InMate Design Guide Socket Mount, Up to 100 A Using Vicor s Maxi, Mini, Micro Series Modules
Contents Part Numbers and Guide to InMate Selection 1 PCB Layout Drawings Full Brick (Maxi 2 Half Brick (Mini 4 Quarter Brick (Micro 6 InMate Outline Drawings Full Brick (Maxi 3 Half Brick (Mini 5 Quarter Brick (Micro 7 Product Specifications and Materials 8 The InMate Socket System InMates are an innovative solution for thru hole socket requirements. Consisting of individual plastic carriers for the input and the output, each contains an array of sockets for either a full, half or quarter brick sized module. The sockets are factory loaded into the carrier, which holds them rigidly in place throughout the assembly and soldering process. The carriers are later removed, leaving the sockets accurately positioned. Insert Solder Standoffs & Exchange Tools 9 Remove Carrier Designed for use with pin compatible Maxi, Mini, Micro Series Vicor bricks, InMates are available for a wide range of PCB sizes and mounting styles. PCB thicknesses can range from 0.055" to 0.1375". Sockets also allow for mounting modules either inboard, with a cutout in the PCB for the module to minimize the height above the board, or onboard. InMates are part of the ModuMate interconnect family and, as such, are rated for up to 100 Amps. InMates are available in standard recyclable JEDEC style trays for use with automated pick and place equipment and are compatible with most standard wave or hand solder operations. The sockets are soldered into the board as part of the PCB assembly process. The module can then be plugged into place at anytime later. Vicor s comprehensive line of power solutions includes modular high density DC-DC converters and accessory components, configurable power supplies and custom power supplies. InMates require the use of modules with the ModuMate pin option and are not designed for use with standard tin-lead pins. v i c o r p o w e r. c o m
Part Numbers and Guide to InMate Selection ➀ Select board thickness. Nominal, 0.094 or. ➁ Select mounting style. Inboard requires a PCB cutout for the belly of the module. See dotted lines on PCB drawings page for cut out area. ➂ Identify module type. Full brick (maxi, half brick (mini or quarter brick (micro. ➃ Select the ordering part number. Order packages of 5 input/output sets or in higher quantities order input and output InMates separately. For individual input or output InMates, minimum orders of 35 for maxi or mini and 40 for micro apply. ➄ Verify correct pin style for the module. For predefined parts, S or F = short ModuMate and N or G = long ModuMate ➅ See page 9 for standoff recommendations. ➀ ➁ ➂ ➃ ➄ Full Brick (Maxi Half Brick (Mini Quarter Brick (Micro Board Mounting Pin Input Output 5 Sets Input Output 5 Sets Input Output 5 Sets Thickness Style Style Nominal " Inboard 18374 18382 18362 18374 18384 18366 18376 18386 18370 S or F Min/Max 0.055"/0.071" Onboard 18378 18388 18364 18378 18390 18368 18380 18392 18372 Nor G Nominal 0.094" Inboard 18375 18383 18363 18375 18385 18367 18377 18387 18371 S or F Min/Max 0.084"/0.104" Onboard 18379 18389 18365 18379 18391 18369 18381 18393 18373 Nor G Nominal " Min/Max 0.1125"/0.1375" Onboard 21539 21543 21510 21539 21544 21511 21540 21545 21512 Nor G v i c o r p o w e r. c o m 1
