Hardened Hybrid Hybrid Air/Conduction Cooled MicroTCA.2 Thermal Test Report March 19, 2012 Revision 1.0 Written by: James Chan, BAE Systems Mark Leibowitz, BAE Systems Eike Waltz, Elma Electronic Inc. Approved by: Michael Borthwick, BAE Systems Jon Leach, BAE Systems Fred Fons, Foxconn David Pursley, Kontron Paul Rutherford, Pentair/Schroff Rodney Bame, Wavetherm David Mosier, Wavetherm Steve Richardson, CBT Technology Vollrath Dirksen, NAT Saeed Karamooz, VadaTech
Revision 1.0 - March 19, 2012 EXECUTIVE SUMMARY The purpose of the testing conducted as described in this report was to identify and characterize the primary (forced-air) and the secondary (conduction) thermal performance contributions inherent in the proposed Hybrid Air/Conduction Cooled MicroTCA.2 specification. The clamshelled AMC module design defined in MicroTCA.2 has been leveraged, in large part, from the ratified MicroTCA.3 Hardened Conduction Cooled Specification. This partial duplication of design serves to ensure that the proposed MicroTCA.2 module/chassis systems will meet established Hardened MIL levels of shock and vibration. The wedge lock (card retainer) design concept is considered unique to the new specification by virtue of it allowing airflow through its cross section. Using two versions of a reference design chassis, one version with non-heat conductive sidewalls and one with traditional aluminum sidewalls, the testing characterized multiple combinations of low-power and high-power AMC thermal load modules (TLMs). Over three days of activity, various system setups generated an extensive data set, capturing chassis inlet airflow velocity, module slot airflow velocity, inlet ambient air temperatures, and module onboard sensor temperatures. Distillation of the test results confirms that a significant thermal dissipation benefit is provided by the secondary (conduction) heat sharing of MicroTCA.2 Hybrid cooling. While this benefit will vary by specific application, the testing documented a contribution of up to 33% in component temperature reduction as compared to standard MicroTCA.0/MicroTCA.1 forced air-only solutions (see Table 6). It is envisioned that thermal engineers and systems architects will choose to exploit this secondary (Hybrid) benefit differently some following the path of increased temperature headroom in the event of a forced air failure, others opting to reduce fan speeds or perhaps saving the investment for a rainy day processor upgrade. ES-1
Revision 1.0 - March 19, 2012 Table of Contents Section Page EXECUTIVE SUMMARY... 1 1 INTRODUCTION... 1 1.1 Scope... 1 1.2 Objective... 1 1.3 Applicable Documents... 1 1.4 Test Location and Schedule... 1 2 TEST SUMMARY AND CONCLUSIONS... 2 2.1 Deviations from Test Plan... 2 2.2 Summary of Cooling Effectiveness... 2 2.2.1 Sensor Temperature Comparison... 2 2.2.2 Airflow Temperature Comparison... 2 2.3 Conclusion... 7 3 TEST SETUP... 8 3.1 Thermal Test Chassis with Backplane... 8 3.2 Test Configurations... 9 3.2.1 Thermal Load Module (TLM)... 9 3.2.2 MicroTCA.2 AMC Characterization Module (MACM)... 9 3.3 Environmental Testing Conditions... 11 3.4 Tests Performed... 13 3.5 Test Sequence Flowchart... 14 3.6 Pretest Checkout... 15 4 TEST RESULTS... 17 4.1 CCS Test 1 Chassis Calibration... 17 4.2 MACM Test 2 Velocity Measurements... 18 4.3 HP-TLM Test 3... 19 4.3.1 Velocity Measurements HP-TLM Module... 19 4.3.2 Airflow Resistance and System Impedance HP-TLM Module... 20 4.4 Test 4a, b, c, d, e and f Temperature and Flow Measurements with Aluminum Chassis... 22 4.5 Test 5a, b, e and f Temperature and Flow Measurements with Plastic Chassis... 29 A.1 Test Setups... A-2 A.2 Test Modules... A-7 A.3 Supporting Drawings... A-9 A.3.1 Test Chassis... A-9 A.3.2 Test Modules... A-19 iii
Revision 1.0 - March 19, 2012 Figure List of Figures Page 1 3-Slot Thermal Test Chassis with Integrated Chassis Slot Sidewalls... 8 2 Notional View of HP-TLM, based on MicroTCA.2 High Power Module... 9 3 Notional View of MACM, based on MicroTCA.2 Low Power Module... 10 4 Blank MACM MicroTCA.2 Module... 10 5 Blank MACM MicroTCA.2 Module, Side View... 11 6 Thermocouple Placement.... 12 7 Location of Temperature Sensors.... 12 8 MicroTCA.2 Module Test Flow... 14 9 3-Slot Thermal Test Chassis Attached to Round Pressure Plate via Air Duct... 15 10 System Impedance Curve (three slots populated with HP-TLM modules)... 21 11 System Impedance Curve (single slot populated with HP-TLM module)... 21 A1 2000 CFM Airflow Testing Chamber... A-2 A2 Airflow Nozzle Plate... A-2 A3 Blower Assembly Attached to Wind Tunnel... A-3 A4 Static Pressure Taps between Nozzle Array Plate... A-3 A5 Blast Gate with Controller... A-4 A6 Room Ambient Condition Monitor... A-4 A7 Setra Datum 2000 Pressure Meter... A-5 A8 Power Supplies and Test Laptop PC... A-5 A9 ATM2400 and Thermocouple Setup... A-6 A10 HP-TLM Test Module Topside... A-7 A11 HP-TLM Test Module Bottom Side... A-7 A12 Blank MACM MicroTCA.2 Test Module... A-8 A13 Blank MACM MicroTCA.2 Test Module, Side View... A-8 A14 Test Chassis Top Cover... A-9 A15 Test Chassis Front Cover... A-10 A16 Test Chassis, Exhaust Bracket... A-11 A17 Test Chassis, Sensor Bracket... A-12 A18 Test Chassis Sidewall, Right... A-13 A19 Test Chassis Sidewall, Left... A-14 A20 3-Slot Test Chassis Backplane... A-15 A21 Wind Tunnel Mounting Plate... A-16 A22 Upper Side Bracket Mount... A-17 A23 Lower Side Bracket Mount... A-18 A23 Single Mid-size Top Cover (MACM)... A-19 A24 Single Mid-size Top Cover (HP-TLM)... A-20 A25 Single Rear Cover (same for MACM and HP-TLM)... A-21 A26 Hybrid Wedge Lock for Test Modules... A-22 iv
