Crimp.mm (.") pitch PH CONNECTOR Disconnectable Crimp style connectors Emboss Tape Features This is a thin, lowprofile.mm (.") pitch connector.mm (.") in height after mounting and.mm (.1") in width. It is designed to meet the demand for highdensity connection of internal wires to printed circuit boards. It is compact, highly reliable and low in cost. 3 6 Reliable contact The contact has long dimples near the center to ensure a good connection at all times, even under conditions of vibration and mechanical abuse, and when used with low voltage and low current circuits. Easy and effective crimping lthough the contact is compact, it has a long wire strip holding length of.6 +/.mm (.1" +/.16"). This long length simplifies automatic crimping and the crimping of shielded wires. Fully shrouded header The fully shrouded header has walls on all four sides to prevent improper connection to the mating housing and to prevent the instruction of flux and other contaminants. High solderable square post The square post is copperundercoated and tin/leadplated for superior solderability and for whisker prevention. Printed circuit board retention mechanism The solder side of the header has a retention mechanism that prevents it from floating during soldering. s a result, the header can be positioned accurately. Compatible with the KR insulation displacement connector The same shrouded header can be used for either PH crimpstyle connector or KR insulation displacement connector. This allows both s of connector to be used interchangeably without replacing the header. Surface mount model (SMT) This connector is also available in a surface mount configuration. Its housing is made of heat resistant resin so that it is not adversely affected during reflow soldering. ecause of its tiny size and ability to be surface mounted, this connector meets the demand for highdensity mounting of components inside electronic products. Specifications Current rating:. C, DC (WG #) Voltage rating: 1V C, DC Temperature range: C to +8 C (including temperature rise in applying electrical current) Contact resistance: Initial value/1m Ω max. fter environmental testing/m Ω max. Insulation resistance: M Ω min. Withstanding voltage: 8V C/minute pplicable wire: WG #3 to # pplicable PC board thickness:.8 to 1.6mm(.31" to.63") * Contact JST for details Standards Recognized file No. E638 Certified file No. LR81 File No. R8 (conforms to DIN/VDE 6)
Contact.(.).8(.).(.81) 1. (.3) SPHTP.S SPHTP.S pplicable wire mm WG # Insulation O.D.mm(in.). to. 3 to. to 1.(.3 to.).3 to.8 3 to 8. to.(. to.3) reel 8, 1. Phosphor bronze, Tinplated.8 (.8) Note: SPHTP.S is not TÜV approved. 1. (.) Housing 1. (.). (.).(.1). (.) 6.3(.).6(.) 3 6 8 1 1 1 16 PHR PHR 3 PHR PHR PHR 6 PHR PHR 8 PHR PHR1 PHR PHR1 PHR PHR PHR1 PHR16.(.).8(.8).(.1).8(.3) 6.(.36).8(.386) 8.(.31).8(.6) 1.(.3).8(.3) 1.(.) 1.8(.6).(.1) 1.8(.1) 16.(.63) 1.8(.8) 18.(.) 1.8(.88).(.8) 3.8(.3).(.866).8(1.16).(.).8(1.) 6.(1.).8(1.) 8.(1.1) 31.8(1.) 3.(1.181) 33.8(1.331) box Nylon 66, ULV, natural (white) Note: PHR16 is not TÜV approved. 1
Throughhole shrouded header The shrouded headers are interchangeable with those of the KR, KRD and CR insulation displacement connectors (see pages, 1 & ) Top ( circuits) (3 circuits or more) (.) Side.(.1) 1.(.6). (.) 3. (.) (.). (.).8(.18) 1.(.6). (.).(.1) 1.(.6) 3. (.) 3 6 8 1 1 1 16 Top PHK 3PHK PHK PHK 6PHK PHK 8PHK PHK 1PHK PHK 1PHK PHK PHK 1PHK 16PHK Side S PHK S 3PHK S PHK S PHK S 6PHK S PHK S 8PHK S PHK S1PHK SPHK S1PHK SPHK SPHK S1PHK S16PHK.(.).(.1) 6.(.36) 8.(.31) 1.(.3) 1.(.).(.1) 16.(.63) 18.(.).(.8).(.866).(.) 6.(1.) 8.(1.1) 3.(1.181).(.3).(.3).(.3).(.6).(.) 1.(.66) 1.(.) 1.(.83) 1.(.86) 3.(.1).(1.).(1.8).(1.1) 31.(1.6) 33.(1.33) box Top Side (.). (.). (.) 1.6 (.63) 3. (.) 6.(.6) Post: rass, copperundercoated, tin/leadplated Wafer: Nylon 66, ULV, ivory Note: 1.When ordering a naturalcolored (white) shrouded header, please specify a model number with suffix S (Example: 3PHKS)..16circuit headers are not TÜV approved. Throughhole PC board layout (viewed from soldering side) and ssembly layout Top Side.±. 1.min. (.±.) (.).8min. (.). +.1 (.8 +. )dia. 8.(.31). (.1).±. (.±.) 1.min. (.) 6.min. (.6). +.1 (.8 +. )dia..1(.38) 6. (.6).8 (.18) Note: 1. Tolerances are noncumulative ±.mm(±.") for all centers.. Hole dimensions differ according to the kind of printed circuit board and piercing method. If printed circuit boards made of hard material such as FR are used, the hole dimensions should be larger. The hole dimensions shown above are reference values. Contact JST for details.
