Thermal Test Report. Issue by. Engineering Department. Rugged LCD : WRD1040. Product Model Product Description. Test Reason. Polo Chang Test Engineer
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1 l-tech Thermal Test Report Issue by Product Model Product Description Engineering Department Report No:0710TT0207 Rugged LCD : WRD1040 New product Rugged Display PCB:i-Tech/R5W-310 Rugged Display Renew product PCB: BIOS: Test Reason Revision change PCB: BIOS: Component: 2007/10/18 Issue date Lindon Lin Approved Polo Chang Test Engineer I
2 I-TECH 1.Document Introduction This document describes how we conduct the environment conditions and test procedure. It includes the test equipment we use,the test condition,and the test procedure we take. We also define our test criteria and the way to conclude the test result. (According to client's test specification, please see following sheets in detail.) Table of Testing Summary Results NO Test Item Condition Description Sect. 1 Thermal Profile Test -Operating -Thermal Cycle: 30/40/55 ± 2 C -Every stage of 2 Hours / Page 4 /5 Reference to IEC Product Configuration 1. A/D Board : i-tech / R5W Display : Panel 10.4 Mitsubishi/AA104SG01 3. Inverter: TPCI For 10.4 WM System FAN: NO 2
3 I-TECH 3. Product Configuration of Photo EUT of Photo Top View Bottom View C3f o <^m«c Front View Back View Right Side View Left Side View
4 I-TECH 4. Thermal Profile Test A. Test Equipment: Test Site: i-tech LAB (1 programmable Temperature & Humidity Chamber -Kson/ THS-E4T-100/S/N: 5887K -(2)YOKOGAWA/ur20000 (S5F108548) B. LAB Environmental Conditions: Ambient Temperature :25 +/- 3 C -Relative Humidity :55 +/- 20% RH C. Test Method / Specification : Reference to IEC Thermal Cycle: 30 C/40 C/55 C ±2 C -AC Power: 110/220 VAC, 60/50Hz Running Windows XP with Stress software BCM Diagnostics Pro Version Quantity : Total 1 Set -Testing Period: Oct 17, 2007 to Oct 17,2007 C 55 C 2 Hours 40 C 2 Hours '0.5 Hour 0.5 Hour 30 C 25 C 0.5 Hour 2 Hours 0.5 Hour 0 C ^Time 00:00 00:30 02:30 03:00 05:00 05:30 07:30 08:00 Figure 1:High temperature thermal cycle
5 C. Check Condition and Requirements: I-TECH It is to check the thermal profile of the test unit,and also test unit can work under different environment temperature condition. The highest temperature /position, lowest temperature /position and the average temperature value will be display at the thermal profile record. The equipment in its high temperature mode, shall exposed to daily high-low temperature cycles between 30 C * 40 C and 55 C The equipment shall withstand the required environmental conditions and shall meet, without any functional damage, all performance requirements after being exposed to 1 cycles of high temperatures, as illustrated in Figurel. P. Test Result: Examine the appearance of specimen(s) by visual check and perform functional check after this test. Connect the specimen with rated power then examine whether the display function of specimen could be work normally or not. Functional Check & Mechanical Structure : Normal Appearance check(visual check) :No visible damage Temperature of Test Point: Add Thermal Pad to Bottom Cover Enclosure Temperature rise C of part: 30 C 40 C 55 C 1. U13: RTD2033V-LF PQFP U4: AZ1084S-3.3 TO-263-3L U10: TW9906 TQFP-80 BATA2-GR L1: Choke22uH 5A Inverter PCB Power PCB Enclosure inside near middle Enclosure inside near up Enclosure outside near up Ambient temperature Note: The table shows the examine of system health status. In comparison with the component spec, the examine result will be minor inconsistency. Although the temp is a bit overheating, it's still in tolerating ranges and working properly. 5
6 Temperature records for test points from Data Logger. I-TECH 6
7 (1) Temperature Point of Number Description l-tech (2) Temperature Point of Number Description
8 (3) Temperature Point of Number Description l-tech NOTE: 10-Ambient in Chamber E. Test Judgment: Test Result as below: """\^Check Item Appearance check (Visual check) Functional & Style lteiri^\^ Initial Final Performance No. ^ \ check Rugged LCD : WRD1040 No visible damage No visible damage Normal
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