PCB Layout - Full Brick (Maxi Inboard and Onboard 4 1.790 45,47 3 2.000 0.195 4,96 2 1 0.06 1,5 0.064±0.003 1,63±0,08 (#52 DRILL 0.300 4X Ø UNPLATED 7,62 4X R SOCKET 0.542 13,77 0.525 13,33 (" PCB (0.094," PCB EXCHANGE TOOL MOUNTING STANDOFFS 0.470 11,94 ( 4.200 106,68 6X Ø 0.130±0.003 3,3 ± 0,08 INBOARD MOUNT CUT-OUT AREA 1.800 45,72 3.600 91,44 3.844 97,64 4.200 106,68 CIRCUIT BOARD 5 6 7 8 9 0.283±0.003 2X Ø 7,19±0,08 SOLDER PAD Ø0.323/Ø8.20 7X Ø 0.200±0.003 5,08±0,08 SOLDER PAD Ø0.240/Ø6.10 0.700 17,78 1.000 25,4 1.400 35,56 2X 2X 0.300 7,62 0.116 2,95 0.070 1,78 0.033 0,84 ONBOARD MOUNT INBOARD BOARD MOUNT MOUNT COMPONENT SIDE SHOWN PC BOARD LAYOUT TABLE I PIN INFORMATION NO. SYMBOL FUNCTION PIN DIA. 1 23 4 56 7 89 + PC PR S SC +S+ + I N PRIM CONTROL PARALLEL I N OUT SENSE SEC CONTROL + SENSE + OUT 0.180 / 4,57 0.180 / 4,57 Ø 0.283 REF 7,19 NOTES: 1. ALL DIMENSIONS ARE Ø 0.323 REF 8,2 SOLDER PAD INCH METRIC OR INCH / METRIC 2. ANS/IPC-D-300 SPECIFICATIONS APPLY FOR CLASS "B" BOARDS 3 2 1 0.09 2,3 0.80±0.03 20,3±0,8 0.38 9,7 LOCATING PINS 3 2 1 4 5 6 7 8 9 4X TYPICAL TOOL CLEARANCE 1.07/27,2 MINIMAL TOOL CLEARANCE 0.77/19,5 2.00 0.49 12,4 EXCHANGE TOOL HOOK AREA, 4 PLCS (BOTH ENDS, SEE VIEW EXCHANGE TOOL BASEPLATE PCB 1.25 31,8 15 2 v i c o r p o w e r. c o m
InMate and Socket Assembly Outlines Full Brick (Maxi Part Marking 9=Full Size 8=Half Brick 7=Quarter Brick L=Long (Onboard S=Short (Inboard 2.00 2.00 -B- "X" -A- "X" -A- MAX 0.80 20,3 0.25 6,4 0.1795±0.0010 4,56±0,025 0.007[0,18] A B C MAX 0.25 6,4 0.80 20,3 LARGE SOCKETS 0.2625±0.0010/6,668±0,025 SMALL SOCKETS 0.1795±0.0010/4,559±0,025 0.007[0,18] A B C 0.30 7,6 0.30 7,6 -C- -C- -B- MOUNTING STYLE MATERIALS: INMATES: PPS Ryton TM R-7 SOCKETS: BE-CU #25, Au PLATED. DIMENSIONS ARE IN INCH OR INCH / METRIC MM 1.000 25,4 DIM "X" INCH/MM 1.400 35,56 DIM INCH/MM 0.059±0.001 1,50±0,03 0.003[0,08] A B C INBOARD 0.136/3,45 0.033/0,84 ONBOARD 0.173/4,39 0.070/1,78 UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE INCHES TOLERANCES ARE: 0.700 17,78 1.000 25,4 FRACTIONS DECIMALS ANGLES ±1/64.XX = ±.01 ±1.XXX = ±.005 1.400 35,56 0.059±0.001 1,50±0,03 0.003[0,08] A B C ( MAX 0.1795 ( 4,559 SOCKET DETAIL (DIM B (DIM A 0.062 1,57 ( 0.195 4,95 ( MAX 0.2625 6,668 (DIM B (DIM A 0.162 4,11 0.274 6,96 ( ( ( Mounting Board Thk DIM A DIM B Inboard /1,60 0.133/3,79 0.100/2,54 Onboard /1,60 0.170/4,32 0.100/2,54 Inboard 0.094/2,39 0.168/4,27 0.135/3,43 Onboard 0.094/2,39 0.205/5,21 0.135/3,43 Onboard / 0.230/5,84 0.160/4,06 0.080" SOCKET 0.180" SOCKET v i c o r p o w e r. c o m 3
PCB Layout - Half Brick (Mini Inboard and Onboard ( 4X 0.130 ± 0.003 3,30 ± 0,08 IN-BOARD MOUNT CUT-OUT INBOARD AREA MOUNT CUT-OUT AREA 1.790 45,47 2.000 0.300 7,62 0.195 4,96 4 3 2 1 4X R 4X Ø 0.060 1,5 0.064±0.003 1,63±0,08 (#52 DRILL 1.300 33,02 1.575 40,01 UNPLATED SOCKET CIRCUIT BOARD 0.542 13,77 0.525 13,33 (" PCB (0.094," PCB EXCHANGE TOOL MOUNTING STANDOFFS 0.470 11.94 5 6 7 8 9 0.283±0.003 2X Ø 7,19±0,08 SOLDER PAD Ø.323/Ø8.20 0.700 17,78 2X 2X 0.300 7,62 0.105 2,67 7X Ø 0.200±0.003 5,08±0,08 