LSIC2SD120A10. GEN2 SiC Schottky Diode LSIC2SD120A10, 1200 V, 10 A, TO-220-2L. RoHS. Description

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LSIC2SD12A1 RoHS Pb Description This series of silicon carbide (SiC) Schottky diodes has negligible reverse recovery current, high surge capability, and a maximum operating junction temperature of 175 C. These diodes series are ideal for applications where improvements in efficiency, reliability, and thermal management are desired. Features Positive temperature coefficient for safe operation and ease of paralleling 175 C maximum operating junction temperature Excellent surge capability Extremely fast, temperature-independent switching behavior Dramatically reduced switching losses compared to Si bipolar diodes Circuit Diagram TO-22-2L Applications Case Case Boost diodes in PFC or DC/DC stages Switch-mode power supplies Solar inverters Industrial motor drives EV charging stations 1 2 Uninterruptible power supplies 1 2 Environmental Littelfuse RoHS logo = RoHS conform Littelfuse HF logo = Halogen Free Littelfuse PB-free logo = PB--free lead plating RoHS Pb Maximum Ratings Characteristics Symbol Conditions Value Unit Repetitive Peak Reverse Voltage RM - 12 V DC Blocking Voltage T j = 25 C 12 V 28 Continuous Forward Current I F A = 125 C 15 T = 25 C C = 151 C 1 Non-Repetitive Forward Surge Current I FSM = 25 C, T P = 1 ms, Half sine pulse 8 A T Power Dissipation P C = 25 C 136 Tot = 11 C 59 W Operating Junction Temperature - -55 to 175 C Storage Temperature T STG - -55 to 15 C Soldering Temperature T sold - 26 C

Electrical Characteristics Value Characteristics Symbol Conditions Min. Typ. Max. I Forward Voltage V F = 1 A, = 25 C - 1.5 1.8 F I F = 1 A, = 175 C - 2.2 Unit V V Reverse Current I R = 12 V, T = 25 C - <1 1 J R μa = 12 V, T = 175 C - 1 J = 1 V, f =1 MHz - 582 Total Capacitance C = 4 V, f = 1 MHz - 53 = 8 V, f = 1 MHz - 4 Total Capacitive Charge Q C = 8 V, - 57 nc Footnote: = +25 C unless otherwise specified Thermal Characteristics Qc = C(V)dV pf Value Characteristics Symbol Conditions Unit Min. Typ. Max. Thermal Resistance R θjc - - 1.1 C/W Figure 1: Typical Foward Characteristics Figure 2: Typical Reverse Characteristics Forward Current (A) 2 18 16 14 12 1 8 = 25 C = 125 C = 15 C = 175 C Reverse Current, I R (A) 1E-4 1E -5 1E -6 = 175 C = 15 C 6 4 1E -7 = 125 C = 25 C 2 -.5.5 1.5 2.5 3.5 4.5 Forward Voltage (V) 1E -8 2 4 6 8 1 12 Reverse Voltage, (V)

Figure 3: Power Derating Figure 4: Current Derating Power (W) 16. 14. 12. 1. 8. 6. 4. Forward Current (A) 12 1 8 6 4 1 % Duty 3 % Duty 5 % Duty 7 % Duty DC 2. 2. 25 5 75 1 125 15 175 Case Temperature ( C ) 25 5 75 1 125 15 175 Case Temperature ( C ) Figure 5: Capacitance vs. Reverse Voltage Figure 6: Capacitive Charge vs. Reverse Voltage 6 5 7 6 Capacitance (pf) 4 3 2 Capaci ve Charge (nc) 5 4 3 2 1 1 1 1 1 1 Voltage (V) 1 2 4 6 8 1 Voltage (V)