Revision 1.0 - March 19, 2012 Table List of Tables Page 1 Test Setup A, Tests 5a and 5e Module Sensor Temperature Measurements Non-Conductive Plastic Chassis Sidewalls... 3 2 Test Setup A, Tests 4a and 4e Module Sensor Temperature Measurements, Conductive Aluminum Chassis Sidewalls... 3 3 Component Temperature Benefit from Hybrid Approach, Three Energized Modules, per Comparison of Measurements Shown in Tables 1 and 2.... 3 4 Test Setup B, Tests 5b and 5f Module Sensor Temperature Measurements, Non-Conductive Plastic Chassis Sidewalls... 4 5 Test Setup B, Tests 4b and 4f Module Sensor Temperature Measurements, Conductive Aluminum Chassis Sidewalls... 4 6 Component Temperature Benefit from Hybrid Approach, Single Energized Module, per Comparison of Measurements Shown in Tables 4 and 5.... 4 7 Test Setup A, Tests 5a and 5e Module Airflow Temperature Measurements, Non-Conductive Plastic Chassis Sidewalls... 5 8 Test Setup A, Tests 4a and 4e Module Airflow Temperature Measurements, Conductive Aluminum Chassis Sidewalls... 5 9 Airflow Temperature Rise Difference, Three Energized Modules, per Comparison of Measurements Shown in Tables 7 and 8... 5 10 Test Setup B, Tests 5b and 5f Module Airflow Temperature Measurements, Non-Conductive Plastic Chassis Sidewalls... 6 11 Test Setup B, Tests 4b and 4f Module Airflow Temperature Measurements, Conductive Aluminum Chassis Sidewalls... 6 12 Airflow Temperature Rise Difference, Single Energized Module, per Comparison of Measurements Shown in Tables 10 and 11... 6 13 Summary of Tests Performed... 13 14 Static Pressure Drop at varied CFM Chassis (Aluminum)... 20 B1 Equipment List... B-2 Appendix List of Appendices Page A Test Setup and Supporting Drawings... A-1 B Equipment List... B-1 v
Revision 1.0 - March 19, 2012 Revision History Revision Changes Date 1.0 Initial Release March 19, 2012 vi
Revision 1.0 - March 19, 2012 LIST OF ACRONYMS/ABBREVIATIONS AMC CFM HP-TLM LED MACM MTCA Advanced Mezzanine Card Cubic Feet per Minute High Power Thermal Load Module Light-Emitting Diode MicroTCA.2 AMC Characterization Module Micro Telecommunications Architecture PC PCB PICMG PQ RH TLM Personal Computer Printed Circuit Board PCI Industrial Computer Manufacturers Group Pressure/Flow Rate Relative Humidity Thermal Load Module iv
1 INTRODUCTION 1.1 Scope This report describes the results of thermal testing conducted to determine the thermal and pressure drop characteristics of representative AMC Modules, which follow the mechanical design concepts defined in Micro Telecommunication Computing Architecture PICMG MicroTCA.2 Base Specification. Testing was conducted using both low- and high-power output test Modules in an air-flow controlled test chamber at room ambient conditions in accordance with the Hybrid Air/Conduction Cooled MicroTCA.2 Thermal Test Plan. 1.2 Objective The objective of these tests was to verify the functional attributes of the unit under test to determine the cooling capability of the AMC Module concepts proposed for adoption of the Hybrid MicroTCA.2 PICMG specification. These thermal characteristics were defined by measuring airflow resistance, velocity and temperature rises on one or more powered Thermal Load Modules (TLMs) under test. Two types of dimensionally identical reference Chassis designs, one constructed with Aluminum Sidewalls and the other with Plastic Sidewalls, were used to assess the effectiveness of conduction cooling under different power dissipation and airflow conditions. 1.3 Applicable Documents Unless otherwise specified, the following documents of issue in effect at the time of testing form a part of this report to the extent specified herein. The requirements of subtier specifications and/or standards apply only when specifically referenced in this test report. The following specifications used are from direct or derived requirements to support the testing and generation of the MicroTCA.2 specification. Hybrid/Air Conduction Cooled MicroTCA.2 Thermal Test Plan Revision 1.1, November 07, 2011 Hybrid/Air Conduction Cooled MicroTCA.2 Thermal Test Procedure Revision 1.0, November 07, 2011 1.4 Test Location and Schedule All tests were performed from November 8 to 11, 2011 at the test facility below: Degree Controls, Inc. 18 Meadowbrook Drive Milford, NH 03055, USA Tel: (603) 672-8900 or (877) 334-7332 1
2 TEST SUMMARY AND CONCLUSIONS 2.1 Deviations from Test Plan Hybrid/Air Conduction Cooled MicroTCA.2 Thermal Test Plan Revision 1.1 includes a section entitled Thermal Test and Analysis Data (Tests to be run at 50W, 25W & 8W), which states that Analysis to be performed to fill in data for Tables 1 and 2. These tables include rows to record data for a total of six different Module sizes. However, during testing it was determined that the testing of one (popular) Module size would be sufficient to prove the advantage of the Hybrid cooling approach as defined in MicroTCA.2. Thus, the data and conclusions in this Test Report are based on the testing of Mid-Size Single Modules only. In this respect, the Test Report supersedes the test regimen as defined in the Test Plan. 2.2 Summary of Cooling Effectiveness Under the same range of airflow conditions, Modules set for equal power dissipation were tested in a Chassis with conductive Aluminum Sidewalls, and alternatively in the same Chassis with non-conductive Plastic Sidewalls. Sensor temperature and Module airflow measurements indicative of cooling effectiveness under the given conditions are shown in sections 2.2.1 and 2.2.2. Section 2.3 highlights the conclusions drawn from the testing. 2.2.1 Sensor Temperature Comparison For the summary tables in this subsection, refer to Section 3 for test setups, in particular the Test Sequence Flowchart in Section 3.5, which identifies test setups A and B. Refer also to Section 4 for detailed test results, Appendix A for Test Setups and Supporting Drawings, and Appendix B for a list of equipment used to perform the tests. Data in Tables 1, 2, 4 and 5 demonstrate that the sensor temperature rises observed for the chassis with Aluminum Sidewalls were consistently lower than those for chassis with the Plastic Sidewalls. Tables 3 and 6 summarize the component temperature benefit of the Hybrid cooling approach based on these measurements. 2.2.2 Airflow Temperature Comparison For the summary tables in this subsection, refer to Section 3 for test setups, in particular the Test Sequence Flowchart in Section 3.5, which identifies test setups A and B. Refer also to Section 4 for detailed test results, Appendix A for Test Setups and Supporting Drawings, and Appendix B for a list of equipment used to perform the tests. Data in Tables 7, 8, 10 and 11 demonstrate that the inlet-exit temperature rises observed for the chassis with Aluminum Sidewalls were consistently lower than those observed for the chassis with Plastic Sidewalls. Tables 9 and 12 summarize this inletexit temperature rise difference as a percentage of reduction. 2
