Utilizing Remanufactured Integrated Circuits (IC s) In Accordance With FAR 52.211-5 to Solve DMSMS Issues AFLCMC/WWM Wright-Patterson AFB, OH (937) 713-6765 1 Nov 2017
What is a Remanufactured Die Extracted/Repackaged and De-capsulate Plastic Encapsulated Microcircuit (DER /DPEM ) IC? Remanufactured DER / DPEM IC Process Find functional new donor IC in wrong package type (same functionality in wrong package) Donor IC is tested to original component specifications Die ( electronic brain of IC ) from donor IC is extracted, put into needed package form, wire bonded, sealed and tested RESULT A remanufactured form, fit, & functional part is ready for use in DoD systems The remanufactured part is listed as a suitable substitute for the DMSMS IC
FAR 52.211-5 Defines How to Contractually Use Remanufactured Parts
Federal Acquisition Regulation (FAR) 52.211-5 Requirements for Remanufactured Parts F-16 Program Contracting & Engineering Determination DER /DPEM parts are remanufactured parts per FAR 52.211-5 (means factory virgin material rebuilt to original specification). FAR 52.211-5 is invoked for DoD Contracts to Original Equipment Manufacturers (OEMs) for new/spares production. Per FAR 52.211-5, the Contractor shall provide supplies that are remanufactured unless the contract requires virgin material or supplies composed of manufactured virgin material. Per FAR 52.211-5(d), a proposal is required to provide remanufactured parts that shall include a detailed description of such supplies and shall be submitted to the Contracting Officer for approval.
Minimum FAR 52-211-5 Proposal Data Requirements Thoroughly explain how parts will be remanufactured and qualified Provide data that shows the reason(s)/benefit(s) for using remanufactured item vs. a unplanned redesign so Contracting Officer can determine whether or not to accept use of remanufactured items Some Potential Benefits of a Remanufactured Part to Government Less expensive Shorter development time More reliable Parts need to be labeled (e.g. new, remanufactured, or reconditioned) Contractor may be liable for fraud if part sold to the Government is mislabeled Please utilize slides 7, 8, and 9 herein as a decision support system for planning a remanufactured part to solve DMSMS
Remanufacturing is Utilized Across Many Industries
Utilize SD-22 DMSMS Guidebook to Determine Best DMSMS Solution https://www.acq.osd.mil/se/docs/sd-22-dmsms.pdf
A Decision Support System for Planning Remanufacturing to Solve DMSMS Issues Business Scenarios Demand Requirements Mission Impact Solution Costs Life Cycle Know-How End of Life Weapon System Life Cycle Decision Criteria Remanufacturing Feasibility Assessment Decision Support Outcome Information Phase Life Cycle Information Manufacturer Usage Product History Remanufacture Capability Existing Expertise Predictions based on product assessment: Most Likely Decision (remanufacture, redesign) Success Rate Average Cost to Remanufacture Average Time to Remanufacture
Cost, Time, and Redesign Model for Assessing Remanufactured Product
Federal Acquisition Regulation (FAR) 52.211-5 DoD and Industry Benefits Financial: Remanufactured items cost less than unplanned redesigns. Time: Remanufactured items (piece part level) can be delivered in days if previously qualified to months if not compared to years with a redesign. If a planned re-design is in work, the remanufactured part can bridge the gap until qualified. Logistical/Configuration Control: Remanufactured items are a form, fit, and functional Class II change - Drawing revision to add alternate part. Elimination of Counterfeit Parts: Remanufactured items will be produced with only franchised ( trusted source ) donor bare or extracted die.