Figure 7: Stored Energy vs. Reverse Voltage Figure 8: Transient Thermal Impedance Stored Energy (uj) 25 2 15 1 5 2 4 6 8 1 Voltage (V) Normalized Transient Thermal Impedance 1.E+ 1.E-1 1.E-2 1.E-3.5.3.1.5.2.1 Single 1.E--6 1.E- 5 1.E-4 1.E-3 1.E-2 1.E-1 1.E+ Pulse Width (s) Part Numbering and Marking System Packing Options SIC = SiC Diode 2 = Gen2 SIC2SD12A1 SD = Schottky Diode LF 12 = Voltage Rating (12 V) A = TO-22-2L YYWWE ZZZZZZ-ZZ 1 = Current Rating (1 A) YY = Year WW = Week E = Special Code ZZZZZZ-ZZ = Lot Number Part Number Marking Packing Mode M.O.Q LSIC2SD12A1 SIC2SD12A1 Tube 1

Dimensions-Package TO-22-2L A MOLD GATE L D L1 D1 H1 ~4.5 E "A" D C C e1 e PLATING BASE METAL c c1 E2/2 1. mm CHARACTER HEIGHT COUNTRY OF ORIGIN R.5(2x) TOP & SIDE MATTE FINISH ALL OTHER SIDES ARE SHINY FINISH PLATING BASE METAL c c1 R A1 A2 PHIL DETAIL "A" SCALE 2:1 5 ±1 5 ±1 1.55xDp.1 EJECTOR PIN MOLD FLASH (Refer to notes) Symbol Millimeters Min Nominal Max A 4.32 4.45 4.57 A1 1.14 1.27 1.4 A2 2.5-2.74 b.69 -.88 b1.68 -.87 b2 1.23-1.39 b3 1.22 1.27 1.38 c.36 -.53 c1.63 -.527 D 14.9-15.6 D1 8.615-9.17 D2 12.84-12.95 E 1. 1.18 1.36 E1 7.57 7.61 7.68 e1 2.49 2.54 2.59 e 5.3 5.8 5.13 H1 6.295 6.545 6.795 L 13. 13.5 14. L1 2.39-3.25 øp 3.71 3.84 3.96 Q 2.65-3.5 R - -.254 SECTION C-C b3 b2 SECTION D-D P E1 Q D2 b1 b Recommended Solder Pad Layout 5.8 2x R.62 1.93 UNIT: mm NOTES: 1. DIMENSIONS D & E DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED.127 MM PER SIDE. THESE DIMENSIONS ARE MEASURED AT THE OUTERMOST EXTREME OF PLASTIC BODY. 2. DIMENSIONS E2 & H1 DEFINE A ZONE WHERE STAMPING AND SINGULATION IRREGULARITIES RE ALLOWED.

Packing Specification ( Tube for TO-22-2L ) 532 ±.5 8 519 ±.5 9 6.5 ±.2 BLUE MARKINGS, CENTERED ON TUBE LENGTH 6.5 ±.2 7 ±.2 4 16.8 3.9 7 ±.2 5 2.1 MARKING SURFACE 3 5.5 2 7 3.1 ±.5 5.9 ±.1 1 31.4 ±.2 6.75 ±.1 4 ±.127 DETAIL B 4 ±.127 4 ±.127 DETAIL C 4 ±.127 NOTES: 1. Material transparent extruded PVC with antistatic dipping 2. Radius :.5 maximum unless otherwisen specified 3. Critical areas : Labelled in Box 4. All pin plug holes are considered critical dimension 5. Marking Font Type : Times new roman, 3.12 ±.127 in height 6. Material Thickness :.75 ±.1 7. Tolerance unless otherwise specified: Decimal: ±.5 Angle: ±1 8. Unit : Millimeter (mm) Disclaimer Notice - Littelfuse products are not designed for, and shall not be used for, any purpose (including, without limitation, automotive, military, aerospace, medical, life-saving, life-sustaining or nuclear facility applications, devices intended for surgical implant into the body, or any other application in which the failure or lack of desired operation of the product may result in personal injury, death, or property damage) other than those expressly set forth in applicable Littelfuse product documentation. Warranties granted by Littelfuse shall be deemed void for products used for any purpose not expressly set forth in applicable Littelfuse documentation. Littelfuse shall not be liable for any claims or damages arising out of products used in applications not expressly intended by Littelfuse as set forth in applicable Littelfuse documentation. The sale and use of Littelfuse products is subject to Littelfuse Terms and Conditions of Sale, unless otherwise agreed by Littelfuse. Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.

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