MCS/MCSE/MCSL Series Chip size: 00 to 51 NB, Tablet Pad, PC, Smart Phone Power Module for LED Lighting and Backlights Power Rating Resistance (mω) MCS00 1/8w M.5~50 mω -55~+10 ±50 MCS0603 1/W M.5~30 mω -55~+10 ±50 MCSE0805 1/W 1.0~100 mω -55~+10 ±50~±5 MCSE106 1W 1.0~00 mω -55~+10 ±50~±100 MCS51 1W,W 10-300 mω -55~+10 ±100 1-9 mω -55~+10 ±100 MCSE30 5W 5.0~50 mω -55~+10 ±50 MCSL0508 1/W 5~30 mω -55~+10 ±5 MCSL061 1W 5~30 mω -55~+10 ±100 MCSL15 3W 5~10 mω -55~+10 ±50 MCSL03 6W 10~0 mω -55~+10 ±50 Tolerance F=+/-1% G=+/-% J=+/-5% s(mm) L W T A B MCS00 1.0±0.10 0.55±0.10 0.5±0.10 0.15±0.10 0.5±0.10 MCS0603 1.60±0.10 0.80±0.10 0.60±0.15 0.15±0.10 0.55±0.15 MCSE0805.10±0.0 1.30±0.15 0.0±0.15 0.0±0.0 0.0±0.0 MCSE106(S) 3.10±0.0 1.55±0.0 0.0±0.15 0.50±0.0 0.55±0.0 MCSE106(L) 1.10±0.0 MCS51(S) 0.80±0.15 01.10±0.5 6.5±0.0 3.5±0.0 0.90±0.0 MCS51(L) 1.00±0.0.0±0.5 MCSE30 11.0±0.0 5.0±0.0 0.65±0.0 -.6±0.30 MCSL0508 1.30±0.0.0±0.0 0.60±0.0 0.30±0.0 MCSL061 1.60±0.0 3.±0.0 0.60±0.0-0.30±0.0 MCSL15 3.10±0.15 6.3±0.15 0.80±0.15 0.55±0.15 MCSL03 5.0±0.0 11.0±0.0 0.65±0.0-0.95±0.0 3 Damp with Load Voltage equal to 5 time rated power for 5 sec (JIS-C50-5.5) subjected to a relative humidity of 90-95% and a temperature of 90-95% percent and a temperature of 0 ± C for the period of 1000 hrs. (MIL-STD-0, Method 103) chamber 15 ±3 for 1000 hrs. (JIS-C50-.) Apply rated power for 1000 hours with 1.5 hours ON and 0.5 hour OFF. (JIS- C50-.10) direction of arrow unit band width reaches mm(+0./-0mm) illustrated in the figure below and hold for 10 ± 1 sec. (JIS-C50-6.1) specified in the solder bath 60 ±5 for 10 ±1 sec. (MIL-STD 0,Method 10) R X t specified in the solder bath 35 ±5 for ±0.5 sec. It shall be immersed to a point 10mm from its root. (Sn96.5/Ag3.0/Cu0.5) (JIS-C50-6.11)
MCSH Series Chip size: 0603 to 51 Power Rating Resistance (mω) Tolerance 3 Damp with Load Voltage equal to 5 time rated power for 5 sec (JIS-C50-5.5) temperature of 0± for the period of 1000 hrs.. (MIL- STD-0, Method 103) 00 1/W 0603 1/W.5~30-55~+10 ±50 F=±1% G=±% J=±5% chamber 15± for 1000 hrs. (JIS-C50-.) Apply rated power at 0± for 1000 hours with 1.5 hours ON and 0.5 hour OFF. (JIS-C50-.10) direction of arrow unit band width reaches mm(+0./- sec. (JIS-C50-6.1) specified in the solder bath 60±5 for 10±1 sec. (MIL-STD-0,Method 10) s(mm) L W t A 00 1.00±0.10 0.55±0.10 0.5±0.10 0.5±0.10 0603 1.60±0.10 0.80±0.10 0.55±0.15 0.30±0.0 specified in the solder bath 35 ±5 for ±0.5 sec. It shall be immersed to a point 10mm from its root. (Sn96.5/Ag3.0/Cu0.5) (JIS-C50-6.11)
