Product Code Size Number of Type Characteristics Nominal Impedance Form Suffix Terminals. High Impedance Type. Low DCR Type

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Type: /P N Features urst/radiation noise fi ltering for audio circuits The optimally magnetic-coupled ferrite beads allow for the fi ltering of both common and normal mode noises The strong multi-layer structure provides high resistance to refl ow soldering heat and a high mounting reliability Magnetic shield type High Impedance : to 1 k type) Low Resistance Value :. max. (P type) High Impedance :, Low Resistance Value :.9 max. (N type) Recommended pplications Receiver lines, speaker lines, microphone lines and headset of mobile phones. udio signal lines of Portable audio equipment, Ps, PDs. xplanation of Part Numbers /P Type 1 3 5 7 8 9 1 11 1 1 U Product ode Size Number of Type haracteristics Nominal Impedance Form Suffix Terminals Noise Filter ode Dimensions(mm) 1.5 1..5 (L) () (H) Terminals oupled type P High Impedance Type Low DR Type The first two digits are significant figure of impedance value, and the third one denotes the number of zeros following ode Packing U mbossed arrier Taping N Type 1 3 5 7 8 9 1 11 1 N 1 Product ode Size Number of Type haracteristics Nominal Impedance Form Suffix Terminals Noise Filter ode Dimensions(mm) 1.5 1..5 (L) () (H) Terminals oupled type N High Impedance Type and Low DR Type The first two digits are significant figure of impedance value, and the third one denotes the number of zeros following ode Packing Pressed arrier Taping onstruction Dimensions in mm (not to scale) F Ferrite D Inner onductor lectrode Type (inches) (5) Dimensions (mm) D F Mass (eight) [mg/pc.] 1.±.15 1.5±.15.5±.1.±.15.5±.1.35±.1 3 Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use. Feb. 8

ircuit onfi guration (No Polarity) 3 3 1 1 Ratings Impedance () Rated Voltage Rated urrent D Re sis tance Part Number ( ) at 1 MHz Tolerance(%) (V D) (m D) ( ) max. P11U 1 5.3 P1U 35. ±5 5 1U 1.7 1U 1 5 1.5 Impedance (ommon mode) Rated Voltage Rated urrent D Re sis tance Part Number ( ) at 1 MHz Tolerance(%) (V D) (m D) ( ) max. N1 ±5 5.9 Impedance haracteristics (Typical) P11U 5 3 1 ommon mode 1 1 1 1 1 1U 5 P1U 5 3 1 ommon mode 1 1 1 1 1 1U 1 3 1 8 ommon mode 1 ommon mode 1 1 1 1 1 1 1 1 1 1 Measurement ircuit ()Open Mode ()ommon Mode ()Normal Mode Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use. Feb. 8

Impedance haracteristics (Typical) N1 Measurement ircuit 1 1 1 1 8 Differential mode ()Open Mode ()ommon Mode ommon mode 1 1 1 1 1 ()Differential Mode Packaging Methods (Taping) Standard Quantity Part Number Kind of Taping Pitch (P 1 ) Quantity P U U mbossed arrier Taping mm 5 pcs./reel N Pressed arrier Taping mm 1 pcs./reel mbossed arrier Taping Pressed arrier Taping t1 Sprocket hole φd ompartment F Sprocket hole P P φd F t P1 P P hip component Tape running direction t hip component P1 ompartment Tape running direction Taping Reel T φ φd φ φ t mbossed arrier Dimensions (mm) Part Number F P 1 P P φd t 1 t P U 1.±.15 1.5±.15 8.±. 3.5±.1 1.75±.1.±.1.±.1.±.1 1.5±.1.5±.5.9±.15 U Pressed arrier Dimensions (mm) Part Number F P 1 P P φd t N 1.±.15 1.5±.15 8.±. 3.5±.1 1.75±.1.±.1.±.1.±.1 1.5±.1.8±.1 Standard Reel Dimensions (mm) Part Number φ φ φ φd T t U 18.±3..±1. 13.±.5 1.±.8.±.5 9.±.3 11.±1.5 1.±. Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use. Feb. 8