Table 1. Test Setup A, Tests 5a and 5e Module Sensor Temperature Measurements, Non-Conductive Plastic Chassis Sidewalls Plastic Chassis Sidewall 3 Energized Modules 3 Energized Modules Test 5a Total 154 Watts Test 5e Total 265 Watts Chassis Airflow [CFM] 20 40 60 87 20 40 60 87 Airflow per Slot [CFM] 6.7 13.3 20.0 29.0 6.7 13.3 20.0 29.0 Inlet Ambient Air Temp [ C] 22.3 22.8 23.2 22.8 22.2 22.4 22.7 22.9 Avg Sensor Temp [ C] 45.4 37.9 35.1 32.3 61.0 47.4 42.2 38.7 Sensor Temperature Rise (Sensor-Inlet) [ C] 23.1 15.2 11.9 9.5 38.8 25.0 19.5 15.7 Table 2. Test Setup A, Tests 4a and 4e Module Sensor Temperature Measurements, Conductive Aluminum Chassis Sidewalls Aluminum Chassis Sidewall 3 Energized Modules 3 Energized Modules Test 4a Total 154 Watts Test 4e Total 265 Watts Chassis Airflow [CFM] 20 40 60 87 20 40 60 87 Airflow per Slot [CFM] 6.7 13.3 20.0 29.0 6.7 13.3 20.0 29.0 Inlet Ambient Air Temp [ C] 22.5 22.6 22.8 23.1 22.6 22.4 22.4 23.0 Avg Sensor Temp [ C] 43.9 36.8 34.0 32.2 57.5 Sensor Temperature Rise (Sensor-Inlet) [ C] 21.47 14.12 11.18 9.11 34.9 Table 3. Component Temperature Benefit from Hybrid Approach, Three Energized Modules, per Comparison of Measurements Shown in Tables 1 and 2. Delta T (Plastic Chassis Sensor Avg - Aluminum Chassis Sensor Avg) [ C] Component Temperature Hybrid Benefit % 1.7 1.0 0.7 0.4 3.9 7% 7% 6% 4% 10% 3
Table 4. Test Setup B, Tests 5b and 5f Module Sensor Temperature Measurements, Non-Conductive Plastic Chassis Sidewalls Plastic Chassis Sidewall Single Energized Module Center Slot Test 5b 51.6 Watts Single Energized Module - Center Slot Test 5f 93.6 Watts Chassis Airflow [CFM] 20 40 60 87 20 40 60 87 Airflow per Slot [CFM] 6.7 13.3 20.0 29.0 6.7 13.3 20.0 29.0 Inlet Ambient Air Temp [ C] 21.9 22.4 22.8 23.2 22.4 22.3 22.6 22.9 Avg Sensor Temp [ C] 41.9 36.3 34.1 32.5 56.2 45.9 41.6 38.7 Sensor Temperature Rise (Sensor-Inlet) [ C] 20.0 13.9 11.3 9.3 33.7 23.6 19.0 15.7 Table 5. Test Setup B, Tests 4b and 4f Module Sensor Temperature Measurements, Conductive Aluminum Chassis Sidewalls Aluminum Chassis Sidewall Single Energized Module Center Slot Test 4b 51.6 Watts Single Energized Module - Center Slot Test 4f 93.6 Watts Chassis Airflow [CFM] 20 40 60 87 20 40 60 87 Airflow per Slot [CFM] 6.7 13.3 20.0 29.0 6.7 13.3 20.0 29.0 Inlet Ambient Air Temp [ C] 21.7 21.9 21.5 21.8 22.9 23.0 23.1 22.9 Avg Sensor Temp [ C] 35.1 34.2 31.9 30.4 50.5 44.9 37.1 Sensor Temperature Rise (Sensor-Inlet) [ C] 13.4 12.3 10.4 8.6 27.6 21.9 14.2 Table 6. Component Temperature Benefit from Hybrid Approach, Single Energized Module, per Comparison of Measurements Shown in Tables 4 and 5. Delta T (Plastic Chassis Sensor Avg - Aluminum Chassis Sensor Avg) [ C] Component Temperature Hybrid Benefit % 6.6 1.6 0.9 0.7 6.2 1.7 1.6 33% 12% 8% 7% 18% 7% 10% 4
Table 7. Test Setup A, Tests 5a and 5e Module Airflow Temperature Measurements, Non-Conductive Plastic Chassis Sidewalls Plastic Chassis Sidewall 3 Energized Modules 3 Energized Modules Test 5a Total 154 Watts Test 5e Total 265 Watts Chassis Airflow [CFM] 20 40 60 87 20 40 60 87 Airflow per Slot [CFM] 6.7 13.3 20.0 29.0 6.7 13.3 20.0 29.0 Inlet Ambient Air Temp [ C] 22.3 22.8 23.2 22.8 22.2 22.4 22.7 22.9 Avg. Slot Exit Temp [ C] 34.9 30.1 28.4 26.7 42.7 33.8 30.7 29.1 Airflow Temperature Rise (Exit-Inlet) [ C] 12.6 7.3 5.2 3.9 20.5 11.5 8.1 6.1 Table 8. Test Setup A, Tests 4a and 4e Module Airflow Temperature Measurements, Conductive Aluminum Chassis Sidewalls Aluminum Chassis Sidewall 3 Energized Modules 3 Energized Modules Test 4a Total 154 Watts Test 4e Total 265 Watts Chassis Airflow [CFM] 20 40 60 87 20 40 60 87 Airflow per Slot [CFM] 6.7 13.3 20.0 29.0 6.7 13.3 20.0 29.0 Inlet Ambient Air Temp [ C] 22.5 22.6 22.8 23.1 22.6 22.4 22.4 23.0 Avg Slot Exit Temp [ C] 34.6 29.7 27.8 26.8 42.3 33.7 30.4 28.5 Airflow Temperature Rise (Exit-Inlet) [ C] 12.2 7.0 5.0 3.7 19.7 11.3 8.0 5.5 Table 9. Airflow Temperature Rise Difference, Three Energized Modules, per Comparison of Measurements Shown in Tables 7 and 8 Delta T inlet-exit (Plastic Chassis Sidewall Avg - Aluminum Chassis Sidewall Avg) [ C] Air Temperature Rise Difference % 0.4 0.3 0.2 0.2 0.8 0.2 0.1 0.6 3% 4% 4% 5% 4% 2% 1% 10% 5
Table 10. Test Setup B, Tests 5b and 5f Module Airflow Temperature Measurements, Non-Conductive Plastic Chassis Sidewalls Plastic Chassis Sidewall Single Energized Module - Center Slot Test 5b 51.6 Watts Single Energized Module - Center Slot Test 5f 93.6 Watts Chassis Airflow [CFM} 20 40 60 87 20 40 60 Airflow per Slot [CFM] 6.7 13.3 20.0 29.0 6.7 13.3 20.0 Inlet Ambient Air Temp [ C] 21.9 22.4 22.8 23.2 22.4 22.3 22.6 Avg Slot Exit Temp [ C] 31.9 28.5 27.2 26.6 38.6 32.3 29.8 Airflow Temperature Rise (Exit-Inlet) [ C] 10.0 6.1 4.4 3.4 16.2 10.0 7.2 Table 11. Test Setup B, Tests 4b and 4f Module Airflow Temperature Measurements, Conductive Aluminum Chassis Sidewalls Aluminum Chassis Sidewall Single Energized Module - Center Slot Test 4b 51.6 Watts Single Energized Module - Center Slot Test 4f 93.6 Watts Chassis Airflow [CFM} 20 40 60 87 20 40 60 Airflow per Slot [CFM] 6.7 13.3 20.0 29.0 6.7 13.3 20.0 Inlet Ambient Air Temp [ C] 21.7 21.9 21.5 21.8 22.9 23.0 23.1 Avg Slot Exit Temp [ C] 29.5 27.0 25.4 24.8 35.2 32.1 29.9 Airflow Temperature Rise (Exit-Inlet) [ C] 7.8 5.1 3.9 3.1 12.3 9.1 6.8 Table 12. Airflow Temperature Rise Difference, Single Energized Module, per Comparison of Measurements Shown in Tables 10 and 11 Delta T inlet-exit (Plastic Chassis Sidewall Avg - Aluminum Chassis Sidewall Avg) [ C] Air Temperature Rise Difference % 2.2 1.0 0.5 0.3 3.9 0.9 0.4 22% 16% 11% 9% 24% 9% 6% 6