SOLDER PAD Ø0.240/Ø6.10 1.000 25,4 1.400 35,56 COMPONENT SIDE SHOWN ONBOARD MOUNT INBOARD MOUNT PC BOARD LAYOUT.283 7,19.323 8,2 SOLDER PAD Ø REF Ø REF 3 2 1 0.09 2,3 0.38 9,7 TABLE I Mini FARM FIAM 0.80±0.03 20,3±0,8 PIN SYMBOL FUNCTION SYMBOL FUNCTION SYMBOL FUNCTION PIN DIA. NO. (inches / mm 1 + +IN N Neutral + +IN 2 PC Prim. Control EMI GRD EMI N/C No Connection 3 PR Parallel NC No Connection EMI/GRD Ground 4 IN L Line IN 5 OUT Out OUT 0.150 / 3,81 6 S Sense EN Enable ON/OFF ON/OFF 7 SC Sec. Control ST Strap N/C No Connection 8 +S +Sense BOK BUS OK N/C No Connection 9 + +Out + + OUT + +Out 0.150 / 3,81 NOTES: 1. ALL DIMENSIONS ARE INCH METRIC OR INCH / METRIC 2. ANS/IPC-D-300 SPECIFICATIONS APPLY FOR CLASS "B" BOARDS LOCATING PINS 4 3 2 1 6 7 8 9 5 4X TYPICAL TOOL CLEARANCE 1.07/27,2 MINIMAL TOOL CLEARANCE 0.77/19,5 2.00 0.49 12,4 EXCHANGE TOOL HOOK AREA, 4 PLCS (BOTH ENDS, SEE VIEW EXCHANGE TOOL BASEPLATE PCB 1.25 31,8 15 4 v i c o r p o w e r. c o m
InMate and Socket Assembly Outlines Half Brick (Mini Part Marking 9=Full Size 8=Half Brick 7=Quarter Brick L=Long (On-Board (Onboard S=Short (In-Board (Inboard 2.00 2.00 -B- "X" "X" -A- MAX 0.80 20,3 0.25 6,4 0.1795±0.0010 4,56±0,025 0.007[0,18] A B C 0.30 7,6 -B- -A- 0.25 6,4 0.80 20,3 LARGE SOCKETS 0.2625±0.0010/6,668±0,025 SMALL SOCKETS 0.1795±0.0010/4,559±0,025 0.007[0,18] A B C 0.30 7,6 -C- -C- MOUNTING STYLE INBOARD ONBOARD 1.000 25,4 MATERIALS: INMATES: PPS Ryton TM TM R-7 SOCKETS: SOCKETS: BE-CU BE-CU #25, Au #25, PLATED. Au PLATED. DIMENSIONS ARE IN INCH OR INCH / METRIC MM DIM "X" INCH/MM 1.400 35,56 DIM INCH/MM 0.136/3,45 0.033/0,84 0.173/4,39 0.070/1,78 0.059±0.001 1,50±0,03 0.003[0,08] A BC 0.700 17,78 1.000 25,4 UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE INCHES TOLERANCES ARE: FRACTIONS DECIMALS ANGLES ±1/64.XX = ±.01 ±1.XXX = ±.005 1.400 35,56 0.059±0.001 1,50±0,03 0.003[0,08] A B C ( MAX ( 0.1795 4,559 SOCKET DETAIL (DIM B (DIM A 0.062 1,57 ( 0.195 4,95 ( MAX. ( 0.2625 6,668 (DIM B (DIM A 0.132 3,35 ( 0.274 6,96 Mounting Board Thk DIM A DIM B Inboard /1,60 0.133/3,79 0.100/2,54 Onboard /1,60 0.170/4,32 0.100/2,54 Inboard 0.094/2,39 0.168/4,27 0.135/3,43 Onboard 0.094/2,39 0.205/5,21 0.135/3,43 Onboard / 0.230/5,84 0.160/4,06 0.080" SOCKET 0.150" SOCKET In-Board On-Board In-Board On-Board On-Board v i c o r p o w e r. c o m 5
PCB Layout - Quarter Brick (Micro Inboard and Onboard 1.270 32,26 1.090 27,69 0.145 3,68 0.542 13,77 (.063" PCB 0.525 13,34 0.275 6,99 0.525 13,33 (0.094,.125" PCB 4X 0.130 ± 0.003 3,30 ± 0,08 0.235 5,97 4X Ø 0.064±0.003 1,63±0,08 (#52 DRILL UNPLATED EXCHANGE TOOL 0.470 11,94 LOCATING PINS 4 3 2 1 INBOARD MOUNT CUT-OUT AREA SOCKET MOUNTING STANDOFFS 4 3 2 1 2.000 1.300 33,02 5 6 7 PCB 1.734 44,04 (2.000 CIRCUIT BOARD 5 6 7 0.200 Ø REF 5,08 Ø 0.240 REF 6,1 SOLDER PAD.350 8,89 0.800 20,32 1.300 33,02 COMPONENT SIDE SHOWN PC BOARD LAYOUT 2X 2X 1,6 0.133 3,38 7X Ø 0.200±0.003 5,08±0,08 SOLDER PAD Ø0.240/Ø6,10 0.070 1,78 ONBOARD MOUNT 3 2 1 0.09 2,3 0.033 0,84 INBOARD MOUNT 0.38 9,7 1.32 33,5 0.37 9,4 EXCHANGE TOOL HOOK AREA, 4 PLCS (BOTH ENDS, SEE VIEW 4X BASEPLATE TYPICAL TOOL CLEARANCE 1.07/27,2 MINIMAL TOOL CLEARANCE 0.77/19,5 PCB