WIP252012Q ZF Series Specification Product Name Series Power Inductor WIP252012Q ZF Series Size EIAJ 2520
WIP252012Q ZF Series Engineering Specification 1. Feature This specification applies Low Profile Power Inductors. Halogen free, Lead Free, RoHS Compliance. 2. Explanation of Part Number W I P 2 5 2 0 1 2 Q 2 R 2 M Z F 1 2 3 4 5 6 7 1 : Product Series 2 : Size Code: The first two digitals: length(mm), The last two digitals: width(mm) 3 : Thickness(mm) 4 : Model Code 5 : Inductance (μh) : 2R2=2.2uH 6 : Inductance Tolerance Code: M=±20% ; Y=±30% 7 : Control S/N 3. Construction & Dimensions Series A B C D E WIP252012Q ZF 2.5-0.1/+0.2 2.0-0.05/+0.35 1.2 max. 0.85 ref. 0.80 ref. Units: mm WIP252012Q ZF Series Engineer Specification Version: A1 Page 1 of 6
4. Specifications Part Number Inductance (uh) Tolerance (%) Test Frequency (Hz) DCR (Ω) ±20% I sat (A) I rms (A) Typ. Max. Typ. Max. WIP252012Q-R47Y-ZF 0.47 ±30% 0.1V/1M 0.028 4.0 3.6 3.7 3.35 WIP252012Q-R68Y-ZF 0.68 ±30% 0.1V/1M 0.036 3.0 2.7 3.3 3.0 WIP252012Q-1R0Y-ZF 1.0 ±30% 0.1V/1M 0.049 2.7 2.45 2.6 2.3 WIP252012Q-1R5Y-ZF 1.5 ±30% 0.1V/1M 0.063 2.30 2.05 2.20 1.95 WIP252012Q-2R2M-ZF 2.2 ±20% 0.1V/1M 0.08 2.15 1.95 1.85 1.65 WIP252012Q-4R7M-ZF 4.7 ±20% 0.1V/1M 0.176 1.50 1.35 1.20 1.05 Note: Isat:Based on inductance change( L/L0: -30%)@ ambient temp. 25 Irms:Based on temperature rise ( T:40 typ.) WIP252012Q-R47Y-ZF WIP252012Q-R68Y-ZF WIP252012Q-1R0Y-ZF WIP252012Q-1R5M-ZF WIP252012Q ZF Series Engineer Specification Version: A1 Page 2 of 6
WIP252012Q-2R2M-ZF WIP252012Q-4R7M-ZF 5. Appearance Exposed wire tolerance limit of coating resin part on product side. Size of exposed wire occurring to coating resin is specified below. 1. Width direction(dimension a):acceptable when a w/2 Nonconforming when a>w/2 2. Length direction(dimension b):dimension b is not specified. 3. The total area of exposed wire occurring to each sides is not greater than 50% of coating resin area, and is acceptable 6. Material Lists No. Item Material a Core Ferrite Core b Coating Epoxy with magnetic powder c Termination Tin (Pb-Free) d Wire Enameled Copper Wire WIP252012Q ZF Series Engineer Specification Version: A1 Page 3 of 6
7. Reliability and Test Condition Item Performance Test Method and Remarks Operating Temperature -55~+125 (For products in unopened tape package, less than 40 ) Electrical Performance Test Inductance L Q SRF DC Resistance Refer to standard electrical characteristic list Agilent-4291, Agilent-4287 Agilent-4192, Agilent-4285 Agilent-4291 Agilent-4338 Rated Current Base on temp. rise & L/L0A 30%. Saturation DC Current (Isat) will cause L0 to drop approximately L(%). Temperature Rise Test Mechanical Performance Test ΔT 40 Max Heat Rated Current (Irms) will cause the coil temperature rise approximately T( ) without core loss. 1.Applied the allowed DC current. 2.Temperature measured by digital surface thermometer Solder Heat Resistance Appearance:No damage. Inductance:within±10% of initial value Q:Shall not exceed the specification value. RDC:within ±15% of initial value and shall not exceed the specification value Temperature ( C) 260 ±5 (solder temp) Time (s) Depth: completely cover the termination Temperature ramp/immersion and emersion rate Number of heat cycles 10 ±1 25mm/s±6 mm/s 1 Solderability Test More than 95% of terminal electrode should be covered with solder. Reliability Test Life Test Thermal shock Humidity Resistance Test Vibration Test Appearance:No damage. Inductance:within±10% of initial value Q:Shall not exceed the specification value. RDC:within ±15% of initial value and shall not exceed the specification value After fluxing,component shall be dipped in a melted solder bath at 235±25 for 4±1seconds. Temperature:125±2 (Bead) Temperature: 85±2 (Inductor) Applied current:rated current Duration:1000±12hrs Measured at room temperature after placing for 24±2 hrs Step1:-40±2 30±5min Step2:25±2 0.5min Step3:105±2 30±5min Number of cycles: 500 Measured at room fempraturc after placing for 24±2 hrs Humidity:85±2 % R.H, Temperature:85 ±2 Duration:1000hrs Min. with 100% rated current Measured at room temperature after placing for 24±2 hrs Oscillation Frequency: 10~2K~10Hz for 20 minutes Equipment: Vibration checker Total Amplitude:0. 15mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations) WIP252012Q ZF Series Engineer Specification Version: A1 Page 4 of 6
8. Soldering and Mounting 8-1 Soldering Mildly activated rosin fluxes are preferred. terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 8-1-1 Solder re-flow: Recommended temperature profiles for re-flow soldering in Figure 1. 8-1-2 Soldering Iron(Figure 2): Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Preheat circuit and products to 150 Never contact the ceramic with the iron tip Use a 20 watt soldering iron with tip diameter of 1.0mm 355 tip temperature (max) 1.0mm tip diameter (max) Limit soldering time to 4~5 sec. 8-2 Recommended PC Board Pattern L(mm) G(mm) H(mm) 2.9 0.8 2.4 WIP252012Q ZF Series Engineer Specification Version: A1 Page 5 of 6
9. Packaging Information 9-1 Reel Dimension Type A(mm) B(mm) C(mm) D(mm) 7 x8mm 8.4±1.0 50 min. 13±0.8 178±2 9-2 Tape Dimension Type Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) WIP252012Q 2.85±0.1 2.45±0.1 1.4±0.1 4.0±0.1 0.23±0.05 9.3 Packaging Quantity Type PCS/Reel WIP252012Q 2,000 9-4 Tearing off force WIP252012Q ZF Series Engineer Specification Version: A1 Page 6 of 6