Recommended Land Pattern Design F D D Dimension (mm) 1.5 to 1.9 1.1.5 D.5 to.7. F.3 Recommended Soldering onditions Recommendations and precautions are described below. Recommended soldering conditions for refl ow Refl ow soldering shall be performed a maximum of two times. Please contact us for additional information when used in conditions other than those specifi ed. Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability be fore ac tu al use. Peak For soldering (xample : Sn-37Pb) Temperature Time Preheating 1 to 1 s to 1 s Main heating bove 3 s to s Peak 35 ± 1 max. 1 s Temperature Preheating Heating For lead-free soldering (xample : Sn/3g/.5u) Temperature Time Preheating 15 to 17 s to 1 s Main heating bove 3 3 s to s Peak max. max. 1 s Time <Repair with hand soldering> Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 35 or less. Solder each electrode for 3 seconds or less. Never touch this product with the tip of a soldering iron. Safety Precautions The following are precautions for individual products. Please also refer to the precautions common to MI Filters, SD Suppressors, Fuses, and MR Sensors shown on page L113 of this catalog. 1. hen possible, do not mount (hereafter called the fi lters) by fl ow soldering. It is highly possible that fl ow soldering may cause bridges between the electrodes.. Use rosin-based fl ux or halogen-free fl ux. 3. For cleaning, use an alcohol-based cleaning agent. efore using any other type, consult with our sales person in advance.. Do not apply shock to the fi lters or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, their bodies may be chipped, affecting their performance. xcessive me chanical stress may damage the fi lters. Handle with care. 5. Store the fi lters in a lo ca tion with a temperature ranging from 5 to + and a relative humidity of % to %, where there are no rapid changes in temperature or humidity.. Use the fi lters within half a year after the date of the outgoing inspection indicated on the packages. Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use. Jul. 8

Safety Precautions (ommon precautions for MI Filters, SD Suppressors, Fuses, and MR Sensors) hen using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject to change without prior notice. Do not use the products beyond the specifi cations described in this catalog. This catalog explains the quality and performance of the products as individual components. efore use, check and evaluate their operations when installed in your products. Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause the loss of human life or other signifi cant dam age, such as damage to vehicles (automobile, train, vessel), traffi c lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. Systems equipped with a protection circuit and a protection device Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sin gle fault (1) Precautions for use These products are designed and manufactured for general and standard use in general elec tron ic equipment (e.g. V equipment, home electric appliances, offi ce equipment, information and communication equipment) These products are not intended for use in the following special conditions. efore using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as l, HS, NH3, SO, or NO. lectric Static Discharge (SD) nvironment (except SD Suppressors) These components are sensitive to static electricity and can be damaged under static shock (SD). Please take measures to avoid any of these environments. Smaller components are more sensitive to SD environment. 5. lectromagnetic nvironment void any environment where strong electromagnetic waves exist.. In an environment where these products cause dew condensation 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials These products generate Joule heat when energized. arefully position these products so that their heat will not affect the other components. arefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or infl ammables, such as vinyl-coated wires, near these products (except Thermal utoffs). Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the performance or reliability of the products. arefully select a fl ux cleaning agent for use after soldering. n unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. () Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of ar riv al at your company, provided that they remain packed as they were when delivered and stored at a tem per a ture of 5 to 35 and a relative humidity of 5 % to 85 %. (Micro hip Fuses: Guaranteed for months from the date of arrival at your company) The performance of MI Filters is guaranteed for months or a year from the out go ing inspection date indicated on the packages, provided that they are stored at a temperature of -5 to + and a relative humidity of % to %. heck the guarantee period in the specifi cations. The performance of Thermal ut offs is guaranteed for a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of -1 to + and a relative humidity of 3 % to 75 %. ven within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as l, HS, NH3, SO, or NO. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in nglish. L113 Jan. 8