2.3 Conclusion Modules of all power levels benefit from the Hybrid Air/Conduction cooling approach, in which conduction allows thermal sharing among modules and with the chassis. This thermal sharing effect allows additional surface area to be exposed to the airflow through the chassis to more effectively dissipate the system s total thermal load. Though forced-air convection yields the dominant cooling effect in MicroTCA.2 systems, there is a significant secondary conduction cooling benefit associated with the Module Clamshell and Wedge Lock designs. By taking advantage of complementary conductive heat transfer through finned clamshelled Module surfaces and Aluminum Chassis Sidewalls, as well as heat sharing between adjacent Chassis slots, the MicroTCA.2 hybrid cooling solution effectively provides increased thermal margin over other MicroTCA modes in environments with higher ambient air temperature or decreased airflow. At a flow condition of 6.7 CFM per slot, a Single Module dissipating 51.6 watts of power recorded a 6.6 C reduction in component temperature a 33% component temperature benefit using the MicroTCA.2 hybrid cooling approach compared to the performance of a standard MicroTCA.0/MicroTCA.1 forced air-only solution (see Table 6). To optimize thermal design objectives, thermal engineers can exploit the increased thermal margin offered by the MicroTCA.2 hybrid cooling concept in several ways: Reserve the thermal benefit as a back-up (mini fail-safe) for use during a cooling malfunction, thus maintaining safe component temperatures prior to an unplanned loss or reduction in airflow Invest the thermal benefit towards the migration path of future system upgrades, allowing more powerful processors to be substituted without adding additional cooling overhead Reduce the amount of airflow through a MicroTCA.2 system to reduce energy consumption, minimize acoustic disturbance and increase fan reliability Extend the benefit to a natural convection application (no forced air), allowing natural convection cooling at higher ambient air temperatures For a dirty environment, use MicroTCA.2 in a sealed enclosure with Chassis internal airflow 7
3 TEST SETUP Testing was conducted using an airflow wind tunnel chamber designed for measuring fan performance and/or system impedance. The chamber size was 30 inches in diameter and approximately 8 feet long. The standard flow range was from 3 to 2000 cubic feet per minute (CFM). The chamber was equipped with a Blower hook-up at one end and a round pressure adapter plate with the Test Chassis installed at the other end. The middle of the chamber had a nozzle array plate containing different diameter nozzles to accommodate testing of various flow ranges. The pressure taps on both sides of the Nozzle Plate within the chamber monitored the differential and static pressures corresponding to the test flow. The control of the airflow was accomplished by means of a blast gate in conjunction with the blower speed controller to vary and fine tune the desired flow through the chamber. Details of tests performed, test configurations, test sequence and pre-test checkout are described below. See Appendix A for photos of the Test Setup and Appendix B for equipment used for testing. 3.1 Thermal Test Chassis with Backplane The two dimensionally identical thermal Test Chassis used in testing are described below, and shown in Figure 1. 3-slot thermal Test Chassis with thermally conductive Sidewalls and 3-slot Backplane. This Test Chassis is referred to as Aluminum Chassis in this report. 3-slot thermal Test Chassis with thermally non-conductive Sidewalls and 3-slot Backplane. This Test Chassis is referred to as Plastic Chassis in this report. Figure 1. 3-Slot Thermal Test Chassis with Integrated Chassis Slot Sidewalls Backplane The three-slot Backplane to support MicroTCA.0 physical requirements for three Single, Mid-Size AMCs, +12VDC payload and +3.3VDC management power, no fabric or IPMI support is shown in Appendix A, Figure A-20. 8
3.2 Test Configurations The following Module samples were used for testing Qty 4 (3 + 1 spare) MicroTCA.2 Single, Mid-Size High- Power Thermal Load Modules (HP-TLM) compliant with AMC.0 Revision 2 Qty 1 MicroTCA.2 AMC Characterization Module (MACM), consisting of a blank AMC air baffle module (Single, Mid-Size) inside a low-power MicroTCA.2 clamshell 3.2.1 Thermal Load Module (TLM) The Thermal Load Module (TLM) was designed using an Advanced Mezzanine Card (AMC) Single, Mid-Size Thermal Load Module inside of a MicroTCA.2 Clamshell, which incorporates cooling fins (see Figure 2). Figure 2. Notional View of HP-TLM, based on MicroTCA.2 High Power Module 3.2.2 MicroTCA.2 AMC Characterization Module (MACM) The MicroTCA.2 AMC Characterization Module (MACM) was used for maximum airflow and minimum impedance testing. These Modules had Side 1 and Side 2 Covers but no external fins and no components on the PCB other than the Hot Swap Switch and LED holder. The MACM is shown in Figures 3 through 5. 9
Figure 3. Notional View of MACM, based on MicroTCA.2 Low Power Module WEDGE LOCK NOT SHOWN FOR CLARITY Figure 4. Blank MACM MicroTCA.2 Module 10
WEDGE LOCK NOT SHOWN FOR CLARITY Figure 5. Blank MACM MicroTCA.2 Module, Side View 3.3 Environmental Testing Conditions All measurements were taken at room ambient conditions as monitored with calibrated instruments. Environmental test conditions and measurement tolerances were as follows: Environmental Conditions: Wind Tunnel Nozzle diameter of 6.0 inches Chassis airflow provided: 20 CFM; 40 CFM; 60 CFM; 87 CFM Ambient Pressure from 991.8 hpa to 1012.3 hpa % Relative Humidity from 32.5 % RH to 47.0 % RH Ambient Temperature from 21.8 C to 23.4 C Tolerances: Temperature: ±2.0 C Airflow: ±2.5% Thermocouple setup accuracy: +/- 1.5% Thermocouple repeatability: +/- 0.01% Thermocouple and temperature sensor location and placement are as shown in Figures 6 and 7. 11
Figure 6. Thermocouple Placement. One Thermocouple was placed inside the air duct to monitor input temperatures and nine Thermocouples were placed in the air outlet to monitor exit temperatures. Figure 7. Location of Temperature Sensors. Numbered squares show location of six built-in temperature sensors on HP-TLM Module. 12
