High Power Low Ohm Chip Resistors. Size W, W, /2W

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WW25P, WW20P, WW12P ±1%, ±5% 47mΩ~976mΩ High Power Low Ohm Chip Resistors Size 2512 2W, 2010 1W, 1206 1/2W *Contents in this sheet are subject to change without prior notice. Page 1 of 7 ASC_WW25P-20P-12P_V08 Sep.2010

FEATURE 1. High power rating and compact size 2. High reliability and stability 3. Reduced size of final equipment 4. RoHS compliant and lead free products. APPLICATION Power supply PDA Digital meter Computer Automotives Battery charger DC-DC power converter DESCRIPTION The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to nominated value within tolerance which controlled by laser trimming of this resistive layer. The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For ease of soldering the outer layer of these end terminations is Tin (lead free) alloy. Fig 1. Consctruction of Chip-R Page 2 of 7 ASC_WW25P-20P-12P_V08 Sep.2010

QUICK REFERENCE DATA Item General Specification Series No. WW25P WW20P WW12P Size code 2512 (6432) 2010 (5025) 1206 (3216) Resistance Tolerance ±1%, ±5% Resistance Range 0.047Ω ~ 0.976Ω TCR (ppm/ C) 100mohm ~ 976mohm 47mohm ~ 97.6mohm ±100ppm ±150ppm ±100ppm ±150ppm ±100ppm ±200ppm Max. dissipation at T amb =70 C 2 W 1 W 1/2 W Max. Operation Voltage (DC or RMS) 300V 200V 200V Max. Overload Voltage (DC or RMS) 500V 400V 400V Climatic category (IEC 60068) 55/155/56 Note : 1. This is the maximum voltage that may be continuously supplied to the resistor element, see IEC publication 60115-8 2. Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by RCWV = Rated Power Resistance Value or Max. RCWV listed above, whichever is lower. 3. 2W loading with total solder-pad and trace size of 300 mm 2 4. Resistance value will be changed by soldering condition and design of soldering pad, please design products in consideration of this change of resistance value. MECHANICAL DATA Unit: mm Symbol WW25P WW20P WW12P L 6.30 ± 0.20 5.00 ± 0.20 3.10 ± 0.15 W 3.10 ± 0.20 2.50 ± 0.20 1.60 ± 0.15 T 0.60 ± 0.15 0.60 ± 0.10 0.55 ± 0.10 Tt 0.60 ± 0.25 0.60 ± 0.25 0.50 ± 0.25 Tb 1.80 ± 0.25 0.60 ± 0.25 0.50 ± 0.25 Page 3 of 7 ASC_WW25P-20P-12P_V08 Sep.2010

Recommended Solder Pad Dimensions D W Type W D L WW25P 3.7mm 2.45mm 7.6mm MARKING L Each resistor is marked with a four-digit code on the protective coating to designate the nominal resistance value. Example: R100 = 0.100Ω R910 = 0.910Ω FUNCTIONAL DESCRIPTION Product characterization Standard values of nominal resistance are taken from the E96 & E24 series for resistors with a tolerance of ±5% & ±1%. The values of the E24/E96 series are in accordance with IEC publication 60063. Derating curve The power that the resistor can dissipate depends on the operating temperature; see Fig.2 Figure 2 Maximum dissipation in percentage of rated power as a function of the ambient temperature MOUNTING Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for handling by automatic placement systems. Chip placement can be on ceramic substrates and printed-circuit boards (PCBs). Electrical connection to the circuit is by individual soldering condition. The end terminations guarantee a reliable contact. Page 4 of 7 ASC_WW25P-20P-12P_V08 Sep.2010

SOLDERING CONDITION The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260 C for 10 seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other discrete components on the reverse (mixed PCBs). Surface Mount Resistors are tested for solderability at 235 C during 2 seconds. The test condition for no leaching is 260 C for 30 seconds. Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 3. Fig 3. Infrared soldering profile for Chip Resistors CATALOGUE NUMBERS The resistors have a catalogue number starting with. WW25 P R100 J T L Size code Type code Resistance code Tolerance Packaging code Termination code WW25 : 2512 WW20 : 2010 WW12 : 1206 P :Power 2512 size=2 watt 2010 size=1 watt 1206 size=0.5 watt E96 +E24: R is first digit followed by 3 significant digits. e.g.: 0.1ohm = R100 J : ±5% F : ±1% T : 7 Reel taping L = Sn base (lead free) 0.047ohm = R047 0.56ohm = R560 Tape packaging WW12 : 8mm width paper taping 5,000pcs per reel. WW25;WW20: 12mm width plastic taping 4,000pcs per reel. Page 5 of 7 ASC_WW25P-20P-12P_V08 Sep.2010

