History The company SIEGERT was founded in 1945 by Dipl.-Ing. Ludwig Siegert. During the 50ies the enterprise focused on the manufacturing of film resistors. 1965 was the start of production of miniaturized resistors, dedicated to the hearing-aid industry. Early in the 70ies SIEGERT introduced the thick film technology, creating an independent business unit: The SIEGERT Hybrid Technology. Due to the high increase in the demand for that technology, in 1975 a new building in Cadolzburg-Egersdorf was set up, expanded in 1980, 1985 and 2006. The 90ies brought to the Siegert-group a new strategic position. The business unit resistors was separated. For the hybrid and microelectronic unit strategic alliances with medium sized European enterprises were developed. SIEGERT electronic become a major partner in the Microtel Group. The companies of that Group are developing and manufacturing electronic boards, modules, sensors and complete systems for different application fields in the electronic industry. The results are synergies, from which our customers can benefit.
About Us We see us as a full-service-supplier, customer oriented, innovative and flexible. Our service covers the development, production and test, as well as after-sales-service. A broad technological basis allows to look for optimised solutions. As hybrid, assembled PC-board or complete sub-system, we provide you with your requested product. The whole know how of our development group is at your disposal for new ideas and alternative solutions. Design for manufacturing and testing and design for cost effectiveness are the main tasks during development and layouting. We define the interconnection and assembling technology, produce the prototypes and perform product reviews for example by using reliability tests. Our international sourcing of material secures availability of competitive and environmental controlled components and materials, even in allocation times. We focus on supply chain management, on partnership and development of suppliers and on logistics. A flexible and tracked production, fully automated for high quantities, semi automated for medium quantities and manual for small lots, is the basis for cost effective manufacturing of your products, using modern equipment and State-of-the-arttechnologies. Major contents offered by our after-sales service are a fair complaint management, spares provisioning and end-oflife service. In case of, we commit ourselves to error analysis, root cause identification and repair through the use of documented quality processes and to feedback the acquired knowledge to improve the production. Centre of our company is an approved and practised QM-system according ISO/TS 16949 : 2002. But centre of our work is just one- you, our customer.
Hybrid circuits Hybrid circuits are electronic modules printed on ceramic substrates. A technology in between semiconductor integration and discrete realization on PCB technology. Possibility of high thermal loading, high reliability and life time, good long term performance and excellent tracking of resistors and good electromagnetic compatibility are just a few of many special features of thick film hybrid technology. Hybrid circuits are commonly used, when electronic modules have to meet high technical requirements. Among others, this is proved by the internationally successful German Automotive industry. The applications range from motor and gear control units to security and comfort electronics. In harsh environmental conditions under the hood only hybrids meet the high standard: Space requirements at consumer cost SIEGERT electronic produces thick film hybrid circuits since 1970. Soldered hybrids, through-hole metallizations in ceramics, multilayer circuits (up to 6 conductor layers per side), bonded hybrids, shaped ceramics, Flip Chip on ceramic, power thick film devices and multi chip modules are major milestones of our experience. By focusing on funded R&D projects in the field of micro systems and sensors, we are developing our future. SIEGERT electronic is among the biggest service companies in the European market, which offer thick film hybrids. Power Thick Film Hybrid Sandwich Soldered hybrid Shaped ceramic Fine pitch bonding