TABLE I Micro VI-ARM FiltMod IAM 48 0.80±0.03 20,3±0,8 0.59 14,99 15 PIN SYMBOL FUNCTION SYMBOL FUNCTION SYMBOL FUNCTION SYMBOL FUNCTION PIN DIA. NO. (inches / mm 1 + +IN -Out + +IN -Out 2 PC Prim. Control EN Enable N/C No Connection N/C No Connection 3 PR Parallel B OK -Bus OK N/C No Connection ON/OFF ON/OFF 4 IN + +Out -IN + +OUT 5 OUT N Neutral -OUT + +IN 6 SC Sec. Control ST Strap GRD Ground N/C No Connection 7 + +OUT L Line + +OUT IN NOTES: 1. ALL DIMENSIONS ARE INCH METRIC OR INCH / METRIC 2. ANS/IPC-D-300 SPECIFICATIONS APPLY FOR CLASS "B" BOARDS 6 v i c o r p o w e r. c o m
InMate and Socket Assembly Outlines Quarter Brick (Micro Part Marking 9=Full Size 8=Half Brick 7=Quarter Brick L=Long (Onboard S=Short (Inboard "X" 1.40 35,6 -B- -A- "X" 1.40 35,6 MAX 0.275 6,99 0.25 6,4 1.300 33,02 0.525 13,34 0.72 18,2 0.800 20,32 0.1795±0.0010 4,56±0,025 0.059±0.001 1,50±0,03 0.007[0,18] A BC 0.30 7,6 -B- -A- 0.003[0,08] AB C MAX 0.25 6,4 1.300 33,02 0.72 18,2 0.800 20,32 0.1795±0.0010 4,56±0.025 0.007[0.18] A BC 0.30 7,6 0.059±0.001 1,50±0,03 -C- -C- 0.003[0.08] A BC MOUNTING STYLE INBOARD ONBOARD MATERIALS: INMATES: PPS Ryton TM R-7 SOCKETS: BE-CU #25, Au PLATED. DIMENSIONS ARE IN INCH OR INCH / METRIC MM DIM "X" INCH/MM DIM INCH/MM 0.136/3,45 0.033/0,84 0.173/4,39 0.070/1,78 ( MAX (DIM A UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE INCHES TOLERANCES ARE: FRACTIONS DECIMALS ANGLES ±1/64.XX = ±.01 ±1.XXX = ±.005 SOCKET DETAIL (DIM B ( 0.1795 4,559 0.062 1,57 ( 0.195 4,95 Mounting Board Thk DIM A DIM B Inboard /1,60 0.133/3,79 0.100/2,54 Onboard /1,60 0.170/4,32 0.100/2,54 Inboard 0.094/2,39 0.168/4,27 0.135/3,43 Onboard 0.094/2,39 0.205/5,21 0.135/3,43 Onboard / 0.230/5,84 0.160/4,06 0.080" SOCKET v i c o r p o w e r. c o m 7
Specifications and Materials Parameter Specification Value Reference Compatibility S = short Au plated Short ModuMate pins Module pin styles See P/N selection (pg1 N = long Au plated Long ModuMate pins Mechanical Contact normal force Number of mating cycles 100 grams EOL min GR-1217-CORE, R5-23 5 min Exception to GR-1217-CORE which specifies 25 mating cycle Module engagement force 32 lbs per connector max GR-1217-CORE, R5-31,32 Module disengagement force 32 lbs per connector max GR-1217-CORE, R5-31,32 Electrical Current rating Low level contact resistance 0.080" dia socket (LLCR Low level contact resistance 0.150" dia socket (LLCR Low level contact resistance 0.180" dia sockets (LLCR Thermal Max socket temperature Temperature rise Environmental Shock and vibration 100 Amps - Maxi 50 Amps - Mini Gold plating standards, and 25 Amps - Micro accepted industry standards (Based on 120 C max socket such as IICIT, EIA, Bellcore guidelines temperature & 30 C max temperature rise of contact 400 µ Ohms max GR-1217-CORE, 6.2.1 300 µ Ohms max GR-1217-CORE, 6.2.1 200 µ Ohms max GR-1217-CORE, 6.2.1 120 C max 30 C max EIA-364-70A (2 Max continuous use temperature for gold plating GR-1217-CORE (1 InMate products are tested in random vibration environments to best simulate the broad spectrum of frequencies and amplitudes that may be encountered in typical applications. Actual system resonant frequencies will depend on PCB