TEST AND REQUIREMENTS Basic specification : JIS C 5201-1 : 1998 TEST PROCEDURE REQUIREMENT Clause 4.8 Temperature Coefficient of Resistance (TCR ) Clause 4.13 Short time overload Clause 4.18 Resistance to soldering heat(r.s.h) Clause 4.17 Solderability Clause 4.19 Temperature cycling Clause 4.25 Load life (endurance) Clause 4.24 Load life in Humidity Clause 4.33 Bending strength Clause 4.32 Adhesion Insulation Resistance Natural resistance change per change in degree centigrade. R R 1 R 2 1 6 10 ( t t ) 2 1 (ppm/ C) R 1 : Resistance at reference temperature R 2 : Resistance at test temperature t 1 : 20 C+5 C-1 C Permanent resistance change after 5 second application of a power 5.0 times of rated power or the maximum overload voltage specified in the above list, whichever is less. Un-mounted chips completely immersed for 10±1second in a SAC solder bath at 260 ±5ºC Un-mounted chips completely immersed for 2±0.5second in a SAC solder bath at 235 ±5 30 minutes at -55 C±3 C, 2~3 minutes at 20 C+5 C-1 C, 30 minutes at +155 C±3 C, 2~3 minutes at 20 C+5 C-1 C, total 5 continuous cycles 1000 +48/-0 hours, loaded with RCWV or Vmax in chamber controller 70±2ºC, 1.5 hours on and 0.5 hours off 1000 +48/-0 hours, loaded with RCWV or Vmax in humidity chamber controller at 40 C±2 C and 90~95% relative humidity, 1.5hours on and 0.5 hours off Resistors mounted on a 90mm glass epoxy resin PCB(FR4); bending : 2 mm(2512;2010) 3mm(1206), once for 10 seconds Pressurizing force: 5N, Test time: 10±1sec Refer to quick reference data for T.C.R specification R/R max. J: ±(2%+0.5mΩ) F: ±(1%+0.5mΩ) R/R max. J: ±(1%+0.5mΩ) F: ±(0.5%+0.5mΩ) Good tinning (>95% covered) R/R max. J ±(1%+1mΩ) F ±(0.5%+1mΩ) R/R max. J ±(3%+0.5mΩ) Apply the maximum overload voltage (DC) for 1minutes R 10GΩ F ±(1%+0.5mΩ) R/R max. J ±(3%+0.5mΩ) F ±(1%+0.5mΩ) R/R max. J ±(1%+1mΩ) F ±(0.5%+1mΩ) No remarkable damage or removal of the terminations Clause 4.6 Dielectric Withstand Voltage Clause 4.7 Apply the maximum overload voltage (AC) for 1 minutes No breakdown or flashover Page 6 of 7 ASC_WW25P-20P-12P_V08 Sep.2010

PACKAGING Paper Tape(WW12P) & Plastic Tape(WW25P;WW20P) specifications (unit :mm) Series No. A B W F E WW25P 6.90±0.20 3.60±0.20 WW20P 5.50±0.20 2.80±0.20 12.00±0.30 5.50±0.10 1.75±0.10 WW12P 3.60±0.20 2.00±0.20 8.00±0.30 3.50±0.20 Series No. P1 P0 ΦD T WW25P WW20P 4.00±0.10 4.00±0.10 Φ1.50 + 0.1 0. 0 Max. 1.2 WW12P Max. 1.0 Reel dimensions (unit : mm) Reel / Tape A B C D 7 reel for 12mm tape 9.00±0.50 Φ178.0±2.0 Φ60.0±1.0 13.0±0.2 7 reel for 8mm tape 12.4±1.00 Page 7 of 7 ASC_WW25P-20P-12P_V08 Sep.2010