DC APPROX 8.11 VII

65 Air Cooled Assemblies outline 38 Ø APPROX 7.75 VII

66 Air Cooled Assemblies outline 39 AIR AIR AC 8.00 AC Ø AC 1.30 DC DC APPROX 8.11 VII

67 Air Cooled Assemblies outline 51 Ø APPROX 7.75 VII

68 Accessories High Power Assembly Accessories A wide range of accessories can be added to meet most customer requirements Allows for flexibility to meet customer design needs Frees up engineering and production resources Provides a turn-key, drop in power assembly Eliminates the need to inventory these items Semiconductor Fuses Terminal Blocks Copper Bus Bars Bimetalic Thermal Switches VIII Snubber Circuits Glastic Mounting Feet 65

69 Assemblies Solid State Relay Assemblies C & H Technology s line of Solid State Relay Assemblies takes the guess work out of working with this type of component. Assemblies are rated from amps for both single and three phase applications. The relay modules are matched with the optimal size heat sink for economy and performance. All assemblies are panel mountable. 25A 1 Phase Zero or Random Crossing Input Voltages: VAC, 3-32 VDC Over Voltage and Transient Protection Output voltages: VAC, VAC 10A 3 Phase 100A 1 Phase IX 25A 3 Phase 125A 3 Phase 66

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