PACKAGE OPTION ADDENDUM
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4 PACKAGE OPTION ADDENDUM 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) VEA ACTIVE CDIP J 16 1 TBD Call TI Call TI A ACTIVE LCCC FK 20 1 TBD POST-PLATE A ACTIVE LCCC FK 20 1 TBD POST-PLATE EA ACTIVE CDIP J 16 1 TBD A42 SNPB EA ACTIVE CDIP J 16 1 TBD A42 SNPB FA ACTIVE CFP W 16 1 TBD A FA ACTIVE CFP W 16 1 TBD A42 SN54LS145J ACTIVE CDIP J 16 1 TBD A42 SNPB SN54LS145J ACTIVE CDIP J 16 1 TBD A42 SNPB SN74145N ACTIVE PDIP N Pb-Free SN74145N ACTIVE PDIP N Pb-Free SN74145N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74145N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74145NE4 ACTIVE PDIP N Pb-Free SN74145NE4 ACTIVE PDIP N Pb-Free SN74145NSR ACTIVE SO NS Green (RoHS & SN74145NSR ACTIVE SO NS Green (RoHS & SN74145NSRE4 ACTIVE SO NS Green (RoHS & SN74145NSRE4 ACTIVE SO NS Green (RoHS & SN74145NSRG4 ACTIVE SO NS Green (RoHS & SN74145NSRG4 ACTIVE SO NS Green (RoHS & SN74LS145D ACTIVE SOIC D Green (RoHS & SN74LS145D ACTIVE SOIC D Green (RoHS & SN74LS145DE4 ACTIVE SOIC D Green (RoHS & SN74LS145DE4 ACTIVE SOIC D Green (RoHS & SN74LS145DG4 ACTIVE SOIC D Green (RoHS & SN74LS145DG4 ACTIVE SOIC D Green (RoHS & SN74LS145DR ACTIVE SOIC D Green (RoHS & SN74LS145DR ACTIVE SOIC D Green (RoHS & Addendum-Page 1
5 PACKAGE OPTION ADDENDUM 4-Jun-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty SN74LS145DRE4 ACTIVE SOIC D Green (RoHS & SN74LS145DRE4 ACTIVE SOIC D Green (RoHS & SN74LS145DRG4 ACTIVE SOIC D Green (RoHS & SN74LS145DRG4 ACTIVE SOIC D Green (RoHS & SN74LS145N ACTIVE PDIP N Pb-Free SN74LS145N ACTIVE PDIP N Pb-Free Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) SN74LS145N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74LS145N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74LS145NE4 ACTIVE PDIP N Pb-Free SN74LS145NE4 ACTIVE PDIP N Pb-Free SN74LS145NSR ACTIVE SO NS Green (RoHS & SN74LS145NSR ACTIVE SO NS Green (RoHS & SN74LS145NSRE4 ACTIVE SO NS Green (RoHS & SN74LS145NSRE4 ACTIVE SO NS Green (RoHS & SN74LS145NSRG4 ACTIVE SO NS Green (RoHS & SN74LS145NSRG4 ACTIVE SO NS Green (RoHS & SNJ54145J ACTIVE CDIP J 16 1 TBD A42 SNPB SNJ54145J ACTIVE CDIP J 16 1 TBD A42 SNPB SNJ54LS145FK ACTIVE LCCC FK 20 1 TBD POST-PLATE SNJ54LS145FK ACTIVE LCCC FK 20 1 TBD POST-PLATE SNJ54LS145J ACTIVE CDIP J 16 1 TBD A42 SNPB SNJ54LS145J ACTIVE CDIP J 16 1 TBD A42 SNPB SNJ54LS145W ACTIVE CFP W 16 1 TBD A42 SNJ54LS145W ACTIVE CFP W 16 1 TBD A42 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free, Pb-Free (RoHS Exempt), or Green (RoHS & - please check for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free : TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered Addendum-Page 2
6 PACKAGE OPTION ADDENDUM 4-Jun-2007 at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & : TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3
7 PACKAGE MATERIALS INFORMATION 9-Jun-2007 TAPE AND REEL INFORMATION Pack Materials-Page 1
8 PACKAGE MATERIALS INFORMATION 9-Jun-2007 Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant SN74145NSR NS 16 MLA Q1 SN74LS145DR D 16 FMX Q1 SN74LS145NSR NS 16 MLA Q1 TAPE AND REEL BOX INFORMATION Device Package Pins Site Length (mm) Width (mm) Height (mm) SN74145NSR NS 16 MLA SN74LS145DR D 16 FMX SN74LS145NSR NS 16 MLA Pack Materials-Page 2
9 PACKAGE MATERIALS INFORMATION 9-Jun-2007 Pack Materials-Page 3
