LSICSD1A5 RoHS Pb Description This series of silicon carbide (SiC) Schottky diodes has negligible reverse recovery current, high surge capability, and a maximum operating junction temperature of 175 C. These diodes series are ideal for applications where improvements in efficiency, reliability, and thermal management are desired. Features Positive temperature coefficient for safe operation and ease of paralleling 175 C maximum operating junction temperature Excellent surge capability Extremely fast, temperature-independent switching behavior Dramatically reduced switching losses compared to Si bipolar diodes Circuit Diagram TO--L Applications Case Case Boost diodes in PFC or DC/DC stages Switch-mode power supplies Solar inverters Industrial motor drives EV charging stations 1 Uninterruptible power supplies 1 Environmental Littelfuse RoHS logo = RoHS conform Littelfuse HF logo = Halogen Free Littelfuse PB-free logo = PB--free lead plating RoHS Pb Maximum Ratings Characteristics Symbol Conditions Value Unit Repetitive Peak Reverse Voltage RM - 1 V DC Blocking Voltage T j = 5 C 1 V 17.5 Continuous Forward Current I F A = 135 C 8.5 T = 5 C C = 158 C 5 Non-Repetitive Forward Surge Current I FSM = 5 C, T P = 1 ms, Half sine pulse 4 A T Power Dissipation P C = 5 C 1 Tot = 11 C 43.3 W Operating Junction Temperature - -55 to 175 C Storage Temperature T STG - -55 to 15 C Soldering Temperature (reflow MSL 1) T sold - 6 C 17 Littelfuse, Inc.
Electrical Characteristics Value Characteristics Symbol Conditions Min. Typ. Max. I Forward Voltage V F = 5 A, = 5 C - 1.5 1.8 F I F = 5 A, = 175 C -.1 Unit V V Reverse Current I R = 1 V, T = 5 C - <1 1 J R = 1 V, T = 175 C - 5 J μa = 1 V, f =1 MHz - 31 Total Capacitance C = 4 V, f = 1 MHz - 9 pf = 8 V, f = 1 MHz - 1 Total Capacitive Charge Q C = 8 V, - 3 nc Footnote: = +5 C unless otherwise specified Thermal Characteristics Qc = C(V)dV Value Characteristics Symbol Conditions Unit Min. Typ. Max. Thermal Resistance R θjc - - 1.5 C/W Figure 1: Typical Foward Characteristics Figure : Typical Reverse Characteristics 1 Forward Current (A) 9 8 7 6 5 4 = -55 C = 5 C = 15 C = 15 C = 175 C Reverse Current, I R (A) 1E-4 1E -5 1E -6 = 175 C 3 1E -7 = 15 C = 15 C = 5 C 1.5 1 1.5.5 3 3.5 4 4.5 Forward Voltage (V) 1E -8 4 6 8 1 1 Reverse Voltage, (V) 17 Littelfuse, Inc.
Figure 3: Power Derating Figure 4: Current Derating 1. 6 Power (W) 1. 8. 6. 4.. Forward Current (A) 5 4 3 1 1 % Duty 3 % Duty 5 % Duty 7 % Duty DC. 5 5 75 1 15 15 175 Case Temperature ( C ) 5 5 75 1 15 15 175 Case Temperature ( C ) Figure 5: Capacitance vs. Reverse Voltage Figure 6: Capacitive Charge vs. Reverse Voltage 35 3 4 35 Capacitance (pf) 5 15 1 5 Capaci ve Charge (nc) 3 5 15 1 5 1 1 1 1 4 6 8 1 Voltage (V) Voltage (V) 17 Littelfuse, Inc.
Figure 7: Stored Energy vs. Reverse Voltage Figure 8: Transient Thermal Impedance 1 Stored Energy (uj) 1 8 6 4 4 6 8 1 Voltage (V) Normalized Transient Thermal Impedance 1.E+.5.3.1 1.E-1.5. 1.E- 1.E-5.1 Single 1.E-4 1.E-3 Pulse Width (s) 1.E- 1.E-1 Part Numbering and Marking System Packing Options SIC = SiC Diode = Gen SICSD1A5 SD = Schottky Diode LF 1 = Voltage Rating (1 V) A = TO--L YYWWE ZZZZZZ-ZZ 5 = Current Rating (5 A) YY = Year WW = Week E = Special Code ZZZZZZ-ZZ = Lot Number Part Number Marking Packing Mode M.O.Q LSICSD1A5 SICSD1A5 Tube 1 17 Littelfuse, Inc.
Dimensions-Package TO--L A MOLD GATE L D L1 D1 H1 ~4.5 E "A" D C C e1 e PLATING BASE METAL c c1 E/ 1. mm CHARACTER HEIGHT COUNTRY OF ORIGIN R.5(x) TOP & SIDE MATTE FINISH ALL OTHER SIDES ARE SHINY FINISH PLATING BASE METAL c c1 R A1 A PHIL DETAIL "A" SCALE :1 5 ±1 5 ±1 1.55xDp.1 EJECTOR PIN MOLD FLASH (Refer to notes) Symbol Millimeters Min Nominal Max A 4.3 4.45 4.57 A1 1.14 1.7 1.4 A.5 -.74 b.69 -.88 b1.68 -.87 b 1.3-1.39 b3 1. 1.7 1.38 c.36 -.53 c1.63 -.57 D 14.9-15.6 D1 8.615-9.17 D 1.84-1.95 E 1. 1.18 1.36 E1 7.57 7.61 7.68 e1.49.54.59 e 5.3 5.8 5.13 H1 6.95 6.545 6.795 L 13. 13.5 14. L1.39-3.5 øp 3.71 3.84 3.96 Q.65-3.5 R - -.54 SECTION C-C b3 b SECTION D-D P E1 Q D b1 b Recommended Solder Pad Layout 5.8 x R.6 1.93 UNIT: mm NOTES: 1. DIMENSIONS D & E DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED.17 MM PER SIDE. THESE DIMENSIONS ARE MEASURED AT THE OUTERMOST EXTREME OF PLASTIC BODY.. DIMENSIONS E & H1 DEFINE A ZONE WHERE STAMPING AND SINGULATION IRREGULARITIES RE ALLOWED. 17 Littelfuse, Inc.
Packing Specification (Tube for TO--L ) 53 ±.5 8 519 ±.5 9 6.5 ±. BLUE MARKINGS, CENTERED ON TUBE LENGTH 6.5 ±. 7 ±. 4 16.8 3.9 7 ±. 5.1 MARKING SURFACE 3 5.5 7 3.1 ±.5 5.9 ±.1 1 31.4 ±. 6.75 ±.1 4 ±.17 DETAIL B 4 ±.17 4 ±.17 DETAIL C 4 ±.17 NOTES: 1. Material transparent extruded PVC with antistatic dipping. Radius :.5 maximum unless otherwisen specified 3. Critical areas : Labelled in Box 4. All pin plug holes are considered critical dimension 5. Marking Font Type : Times new roman, 3.1 ±.17 in height 6. Material Thickness :.75 ±.1 7. Tolerance unless otherwise specified: Decimal: ±.5 Angle: ±1 8. Unit : Millimeter (mm) 17 Littelfuse, Inc.