Remanufactured Part Lifecycle >1 year DMSMS Discontinued Re-enters Supply Chain Remanufactured Part Passes Qualification Testing Regularly Maintained Remanufactured Part Produced Performs Product Lifecycle Begins Donor Part Tested Bare or Extracted Die Repackaged to Customers Foot Print
Obsolete IC/Discrete Procurement Options Lowest Cost Solution and Fastest Implementation $ - $10K to $100K: Original Component Manufacturer (OCM) options: - OCM product in bare die/wafers (only feasible if MOQ meets your budget) or packaged format from OCM, franchised distributor, Generalized Emulation of Microcircuits (GEM) or Defense Microelectronics Activity (DMEA) - Substitution of viable Form, Fit or Function (FFF) product from franchised distributor - Spare circuit cards $ - $10K to $100K: Non-trusted parts from a broker are sometimes used they are often of questionable pedigree, especially with memories - AS6081 Counterfeit Avoidance and Mitigation processes are required and don t guarantee authenticity $$ - $50K to $500K: Remanufactured Part Solution Highest Cost Solution and Slowest Implementation $$$ - $100K to $1M: Fabricate additional original OCM ICs (restart production line) - Significant NRE and MOQ - Typically not an option $$$$ - TBD: DLA GEM, DMEA new designs are manufactured $$$$$ - $2M to $20M: LRU redesign $$$$$$ - $5M to $50M: New system design
Remanufactured Integrated Circuit Architecture DIE
AFRL Remanufactured IC Validation/Qualification Study Can Remanufactured ICs Support USAF IC-based DMSMS Needs? YES!!
AFRL Remanufactured IC Study Objective Validate the long-term reliability of (DER /DPEM ) IC s (AKA remanufactured microcircuits) in military systems Scope Extraction of dies from Plastic Encapsulated Microcircuit (PEM) packaging and repackaging of these dies in hermetically sealed packaging
Remanufactured IC Study Qualification Requirements Qualification Test Plan and Test Procedures MIL-STD-883 testing of donor and DER ICs Groups A, B, C (Dynamic Life Test), and D Life Test - Accessed Long-Term Reliability of ICs Extended testing from 1000 hours to 2000 hours Donor and DER /DPEM ICs were operational Variability Analysis - Compare each DER /DPEM IC to its original plastic donor IC and specifications to evaluate DER /DPEM IC for compliance/processing degradation/long-term reliability Want to see full spec compliance, minimal parametric drift and no long term reliability degradation Validation Study Reports DER /DPEM vendor Qualified Product List (QPL)/Qualified Manufacturers List (QML) like certification process based on MIL-STD-883 requirements and validation study lessons learned
DPACI s Test Results (Report under USAF/DLA review) F-16 Part Number (Generic Part Number) 5962 8852503YA (AT28C256-15US) 32 X 8K EEPROM Original Package 28 PIN Plastic SOIC New Package 68-pin Hermetic LCC Counterfeit Analysis Variability Analysis Reliability Study DER/ DPEM HERM ASSY SMD Military 3-T Electrical 100% Screen/ Group A QCI Group B QCI Group C 2000 Hour Life Test QCI Group D AS6081 & AS5553 PASSED PASSED 100% 100% PASSED PASSED PASSED PASSED PASSED 4000 Hour Life Test 8000 Hour Life Test PASSED Est. Completion 3 Nov 2017 LM161D/883B (LM361M) Differential Comparator 5962 85155172A (TIBPAL16L8-10CN) Programmable Logic Array 14-pin Plastic SOIC 20-pin Plastic DIP 14-PIN Hermetic CERDIP 20-pin Hermetic LCC AS6081 & AS5553 PASSED PASSED 100% 100% PASSED PASSED PASSED PASSED PASSED AS6081 & AS5553 PASSED PASSED 100% 100% PASSED PASSED PASSED PASSED PASSED PASSED PASSED PASSED PASSED 5962 8989601PA (OP-90G) Precision Op-Amp DM54156J/883B (SN74156) Decoder and Multiplexer 8-pin Plastic DIP 16-pin Plastic DIP 8-pin Hermetic CERDIP 16-pin Hermetic CERDIP AS6081 & AS5553 PASSED PASSED 100% 100% PASSED PASSED PASSED PASSED PASSED AS6081 & AS5553 PASSED PASSED 100% 100% PASSED PASSED PASSED PASSED PASSED New DLA requirement drove Life Testing beyond original contract requirement of 2000 hours PASSED PASSED PASSED PASSED
Apparent GCI s Study Test Results (Report not yet submitted for USAF review) F-16 P/N (GEN#) AT28C64B Memory Device XC4013XL Field Programmable Gate Array Original Package 28-pin SOIC Plastic 160-pin TQFP Plastic New Package Ceramic- 28 Pin SideBraze Ceramic- 144 CQFP Counterfeit Analysis Variability Analysis Reliability Study DER Hermetic Assembly SMD Military 3-T Electrical 100% Screen/ Group A QCI Group B QCI Group C 2000 Hour Life Test QCI Group D 4000 Hour Life Test Scheduled Completion Authorized Distributor - Franchised PASSED PASSED 100% 100% PASSED PASSED PASSED PASSED PASSED PASSED Authorized Distributor - Franchised PASSED PASSED 100% 100% PASSED PASSED PASSED PASSED PASSED SEE * BELOW New DLA technology insertion life test requirements MIL-STD-883 life test requirement extended from 1000 hours to 4000 hours at 125 degrees Celsius ICs must now be operating with near max I/O signal levels & loads during MIL-STD-883 life test *XC4013XL FPGA: Packaging and sealing material was not sufficient for 883 requirements. Also noted by the supplier Kyocera. Only going with a solder seal solution on a brazed sealing ring.