CCSH Series Chip size: 0603 to 51 s(mm) L W t A B 0603 1.55±0.10 0.85±0.10 0.5±0.10 0.30±0.0 0.35±0.0 0805.10±0.15 1.30±0.15 0.65±0.15 0.0±0.0 0.0±0.0 106-S Type 0.50±0.30 3.10±0.0 1.65±0.10 0.65±0.15 106-L Type 0.80±0.30 0.5±0.0 51-S Type 0.60±0.30 51-L Type 6.5±0.0 3.5±0.10 0.80±0.15 1.80±0.30 0.50±0.5 Voltage equal to 3 time rated power for 5 sec (JIS-C50-5.5) Power Rating 0603 1/8W 0805 1/W 106 1/W 51 W Resistance (mω) 1% % 5% 0~99 Operation Temp. 100~99 ±00 6~10 11~100 ±00 101~96 ±00 6~10-55±155 11~100 ±00 101~96 ±00 10~ ±300 ~00 ±00 00~910 ±100 3 Damp with Load temperature of 0± for the period of 1000 hrs.. (MIL- STD-0, Method 103) chamber 15± for 1000 hrs. (JIS-C50-.) Apply rated power at 0± for 1000 hours with 1.5 hours ON and 0.5 hour OFF. (JIS-C50-.10) direction of arrow unit band width reaches mm(+0./- sec. (JIS-C50-6.1) specified in the solder bath 60±5 for 10±1 sec. (MIL-STD-0,Method 10) specified in the solder bath 35 ±5 for ±0.5 sec. It shall be immersed to a point 10mm from its root. (Sn96.5/Ag3.0/Cu0.5) (JIS-C50-6.11)
100~99 Metal Strip Current Sensing Resistor CCS Series Chip size: 0603 to 51 s(mm) L W t A B 0603 1.55±0.10 0.85±0.10 0.5±0.10 0.30±0.0 0.35±0.0 0805.10±0.15 1.30±0.15 0.65±0.15 0.0±0.0 0.0±0.0 106-S Type 0.50±0.30 3.10±0.0 1.65±0.10 0.65±0.15 106-L Type 0.80±0.30 0.5±0.0 51-S Type 0.60±0.30 51-L Type 6.5±0.0 3.5±0.10 0.80±0.15 1.80±0.30 0.50±0.5 Voltage equal to 3 time rated power for 5 sec (JIS-C50-5.5) Power Rating 00 1/16W 0603 1/10W 106 1/W Resistance (mω) 1% % 5% 100~99 Operation Temp. ±500 500~96 ±00 100~99 ±500 500~96 ±00 50~99-55±155 ±500 100~99 ±00 3 Damp with Load temperature of 0± for the period of 1000 hrs.. (MIL- STD-0, Method 103) chamber 15± for 1000 hrs. (JIS-C50-.) 500~96 50~99 Apply rated power at 0± for 1000 hours with 1.5 hours ON and 0.5 hour OFF. (JIS-C50-.10) 51 1W 100~99 ±500 500~96 ±00 direction of arrow unit band width reaches mm(+0./- sec. (JIS-C50-6.1) specified in the solder bath 60±5 for 10±1 sec. (MIL-STD-0,Method 10) specified in the solder bath 35 ±5 for ±0.5 sec. It shall be immersed to a point 10mm from its root. (Sn96.5/Ag3.0/Cu0.5) (JIS-C50-6.11)
MCSS Series Excellent long term stability 5W up to 19A at 0.3mΩ Chip size: 51, 390, 5910 & 80 Power modules Frequency converters Current sensor for power hybrid sources High current for automotive Loading below condition for 5 cycles. Peak current equal 5 x rated power. Power Rating Resistance (mω) MCSS51 1.5~3W 0.3~5.0-55~+10 ±50~±150 MCSS390 ~5W 0.~5.0-55~+10 ±50~±5 MCSS5930 6~10W 0.~1.0-55~+10 ±50~±100 3 Moisture Resistance temperature of 5 /65 10 cycles. (MIL-STD-0, Method 106) MCSS5910 10W 0. -55~+10 ±100 MCSS80 15W 0.1-55~+10 ±100 chamber 15 for 1000 hrs. (JIS-C50-.) Apply rated power for 1000 hours with 1.5 hours ON and 0.5 hour OFF. (JIS-C50-.10) direction of arrow unit band width reaches mm(+0./- sec. (JIS-C50-6.1) Solder ability specified in the solder bath 35 ±5 for ±0.5 sec. It shall be immersed to a point 10mm from its root. (Sn96.5/Ag3.0/Cu0.5) (JIS-C50-6.11) s(mm) L W T A C (Max.) P MCSS51 6.50±0. 3.5±0. 0.±0.15 0.90±0. 0. 0.35±0. MCSS390 10.±0. 5.0±0. 0.80±0.15 1.8±0.3 0.6 0.50±0. MCSS5930 15.0±0..5±0. 0.58±0.15.0±0. 1.0 0.50±0. MCSS5910 15.0±0. 6.5±0. 0.58±0..5±0. 0.9 1.0±0. MCSS80 8.0±0. 0.0±0. 3.0±0. - - -