SPECIFICATION COMMERCIALLY AVAILABLE CERAMIC FILTER PART NUMBER: CF DOCUMENT CHECKED 9/28/11 DS 12/01/2011 TFG 12/01/2011 GL

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DIELECTRIC CERAMIC FILTER SPECIFICATION 1 OF 6 SPECIFICATION COMMERCIALLY AVAILABLE CERAMIC FILTER PART NUMBER: CF-32002005 ISSUED / REVISION ENGINEER APPROVED DOCUMENT CHECKED DRAFTSMAN DOCUMENT CHECKED 11/14/04 ** 3/17/2010 SRJ 3/17/2010 BF 9/28/11 DS 12/01/2011 TFG 12/01/2011 GL FILTRONETICS Inc

1. APPLICATION DIELECTRIC CERAMIC FILTER SPECIFICATION 2 OF 6 THIS SPECIFICATION APPLIES TO BAND PASS FILTER USING DIELECTRIC RESONATORS. 2. PART NUMBER PART NO CF-32002005 3. SPECIFICATIONS NO ITEMS Ref. SPECIFICATION 1 Center Frequency (Fo) a1 3200 MHz 2 3dB Band Width b1 Fo +/- 100 MHz MIN 3 Insertion Loss @ Fo a1 2.5 db Max 4 40 db Band Width Fo +/- 380 MHz MAX 5 Attenuation @ 2500 MHz 50 db Min 6 Impedance 50Ω 7 Maximum Input Power 1 W (+30dBm) 8 Operating Temperature Range -35 to +75 S21 LOG MAG NETWORK ANALYZER S11 SWR NETWORK ANALYZER

4. DIMENSIONS DIELECTRIC CERAMIC FILTER SPECIFICATION 3 OF 6 UNIT: MM TOLERANCE: +/-0.5MM IN/OUT LAND: +/-0.3MM MATERIAL SPECIFICATION 1. PCB MARKING Part Number: CF-32002005 Filtronetics 1) MATERIAL: FR4 2) TERMINALS: Au PLATED 2. METAL CASE 1) MATERIAL: Au OR Ni PLATED 3. RESONATOR 1) COATING MATERIAL: Ag 2) DIMENSION: 4.0MM x 4.0MM CAUTIONS: 1. When handling products, be careful not to damage the outer-electrode. 2. When handling these products be careful not to touch the outer-electrode with bare hands or solder-ability is reduced. 3. Do not apply excessive pressure or shock to product in handling or in transportation or damage to the ceramic filters may result.

5. GRAPHS DIELECTRIC CERAMIC FILTER SPECIFICATION 4 OF 6 S21 & S11 (INSERTION LOSS, RETURN LOSS, 3 db BAND WIDTH) S21 & S11 (SMITH CHART, V.S.W.R, 40 db BAND WIDTH)

Pad Layout DIELECTRIC CERAMIC FILTER SPECIFICATION 5 OF 6 6. DEFINITIONS TERMS DESCRIPTION SPECIFICATION Center Frequency Pass Band Width Insertion Loss Attenuation Pass Band Ripple V.S.W.R in Pass Band The midpoint of through band pass filter pass band, normally expressed as the arithmetic mean of the -3dB point. Also called Fo. The width of the pass band of a filter referenced to the minimum insertion loss point in the pass band. The pass band of a filter is stated as -1.0dB bandwidth. The loss of the filter, in db, measured at center frequency relative to a through line (0 db). Reduction of RF power through a filter measured in db, at desired band and referenced to 0 db. (Filter to be removed from circuit) Variations in loss in the pass band of the filter, superimposed upon the fundamental shape of the pass band. The ratio of the maximum value of a standing wave to its minimum value, related to the return loss in pass band. 3. SPECIFICATION

DIELECTRIC CERAMIC FILTER SPECIFICATION 6 OF 6 7. RELIABILITY TEST AND CONDITIONS ITEM TEST CONDITIONS REQUIREMENTS Operating Temp. Range - 45 ~ + 85-40 ~ + 70 Resistance to solder heat Preheat temperature : 120 to 150 Preheat time: 1 to 1.5 min Solder temperature: 260 +/- 10 Dipping time: 10 +/- 0.5 sec Solderability Preheat temperature: 120 to 150 Heat resistance (High-temperature Load) Thermal shock (Temperature cycle) Preheat time: 1 to 1.5 min Solder temperature: 235 +/- 5 Dipping time: 5 +/- 1 sec Temperature: 85 +/- 2 Applied voltage: Rated voltage Applied current: Rated current Recovery: 1 to 2hrs of recovery under the standard condition after the removal from test chamber. Conditions for 1 cycle Step 1: + 85 15 min Step 2 : - 30 15 min Number of cycle: 10 Humidity Resistance Temperature: 40 +/- 2 Humidity: 90 to 95% RH Duration: 96 +/- 5 hrs Recovery: 1 to 2hrs of recovery under the standard condition after the removal from test chamber. Vibration Frequency: 10 ~ 50 Hz Amplitude: 1.52 mm ( 0.060 inches) Direction: X, Y and Z Time: each 30 min for all directions No damage such as cracks should be caused in chip element. More than 80% of the terminal electrode shall be covered with new solder 8. REFLOW SOLDERING STANDARD CONDITIONS Measuring point of temperature in-out terminals of the device. Reflow Soldering Both convection and infrared rays Hot air Hot plates Solder Cream: Sn64/Pb36