construction and mounting details. For critical, or unusual, shock and vibration environments, the performance of the system should be independently verified. Material Properties of InMate Components Headers Material: Ryton TM R 7 PPS, 65% glass fiber and mineral filled compound Flammability Thermal stability (short term Thermal stability (long term Solder Cap Material Plating Sockets Material Poly-Phenylene Sulfide UL94 V-0/5VA 260 C (500 F 200 C (392 F 305 stainless steel Clear passivate to repel solder Brush Wellman Alloy #25 C17200 deep draw quality or equiv. thick Plating Woods nickel strike followed by 50 µ in min low stress sulfamate-based electrolytic nickel, followed by 20 µ in min hard goldfollowed by 10µin min soft gold (1 GR-1217-CORE issue 1, November 1995 Generic Requirements for Separable Electrical Connectors Used in Telecommunications Hardware. A module of NEBSFR, FR-2063 (2 ANSI/EIA-364 American National Standards Institute/ Electronic Industries Association (Electronic Components, Assemblies & Materials Association 8 v i c o r p o w e r. c o m
InBoard Standoff Recommendations (Slotted Baseplate Modules Only OnBoard All board sizes " or high mount 0.094" and " 0.094" and " PCB 0.348" Standoff Ordering Part Number, Bags of 100 19129 F-F 19130 M-F* 0.420" Standoff Ordering Part Number, Bags of 100 19134 F-F 19135 M-F* 0.403" Standoff Ordering Part Number, Bags of 100 19132 F-F 19133 M-F* * Threaded heat sink View standoff drawings online at vicorpower.com/support/apps-info/standoffs.htm Screws with Thread Lock, 100pc packages Recommended Use Part Length PCB Heat Sink or Number Side Baseplate Side 19141 3/16 Inboard, 0.094 19142 1/4 Onboard, 0.094 19143 5/16 Onboard, In-Board M-F Baseplate only, No Heat Sink 19144 3/8 Onboard M-F 19145 1/2 Standard Heat Sink Kits: Pre-Packaged Standoff and Screw Kits (Enough for one module Full Size Brick Half and Quarter Size Brick PCB Module No Thru hole Threaded No Thru hole Threaded Heat Sink Heat Sink Heat Sink Heat Sink Heat Sink Heat Sink Inboard 19228 18153 18154 19228 18169 18170 Onboard 19229 18158 18159 19229 18174 18175 Inboard 19228 18153 18154 19228 18169 18170 0.094 Onboard 19227 18156 18157 19227 18172 18173 Onboard 24146 24054 18157 24146 24058 18173 Module Exchange Tools Used in facilitating the proper extraction of modules from thru hole or InMate sockets. Removal without using the exchange tool may cause damage to the sockets. Description Part Number Maxi Exchange Tool 22827 Mini Exchange Tool 22828 Micro Exchange Tool 22829 v i c o r p o w e r. c o m 9
Vicor Corporation 25 Frontage Road Andover, MA 01810-5413 Tel: 978-470-2900 Fax: 978-475-6715 Lombard, IL Tel: 630-769-8780 Fax: 630-769-8782 Sunnyvale, CA Tel: 408-522-5280 Fax: 408-774-5555 Austin, TX Tel: 512-833-6177 Fax: 512-833-6181 Vicor France Tel: +33 1 34 52 18 30 Fax: +33 1 34 52 28 30 Vicor Germany Tel: +49 89 962 439 0 Fax: +49 89 962 439 39 Vicor Italy Tel: +39 02 22 47 23 26 Fax: +39 02 22 47 31 66 Vicor U.K. Tel: +44 1276 678222 Fax: +44 1276 681269 Vicor Japan Co., Ltd. Tel: +81-3-5487-3880 Fax: +81-3-5487-3885 Vicor Hong Kong Tel: +852-2956-1782 Fax: +852-2956-0782 vicorpower.com 26148 Rev 2.3 07/06