3.4 Tests Performed A summary of the tests performed is provided in Table 13. Test Table 13. Summary of Tests Performed Description 1 Chassis Calibration - Balancing/measuring the airflow distribution of the Test Chassis 2 Velocity Measurements MACM Module 3 Velocity Measurements HP-TLM Module Airflow Resistance and System Impedance Measurement HP-TLM Module 4a Temperature Measurements HP-TLM (A) Test 4a Aluminum Chassis: all slots (A,B and C) populated with HP-TLM, each Module (slots A,B,C) dissipates 51.6 watts for total of 154 watts 4b Temperature Measurements HP-TLM (B) Test 4b Aluminum Chassis: all slots (A, B and C) populated with HP-TLM, only the middle module (slot B) dissipates 51.6 watts. Other two modules were installed, but power off. 4c Temperature Measurements HP-TLM (A) Test 4c Aluminum Chassis: all slots (A, B and C) populated with HP-TLM, each Module (slots A, B and C) dissipates 25.2 watts for total of 76.9 watts 4d Temperature Measurements HP-TLM (B) Test 4d Aluminum Chassis: all slots (A, B and C) populated with HP-TLM, only the middle module (slot B) dissipates 25.2 watts. Other two modules were installed, but power off. 4e Temperature Measurements HP-TLM (A) Test 4e Aluminum Chassis: all slots (A,B and C) populated with HP-TLM, each Module (slots A, B and C) dissipates max power of 88 watts for total of 265 watts. 4f Temperature Measurements HP-TLM (B) Test 4f Aluminum Chassis: all slots (A, B and C) populated with HP-TLM, only the middle module (slot B) dissipates 93.6 watts. Other two modules were installed, but power off. 5a Temperature Measurements HP-TLM (A) Test 5a Plastic Chassis: all slots (A,B and C) populated with HP-TLM, each Module (slots A,B and C) dissipates 51.6 watts for total of 154 watts. 5b Temperature Measurements- HP-TLM (B) Test 5b Plastic Chassis: all slots (A, B and C) populated with HP-TLM, only the middle module (slot B) dissipates 51.6 watts. Other two modules were installed, but power off. 5c 5d Not Used Not Used 5e Temperature Measurements HP-TLM (A) Test 5e Plastic Chassis: all slots (A,B and C) populated with HP-TLM, each Module (slots A, B and C) dissipates max power of 88 watts for total of 265 watts 5f Temperature Measurements HP-TLM (B) Test 5f Plastic Chassis: all slots (A, B and C) populated with HP-TLM, only the middle module (slot B) dissipates 93.6 watts. Other two modules were installed, but power off. 13
3.5 Test Sequence Flowchart Figure 8 shows the test sequence for the Module assemblies tested. This sequence of thermal testing was conducted to show compliance of the Modules to the thermal requirements stated within this document. Figure 8. MicroTCA.2 Module Test Flow 14
3.6 Pretest Checkout The thermal Test Chassis was mounted to a transition air duct connected to the wind tunnel pressure plate, as shown in Figure 9. Two pressure plate assemblies with different Chassis configurations were tested as standalone units with electrical connections to Power Supplies and the Test PC: Aluminum Chassis Pressure Plate Assembly Plastic Chassis Assembly Figure 9. 3-Slot Thermal Test Chassis Attached to Round Pressure Plate via Air Duct All necessary supporting equipment including power supplies, test PC, thermocouples and pressure transducer were attached as required. Model numbers, serial numbers and calibration date of all test equipment were recorded on the equipment list data sheet. Measurements were taken at room ambient condition as monitored with calibrated instruments. Functional checks were performed on Modules, and the Test PC was monitored for on-board HP-TLM temperature sensor hexadecimal value readings in accordance with Hybrid/Air Conduction Cooled MicroTCA.2 Thermal Test Procedure, Appendix C: TLM Setup and Software Control. See Appendix A for photos of Test Setup and equipment used for tests. Pretesting was performed under standard laboratory conditions, with ambient forced airflow across thermal Test Chassis in the direction as shown in Figure 9. A 1.60 inch diameter nozzle array plate was used for all tests with the flow rate ranging from 16.8 to 121 CFM and differential pressure drops across nozzles from 0.10 to 5.00 inches of water, respectively. Flow rates of 20, 30, 40, 60 and 87 CFM were selected for velocity measurements and 20, 40, 60 and 87 CFM were selected for all temperature measurements. 15
Measurements were conducted to determine time required to achieve temperature stabilization using lowest flow rate of 20 CFM. The result of the testing indicated that temperature measurements set to record at 10-second intervals for 15 minutes duration was sufficient for thermal stabilization. Stabilization is defined as when temperature gradient on readings does not vary by more than 2.0 degrees C per hour. In order to complete all required testing within the allocated schedule, it was decided that only the Middle HP-TLM sensor temperature readings would be taken during the test, and that the Top and Bottom HP-TLM modules sensor temperature readings would not be recorded. 16
4 TEST RESULTS 4.1 CCS Test 1 Chassis Calibration Measure flow rate at various air inlet openings on Aluminum Chassis. Measurement taken with a Velocity meter at different locations with Top Sidewall removed and all slots open. Velocity measurements were taken in this configuration Flow Rate (CFM) Side view of Chassis in the direction of airflow Velocity (ft/min) Row #1 #2 #3 #4 #5 #6 #7 #8 Min. Max. Average 20 A 530 480 570 560 590 590 580 570 480 590 559 B 510 510 560 550 590 570 580 570 510 590 555 C 495 520 540 530 570 550 570 540 495 570 539 40 A 960 960 1050 1030 1110 1060 1060 1080 960 1110 1039 B 950 960 1010 1010 1120 1090 1080 1080 950 1120 1038 C 980 950 1000 990 1080 1010 1030 1020 950 1080 1008 87 A 2240 2290 2570 2440 2750 2580 2570 2590 2240 2750 2504 B 2450 2440 2570 2390 2640 2600 2630 2550 2390 2640 2534 C 2510 2370 2500 2340 2630 2460 2570 2430 2340 2630 2476 17
