Regis Meuret SAFRAN Hispano-Suiza ECPE 24/11/2011 : Power Electronics Research in Europe ECPE 24/11/2011 1
AGENDA INTRODUCTION: CREAM context POWER ELECTRONIC OBJECTIVES IN CREAM CREAM IN THE HT SAFRAN ROAD MAP 2
INTRODUCTION CREAM CONTEXT AND OBJECTIVES Compact and Reliable Electronics for Actuators and Motors www.creamproject.eu Acknowledgement The research leading to these results has received funding from the European Union Seventh Framework Programme (FP7/2007-2013) under grant agreement AAT.2008.4.2.4-234119 CREAM" 3
INTRODUCTION CREAM: FP7 Program with 14 Partners Sept 2009 Sept 2012 4
INTRODUCTION CONTEXT ACARE 2020: Environment, lifecycle cost More Electrical Aircraft Replace hydraulics actuation by electrical actuation Several subsystems concerned: Flight control systems, landing gear systems, fuel pumps for motor regulation, cabin pressurisation Several architectures under study on research programs Power buses (HVDC or AC) Control buses (control loops management) Energy regeneration issues Share of the control loops between equipments Electronics in cabinets shared between several actuators / integrated EMA in harsh environment CREAM objective is to validate technologies enabling the integration of a compact, reliable all in one actuator in harsh environment. The demonstration is performed on a primary flight control actuator 5
INTRODUCTION Innovative Actuator Mechanism with highintegrationof motor, bearings and roller screw developed by Sagem Control electronics Power drive electronics 2.3 Control electronic technologies : high temp substrate(ltcc,htcc) LT process nanoscale joining high temp protections SOI and asic integration 2.2 Power electronic technologies : high temp substrate LT process nanoscale joining high temp integrated curent sensor Sic Power part CREAM technological research program State of the art Generation2 Aileron actuator(2010) Weight/vol : 12.5 kg/ 6 l, Reliability 40000h, Temp 85 C TRL6: Flight proven on A320 flying test bench 2.1 Compact control and Power drive electronic MCPM Future CREAM EMA technology future aileron actuator Target weight/vol : 9 kg/ 4 l, reliability >50000h, Temp > 150 C 3 2.4 High temperature Reliability evaluation program research Motor mass & volume reduction and temp increase higher density magnetic material Motor power optimization New motor concept (Variable reluctance) Electronic, motor and mechanism integration concept 6
MCPM Description of the MCPM MCPM to Survive in Ambient Conditions (-65 C to 20 0 C) Operational Lifetime of 100,000 hours 20 A peack 14 A rms (SiC JFET dies from SiCED) DC input: 540VDC 14A AC output: 540V AC phase to phase 10A f max = 500Hz + DC linck capacitor + Current output sensor 7
Gate Driver Circuits for Power Half Bridges Scalable sink/source current from 2A to 20A Supply Voltage: 5V to 30V Capable to drive normally-on and normally-off power devices ATLAS & THEMIS available in CSOIC28 Can drive SiC MOSFET and JFET Si MOSFET and IGBT 8
Current sensor 9 9
High Voltage Board Objectives : to connect DC bus ceramic capacitor, current transducer, JFET switch 10
Power Inverter Which Technology for the assembly and package? bond wire die attach Ceramic, substrat process realisation Substrat attach Base plate 11 11
Wire bonding Technology Tests Results and technology recommendation Top side interconnection Aluminium wire bonding Power cycling test Silver Sintered Top Side Interconnection Power cycling test 12
Die attach Technology Tests Results and technology recommendation Die attach technology High temperature die attach technologies soldering (AuGe12, ZnAl5, PbSn5) sintering using nano silver paste Power cycling test High temperature storage Passive Cycling tests are ongoing 13
Conventional Substrate Technology Tests Results and technology recommendation Substrate technology Direct copper bond (DCB) Al 2 O 3 - Cu Active metal bracing (AMB) Si 3 N 4 -Cu Direct aluminium bond (DAB) AlN-Al Temperature Cycling copper - aluminum oxide DBC aluminum aluminum nitride DBA copper silicon nitride AMB 14
Innovative substrate Cu/Dia on Aln or AL2O3 Objectives : Thermal improvement 15
Base plate Technology Tests Results and technology recommendation Base plate material Copper, Copper Diamond Compound, AlSiC Compound Temperature Cycling Cu-baseplate AlSiC-baseplate 16
Leg design Finished Capacitor SiC J-FET Heat Spreader Gate capacitor 17
High Temperature MCPM : Improve Power density Actual HT Power Core demonstrator Innovative material Study for packaging Discreet component of drivers Board; HT laminate polyimide PCB Used more HT Silicon Component Low integration : 5kW/l density Ceramic and PPS capacitance High stability of HVDC capacitor High Density power module New substrate and design Innovative packaging solution Heat spreader High spreading capability Vapor chamber optimization Drivers on SOI technology Flyback driver supply Coreless isolation transformer High integration of EMI Filter Innovative magnetics materials HT Control board CPU on SOI Technology Substrate : HT laminate polyimide, LTCC HT MCPM : High integration power core : up to 7kW/l density High reliability SOI component New solder solution LTCC and ceramic substrate 18 18
THANK YOU FOR YOUR ATTENTION QUESTIONS 19