Rapid Innovation Fund (RIF) The USAF recently selected Global Circuit Innovations (GCI) Inc. to receive 2.7 million dollars in Rapid Innovation Fund (RIF) funds to solve up to 25 obsolete Integrated Circuit (IC) issues across USAF platforms utilizing remanufactured parts. Their selection in part was based on their success in solving a MICAP need for Navy Prowler and Growler aircraft using a remanufactured part Reliability of remanufactured parts will be tracked and compared to parts they replace
Rapid Innovation Fund (RIF) Cont. This project will provide the funding for evaluation units and qualification testing for each approved IC A provided data collection form will be completed for each candidate part submitted that is causing a MICAP event or a redesign due to obsolete parts A select number of remanufactured parts will be submitted for board level testing to ensure the die will work in their intended application before qualification parts are built Manufacturing variability affects performance of part Remanufactured parts will undergo, at a minimum, MIL-STD-883 testing The AFRL and participating contractors will analyze the test data to validate the performance and long-term reliability of the remanufactured parts
RIF: Program A LRUs With Obsolete Parts Battery Charger - ROI = $1M 3 of 3 parts identified as Discontinued are still Active Power Supply Controller - ROI = $1M 18 of 27 parts identified as Discontinued are still Active 9 of 27 still require additional info NWIU - ROI = $1M 16 of 28 parts identified as Discontinued are still Active 8 of 28 alternate F3 parts available at Rochester 4 of 28 parts identified as remanufactured candidates
RIF: Program B LRUs With Obsolete Parts Radar 2 Multi-Chip Modules - ROI = $30M ($15M per multi-chip module without a redesign) 6 of 6 parts identified as remanufactured candidates for both modules 1 chip in each module requires programming Radar Bipolar Gate Array - ROI = $2M Bipolar Gate Array will be recreated with a hybrid Multi-Chip Module in identical 64-CQFP package as obsolete part 8 die removed from donor ICs as remanufactured candidates Donor die will be placed on RIF contractors custom designed substrate
RIF: Program C LRUs With Obsolete Parts Hybrid RF Amplifier - ROI = $2M 1 of 1 parts identified as a remanufactured candidate Dispensing Switch Assembly - ROI = $2M 1 of 1 parts identified as a remanufactured candidate
Remanufactured Part Success ALQ-99 TJS POD AN/ALQ-99 Tactical Jamming System (TJS) Pod LBT Band 4 Band 5/6 Band 7 Band 8 Band 9/10 Exciters Hardbacks Radom's PIU RAT NSWC Crane was experiencing a Mission Impaired Capability Awaiting Parts (MICAP) event on the EA-6B and EA-18G ALQ-99 TJS Pod The remanufactured part prevented >$1M redesign effort
Conclusion Utilize FAR 52.211-5 for contract approval to use remanufactured parts Remanufactured parts provide a quick-reaction low-cost substitute/replacement IC solution Remanufactured parts can be used to solve Mission Impaired Capability Awaiting Parts (MICAP) and DMSMS issues Remanufactured parts should be used before parts from the open market without traceability