4.2 MACM Test 2 Velocity Measurements Slots A and C were blocked, each with a taped HP-TLM. Air exit Sidewall openings for Slot A and C were blocked with tape. The middle slot B was open and populated with a MACM module. Velocity measurements were taken in this configuration Side view of Chassis in the direction of airflow Flow Rate (CFM) Velocity (ft/min) #1B #2B #3B #4B #5B #6B #7B #8B Min. Max. Average 20 1060 1170 1450 530 1520 1390 1490 1430 530 1520 1255 30 1570 1570 2210 910 2170 2010 2150 2110 910 2210 1838 40 1430 1620 2060 770 1980 1830 1950 1850 770 2060 1686 60 3470 3200 5500 3420 4750 4500 4728 4538 3200 5500 4263 87 4750 5390 7269 4300 6779 6375 6700 6600 4300 7269 6020 18
4.3 HP-TLM Test 3 4.3.1 Velocity Measurements HP-TLM Module Slots A and C were blocked, each with taped a HP-TLM. Air exit Sidewall openings for Slot A and C were blocked with tape. The middle slot B was open and populated with a HP-TLM module. Velocity measurements were taken in this configuration Flow Rate (CFM) Side view of Chassis in the direction of airflow Velocity (ft/min) #1B #2B #3B #4B #5B #6B #7B #8B Min. Max. Average 20 1180 980 1430 1290 1670 1530 1540 1590 980 1670 1401 30 1710 1450 2050 1890 2450 2270 2300 2300 1450 2450 2053 40 2210 1720 2710 2310 3240 3030 3060 3030 1720 3240 2664 60 3310 2480 4000 3730 5020 4830 4750 4840 2480 5020 4120 87 4700 3800 6530 6560 6980 6835 6680 6750 3800 6980 6104 19
4.3.2 Airflow Resistance and System Impedance HP-TLM Module The purpose of the system impedance test was to determine the pressure required to move the appropriate amount of volume flow through the system. For the impedance test, an air-flow test chamber blast gate was used to control different flow rates of air in Cubic Feet per Minute (CFM) that was forced through the Test Chassis, resulting in various pressure drops flow points. Table14 shows static pressure drop measurements associated with different CFM using Chassis with Aluminum Sidewalls. Data plot of System Impedance Curve for 3 slots and 1 slot is as shown in Figures 10 and 11. None of the populated HP-TLMs were powered on or monitored during testing. Table 14. Static Pressure Drop at varied CFM Chassis (Aluminum) Differential Pressure across nozzles (Inches of Water) Flow Rate (CFM) Static Pressure 1 (A, B and C Slots) (Inches of Water) Static Pressure 2 (B Slot) (Inches of Water) Notes: 0.1 16.8 0.05 0.19 0.2 24.0 0.08 0.35 0.3 29.5 0.11 0.51 0.4 34.1 0.14 0.68 0.5 38.2 0.17 0.82 0.6 41.9 0.20 0.96 0.7 45.3 0.23 1.13 0.8 48.4 0.26 1.27 0.9 51.4 0.28 1.44 1 54.2 0.31 1.57 1.1 56.9 0.35 1.73 1.2 59.5 0.38 1.89 1.3 61.9 0.40 2.04 1.4 64.3 0.43 2.17 1.5 66.5 0.45 2.30 1.6 68.7 0.49 2.44 1.7 70.9 0.52 2.56 1.8 72.9 0.54 2.75 1.9 75.0 0.57 2.83 2 76.9 0.59 2.97 2.1 78.8 0.63 3.08 2.2 80.7 0.66 3.20 2.3 82.5 0.68 3.34 2.4 84.3 0.72 3.47 2.5 86.0 0.74 3.60 2.6 87.8 0.77 3.71 1) Static pressure drop data from different flow rates were taken using all three slots populated with HP-TLM modules. 2) Static pressure drop data from different flow rates were taken using all three slots populated with HP-TLM modules; slot A and C were blocked modules and slot B was tested opened. 20
Figure 10. System Impedance Curve (three slots populated with HP-TLM modules) Figure 11. System Impedance Curve (single slot populated with HP-TLM module) 21
4.4 Test 4a, b, c, d, e and f Temperature and Flow Measurements with Aluminum Chassis Thermocouples Location for Aluminum Chassis Setup HP-TLM Modules Board Sensor Location and Airflow Direction 22
Test 4a (154 Watts) - All Modules PS 1 PS 2 Voltage Input (Volts) 12.0 3.3 Total Current (A) 12.7 0.35 Total Power Dissipation (Watts) 153.56 Flow Rate (CFM) 20 40 60 87 Static Pressure Readings ( inch of Water) 0.069 0.205 0.421 0.820 Average Temperature across slot ( C) (Note 1) 34.6 29.7 27.8 26.8 Average Inlet Air Temperature ( C) 22.5 22.6 22.8 23.1 Average Temperature Rise across slots ( C) 12.2 7.0 5.0 3.7 (Note 2) Sensor 1 Temperature ( C) 42.5 35.5 33.0 31.5 Sensor 2 Temperature ( C) 45.5 38.0 35.5 33.5 Sensor 3 Temperature ( C) 43.5 36.5 33.5 31.5 Sensor 4 Temperature ( C) 44.5 37.5 34.5 32.5 Sensor 5 Temperature ( C) 44.5 37.0 34.0 32.5 Sensor 6 Temperature ( C) 43.0 36.0 33.5 31.5 CFM Notes: Thermocouple Temperature ( C) A1 A2 A3 B1 B2 B3 C1 C2 C3 20 33.7 33.9 35.6 35.5 36.5 35.0 33.8 33.2 34.4 40 28.4 29.1 30.7 30.5 30.4 29.9 29.4 28.8 29.7 60 26.8 27.4 28.8 28.1 28.1 28.1 27.8 27.3 28.1 87 25.8 26.5 27.5 27.0 27.0 27.0 26.8 26.3 27.1 1. Average temperature across all slots is an average temperature value across Rows A1, A2, A3, B1, B2, B3 and C1, C2, C3. 2. Average temperature rise across slots is an average temperature value across Rows A1, A2, A3, B1, B2, B3 and C1, C2, C3. 23
Test 4b (51.6 Watts) - Single Module PS 1 PS 2 Voltage Input (Volts) 12.0 3.3 Total Current (A) 4.5 0.4 Total Power Dissipation (Watts) 55.32 Flow Rate (CFM) 20 40 60 87 Static Pressure Readings (Inch of Water) 0.071 0.200 0.420 0.820 Average Temperature across slot B ( C) (Note 1) 29.5 27.0 25.4 24.8 Average Inlet Air Temperature ( C) 21.7 21.9 21.5 21.8 Average Temperature Rise across slot B ( C) 7.8 5.1 3.9 3.1 (Note 2) Sensor 1 Temperature ( C) 34.5 33.5 31.0 29.5 Sensor 2 Temperature ( C) 37.0 35.5 33.5 32.0 Sensor 3 Temperature ( C) 34.5 33.5 31.5 30.0 Sensor 4 Temperature ( C) 36.0 35.0 32.5 31.0 Sensor 5 Temperature ( C) 35.0 34.5 32.0 30.5 Sensor 6 Temperature ( C) 33.5 33.0 31.0 29.5 CFM Thermocouple Temperature ( C) A1 A2 A3 B1 B2 B3 C1 C2 C3 20 25.2 26.2 27.6 29.9 30.4 28.3 25.7 25.3 26.0 40 23.9 24.6 26.1 27.0 27.5 26.4 24.5 24.0 24.6 60 22.8 23.6 24.7 25.5 25.7 25.2 23.7 23.2 23.7 87 22.5 23.4 24.2 24.9 24.9 24.6 23.4 23.1 23.6 Notes: 1. Average temperature across slots is an average temperature value across Rows B1, B2, B3 as Rows A and C were not dissipating in this case. 2. Average temperature rise across slots is an average temperature value across Rows B1, B2, B3 as Rows A and C were not dissipating in this case. 24