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12 PACKAGE OPTION ADDENDUM 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) VEA ACTIVE CDIP J 16 1 TBD A42 SNPB A ACTIVE LCCC FK 20 1 TBD POST-PLATE A ACTIVE LCCC FK 20 1 TBD POST-PLATE EA ACTIVE CDIP J 16 1 TBD A42 SNPB EA ACTIVE CDIP J 16 1 TBD A42 SNPB FA ACTIVE CFP W 16 1 TBD A FA ACTIVE CFP W 16 1 TBD A42 SN54LS145J ACTIVE CDIP J 16 1 TBD A42 SNPB SN54LS145J ACTIVE CDIP J 16 1 TBD A42 SNPB SN74145N ACTIVE PDIP N Pb-Free SN74145N ACTIVE PDIP N Pb-Free SN74145N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74145N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74145NE4 ACTIVE PDIP N Pb-Free SN74145NE4 ACTIVE PDIP N Pb-Free SN74145NSR ACTIVE SO NS Green (RoHS & SN74145NSR ACTIVE SO NS Green (RoHS & SN74145NSRE4 ACTIVE SO NS Green (RoHS & SN74145NSRE4 ACTIVE SO NS Green (RoHS & SN74145NSRG4 ACTIVE SO NS Green (RoHS & SN74145NSRG4 ACTIVE SO NS Green (RoHS & SN74LS145D ACTIVE SOIC D Green (RoHS & SN74LS145D ACTIVE SOIC D Green (RoHS & SN74LS145DE4 ACTIVE SOIC D Green (RoHS & SN74LS145DE4 ACTIVE SOIC D Green (RoHS & SN74LS145DG4 ACTIVE SOIC D Green (RoHS & SN74LS145DG4 ACTIVE SOIC D Green (RoHS & SN74LS145DR ACTIVE SOIC D Green (RoHS & SN74LS145DR ACTIVE SOIC D Green (RoHS & Addendum-Page 1
13 PACKAGE OPTION ADDENDUM 18-Sep-2008 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty SN74LS145DRE4 ACTIVE SOIC D Green (RoHS & SN74LS145DRE4 ACTIVE SOIC D Green (RoHS & SN74LS145DRG4 ACTIVE SOIC D Green (RoHS & SN74LS145DRG4 ACTIVE SOIC D Green (RoHS & SN74LS145N ACTIVE PDIP N Pb-Free SN74LS145N ACTIVE PDIP N Pb-Free Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) SN74LS145N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74LS145N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74LS145NE4 ACTIVE PDIP N Pb-Free SN74LS145NE4 ACTIVE PDIP N Pb-Free SN74LS145NSR ACTIVE SO NS Green (RoHS & SN74LS145NSR ACTIVE SO NS Green (RoHS & SN74LS145NSRE4 ACTIVE SO NS Green (RoHS & SN74LS145NSRE4 ACTIVE SO NS Green (RoHS & SN74LS145NSRG4 ACTIVE SO NS Green (RoHS & SN74LS145NSRG4 ACTIVE SO NS Green (RoHS & SNJ54145J ACTIVE CDIP J 16 1 TBD A42 SNPB SNJ54145J ACTIVE CDIP J 16 1 TBD A42 SNPB SNJ54LS145FK ACTIVE LCCC FK 20 1 TBD POST-PLATE SNJ54LS145FK ACTIVE LCCC FK 20 1 TBD POST-PLATE SNJ54LS145J ACTIVE CDIP J 16 1 TBD A42 SNPB SNJ54LS145J ACTIVE CDIP J 16 1 TBD A42 SNPB SNJ54LS145W ACTIVE CFP W 16 1 TBD A42 SNJ54LS145W ACTIVE CFP W 16 1 TBD A42 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free, Pb-Free (RoHS Exempt), or Green (RoHS & - please check for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free : TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered Addendum-Page 2
14 PACKAGE OPTION ADDENDUM 18-Sep-2008 at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & : TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3
15 PACKAGE MATERIALS INFORMATION 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) SN74145NSR SO NS Q1 SN74LS145DR SOIC D Q1 SN74LS145NSR SO NS Q1 W (mm) Pin1 Quadrant Pack Materials-Page 1
16 PACKAGE MATERIALS INFORMATION 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74145NSR SO NS SN74LS145DR SOIC D SN74LS145NSR SO NS Pack Materials-Page 2
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19 MECHANICAL DATA MLCC006B OCTOBER 1996 FK (S-CQCC-N**) 28 TERMINAL SHOWN LEADLESS CERAMIC CHIP CARRIER NO. OF TERMINALS ** MIN A MAX MIN B MAX (8,69) (9,09) (7,80) (9,09) A SQ B SQ (11,23) (16,26) (18,78) (23,83) (28,99) (11,63) (16,76) (19,32) (24,43) (29,59) (10,31) (12,58) (12,58) (21,6) (26,6) (11,63) (14,22) (14,22) (21,8) (27,0) (0,51) (0,25) (2,03) (1,63) (0,51) (0,25) (1,40) (1,14) (1,14) (0,89) (0,71) (0,54) (1,27) (1,14) (0,89) / D 10/96 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a metal lid. D. The terminals are gold plated. E. Falls within JEDEC MS-004 POST OFFICE BOX DALLAS, TEXAS 75265
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24 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. 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PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) 5962-9687802QEA
SN5486, SN54LS86A, SN54S86 SN7486, SN74LS86A, SN74S86 QUADRUPLE 2-INPUT EXCLUSIVE-OR GATES
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SN5474, SN54LS74A, SN54S74 SN7474. SN74LS74A, SN74S74 DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET AND CLEAR
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