June 26, 2006 DIELECTRIC CERAMIC DUPLEX FILTER SPECIFICATION 1 OF 6 SPECIFICATION ITEM: DIELECTRIC CERAMIC DUPLEX FILTER PART NUMBER: CFDM

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June 26, 2006 DIELECTRIC CERAMIC DUPLEX FILTER SPECIFICATION 1 OF 6 SPECIFICATION ITEM: DIELECTRIC CERAMIC DUPLEX FILTER PART NUMBER: CFDM-0902094710 Application: GSM 900 Duplexer ISSUED CHECKED CHECKED CHECKED APPROVED FILTRONETICS Inc

June 26, 2006 DIELECTRIC CERAMIC DUPLEX FILTER SPECIFICATION 2 OF 6 1. APPLICATION THIS SPECIFICATION APPLIES TO A BAND PASS DUPLEX FILTER USING DIELECTRIC RESONATORS. 2. PART NUMBER PART NO PACKAGING CFDM-0902094710 PLASTIC TRAY 3. SPECIFICATIONS No ITEMS LOW HIGH 1 Center Frequency (Fo) a1 902.5 MHz 947.5 MHz 2 Pass Band Width (BW) b1 890 ~ 915 MHz 935 ~ 960 MHz 3 Insertion Loss in BW c1 2.0 db Max 2.0 db Max 4 Ripple in BW d1 1.3 db Max 1.3 db Max 5 Return Loss in BW i1 15.0 db Min 15.0 db Min 6 Attenuation At 890 ~ 915 MHz - 55.0 db Min At 935 ~ 960 MHz 55.0 db Min - 7 Impedance 50 Ohms 50 Ohms 8 Power Rating 3 W Max 3 W Max 9 Operating Temperature -35 to +75-35 to +75 S21 LOG MAG NETWORK ANALYZER S11 LOG MAG NETWORK ANALYZER

June 26, 2006 DIELECTRIC CERAMIC DUPLEX FILTER SPECIFICATION 3 OF 6 4. GRAPHS S21 & S11 (PASS BAND)

June 26, 2006 DIELECTRIC CERAMIC DUPLEX FILTER SPECIFICATION 4 OF 6 5. DIMENSIONS MATERIAL SPECIFICATION 1. METAL CASE 1) MATERIAL: Sn OR Ni PLATED 2. RESONATOR 1) COATING MATERIAL: Ag 2) DIMENSION: 8MM 10POLE 3. ROHS Compliant MARKING CFDM-0902094710 Filtronetics, Inc Date Code UNIT: MM TOLERANCE: +/-0.5MM IN/OUT LAND :+/-0.3MM CAUTIONS: 1. When handling products, be careful not to damage the outer-electrode. 2. When handling products be careful not to touch the outer-electrode with bare hands or solderability is reduced. 3. Do not apply excessive pressure or shock to product in handling or in transportation or damage to the ceramic filters may result.

June 26, 2006 DIELECTRIC CERAMIC DUPLEX FILTER SPECIFICATION 5 OF 6 6. DEFINITIONS TERMS DESCRIPTION SPECIFICATION Center Frequency Pass Band Width Insertion Loss Attenuation Pass Band Ripple V.S.W.R in Pass Band The midpoint of through band pass filter pass band, normally expressed as the arithmetic mean of the -3db point. Also called fo. The width of the pass band of a filter referenced to the minimum insertion loss point in the pass band. The pass band of a filter is stated as -1.0dB bandwidth. The loss of the filter, in db, measured at center frequency relative to a through line (0 db). Reduction of RF powder through a filter measured in db, at desired band and referenced to 0 db. (Filter to be removed from circuit) Variations in loss in the pass band of the filter, superimposed upon the fundamental shape of the pass band. The ratio of the maximum value of a standing wave to its minimum value, related to the return loss in pass band. 3. SPECIFICATION

June 26, 2006 DIELECTRIC CERAMIC DUPLEX FILTER SPECIFICATION 6 OF 6 7. RELIABILITY TEST AND CONDITIONS Resistance to solder heat ITEM TEST CONDITIONS REQUIREMENTS Preheat temperature : 120 to 150 C Preheat time: 1 to 1.5 min Solder temperature: 260 +/- 10 C Dipping time: 10 +/- 0.5 sec Solderability Preheat temperature: 120 to 150 C Preheat time: 1 to 1.5 min Solder temperature: 235 +/- 5 C Dipping time: 5 +/- 1 sec Heat resistance (High-temperature Load) Thermal shock (Temperature cycle) Temperature: 85 +/- 2 C Applied voltage: Rated voltage Applied current: Rated current Recovery: 1 to 2hrs of recovery under the standard condition after the removal from test chamber. Conditions for 1 cycle Step 1: + 85 C 15 min Step 2 : - 30 C 15 min Number of cycle: 10 Humidity Resistance Temperature: 40 +/- 2 C Humidity: 90 to 95% RH Duration: 96 +/- 5 hrs Recovery: 1 to 2hrs of recovery under the standard condition after the removal from test chamber. Vibration Frequency: 10 ~ 50 Hz Amplitude: 1.52 mm ( 0.060 inches) Direction: X, Y and Z Time: each 30 min for all directions No damage such as cracks should be caused in chip element. More than 80% of the terminal electrode shall be covered with new solder 8. REFLOW SOLDERING STANDARD CONDITIONS Measuring point of temperature in-out terminals of the device. Reflow Soldering Both convection and infrared rays Hot air Solder Cream: Sn96.5/Ag3.5