Test 4c (76.9 Watts) All Modules PS 1 PS 2 Voltage Input (Volts) 12.0 3.3 Total Current (A) 6.3 0.4 Total Power Dissipation (Watts) 76.92 Flow Rate (CFM) 20 40 60 87 Static Pressure Readings (Inch of Water) 0.069 0.202 0.430 0.785 Average Temperature across slots ( C) (Note 1) 29.2 27.0 30.4 28.5 Average Inlet Air Temperature ( C) 22.7 22.4 22.4 23.0 Average Temperature Rise across slots ( C) 6.5 4.0 3.0 2.3 (Note 2) Sensor 1 Temperature ( C) 31.5 28.5 27.5 27.0 Sensor 2 Temperature ( C) 38.5 35.0 33.5 32.5 Sensor 3 Temperature ( C) 31.5 29.0 28.0 27.5 Sensor 4 Temperature ( C) 33.5 31.0 29.5 29.0 Sensor 5 Temperature ( C) 35.5 32.0 31.0 30.0 Sensor 6 Temperature ( C) 36.5 33.0 31.5 30.5 CFM Thermocouple Temperature ( C) A1 A2 A3 B1 B2 B3 C1 C2 C3 20 27.6 28.7 30.6 28.7 29.8 30.2 28.5 28.6 30.1 40 25.4 26.6 28.5 26.5 27.0 27.9 26.6 26.6 28.0 60 24.8 26.1 27.7 25.8 26.1 27.0 26.0 26.1 27.1 87 24.7 25.8 27.0 25.5 25.8 26.6 25.8 25.7 26.8 Notes: 1. Average temperature across all slots is an average temperature value across Rows A1, A2, A3, B1, B2, B3 and C1, C2, C3. 2. Average temperature rise across all slots is an average temperature value across Rows A1, A2, A3, B1, B2, B3 and C1, C2, C3. 25
Test 4d (25.2 Watts) - Single Module PS 1 PS 2 Voltage Input (Volts) 12.0 3.3 Total Current (A) 2.3 0.35 Total Power Dissipation (Watts) 28.76 Flow Rate (CFM) 20 40 60 87 Static Pressure Readings (Inch of Water) 0.068 0.205 0.420 0.820 Average Temperature across slot B ( C) (Note 1) 25.9 25.0 25.0 23.7 Average Inlet Air Temperature ( C) 21.6 22.1 22.7 22.2 Average Temperature Rise across slot B ( C) (Note 2) 4.3 2.9 2.3 1.5 Sensor 1 Temperature ( C) 28.0 27.0 25.5 25.5 Sensor 2 Temperature ( C) 35.0 33.0 30.5 30.5 Sensor 3 Temperature ( C) 28.5 27.0 25.5 25.5 Sensor 4 Temperature ( C) 30.5 29.0 27.0 27.0 Sensor 5 Temperature ( C) 32.0 30.0 28.0 28.0 Sensor 6 Temperature ( C) 32.5 30.5 28.5 28.5 Thermocouple Temperature ( C) CFM A1 A2 A3 B1 B2 B3 C1 C2 C3 20 23.5 24.4 25.5 25.5 26.2 26.1 24.5 24.2 24.7 Notes: 40 23.0 23.9 25.1 24.6 25.0 25.3 24.1 23.8 24.3 60 23.1 24.1 25.1 24.6 24.9 25.4 24.4 24.0 24.5 87 22.6 23.5 24.3 23.7 23.3 23.9 23.8 24.0 24.5 1. Average temperature across slots is an average temperature value across Rows B1, B2, B3 as Rows A and C were not dissipating in this case. 2. Average temperature rise across slots is an average temperature value across Rows B1, B2, B3 as Rows A and C were not dissipating in this case. 26
Test 4e (265 Watts) - All Modules PS 1 PS 2 Voltage Input (Volts) 12.0 3.3 Total Current (A) 22.0 0.35 Total Power Dissipation (Watts) 265.16 Flow Rate (CFM) 20 40 60 87 Static Pressure Readings (Inch of Water) 0.071 0.210 0.430 0.785 Average Temperature across slots ( C) (Note 1) 42.3 33.7 30.4 28.5 Average Inlet Air Temperature ( C) 22.6 22.4 22.4 23.0 Average Temperature Rise across slots ( C) (Note 2) 19.7 11.3 8.0 5.5 Sensor 1 Temperature ( C) 53.5 Sensor 2 Temperature ( C) 56.5 Sensor 3 Temperature ( C) 57.0 Sensor 4 Temperature ( C) 58.0 Sensor 5 Temperature ( C) 60.0 Sensor 6 Temperature ( C) 60.0 Note 3 CFM Thermocouple Temperature ( C) A1 A2 A3 B1 B2 B3 C1 C2 C3 20 41.2 40.9 44.7 42.8 45.4 43.6 40.3 39.8 42.4 40 31.7 32.7 36.0 34.3 34.5 35.1 32.8 32.2 34.3 60 28.7 29.3 32.3 30.9 30.8 31.4 29.7 29.2 30.9 87 27.4 28.1 29.0 28.9 29.0 28.7 28.4 27.8 28.9 Notes: 1. Average temperature across all slots is an average temperature value across Rows A1, A2, A3, B1, B2, B3 and C1, C2, C3 2. Average temperature rise across all slots is an average temperature value across Rows A1, A2, A3, B1, B2, B3 and C1, C2, C3 3. Module sensor temperature readings were not recorded due to software issue. 27
Test 4f (93.6 Watts) - Single Module PS 1 PS 2 Voltage Input (Volts) 12.0 3.3 Total Current (A) 7.7 0.35 Total Power Dissipation (Watts) 93.56 Flow Rate (CFM) 20 40 60 87 Static Pressure Readings (Inch of Water) 0.070 0.198 0.410 0.820 Average Temperature across slot B ( C) (Note1) 35.2 32.1 29.9 29.5 Inlet Air Temperature ( C) (Note 4) 22.9 23.0 23.1 22.9 Average Temperature Rise across slot B ( C) (Note 2) 12.3 9.1 6.8 6.6 Sensor 1 Temperature ( C) 46.0 41.0 34.0 Sensor 2 Temperature ( C) 52.5 46.5 38.5 Sensor 3 Temperature ( C) 49.0 44.0 36.0 Note 3 Sensor 4 Temperature ( C) 51.0 45.0 37.0 Sensor 5 Temperature ( C) 53.0 47.0 38.5 Sensor 6 Temperature ( C) 51.5 46.0 38.5 CFM Thermocouple Temperature ( C) A1 A2 A3 B1 B2 B3 C1 C2 C3 20 28.8 29.5 31.8 35.1 37.3 33.2 28.4 28.0 28.8 40 26.8 27.5 29.5 31.8 32.8 31.6 26.9 26.4 27.3 60 26.8 28.6 30.0 30.4 29.3 26.2 25.7 26.5 26.8 87 26.0 26.8 27.9 29.5 29.7 29.4 26.4 26.0 26.7 Notes: 1. Average temperature across slots is an average temperature value across Rows B1, B2, B3 as Rows A and C were not dissipating in this case. 2. Average temperature rise across slots is an average temperature value across Rows B1, B2, B3 as Rows A and C were not dissipating in this case. 3. Module sensor temperature readings were not recorded due to software issues. 4. Inlet air Thermocouple was wired incorrectly; ambient temperature was used for inlet air temperature on above calculation. 28
4.5 Test 5a, b, e and f Temperature and Flow Measurements with Plastic Chassis Thermocouples Location for Plastic Chassis Setup HP-TLM Modules Board Sensor Location and Airflow Direction 29
Test 5a (154 Watts) - All Modules PS 1 PS 2 Voltage Input (Volts) 12.0 3.3 Total Current (A) 12.7 0.4 Total Power Dissipation (Watts) 153.72 Flow Rate (CFM) 20 40 60 87 Static Pressure Readings (Inch of Water) 0.068 0.198 0.410 0.783 Average Temperature across slots ( C) (Note1) 34.9 30.1 28.4 26.7 Average Inlet Air Temperature ( C) 22.3 22.8 23.2 22.8 Average Temperature Rise across slots ( C) (Note 2) 12.6 7.3 5.2 3.9 Sensor 1 Temperature ( C) 44.0 37.0 34.0 31.5 Sensor 2 Temperature ( C) 47.0 39.0 36.0 33.5 Sensor 3 Temperature ( C) 45.5 37.5 35.5 32.0 Sensor 4 Temperature ( C) 46.0 38.5 35.5 32.5 Sensor 5 Temperature ( C) 45.5 38.0 35.0 32.5 Sensor 6 Temperature ( C) 44.5 37.5 34.5 32.0 CFM Thermocouple Temperature ( C) A1 A2 A3 B1 B2 B3 C1 C2 C3 20 33.9 35.3 34.3 35.5 37.1 35.8 34.3 33.1 35.0 40 28.8 29.8 30.1 30.7 30.9 30.6 30.1 29.2 30.5 60 27.3 28.1 28.7 29.0 28.8 28.5 28.8 27.9 28.9 87 25.6 26.5 27.5 26.8 27.0 26.6 27.1 26.3 27.2 Notes: 1. Average temperature across slots is an average temperature value across Rows A1, A2, A3, B1, B2, B3 and C1, C2, C3. 2. Average temperature rise across slots is an average temperature value across Rows A1, A2, A3, B1, B2, B3 and C1, C2, C3. 30