Assembled PC-boards Assembled PC-boards are the basic structure of most electronic systems. By Surface Mount Technology (SMT) the production cost decreased and the packaging density increased. Today SMT-modules are ranked at such technical level, that can fit even high requirements. SIEGERT electronic offers pick and place competence for many decades, because we assemble since end of the 60ies our hybrids by SMT. You as our customer will profit of this experience. We assemble SMT components down to smallest sizes, fine-pitch assembly, BGA and Flip Chip. Our production equipment are very flexible to fit the request of our customers. Fully automated SMT lines including chip shooters and flexible pick and place modules are available. But also lower quantities are in our focus, using semi automated equipment or even manual assembly. Further characteristic is a flexible organisation as well as an effective QM-system. Our customers confirmed. BGA Flex PCB Chip on board Fine pitch assembly Mixed assembly
Sensors Sensors and thick film technology, that s synergy. It doesn t matter, if we are talking on the sensor cell itself, or on sensor signal processing module; analog, digital or mixed circuit functions, different outlines and integration densities and so on. Almost everything is possible. Thick film technology proves its advantages. sensors, temperature sensors, gas sensors, bio sensors and many more. The majority of these modules and sensors are custom made developments. Furthermore we are offering standard pressure sensors, which are developed and produced inside our Group. SIEGERT electronic develops, produces and delivers sensor cells, sub modules and complete sensor systems for different parameters, using thick film and PCB technology. For example: distance detection by laser, capacitive, inductive and optical proximity switches, CCD-sensors for medical applications, pressure sensors, magneto-resistive Miniaturising Lasertrim on PCB Complete solution Flip Chip Chip & Wire
Technical information 1) Substrates Material Alumina (Al 2 O 3 ; 96%) Aluminiumnitride (AlN) Standard size 4 x 4 ; 6 x 4 4 x 4 Standard thickness 0,63 mm; 1 mm 0,63 mm; 1 mm Other thickness 0,16 mm; 0,25 mm; 0,38 mm 0,16 mm; 0,25 mm; 0,38 mm Thermal conductivity 2) 20 W/m K 180 W/m K Coefficient of expansion 3) 6,4 x 10-6 / K 4,7 x 10-6 / K Break through voltage: > 15 KV/mm > 15 KV/mm Dielectric constant (1 MHz): 9,5 9 Printed structures Conductor width Conductor distance Conductor thickness (fired) Minimal resistor geometry Inspection 100 μm 100 μm 5... 100 μm, according to product- and paste specification 0,4 x 0,4 mm AOI (Automatic optical inspection) Electric interconnection and short circuit test High voltage test (multilayer) Printed resistors Resistor values Resistor tolerance (standard) Resistor tolerance (special) Maximal power dissipation Temperature coefficient, absolute Temperature coefficient, relative Long term stability Printed conductors and metals Silver (Ag) Silver palladium (AgPd) Silver platinum (AgPt) Gold (Au) Palladium gold (PdAu) Platinum gold (PtAu) < 10 mω... > 100 MΩ 1 % (100 Ω... 1 MΩ) 0,1 %, on request to be agreed 0,5... 1 W/mm 2 (1KΩ... 1MΩ) 50... 100 ppm, depending on paste system < 20 ppm (same resistor print) typical 0,3%, lower values to be agreed 2... 3 mω/ 10... 50 mω/ 2... 5 mω/ 2... 5 mω/ 80... 100 mω/ 70... 150 mω/ Through hole metallizations Diameter Resistivity 0,2... 0,4 mm (substrate thickness 0,63 mm) < 30 mω Dielectric layers Assembly Hybrid outlines Thickness (fired) 20... 40 μm, others on request Isolation resistance 10 11 Ω Break down voltage 300 V 4) (fired thickness of 35 μm) Dielectric constant (1 MHz) 8... 10 SMT components Soldering Inspection Bare dies Pick and place lines Reflow and wave, N 2 -atmosphere on request Dipping (I/O-Pins) Manual and Robot AOI (Automatic optical inspection) Electric functional test Incircuit test Dynamic endurance test (T-change, climatic etc.) Die bonding (glueing, soldering) Wire bonding (Au, Al) Flip Chip Globe top encapsulation (epoxi, silicon) Single in line (SIL) Pitch 2,54 / 1,27 mm 5) Dual in line (DIL) Pitch 2,54 / 1,27 mm 5) Without pins Pads with or without pre tinning Others Customer specified on request, i.e. in metal housings etc. Passivation Printed network Assembled module Glass passivation (overglass) Additionally or alternatively silicon Conformal coating Encapsulated in housings Hermetic in metal or ceramic housings 1) These values are for technical information only and are not by contract guaranteed properties 2) Temperature range 20... 100 C 3) Temperature range 20... 300 C 4) Higher values on request 5) Other pitch on request
SIEGERT electronic GmbH Pfannenstielstrasse 10 D-90556 Cadolzburg Phone +49 9103 507-0 Fax +49 9103 1789 zentrale@siegert.de www.siegert.de