SMT shrouded header The shrouded headers are interchangeable with those of the KR, KRD and CR insulation displacement connectors (see pages, 1 & ). SMT shrouded headers are not TÜV approved. SM Top (.).(.) 1. (.3)dia. 1.3(.3) C 6.6(.6). (.1) 1.(.) 3. (.16) 3.1 (.1) 1 Top PHSM PHSM PHSM Side S PHSM S PHSM S1PHSM SPHSM Post: Wafer:.(.) 8.(.31) 1.(.) 18.(.).(.8).(.3).(.3).(.6) 1.(.66) 1.(.86) 3.(.1) rass nickelundercoated, tinplated PPS, ULV, natural (dark brown) C.(.18) 8.(.33) 1.(.1).(.).(.81).(.8) box Side (.).(.).(.1) 1.(.) 1. (.3)dia. 1.3(.3) C.8(.31) 3. (.8) 1.6 (.63) 3.(.) SM3 Top. (.).(.) Side 6.6(.6) 1. (.). (.1) 1.(.). (.8). [(.)] 3 6 8 1 1 Top PHSM3T 3PHSM3T PHSM3T PHSM3T 6PHSM3T PHSM3T 8PHSM3T PHSM3T 1PHSM3T PHSM3T 1PHSM3T PHSM3T Side S PHSM3T S 3PHSM3T S PHSM3T S PHSM3T S 6PHSM3T S PHSM3T S 8PHSM3T S PHSM3T S1PHSM3T S1PHSM3T SPHSM3T SPHSM3T.(.).(.3).(.1).(.3) 6.(.36).(.6) 8.(.31).(.) 1.(.3) 1.(.66) 1.(.) 1.(.).(.1) 1.(.83) 16.(.63) 1.(.86) 18.(.) 3.(.1).(.8).(1.).(.866).(1.8).(.).(1.1) 6.(1.) 31.(1.6) reel.(.).(.1) Post: Copper alloy, copperundercoated, tin/leadplated Wafer: Nylon 6, ULV, natural (ivory) Solder tab: rass, copperundercoated, tin/leadplated.. (.) (.6) 1.6 (.63).6 [ (.1) ] Note: The products listed above are supplied on embossedtape. 1
Taping specifications of SM3 shrouded headers [.(.1)dia.] W1 +. 1. (W1 +.8.3 ) 3± (.6 ±.)dia.. ±. (. ±.) Tail tape. (1.)min Connector loaded area leader area Lead tape. (1.)min 1. (.6)min Top to 6 circuits Top to circuits 1.±. (.61±.)dia..±.1 (.1±.).±.1 (.±.) 1.±.1 (.6±.).38±. (.1±.) 1.±. (.61±.)dia..±.1 (.1±.).±.1 (.±.) 1.±.1 (.6±.).38±. (.1±.) F±.1 (.) W±.3(.1) F±.1 (.) S±.1(.) W±.3(.1) 1.±.1 (.±.) 1.±.1 (.±.) side to 6 circuits side to circuits 1.±. (.61±.)dia..±.1 (.1±.).±.1 (.±.) 1.±.1 (.6±.).38±. (.1±.) 1.±. (.61±.)dia..±.1 (.1±.).±.1 (.±.) 1.±.1 (.6±.).38±. (.1±.) 1.±.1 (.±.) F±.1 (.) W±.3(.1) 1.±.1 (.±.) F±.1 (.) S±.1(.) W±.3(.1) Top Side to 3 to 6 to 1 to to 3 to 6 to 1 to Taping dimensions mm(in.) Reel dimensions mm(in.) reel F S W W1.(.).(.3).(.).(.).(.).(.3).(.).(.) 8.(1.8).(1.1) 8.(1.8).(1.1) 16.(.63).(.) 3.(1.6).(1.3) 16.(.63).(.) 3.(1.6).(1.3) 1.(.68).(1.) 33.(1.31).(1.1) 1.(.68).(1.) 33.(1.31).(1.1) Note:Specifications conform to JIS C 86. The tape width, connector loading recess square hole dimensions, etc. are determined by the number of circuits and external shape of the connector to be loaded.
SMT PC board layout (viewed from component side) and ssembly layout SM Top Side 1. +.1 (. +. )dia. [.(.) x (No.of circuits1) +.(.16)] ±.1(.) 1. 1. (.3)(.3)(.33).8 min. 3. (.16) 1. (.) 3. (.8)min. 3.1 (.1). (.1) 3. (.16) 6.6(.6) 1. +.1 (. +. )dia. [.(.) x (No.of circuits1) +.(.16)] ±.1(.) 1. 1. (.3)(.3)(.33).8 3. (.8)min... (.1)min.(.) 1.8 (.1).6(.) 3. (.8).(.1) SM3 Top Side 1.6±.1 (.63±.) 1. (.3) 3.±.1 (.8±.) 1.6±.1 (.63±.).±. (.±.) End face of wafer on the mating side.(.)max..(.)min. 1.±.1 (.±.) 3.±.1 (.±.). (.8) 1.6±.1.±. (.63±.) (.±.) End face of wafer on the mating side min..(.1).(.3)min. 1.min. (.3) 1.min. (.3) Note: 1. Tolerances are noncumulative:±.mm(±." ) for all centers.. The dimensions above should serve as a guideline.contact JST for details.