Test 5b (51.6 Watts) - Single Module PS 1 PS 2 Voltage Input (Volts) 12.0 3.3 Total Current (A) 4.5 0.35 Total Power Dissipation (Watts) 55.16 Flow Rate (CFM) 20 40 60 87 Static Pressure Readings (inch of Water) 0.065 0.196 0.401 0.791 Average Temperature across slot B ( C) (Note 1) 31.9 28.5 27.2 26.6 Average Inlet Air Temperature ( C) 21.9 22.4 22.8 23.2 Average Temperature Rise across slot B ( C) (Note 2) 10.0 6.1 4.4 3.4 Sensor 1 Temperature ( C) 41.0 35.5 33.5 32.0 Sensor 2 Temperature ( C) 43.5 37.5 35.5 34.0 Sensor 3 Temperature ( C) 41.5 36.0 33.5 32.0 Sensor 4 Temperature ( C) 43.0 37.0 34.5 32.5 Sensor 5 Temperature ( C) 42.0 36.5 34.0 32.5 Sensor 6 Temperature ( C) 40.5 35.5 33.5 32.0 CFM Thermocouples Temperature ( C) A1 A2 A3 B1 B2 B3 C1 C2 C3 20 24.8 25.6 26.6 32.1 32.9 30.7 25.1 24.7 25.4 40 23.9 24.5 25.4 28.7 28.9 28.0 24.5 24.1 24.7 60 23.8 24.4 25.1 27.3 27.6 26.7 24.6 24.1 24.7 87 23.9 24.6 25.2 26.7 27.0 26.1 24.9 24.4 25.0 Notes: 1. Average temperature across slot B is an average temperature value across Rows B1, B2, B3 as Rows A and C were not dissipating in this case. 2. Average temperature rise across slot B is an average temperature value across Rows B1, B2, B3 as Rows A and C were not dissipating in this case. 31
Test 5e (265 Watts) - All Modules PS 1 PS 2 Voltage Input (Volts) 12.0 3.3 Total Current (A) 21.7 0.4 Total Power Dissipation (Watts) 261.72 Flow Rate (CFM) 20 40 60 87 Static Pressure Readings ( Inch of Water) 0.068 0.202 0.405 0.782 Average Temperature across slot ( C) (Note 1) 42.7 33.8 30.7 29.1 Average Inlet Air Temperature ( C) 22.2 22.4 22.7 22.9 Average Temperature Rise across all slots ( C) (Note 2) 20.5 11.5 8.1 6.1 Sensor 1 Temperature ( C) 56.5 43.0 38.5 35.5 Sensor 2 Temperature ( C) 62.0 48.5 43.5 40.0 Sensor 3 Temperature ( C) 60.0 46.5 41.5 38.0 Sensor 4 Temperature ( C) 61.0 47.5 42.0 38.5 Sensor 5 Temperature ( C) 63.0 49.5 43.5 40.0 Sensor 6 Temperature ( C) 63.5 49.5 44.0 40.0 CFM Thermocouple Temperature ( C) A1 A2 A3 B1 B2 B3 C1 C2 C3 20 41.1 42.1 42.2 42.9 46.5 45.3 40.9 39.3 43.6 40 32.0 33.2 33.9 34.3 35.2 35.7 33.3 32.0 35.1 60 29.1 29.9 31.0 31.3 31.6 31.5 30.6 29.6 31.9 87 27.5 28.3 30.1 29.4 29.7 29.4 29.0 28.0 30.0 Notes: 1. Average temperature across slots is an average temperature value across Rows A1, A2, A3, B1, B2, B3 and C1, C2, C3. 2. Average temperature rise across slots is an average temperature value across Rows A1, A2, A3, B1, B2, B3 and C1, C2, C3. 32
Test 5f (93.6 Watts) - Single Module PS 1 PS 2 Voltage Input (Volts) 12.0 3.3 Total Current (A) 7.7 0.35 Total Power Dissipation (Watts) 93.56 Flow Rate (CFM) 20 40 60 87 Static Pressure Readings ( Inch of Water) 0.065 0.196 0.400 0.807 Average Temperature across slot B ( C) 38.6 32.3 29.8 28.3 Average Inlet Air Temperature ( C) 22.4 22.3 22.6 22.9 Average Temperature Rise across slot B ( C) (Note 2) 16.2 10.0 7.2 5.4 Sensor 1 Temperature ( C) 52.0 41.5 38.0 35.5 Sensor 2 Temperature ( C) 58.0 47.5 43.0 39.5 Sensor 3 Temperature ( C) 55.0 45.0 41.0 37.5 Sensor 4 Temperature ( C) 56.0 46.0 41.5 38.5 Sensor 5 Temperature ( C) 58.0 48.0 43.0 40.5 Sensor 6 Temperature ( C) 58.0 47.5 43.0 40.5 CFM Thermocouple Temperature ( C) A1 A2 A3 B1 B2 B3 C1 C2 C3 20 27.3 28.0 29.7 38.4 40.4 37.2 26.6 26.3 27.2 40 24.8 25.1 26.4 32.0 32.9 31.9 24.8 24.4 25.1 60 24.2 24.7 25.7 29.9 30.4 29.1 24.7 24.2 24.8 87 23.9 24.5 25.4 28.1 28.9 28.1 24.8 24.3 24.9 Notes: 1. Average temperature across slot B is an average temperature value across Rows B1, B2, B3 as Rows A and C were not dissipating in this case. 2. Average temperature rise across slot B is an average temperature value across Rows B1, B2, B3 as Rows A and C were not dissipating in this case. 33
APPENDIX A Test Setup and Supporting Drawings A-1
A.1 Test Setups Figure A1. 2000 CFM Airflow Testing Chamber Figure A2. Airflow Nozzle Plate A-2
Figure A3. Blower Assembly Attached to Wind Tunnel Figure A4. Static Pressure Taps between Nozzle Array Plate A-3
Figure A5. Blast Gate with Controller Figure A6. Room Ambient Condition Monitor A-4
Figure A7. Setra Datum 2000 Pressure Meter Figure A8. Power Supplies and Test Laptop PC A-5
Figure A9. ATM2400 and Thermocouple Setup A-6
A.2 Test Modules Figure A10. HP-TLM Test Module Topside Figure A11. HP-TLM Test Module Bottom Side A-7
WEDGE LOCK NOT SHOWN FOR CLARITY Figure A12. Blank MACM MicroTCA.2 Test Module WEDGE LOCK NOT SHOWN FOR CLARITY Figure A13. Blank MACM MicroTCA.2 Test Module, Side View A-8
A.3 Supporting Drawings A.3.1 Test Chassis Figure A14. Test Chassis Top Cover A-9
Figure A15. Test Chassis Front Cover A-10
Figure A16. Test Chassis, Exhaust Bracket A-11
Figure A17. Test Chassis, Sensor Bracket A-12
Figure A18. Test Chassis Sidewall, Right A-13
Figure A19. Test Chassis Sidewall, Left A-14
Figure A20. 3-Slot Test Chassis Backplane A-15
Figure A21. Wind Tunnel Mounting Plate A-16
Figure A22. Upper Side Bracket Mount A-17
Figure A23. Lower Side Bracket Mount A-18
A.3.2 Test Modules Figure A23. Single Mid-size Top Cover (MACM) A-19
Figure A24. Single Mid-size Top Cover (HP-TLM) A-20
Figure A25. Single Rear Cover (same for MACM and HP-TLM) A-21
Figure A26. Hybrid Wedge Lock for Test Modules A-22
APPENDIX B Equipment List B-1
Table B1. Equipment List Description Part Number Manufacturer Serial Number Calibration Due Qty +12 VDC Power Supply DCS33-33E Sorensen BAE LY03981300 Not Required 1 +3.3 VDC Power Supply BAE LY18906 1 Fluke DC/AC Meter 337 Fluke 1 Dell Notebook D520 Dell Computer 1 Setra Datum 2000 Pressure Meter 2641OR5WD2DT1F 3852061 2/25/2012 2 Flow Test Chamber 2000CFM Degree Control 2718 N/A 1 Monitor Meter Display PTU200 VA/SALA Z1810001 10/7/2012 1 Accusense ATM2400 Degree Control 1 Air Velocity Meter Model 8330 TSI Incorporated 01020042 N/A 1 Thermocouples UTS1000 AccuSense Degree Control N/A 10 B-2